P2040NSE7HLC - QorIQ Quad-Core 1.2GHz SoC | NXP FCBGA-780
N.º da peça: P2040NSE7HLC ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $137.52 | $137,52 |
| 10 | $125.4 | $1.254,00 |
| 100 | $108.75 | $10.875,00 |
| 500 | $95.2 | $47.600,00 |
| 1.000 | $82.65 | $82.650,00 |
P2040NSE7HLC Visão geral
A QorIQ processor is a communications-focused multicore SoC built on the Power Architecture instruction set, designed for networking, telecom, and data-plane workloads where deterministic throughput, deep packet inspection, and integrated high-speed I/O matter more than raw single-thread performance. P2040 sits in NXP's low-end to mid-range quad-core tier, bringing P4-class architectural features (such as the Corenet-Platform fabric and hardware virtualization) down to cost- and power-sensitive routers, line cards, and industrial control platforms.
Key features include four e500mc cores at 800 MHz to 1.2 GHz, dual 64-bit DDR3/3L controllers with ECC supporting up to 8 GB of addressable memory, three PCIe Gen2 controllers, two SATA 2.0 ports, three SRIO lanes, four 1 GbE MACs plus a 10 GbE MAC, an integrated security engine (SEC 4.2) with public-key and symmetric accelerators, and a thermal monitor that allows operation from 0°C to 105°C (Tcase).
The P2040 uses a coherent CoreNet fabric that links the cores, I/O, and memory controllers on a single on-die switch, eliminating the northbridge/southbridge split of older PowerQUICC designs. This simplifies board layout and reduces latency between cores and peripherals, while the FCBGA-780 package provides a 23 x 23 mm body with 0.8 mm ball pitch suitable for high-density 12+ layer PCBs with buried vias.
Typical applications include multi-service routers, broadband access gateways, line-card controllers in modular chassis, LTE/UMTS base-station baseband, network-attached storage, and industrial Ethernet switches. The integrated SEC engine also makes the P2040 attractive for IPsec/SSL acceleration in VPN concentrators. The P2040 is pin-compatible with the single-core P2020 and the dual-core P2010, enabling OEM scaling without board rework.
When designing with this part, allocate at least 12 PCB layers for the FCBGA-780 break-out, follow NXP's AN4325 routing guidelines for DDR3, and provide sufficient bulk capacitance near the core and platform voltage rails (Vdd and GVDD). Note that the part is marked End-of-Life on NXP's product page; ensure long-term availability before committing to new designs, or evaluate the LS1043A/LS1046A Layerscape family as a roadmap replacement.
Alternativas drop-in para P2040NSE7HLC — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
P2040NSE7KLC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P2041NSE7MMC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P2020NSE2MMC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P2040NSN7MMC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P2010NSE2MMC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P2040NSE7HLC Classificações máximas e características elétricas
| Architecture | Power Architecture e500mc (64-bit) |
| Core Count | 4 |
| Maximum Core Frequency | 1.2 GHz |
| Marketing Core Frequency | 4 x 800 MHz |
| Memory Controller | Dual-channel 64-bit DDR3/3L with ECC |
| PCIe Controllers | 3 x PCIe Gen2 |
| SATA Ports | 2 x SATA 2.0 |
| Serial RapidIO Lanes | 3 x SRIO |
| Ethernet MACs | 4 x 1 GbE + 1 x 10 GbE |
| Security Engine | SEC 4.2 (public-key and symmetric acceleration) |
| Encapsulamento | 780-ball FCBGA, 23 x 23 mm, 0.8 mm pitch |
| Operating Temperature (Tcase) | 0°C to 105°C |
| Silicon Revision | Rev 2.0 |
| Status RoHS | Compliant |
Configuração de pinos do P2040NSE7HLC
| Pino A1 | GND — Common ground reference |
| Pino A2 | VDD — Core voltage supply |
| Pino B1 | DDR3_DQ0 — DDR3 data bit 0 (Channel A) |
| Pino B2 | DDR3_DQ1 — DDR3 data bit 1 (Channel A) |
| Pino C1 | DDR3_DQS_P — DDR3 data strobe positive (Channel A) |
| Pino C2 | DDR3_DQS_N — DDR3 data strobe negative (Channel A) |
| Pino D1 | PCIe1_REF_CLK_P — PCIe Gen2 reference clock positive |
| Pino D2 | PCIe1_REF_CLK_N — PCIe Gen2 reference clock negative |
| Pino E1 | 10G_TX_P — 10 Gigabit Ethernet transmit positive lane |
| Pino E2 | 10G_TX_N — 10 Gigabit Ethernet transmit negative lane |
| Pino F1 | 10G_RX_P — 10 Gigabit Ethernet receive positive lane |
| Pino F2 | 10G_RX_N — 10 Gigabit Ethernet receive negative lane |
Aplicações típicas
P2040NSE7HLC é adequado para 6 aplicaçãos: Multi-Service Router Control Plane, LTE Base Station Baseband Processing, Network-Attached Storage (NAS) Controller, Industrial Ethernet Switch Control Plane, VPN Concentrator / SSL Gateway, Line-Card Controller in Modular Chassis.
