P1012NSN2HFB - QorIQ P1012 800MHz e500v2 MPU | NXP | Networking
N.º da peça: P1012NSN2HFB ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $68.9 | $68,90 |
| 10 | $64.5 | $645,00 |
| 100 | $58.25 | $5.825,00 |
| 250 | $54.1 | $13.525,00 |
| 500 | $49.85 | $24.925,00 |
P1012NSN2HFB Visão geral
What is a QorIQ communications MPU? A QorIQ microprocessor is a system-on-chip (SoC) processor family from NXP (formerly Freescale) designed for embedded networking, telecom, and industrial control applications. QorIQ P1 platform parts integrate one or more PowerPC e500 cores with packet processing accelerators, security engines, and multiple high-speed serial interfaces on a single die. They sit in the product hierarchy between microcontrollers (MCU) and application processors (AP), combining deterministic real-time control with rich connectivity.
Key features include the single e500v2 core running at 800 MHz, integrated GbE MACs, hardware-accelerated cryptography, the QUICC Engine for TDM/HDLC/UART protocol termination, dual USB 2.0 ports, and dual PCIe Gen1 controllers. The memory subsystem supports DDR2/DDR3 with ECC for high-reliability designs. The -N suffix indicates the commercial 0 to 125C temperature range, while the NSN2 designation corresponds to NXP's revision 1.1 die revision.
The architecture is built on 45 nm process technology, balancing performance and power for fan-less industrial and networking equipment. The integrated QUICC Engine offloads communications protocol processing from the core, freeing CPU cycles for control plane and application software. Hardware queue management and pattern matching accelerate deep packet inspection workloads.
Typical applications include industrial routers and gateways, defense and aerospace communications platforms, telecom edge equipment (DSLAM, GPON ONT), networked printers, and factory automation controllers. The integrated peripherals reduce BOM cost and board area compared to discrete processor-plus-ASIC designs.
When designing with this device, ensure the PCB provides adequate thermal relief to the 689-ball exposed pad; the die dissipates significant power at 800 MHz. Use the NXP P1021/P1012 Modular Development System to accelerate software bring-up, and follow the hardware specification for DDR3 trace length matching and SerDes reference clock jitter requirements.
This page synthesizes distributor pricing across 19 sources, drop-in and same-family alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing, replacement, and design decisions on the QorIQ P1012 platform.
Alternativas drop-in para P1012NSN2HFB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com P1012NSN2HFB (mesmo formato e footprint) — diferindo em Core Architecture, Ethernet, Process Technology, USB.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
P1021NSN2HFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P1013NSN2HFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P1020NSSN2HFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P1011NSN2HFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P1023NSN2HFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P1012NSN2HFB Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Series | QorIQ P1 |
| Core Processor | PowerPC e500v2 |
| Number of Cores | 1 |
| Core Architecture | 32-bit |
| Speed | 800 MHz |
| Co-processors / DSP | QUICC Engine (QE) |
| Connectivity | Ethernet, PCIe, USB, TDM, UART, I2C, SPI |
| Ethernet | GbE (10/100/1000 Mbps) |
| Memory Controller | DDR2/DDR3 with ECC |
| USB | USB 2.0 (dual port) |
| PCIe | PCIe Gen1 (x1/x2) |
| Process Technology | 45 nm |
| Encapsulamento / Caixa | 689-TEPBGA II (31x31 mm) with exposed thermal pad |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0 C to 125 C |
| Packaging | Tray |
| Lead Free Status | Lead Free |
| Status RoHS | RoHS Compliant |
| Die Revision | 1.1 |
| Security | Hardware-accelerated cryptography |
Configuração de pinos do P1012NSN2HFB
| Pino A1 | GND — Ground reference (selected ball) |
| Pino B2 | VDD — Core power supply (selected ball) |
| Pino AH31 | DDR3_DQ0 — DDR3 data lane bit 0 (selected ball) |
| Pino AE15 | PCIe0_TX_P — PCIe Gen1 lane 0 transmit positive (selected ball) |
| Pino AD10 | SERDES1_REF_CLK_P — SerDes reference clock positive (selected ball) |
Aplicações típicas
P1012NSN2HFB é adequado para 6 aplicaçãos: Industrial Router and Gateway, Telecom Edge Equipment (DSLAM, GPON ONT), Defense and Aerospace Communications, Networked Printer and Multifunction Device Controller, Factory Automation and PLC Controller, Smart Grid and Substation Networking.
Industrial Router and Gateway
The P1012NSN2HFB integrates GbE, PCIe, USB, and the QUICC Engine into a single 689-TEPBGA II SoC, making it a drop-in choice for industrial routers and protocol-conversion gateways. Its 800 MHz e500v2 core delivers line-rate forwarding for up to 2 GbE ports while the QUICC Engine handles TDM/HDLC/UART termination for legacy serial protocols like RS-485 and E1/T1 used in SCADA and industrial telemetry. The DDR3-ECC memory subsystem ensures error-free logging under industrial temperature swings (0 C to 125 C).
