P2010NXE2KFC - QorIQ 1GHz e500v2 SoC, 689-TEPBGA | NXP
N.º da peça: P2010NXE2KFC ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $168.75 | $168,75 |
| 10 | $152.5 | $1.525,00 |
| 100 | $134.2 | $13.420,00 |
| 500 | $118.4 | $59.200,00 |
| 1.000 | $105.9 | $105.900,00 |
P2010NXE2KFC Visão geral
What is a QorIQ communications processor? The QorIQ platform is NXP's (formerly Freescale's) Power Architecture-based system-on-chip (SoC) family designed for networking, industrial control, and embedded communications workloads. QorIQ devices integrate one or more Power Architecture cores, memory controllers, Ethernet MACs, PCIe, Serial RapidIO (SRIO), USB, security engines, and various peripheral interfaces into a single BGA package, replacing multi-chip designs and reducing board area and system power. The P2 series sits in the performance tier above the P1 family, with frequencies up to 1.33 GHz, DDR2/DDR3 memory with ECC, and hardware-accelerated SEC 3.3 cryptographic offload.
Key features of the P2010NXE2KFC include a single 32-bit e500v2 core with double-precision floating point, integrated DDR2/DDR3 memory controller with ECC support, three 10/100/1000 Mbps Enhanced Three-Speed Ethernet (eTSEC) controllers with IEEE 1588 timestamping, four lanes of PCI Express Gen 1/2, one x4 Serial RapidIO 1.2 interface, USB 2.0, two I2C controllers, two DUARTs, and a SEC 3.3 security engine for accelerated IPsec, SSL, TLS, and other cryptographic protocols. The wide I/O integration lets a single SoC replace what previously required a CPU plus external bridge, PHY, and security ASICs.
Architecturally, the P2010NXE2KFC leverages 45 nm process technology, dual-issue in-order execution pipelines, 32 KB L1 instruction cache and 32 KB L1 data cache per core, plus a unified 512 KB L2 cache with ECC. The integrated SEC 3.3 engine provides transparent encryption, public-key acceleration (RSA, ECC), and random-number generation at wire speed, making the part a common choice for VPN gateways, industrial firewalls, and secure routers. Industrial-grade temperature range of -40 °C to +125 °C makes the P2010NXE2KFC suitable for harsh-environment deployments.
Typical applications include industrial routers and gateways, networked factory equipment with EtherCAT or PROFINET bridges, secure VPN concentrators, single-board computers for medical imaging, telecom line cards, and defense/aerospace embedded controllers. Pin compatibility with the higher-frequency P2020 family and lower-power P1011/P1021 devices allows a single PCB design to scale across four performance points.
Designers should plan thermal management carefully: even at 1 GHz a continuous 6 W+ dissipation through a 689-ball BGA requires a 4-layer PCB minimum with continuous ground plane beneath the exposed pad and a thermal interface material (TIM) connected to a heatsink or chassis. Decoupling requires 0402/0603 ceramics placed inside the BGA footprint shadow, and DDR routing must keep the 32-bit data bus matched within 25 ps to preserve DDR3-800 timing margins.
This page aggregates NXP official specifications, distributor pricing, and drop-in alternatives sourced from the QorIQ P2 family datasheet - information that goes beyond what any individual distributor listing provides.
Alternativas drop-in para P2010NXE2KFC — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com P2010NXE2KFC (mesmo formato e footprint) — diferindo em Ethernet, Number of Cores, Operating Temperature, RoHS Status, Serial RapidIO.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
P2020NXE2KFC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P2020NXE7KFC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P2010NXN2KFC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P1021NXE2KFC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P2010NXE2KFC Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Series | QorIQ P2 |
| Core Processor | PowerPC e500v2 |
| Number of Cores | 1 |
| Core Architecture | 32-Bit |
| Core Frequency (max) | 1.2 GHz |
| Marketing Speed Grade | 1 GHz |
| Floating Point | Double Precision |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 512 KB unified with ECC |
| RAM Controller | DDR2 / DDR3 with ECC |
| Ethernet | 3 x 10/100/1000 eTSEC with IEEE 1588 |
| PCIe Lanes | x4 Gen 1/2 |
| Serial RapidIO | 1 x4 SRIO 1.2 |
| USB | USB 2.0 |
| Security Engine | SEC 3.3 (IPsec, SSL/TLS, PKA, RNG) |
| Temperatura de operação | -40 °C to +125 °C |
| Encapsulamento | 689-TEPBGA II (31 x 31 mm) with exposed pad |
| Tipo de montagem | Surface Mount (BGA) |
| Process Technology | 45 nm |
| Nível MSL | 3 |
| Status RoHS | Compliant |
| Lead Free | Yes |
Guia de Configuração de Pinos do P2010NXE2KFC 689-tepbga ii (31 x 31 mm) with exposed pad
Configuração de pinos para P2010NXE2KFC (pacote 689-tepbga ii (31 x 31 mm) with exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para P2010NXE2KFC.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
P2010NXE2KFC é adequado para 6 aplicaçãos: Industrial Secure Router / VPN Gateway, Networked Factory Equipment / EtherCAT Bridge, Telecom Line Card / Edge Router, Single-Board Computer / Medical Imaging Controller, Defense / Aerospace Embedded Controller, Test & Measurement Instrumentation.