Multi-Service Router Control Plane
The P2040NSE7HLC fits multi-service router control-plane workloads where four e500mc cores provide deterministic packet processing and the integrated SEC 4.2 engine offloads IPsec and SSL handshakes. The 10 Gigabit Ethernet MAC plus four Gigabit MACs give the SoC a wire-speed forwarding plane without an external switch ASIC, while three PCIe lanes accept expansion cards for additional WAN interfaces. Designers place the SoC on a 12+ layer PCB with split power planes for Vdd, GVDD, and the DDR3 supply, following NXP AN4325 routing guidelines. The same FCBGA-780 footprint also accepts the P2010 (dual-core) or P2020 (single-core), so OEMs can ship tiered SKUs from one board design.
Recomendado
LTE Base Station Baseband Processing
In LTE base-station applications, the P2040NSE7HLC's four e500mc cores at 1.2 GHz deliver the throughput required for Layer 2 MAC scheduling and Layer 1 baseband pre-processing. The dual-channel DDR3/3L controller with ECC provides the memory bandwidth needed for HARQ buffers and MAC PDUs, while the Serial RapidIO lanes link to a dedicated DSP or FPGA implementing the PHY. Operating temperature up to 105°C Tcase allows deployment in sealed outdoor radio units. The integrated SEC engine secures backhaul traffic between the eNodeB and the core network without burdening the cores with crypto tasks, freeing cores for scheduling and link-adaptation algorithms.
Recomendado
Network-Attached Storage (NAS) Controller
The P2040NSE7HLC is a strong fit for mid-range NAS controllers where the two SATA 2.0 ports and four Gigabit Ethernet MACs deliver the storage and network bandwidth needed for 4-8 bay consumer/SMB appliances. The four e500mc cores handle file-system operations, RAID parity calculations, and protocol offload (SMB/CIFS/NFS/iSCSI) concurrently, while the DDR3 controller with ECC protects in-memory metadata from soft errors. The integrated SEC engine accelerates encrypted volume support (e.g. LUKS or self-encrypting drive management) with negligible throughput penalty. Its 23 x 23 mm FCBGA package keeps the BOM cost competitive against discrete SoCs in this segment.
Recomendado
Industrial Ethernet Switch Control Plane
The P2040NSE7HLC serves as a management and control-plane CPU for managed industrial Ethernet switches. Its PCIe lanes accept a front-panel PHY/QSGMII switch ASIC, while the Gigabit Ethernet MACs serve as out-of-band management interfaces. Deterministic performance of the e500mc cores is well-suited to industrial protocols such as PROFINET, EtherNet/IP, and Modbus TCP routing layers. Hardware-assisted SEC accelerates TLS-based secure management interfaces, and the part's 105°C Tcase rating supports deployment in factory-floor enclosures with elevated ambient temperatures. The same FCBGA-780 package is offered across the P2 family, letting OEMs share PCB artwork across product tiers.
Recomendado
VPN Concentrator / SSL Gateway
The P2040NSE7HLC's integrated SEC 4.2 security engine accelerates IPsec, SSL/TLS, and SRTP handshakes at line rate, making it well-suited as the crypto core in VPN concentrators and SSL inspection gateways. Four e500mc cores handle session establishment and policy enforcement while the SEC engine performs bulk AES, 3DES, RSA, ECC, and SHA-2 operations. The 10 Gigabit Ethernet MAC forwards inspected traffic upstream, while PCIe lanes accept crypto accelerator cards or RAID storage for log retention. Engineers should pay attention to thermal design since SEC acceleration under load raises die temperature; the FCBGA package's 23 x 23 mm body needs a heatsink or cold plate in confined 1U chassis.
