MPC859DSLVR50A - PowerQUICC MPU 50MHz 357-PBGA | NXP
N.º da peça: MPC859DSLVR50A ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $31.72 | $31,72 |
| 10 | $28.5 | $285,00 |
| 100 | $25.4 | $2.540,00 |
| 500 | $22.1 | $11.050,00 |
| 1.000 | $19.85 | $19.850,00 |
MPC859DSLVR50A Visão geral
An integrated communications controller (PowerQUICC) is a category of system-on-chip that merges a general-purpose microprocessor core with dedicated communications peripherals and memory controllers. PowerQUICC belongs to the broader family of microprocessors, which sit above microcontrollers and below full applications processors in the embedded processing hierarchy. Compared to a discrete CPU-plus-communications-ASIC design, a PowerQUICC reduces component count, board area, and BOM cost while preserving deterministic CPM-driven serial handling for telecom workloads.
Key features include a 50 MHz core, 66 MIPS peak throughput, on-chip DRAM controller, two serial interfaces for ATM/HDLC, USB, I2C, and SPI peripherals, an enhanced SAR (ESAR) mode that adds multiple ATM priority levels and port-to-port switching versus the legacy MPC860SAR, and industrial-grade 0 to 95 C operation. The device is built on a 0.18 micron CMOS process and supports 3.3 V I/O with a separate core voltage rail.
The architecture splits work between the core (general control-plane and management tasks) and the CPM (real-time channelized serial, ATM AAL, and HDLC processing). This dual-engine design lets DSLAM-facing software run on the core while the CPM handles per-channel SAR, framing, and DMA autonomously, which keeps overall CPU utilization low at high channel counts.
Typical applications include DSL modems, Integrated Access Devices, residential gateways, low-port ATM SAR edge devices, and industrial serial routing controllers. The integrated CPM offloads per-channel SAR processing so the Power Architecture core stays free for routing, firewalling, and management-plane software.
When designing with the MPC859DSLVR50A, ensure the 3.3 V and core rails are sequenced correctly and that the 357-ball PBGA land pattern is laid out for adequate thermal dissipation; sustained CPM activity can push junction temperatures high in enclosed CPE enclosures. The MPC859 family is in NXP's End-of-Life product list, so plan last-time-buy volumes carefully for long-lifecycle programs.
Alternativas drop-in para MPC859DSLVR50A — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC859DSLVR50A (mesmo formato e footprint) — diferindo em Operating Temperature, Number of Cores, Package, Process Technology, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC859DSLZP50A
✅ Drop-In✓ Em estoque
$52.5 / unidade
Ver ficha técnica →MPC859TVR50A
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC860SARVR50A
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC852TCVR50A
✅ Drop-In✓ Em estoque
$22.1 / unidade
Ver ficha técnica →MPC866VR50A
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC859DSLVR50A Classificações máximas e características elétricas
| Core Processor | MPC8xx (Power Architecture, 32-bit) |
| Number of Cores | 1 |
| Core Speed | 50 MHz |
| Peak Throughput | 66 MIPS |
| Bus Width | 32-bit |
| Co-Processor / DSP | Communications Processor Module (CPM) |
| Ethernet | 10 Mbps (1), 10/100 Mbps (1) |
| RAM Controllers | DRAM |
| Graphics Acceleration | No |
| Temperatura de operação | 0 C to 95 C |
| Encapsulamento | 357-PBGA (25x25 mm) |
| Tipo de montagem | Surface Mount |
| Process Technology | 0.18 micron CMOS |
| Tensão de alimentação | 3.3 V I/O |
| Part Status | Active (per third-party listings) |
Guia de Configuração de Pinos do MPC859DSLVR50A 357-pbga (25x25 mm)
Configuração de pinos para MPC859DSLVR50A (pacote 357-pbga (25x25 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC859DSLVR50A.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC859DSLVR50A é adequado para 6 aplicaçãos: DSL Modem Customer Premises Equipment, Integrated Access Device (IAD) Platform, Residential Gateway Router, Low-Port ATM SAR Edge Device, Industrial Serial Routing Controller, Embedded Telecom Control Plane Processor.
DSL Modem Customer Premises Equipment
The MPC859DSLVR50A's enhanced SAR (ESAR) CPM with multiple APC priority levels and port-to-port ATM switching makes it a strong fit for DSL modem CPE designs. At 50 MHz core and 66 MIPS throughput, the Power Architecture core handles routing, NAT, and management-plane software while the CPM autonomously performs per-channel ATM SAR and HDLC framing, offloading the CPU. The integrated 10/100 Ethernet MAC supplies the LAN-side interface for the residential gateway, and the 357-PBGA package keeps the BOM compact for cost-sensitive CPE enclosures.
Recomendado
Integrated Access Device (IAD) Platform
The MPC859DSLVR50A suits Integrated Access Device designs that combine DSL uplink, Ethernet LAN, and VoIP/serial services in a single CPE box. The CPM's HDLC and serial channels handle E1/T1 or ISDN PRI interfaces, while the Power Architecture core runs the IAD routing stack and QoS policy engine. At 50 MHz the device sustains typical 4-8 channel IAD workloads without saturating, and the 357-PBGA footprint gives board designers room for magnetics and line drivers alongside the SoC.
