P1022NXE2LFB - QorIQ Dual-Core 1GHz SoC | NXP
N.º da peça: P1022NXE2LFB ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $89.5 | $895,00 |
| 100 | $82.75 | $8.275,00 |
| 500 | $78.2 | $39.100,00 |
| 1.000 | $73.4 | $73.400,00 |
P1022NXE2LFB Visão geral
A QorIQ P1022 SoC is a members of NXP's Power Architecture-based communications processor family, positioned between the single-core P101x and higher-core P20xx platforms. QorIQ processors historically delivered integrated networking, security, and packet-processing acceleration within a single chip, reducing bill-of-materials compared with discrete CPU-plus-assist-chip designs for router, switch, and industrial control use cases. The P1022 family specifically addresses mid-range dual-core workloads needing deterministic performance with low power envelope.
Key features of the P1022NXE2LFB include dual 32-bit e500v2 cores up to 1.055 GHz, integrated 32 KB I-cache and 32 KB D-cache per core, DDR2/DDR3 memory controller with ECC support up to 800 MHz data rate, two 10/100/1000 Mbps Ethernet MACs, three PCI Express controllers, two USB 2.0 controllers (host + device), an LCD controller, and an integrated security engine supporting DES, 3DES, AES, and public-key acceleration. The 'E' industrial-temperature range from -40C to +125C, together with the 'L' lithography and 'FB' lead-free ball package, makes the device suitable for harsh-environment embedded systems.
Architecturally, the P1022NXE2LFB leverages the Power Architecture e500v2 superscalar core with out-of-order execution, a coherent CoreNet fabric interconnect, and dedicated datapath engines for packet parsing, queue management, and cryptography. The SoC integrates multiple power islands so that unused blocks can be clock-gated, allowing systems designers to hold platform power below target thermal envelopes even with the dual cores active.
Typical applications for the P1022NXE2LFB include industrial Ethernet gateways, programmable logic controllers with protocol conversion, secure network-attached storage controllers, factory-floor edge routers, building automation controllers, and embedded industrial PCs running Linux or VxWorks. The dual-core configuration supports real-time control cores combined with networked application cores within a single SoC footprint.
When designing with the P1022NXE2LFB, consider that the device is approaching end-of-life per NXP's product discontinuance notice shown on the official product page. Designers of long-lifecycle programs should evaluate the NXP P1022 successor, or migrate to the LS1021A family, both of which pin-redefine rather than drop-in, so a layout revision is unavoidable. The 689-ball TEPBGA requires careful PCB stackup and microvia technology to escape the fine 1 mm pitch BGA.
This page synthesizes current distributor availability, lifecycle status, and parametric positioning of the P1022NXE2LFB relative to its same-family and same-package alternatives, information not consolidated in a single source from the manufacturer datasheet alone.
Alternativas drop-in para P1022NXE2LFB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com P1022NXE2LFB (mesmo formato e footprint) — diferindo em Architecture, Ethernet MACs, Memory Controller, Operating Temperature, Security Engine.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
P1022NXN2LFB
✅ Drop-In✓ Em estoque
$78.4 / unidade
Ver ficha técnica →P1022NSE2LFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P1022NXE2LFB Classificações máximas e características elétricas
| Family | QorIQ P1 |
| Architecture | PowerPC e500v2 (32-bit) |
| Number of Cores | 2 |
| Maximum Core Frequency | 1.055 GHz |
| L1 Cache per Core | 32 KB I-cache + 32 KB D-cache |
| Coherency Fabric | CoreNet |
| Memory Controller | DDR2 / DDR3 with ECC, 16-bit / 32-bit, 800 MHz data rate |
| Ethernet MACs | Two 10/100/1000 Mbps (RGMII / SGMII) |
| PCI Express | Three controllers, Gen 1 / Gen 2 |
| USB Controllers | Two USB 2.0 (host + device / dual host) |
| Security Engine | SEC with DES / 3DES / AES, public-key accelerator |
| LCD Controller | Yes (integrated) |
| Packaging | 689-TEPBGA II (Plastic Enhanced BGA, 31 x 31 mm, lead-free) |
| Terminal Pitch | 1 mm |
| Temperatura de operação | -40C to +125C (industrial, E grade) |
| Process Technology | 65 nm CMOS |
| Status RoHS | Lead-free ball finish (FB suffix), RoHS compliant |
Guia de Configuração de Pinos do P1022NXE2LFB standard
Configuração de pinos para P1022NXE2LFB (pacote standard). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para P1022NXE2LFB.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
P1022NXE2LFB é adequado para 6 aplicaçãos: Industrial Ethernet Gateways and Protocol Converters, Factory Floor Edge Routers, Secure Industrial NAS Controllers, Building Automation and HVAC Control, Programmable Logic Controllers with CNC or Motion Roles, Industrial Printers and Imaging Platforms.