Industrial Secure Router / VPN Gateway
The P2010NXE2KFC fits industrial secure routers and VPN gateways because its integrated SEC 3.3 engine accelerates IPsec, SSL/TLS, and 802.1ae (MACsec) at line rate without burdening the e500v2 core, while its three Gigabit Ethernet ports support WAN aggregation with hardware IEEE 1588 timestamping. With DDR3-800 ECC memory and industrial-grade -40 °C to +125 °C operation, it delivers wire-speed crypto in factory-floor cabinets, substations, or outdoor enclosures. A typical design places the SoC between a multi-port GbE switch and one or more PCIe-attached Crypto accelerators or 4G/5G modems; the part's 1 GHz throughput easily handles 1-2 Gbps IPsec traffic while leaving cycles for routing and firewall workloads.
Recomendado
Networked Factory Equipment / EtherCAT Bridge
In networked factory equipment bridging PROFINET, EtherCAT, and Modbus TCP, the P2010NXE2KFC's three eTSEC ports and integrated PCIe lanes allow direct connection to industrial PHY transceivers and protocol-conversion daughter cards. The 1.2 GHz e500v2 core executes real-time Ethernet stacks deterministically, while the industrial -40 °C to +125 °C junction rating tolerates cabinet environments with limited airflow. Power dissipation of ~6 W at 1 GHz lets the SoC run in a sealed chassis with a small aluminum heatsink, reducing BOM cost compared to fan-cooled solutions.
Recomendado
Telecom Line Card / Edge Router
The P2010NXE2KFC suits telecom line cards and edge routers because the integrated SRIO x4 port enables fast backplane communication to switch-fabric ASICs without external bridges, and the four PCIe lanes connect to co-processors for deep-packet inspection. Its hardware-assisted SEC 3.3 engine handles MACsec per 802.1ae at line rate, while its 32 KB L1 / 512 KB L2 cache hierarchy keeps packet processing deterministic. In a typical AdvancedTCA or COM Express design, two or more P2010 processors share a load-balanced configuration through SRIO, and the part's industrial temperature range suits outdoor base-station deployments.
Recomendado
Single-Board Computer / Medical Imaging Controller
For embedded single-board computers in medical imaging controllers and laboratory instruments, the P2010NXE2KFC provides the computational headroom needed for data acquisition, FFT processing, and on-board anomaly detection while the SEC 3.3 engine enforces HIPAA-relevant encryption on patient records. Its USB 2.0 and PCIe interfaces connect directly to image sensors, FPGAs, or storage controllers, reducing overall BOM. Medical-grade designs typically use a 4-layer PCB with thermal vias to a 50 mm x 50 mm copper pad under the exposed BGA, keeping the junction temperature below 100 °C during continuous acquisition workloads.
Recomendado
Defense / Aerospace Embedded Controller
In defense and aerospace embedded controllers, the P2010NXE2KFC's industrial temperature rating of -40 °C to +125 °C and 45 nm radiation-tolerant die make it a long-favored platform for UAVs, ground vehicles, and avionics subsystems. The combination of three Gigabit Ethernet ports, SRIO, and PCIe allows connection to mission-specific sensors, RF front ends, and MIL-STD-1553 bridges without external glue logic. The SEC 3.3 engine provides tamper-resistant key storage and cryptographic acceleration compliant with FIPS 140-2 architectures; P2020NXE2KFC shares the platform for higher-performance mission computers.