Recomendado
Telecom Edge Equipment (DSLAM, GPON ONT)
Telecom edge devices require the protocol-processing power that the P1012NSN2HFB's QUICC Engine delivers. The hardware-accelerated TDM and HDLC support enables E1/T1 aggregation and PPP termination without burdening the host CPU. The dual USB 2.0 ports and dual GbE MACs allow simultaneous management and data-plane connectivity. The 689-TEPBGA II exposed-pad package supports long-life field deployments with passive heatsink cooling.
Recomendado
Defense and Aerospace Communications
The P1012NSN2HFB's extended 0 to 125 C operating temperature and hardware cryptography make it suitable for defense communications platforms. The QUICC Engine accelerates tactical-radio interfaces including MIL-STD-188 and synchronous serial protocols, while the integrated security engine handles encryption without dedicated ASICs. Its 45 nm process technology provides resilience to single-event upsets in aerospace environments when combined with appropriate mitigation firmware.
Recomendado
Networked Printer and Multifunction Device Controller
Multifunction printer (MFP) controllers benefit from the P1012NSN2HFB's balance of USB 2.0, GbE, and DDR3-ECC for image buffer management. The 800 MHz e500v2 core runs printer firmware and protocol stacks (LPD, IPP, SNMP) while the QUICC Engine handles legacy serial interfaces for service ports. Compared to discrete MCU plus ASIC designs, the integrated solution reduces BOM cost and PCB area significantly for office equipment designs.
Recomendado
Factory Automation and PLC Controller
Industrial PLC platforms leverage the P1012NSN2HFB's real-time deterministic performance and multi-protocol support. The QUICC Engine terminates fieldbus protocols (PROFIBUS, CAN, Modbus RTU) through TDM channels, eliminating external protocol ASICs. The PCIe interface supports high-speed motion-control cards while the GbE MAC provides industrial Ethernet connectivity (EtherCAT, PROFINET) via external PHY. The 689-TEPBGA II exposed pad handles sustained thermal loads in sealed factory enclosures.
Recomendado
Smart Grid and Substation Networking
Substation networking equipment uses the P1012NSN2HFB's IEC 61850 protocol support through the QUICC Engine's TDM and HDLC channels, enabling GOOSE messaging and sampled value transport. The hardware cryptography engine handles authentication for grid cybersecurity compliance, while the extended temperature range (0 C to 125 C) ensures operation in unconditioned substation cabinets. The DDR3-ECC memory detects and corrects bit errors caused by cosmic radiation in outdoor deployments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para P1012NSN2HFB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | P1021NSN2HFB | P1013NSN2HFB | P1020NSSN2HFB | P1011NSN2HFB | P1023NSN2HFB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31) | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same |
| Number of Cores | 1 | 2 | 1 | 1 | 1 | 2 |
| Core Architecture | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 |
| Maximum Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| QUICC Engine (QE) | Yes | Yes | No | Yes | Yes | Yes |
| GbE MACs | 2 | 2 | 3 | 2 | 2 | 2 |
| DDR3 Support | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) |
| Operating Temperature | 0 C to 125 C | 0 C to 125 C | 0 C to 125 C | 0 C to 125 C | 0 C to 125 C | 0 C to 125 C |
Principais diferenciais
- Integrated QUICC Engine for legacy telecom protocols (vs P1013NSN2HFB)
- Single-core configuration with full P1 peripheral set (vs P1021NSN2HFB)
- DDR3-ECC memory subsystem for high-reliability applications (vs P1011NSN2HFB)
Notas de projeto
The 689-TEPBGA II exposed thermal pad must be soldered directly to a large copper pour on the top PCB layer, with thermal vias connecting to inner ground layers. At full 800 MHz load across the QUICC Engine and DDR3 controller, the die dissipates significant power; a thermal simulation is critical for sealed industrial enclosures. Provide at least 25x25 mm of continuous top-layer copper beneath the BGA.
DDR3 traces must be length-matched within 25 mils (data group) and 50 mils (address/command) per the NXP P1012 hardware specification. Use 100-ohm differential impedance for PCIe and SerDes lanes with reference clocks from a low-jitter source. Place decoupling capacitors immediately adjacent to each power ball pair; the BGA's inner rows are power/ground balls that benefit from 0.1 uF and 1 nF capacitors in parallel.
SerDes reference clock jitter must be below 1 ps RMS for reliable PCIe Gen1 and GbE operation. Route high-speed differential pairs over a continuous reference plane with no splits; keep stubs shorter than 50 mils. The QUICC Engine TDM signals require controlled-impedance routing with matched lengths across the parallel bus. Use the NXP P1021/P1012 Modular Development System board as a reference for validated stack-up and routing guidelines.
Do not confuse the P1012 (with QUICC Engine) with the P1013 (no QE, more GbE); the software initialization tables differ significantly. Ensure the JTAG TAP controller is correctly configured for boundary scan before first power-up. The boot ROM configuration word must match the actual DDR3 timing parameters, or the system will hang silently. Read the errata document for the revision 1.1 die before production release.
Informações de conformidade
RoHS compliant and lead-free per NXP product page and DigChip specifications. AEC-Q100 is not applicable for industrial/networking MPU (automotive-qualified part is P1012NSN2MFB with M suffix). Halogen-free status not explicitly listed in provided data.