Industrial Ethernet Gateways and Protocol Converters
The P1022NXE2LFB's dual e500v2 cores enable one core to run a real-time protocol stack while the second executes a Linux application plane for configuration, telemetry, or OPC UA bridging. Its two integrated Gigabit Ethernet MACs (RGMII/SGMII) remove the need for an external switch IC in compact gateway designs. The integrated security engine accelerates IPsec, MACsec, and TLS sessions, critical for securing industrial traffic. The 689-TEPBGA II package provides ample thermal headroom for factory-floor temperatures up to 125C ambient. Designers can place 10 uF + 0.1 uF ceramic decoupling groups around the SoC's supply balls and route DDR3 with 50 ohm controlled impedance and length-matched byte lanes to maintain signal integrity at 800 MT/s.
Recomendado
Factory Floor Edge Routers
Edge routers in industrial networks must bridge legacy fieldbus (EtherCAT, Modbus, Profinet) with enterprise IT networks and the cloud. The P1022NXE2LFB's dual cores can offload fieldbus master duties on one core and run an edge-stack agent on the second, with DDR3 + ECC providing deterministic memory for real-time scheduling. The PCI Express controllers expose Wi-Fi or LTE modems for backhaul, and the security engine authenticates remote operators. Operating from -40C to +125C lets the router mount inside control cabinets without additional cooling. PCB layout should reserve a 12-layer stackup with 1 mm pitch BGA escape, dedicated GND power islands, and matched-length SERDES lanes for PCIe Gen 2.
Recomendado
Secure Industrial NAS Controllers
Network-attached storage controllers used in video-surveillance and industrial backup systems benefit from the P1022NXE2LFB's ECC-enabled DDR3 controller, hardware AES pipeline, and PCI Express x4 lanes for SATA or NVMe host-bus adapters. The dual cores drive simultaneous RAID rebuild on one core while serving SMB or NFS traffic on the other, sustained by the data path acceleration engine of the QorIQ platform. Operating-temperature of -40C to +125C permits deployment in unheated storage closets. Performance scales predictably: a 1.055 GHz core moving 128 KB page aligned blocks over SATA-III via PCIe typically shows 70-80 percent of raw drive throughput, an attractive number for 4-bay RAID-5 designs.
Recomendado
Building Automation and HVAC Control
Building management systems aggregate BACnet, KNX, and Modbus endpoints across tens of thousands of sensors and actuators. A P1022NXE2LFB-based controller can run a BACnet stack on one core and multi-protocol translation on the second, using the integrated LCD controller to drive a 7-inch touch-display on the operator panel. The 32-bit e500v2 cores are deterministic enough to close the BTnet/MQTT loops within 100 ms cycles, satisfying the responsiveness expectations of HVAC control. The industrial temperature range allows mounting in mechanical rooms where ambient can hit 60C. Effective use of the device requires keeping DDR3 trace lengths within 5 mm tolerance across each byte lane and providing 1 square inch of copper under the BGA lid for thermal spreading.
Recomendado
Programmable Logic Controllers with CNC or Motion Roles
Mid-range PLCs and embedded motion controllers benefit from the P1022NXE2LFB's deterministic dual-core timing, hardware security for signed firmware, and PCI Express links to digital I/O expanders. One core can hold the IEC 61131-3 runtime while the second handles an HMI thread or OPC UA server, all within a 689-TEPBGA II package that withstands the 125C junction temperatures reached inside sealed industrial enclosures. Designers typically pair the SoC with a separate RTC and a CPLD for fail-safe input capture. The benefit over a discrete MCU pair is the consolidated PCI Express switching tree, which shrinks the BOM for high-channel-count PLCs in CNC and packaging machinery.