Recomendado
Line-Card Controller in Modular Chassis
The P2040NSE7HLC serves as a line-card controller CPU in modular telecom chassis where multiple P2040 instances each manage a slot's PHY, framer, and datapath ASICs. Three PCIe Gen2 lanes and three SRIO lanes offer flexible backplane interconnect to the switch fabric card, while dual DDR3 controllers provide per-card memory for OAM buffers, statistics, and forwarding tables. The coherent CoreNet fabric eliminates an external northbridge, simplifying the line-card BOM. Because the P2040 family shares pin compatibility with P2010/P2020, OEMs can ship a common line-card design in different compute tiers depending on slot bandwidth requirements.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para P2040NSE7HLC — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | P2040NSE7KLC | P2041NSE7MMC | P2020NSE2MMC | P2040NSN7MMC | P2010NSE2MMC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 780-FCBGA 23x23 mm | 780-FCBGA 23x23 mm - same | 780-FCBGA 23x23 mm - same | 780-FCBGA 23x23 mm - same | 780-FCBGA 23x23 mm - same | 780-FCBGA 23x23 mm - same |
| Core Count | 4 x e500mc | 4 x e500mc - same | 4 x e500mc - same | 1 x e500mc (-75%) | 4 x e500mc - same | 2 x e500mc (-50%) |
| Maximum Frequency | 1.2 GHz | 1.2 GHz - same | 1.2 GHz - same | 1.2 GHz - same | 1.2 GHz - same | 1.2 GHz - same |
| Memory Controller | Dual 64-bit DDR3/3L with ECC | Dual 64-bit DDR3/3L with ECC - same | Dual 64-bit DDR3/3L with ECC - same | Dual 64-bit DDR3/3L with ECC - same | Dual 64-bit DDR3/3L with ECC - same | Dual 64-bit DDR3/3L with ECC - same |
| Operating Temperature (Tcase) | 0C to 105C | -40C to 125C (extended) | 0C to 105C - same | 0C to 105C - same | 0C to 105C - same | 0C to 105C - same |
| Frame Manager / DPI | No | No - same | Yes (Frame Manager 2.0) | No - same | No - same | No - same |
| Silicon Revision | Rev 2.0 | Rev 2.0 - same | Rev 2.0 - same | Rev 2.0 - same | Rev 1.x | Rev 2.0 - same |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL |
Principais diferenciais
- Quad-core performance with extended-temperature option (vs P2040NSE7KLC)
- Frame Manager 2.0 DPI acceleration in pin-compatible upgrade (vs P2041NSE7MMC)
- Software and footprint scaling across P2 family (vs P2020NSE2MMC)
Notas de projeto
The 780-FCBGA package has a 0.8 mm ball pitch and 23 x 23 mm body. Design the PCB with at least 12 layers (8 routing + 4 power/ground), use laser-drilled microvias or stacked-via structures for the inner ball rows, and follow NXP AN4325 routing guidelines for the CoreNet fabric and DDR3 traces. Place bulk decoupling capacitors (10 uF ceramic plus 1 uF MLCC per rail) within 5 mm of each power ball cluster, and bond the thermal pad to an internal ground plane for heat spreading. Estimated: at 1.2 GHz with all cores active, expect 8-12 W device dissipation; use a heatsink or cold plate in sealed enclosures.
Operating temperature is rated at 0C to 105C Tcase. Measure Tcase at the centre of the package top with a calibrated thermocouple, not at the heatsink, since the die-to-case thermal resistance depends on package-specific internal TIM. Estimated: with a 4-layer internal ground plane and 1 oz copper, junction-to-case thermal resistance is roughly 0.4 C/W; for SEC-accelerator workloads add at least 30% thermal margin to ensure reliability over a 10-year service life. Derate clock frequency or disable cores if Tcase exceeds 95C under sustained load.
Do not route DDR3 traces across a power-plane split. The dual 64-bit DDR3/3L controllers require matched trace lengths within 50 mils and a 50 ohm single-ended impedance. A common pitfall is omitting the DDR3 VTT termination at the mid-point of byte lanes - this causes signal-integrity failures and intermittent write errors. Also remember the silicon revision matters: Rev 1.x (P2040NSN7MMC) and Rev 2.0 (P2040NSE7HLC) share the same package but differ in errata; mixing firmware trained on one revision may misbehave on the other.
Informações de conformidade
RoHS and REACH compliance status confirmed via NXP product page. Not AEC-Q100 qualified - the P2040NSE7KLC provides an extended-temperature grade but still is not AEC-Q100 qualified. For automotive networking designs consider NXP's automotive-qualified S32G family instead.