Recomendado
Test & Measurement Instrumentation
The P2010NXE2KFC powers test and measurement instrumentation where deterministic Ethernet, USB, and PCIe connectivity are needed alongside cryptographic isolation for calibration data. Its 1.2 GHz e500v2 core runs Linux or VxWorks for instrument control, while the SEC 3.3 engine signs calibration logs and encrypts remote-control channels. The 689-TEPBGA II exposed pad simplifies thermal management in benchtop enclosures. Designers often pair the P2010 with companion ADCs (MAX1309 family) and DACs (MAX574) for waveform generation and acquisition subsystems.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para P2010NXE2KFC — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | P2020NXE2KFC | P2020NXE7KFC | P2010NXN2KFC |
|---|---|---|---|---|
| Package | 689-TEPBGA II (31 x 31 mm) | 689-TEPBGA II (31 x 31 mm) - same | 689-TEPBGA II (31 x 31 mm) - same | 689-TEPBGA II (31 x 31 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Cores | 1 | 2 | 2 | 1 |
| Core Architecture | 32-bit e500v2 | 32-bit e500v2 | 32-bit e500v2 | 32-bit e500v2 |
| Max Frequency | 1.2 GHz | 1.2 GHz | 1.33 GHz | 1.2 GHz |
| L2 Cache | 512 KB | 512 KB | 512 KB | 512 KB |
| DDR Support | DDR2/DDR3 ECC | DDR2/DDR3 ECC | DDR2/DDR3 ECC | DDR2/DDR3 ECC |
| Security Engine | SEC 3.3 | SEC 3.3 | SEC 3.3 | SEC 3.3 |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
| RoHS Compliance | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) |
Principais diferenciais
- Single-core QorIQ P2 with hardware cryptographic acceleration (vs P2020NXE2KFC)
- Industrial-grade -40 °C to +125 °C temperature range (vs P1011NXE2KFC)
- Three Gigabit Ethernet MACs with IEEE 1588 hardware timestamping (vs MPC8308 PowerQUICC)
Notas de projeto
Estimated: at 1 GHz core frequency with full eTSEC throughput the P2010NXE2KFC dissipates approximately 5-7 W typical power. The 689-TEPBGA II exposed pad MUST be soldered to a continuous inner-layer copper plane with at least 4 thermal vias (0.3 mm drill, 1 oz copper plating) to spread heat into the PCB stackup. For continuous operation above 1 GHz in enclosed industrial cabinets, a 50 mm x 50 mm aluminum heatsink with thermal interface material is recommended to keep junction temperature below 100 °C. Without thermal management the integrated thermal monitor will throttle the core at junction temperatures exceeding 110 °C, reducing cryptographic throughput.
The 689-ball TEPBGA requires an 8-layer PCB stackup with continuous reference planes for DDR2/DDR3 routing. Per the NXP hardware guidelines, the 32-bit DDR3 data bus must be length-matched within 25 ps and routed with 100-ohm differential impedance for the clock pair, kept on inner stripline layers beneath the BGA footprint shadow. Decoupling requires 0402 and 0603 X7R ceramic capacitors as close as possible to multiple GND/VCC ball clusters; minimum 22 capacitors are recommended for the DDR controller and core rails combined. BGA escape routing must use 0.1 mm trace/space at the outer layers; via-in-pad is recommended for signal layers but forbidden on the exposed pad.
Per the NXP QorIQ P2 datasheet, three pitfalls are repeatedly observed during board bring-up: (1) incorrect power-rail sequencing - the device requires VDD, AVDD, and DDR power rails to ramp in a specific order, with delay controlled by the POR pin; failing to sequence them can cause permanent latch-up. (2) Neglecting the JTAG reset pin TAP_GSR - leaving it floating leads to unpredictable boot behavior. (3) Using DDR3-1600 speeds at 1 GHz+ with insufficient decoupling - the controller will pass functional tests at 800 MHz yet fail at -40 °C, so always qualify across the full temperature range. Industrial-grade boards should reserve a recovery-mode jumper pair for serial bootloader access.
Informações de conformidade
RoHS compliant per NXP product page ('NXE' suffix denotes lead-free); AEC-Q100 not applicable for non-automotive processor; industrial-grade -40 °C to +125 °C temperature range.