Recomendado
Residential Gateway Router
The MPC859DSLVR50A powers residential gateway routers by combining routing, firewall, and DSL uplink in one chip. The integrated 10/100 Ethernet MAC connects to the home LAN switch, while the CPM's ATM channels terminate the WAN-side DSL link and run SAR segmentation autonomously. With 66 MIPS peak throughput and the 357-PBGA package, the device keeps bill-of-materials cost low while leaving headroom for management-plane software such as TR-069 and IPv6 transition mechanisms.
Recomendado
Low-Port ATM SAR Edge Device
The MPC859DSLVR50A's ESAR mode adds multiple APC priority levels and port-to-port ATM switching that low-port SAR edge devices require. Up to two ATM ports can be handled by the CPM while the Power Architecture core runs management and signaling stacks, with deterministic per-channel latency because the CPM offloads SAR processing from the main CPU. The 50 MHz core is sufficient for cell-rate scheduling on small DSLAM or aggregation switches where the device sits at the customer edge.
Recomendado
Industrial Serial Routing Controller
The MPC859DSLVR50A fits industrial serial routing controllers thanks to its multi-channel HDLC, UART, USB, I2C, and SPI peripherals consolidated in a single 357-PBGA package. Industrial routers can use the CPM to bridge SCADA serial links (RS-232/RS-485 via external transceivers) while the Power Architecture core runs the IP routing stack. The 0 to 95 C operating range covers typical factory-floor cabinet interiors, and the proven PowerQUICC software ecosystem shortens time to deployment.
Recomendado
Embedded Telecom Control Plane Processor
The MPC859DSLVR50A serves as an embedded control-plane processor in small telecom nodes such as DSLAM line cards, media gateways, and edge routers. Its Power Architecture core runs control-plane software (routing daemons, OAM, SNMP) while the CPM provides hardware-accelerated HDLC and ATM for signaling links. The 50 MHz / 66 MIPS envelope is matched to dozens of signaling channels without CPU saturation, and the 357-PBGA package integrates cleanly with telecom backplane connector layouts.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC859DSLVR50A — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC859DSLZP50A | MPC859TVR50A | MPC860SARVR50A | MPC852TCVR50A | MPC866VR50A |
|---|---|---|---|---|---|---|
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Speed | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50-100 MHz |
| Core / Bus Width | Power Architecture / 32-bit | Power Architecture / 32-bit | Power Architecture / 32-bit | Power Architecture / 32-bit | Power Architecture / 32-bit | Power Architecture / 32-bit |
| CPM (SAR) | Enhanced SAR (ESAR) with multiple APC priorities | Enhanced SAR (ESAR) | Enhanced SAR (ESAR) | Legacy SAR (no ESAR) | Reduced CPM | Enhanced SAR with higher channel count |
| Ethernet | 10 Mbps + 10/100 Mbps | 10 Mbps + 10/100 Mbps | 10 Mbps + 10/100 Mbps | 10 Mbps + 10/100 Mbps | 10 Mbps + 10/100 Mbps | 10/100 Mbps (multiple) |
| Operating Temperature | 0 C to 95 C | 0 C to 95 C | 0 C to 95 C | 0 C to 95 C | 0 C to 95 C | 0 C to 95 C (extended grades available) |
| Lifecycle Status | Last Time Buy (NXP EOL) | Last Time Buy / EOL | EOL | EOL (older generation) | EOL (older generation) | EOL (older generation) |
Principais diferenciais
- Enhanced SAR (ESAR) CPM with multiple APC priority levels (vs MPC860SARVR50A)
- 0.18 micron process with higher maximum clock headroom (vs MPC852TCVR50A)
- Same 357-PBGA footprint as the higher-channel MPC866 family (vs MPC866VR50A)
Notas de projeto
The MPC859DSLVR50A requires separate 3.3 V I/O and core voltage rails with proper sequencing - the core rail must reach regulation before the I/O rail to avoid latch-up. Use a low-impedance bulk capacitor bank plus high-frequency 0.1 uF decoupling within 5 mm of each power pin cluster. Source: NXP MPC859DSL hardware specifications document. Estimated: at full CPM activity the device draws approximately 700-900 mA from the core rail, so budget the regulator for 1.5 A peak transient capability.
The 357-PBGA package has a theta_JA in the 15-20 C/W range depending on PCB copper area; for an enclosure with 50 C internal ambient, the junction can exceed 95 C under sustained CPM load. Use a 6-layer PCB with a continuous ground plane stitched under the BGA and at least four thermal vias under the die flag to keep junction temperature in spec. Estimated: at 1.5 W dissipation with theta_JA = 18 C/W the junction rise is about 27 C above ambient, so 50 C ambient still leaves 18 C of margin to the 95 C limit.
Route the 1.0 mm pitch 357-ball PBGA with a microvia-in-pad stack-up on at least a 6-layer board, and keep matched-length differential pairs for the 10/100 Ethernet MAC signals within 150 mil tolerance. Place the 50 MHz oscillator within 8 mm of the EXTCLK pins and guard it with a ground ring to minimize jitter. Source: NXP MPC8xx family hardware specifications document. Avoid routing high-speed traces through the BGA shadow; use the inner layers for break-out.
Because NXP has placed the MPC859DSLVR50A under End-of-Life, do not start new designs with this part unless you have a documented last-time-buy agreement and authorized stock for the full program lifetime. For new designs, evaluate the QorIQ and Layerscape families as modern replacements. If you must use the MPC859DSLVR50A, secure two independent distributor sources and pre-buy the full lifetime volume now.
Informações de conformidade
Compliance status not provided in the verified web data. NXP's product page lists 'Environmental Quality' information that should be requested directly for RoHS, lead-free, and REACH confirmation.