Recomendado
Industrial Printers and Imaging Platforms
High-end industrial printers, label applicators, and medical imaging peripherals can leverage the P1022NXE2LFB's LCD controller for local UI, two USB 2.0 ports for scanners and HIDs, and DDR3 with ECC for reliable handling of large image frame buffers. The hardware security engine enforces signed firmware at boot, which is increasingly required by IEC 62443 and FDA cybersecurity guidance. With both cores operating under a Linux/PowerPC distribution, designers can run color-management routines on one core while driving the print engine bus on the second. Industrial temperature grade suits factory-side installations. Layout guidance: dedicate two PCB layers to GND under the BGA, place 22 uF + 0.1 uF + 10 nF ceramic decouplers immediately adjacent to each DDR supply cluster.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para P1022NXE2LFB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | P1022NXN2LFB | P1022NSE2LFB |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm, 1 mm pitch) | 689-TEPBGA II (31x31 mm, 1 mm pitch) - same | 689-TEPBGA II (31x31 mm, 1 mm pitch) - same |
| Number of Cores | 2 (dual) | 2 (dual) - same | 1 (single) |
| Core Frequency (max) | 1.055 GHz | 1.055 GHz - same | 1.055 GHz - same |
| Operating Temperature | -40C to +125C (industrial) | 0C to +105C (commercial) | -40C to +125C (industrial) |
| Architecture | PowerPC e500v2 (32-bit) | PowerPC e500v2 (32-bit) - same | PowerPC e500v2 (32-bit) - same |
| DDR Memory Controller | DDR2/DDR3 with ECC up to 800 MT/s | DDR2/DDR3 with ECC up to 800 MT/s - same | DDR2/DDR3 with ECC up to 800 MT/s - same |
| Gigabit Ethernet | 2x 10/100/1000 MACs | 2x 10/100/1000 MACs - same | 2x 10/100/1000 MACs - same |
| PCI Express | 3 controllers | 3 controllers - same | 3 controllers - same |
| USB 2.0 | 2 controllers | 2 controllers - same | 2 controllers - same |
| Security Engine | SEC with AES/3DES/RSA | SEC with AES/3DES/RSA - same | SEC with AES/3DES/RSA - same |
| Lifecycle Status | Last-time-buy (end-of-life announced) | Last-time-buy - same | Last-time-buy - same |
Principais diferenciais
- Higher industrial temperature ceiling than the P1022NXN2LFB commercial variant (vs P1022NXN2LFB)
- Dual e500v2 cores versus single core (vs P1022NSE2LFB)
- Hardware security engine and ECC memory controller on a single die (vs Discrete MCU + external crypto IC + non-ECC SoC)
Notas de projeto
The 689-TEPBGA II package is thermally enhanced with a heat-spreader lid and should be paired with a thermal interface material and either a heatsink or cold plate in industrial deployments where junction temperature may approach 110C. Without active thermal mitigation, the junction-to-ambient thermal resistance results in roughly 0.4-0.6 C/W rise per watt dissipated, making passive attachment insufficient above 4-5 W total SoC power. Provide thermal vias under and around the package to spread heat into the inner PCB copper planes.
Use a 12-layer (or higher) PCB stackup with one GND plane immediately below the BGA to escape the 1 mm pitch power and signal balls. Route DDR3 byte lanes as 50 ohm controlled-impedance traces with intra-pair length matching within 5 mils and inter-pair matching within 50 mils to maintain signal integrity at 800 MT/s. Place decoupling capacitor groups (10 uF + 0.1 uF + 10 nF) within 100 mils of each power pin pair to suppress CoreNet switching transients.
Do not assume the 1.055 GHz specification is a guaranteed core frequency across all process corners: programming of the SYS_PLL ratio must respect the platform minimum/maximum dividers documented in the QorIQ P1022 reference manual. Running the PLL outside the datasheet range causes bus errors and unrecoverable hangs. Validate the configured core frequency and DDR clock ratios against the SDK initialization tables on first boot of every board, especially when migrating between silicon revisions.
The P1022NXE2LFB is flagged on NXP's website as discontinued or approaching end-of-life. Do not start new designs on this part number; instead, use the same-package drop-in alternatives for sustaining production while planning a migration to the LS1021A or Layerscape LS1043A portfolio for greenfield projects.
Informações de conformidade
Lead-free ball finish indicated by 'FB' suffix in MPN. RoHS compliance stated by NXP product page. AEC-Q100 automotive qualification is not applicable - the P1022 family targets industrial networking rather than automotive ECUs.
