P3041NXN7PNC - QorIQ P3 4-Core 1.5GHz SoC | NXP Semiconductors
N.º da peça: P3041NXN7PNC ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $320.05 | $320,05 |
| 10 | $304.05 | $3.040,50 |
| 100 | $288.05 | $28.805,00 |
| 500 | $272.04 | $136.020,00 |
| 1.000 | $256.04 | $256.040,00 |
P3041NXN7PNC Visão geral
A QorIQ communications processor is a system-on-chip (SoC) that integrates CPU cores, memory controllers, and high-speed serial interfaces for wired and wireless infrastructure. The P3 sub-family sits within the broader QorIQ taxonomy (communications processor -> multicore SoC -> application-specific microprocessor), positioning the part between NXP's lower-power P1/P2020 dual-core devices and the higher-end P4040/P4080 eight-core family.
Key features include hardware-accelerated packet processing, three-level cache hierarchy inherited from the P4 platform, dual DDR3/DDR3L memory controllers with ECC, multiple PCI Express Gen 2 controllers, SATA 2.0, Serial RapidIO (SRIO), and integrated 1 GbE and 10 GbE Ethernet MACs. The device is fabricated in a 45 nm process, balancing performance with power efficiency for thermally constrained enclosures.
Architecturally, the P3041 combines four Power Architecture e500mc cores sharing a coherent triple-level cache to accelerate multi-threaded packet processing while exposing accelerators such as the Data Path Acceleration Architecture (DPAA) for cryptographic, pattern-match, and queue management offload. This makes the silicon well suited to line-card, control-plane, and appliance platforms where deterministic throughput matters more than peak instruction throughput.
Typical applications include enterprise routers and switches, wireless base stations, network-attached storage controllers, industrial control planes, and aerospace/defense embedded compute modules. Engineers select the P3041 when a quad-core Power Architecture design is required at lower power and cost than the eight-core P4080, while retaining the same software ecosystem.
When laying out the PCB, allocate at least four PCB layers for the FCPBGA breakout, follow NXP's power-rail sequencing recommendation, and provide sufficient bulk capacitance near the DDR3 interface to meet signal-integrity targets. Thermal management should assume up to the package's maximum T_J rating.
This page synthesizes NXP datasheet information, distributor stock and pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a consolidated engineering reference for the P3041NXN7PNC.
Alternativas drop-in para P3041NXN7PNC — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
P3041NSE7PNC
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
P3041NSN7PNC
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
P3041NXN7PNC Classificações máximas e características elétricas
| Architecture | 32-bit Power Architecture (e500mc) |
| Core Family | QorIQ P3 |
| Number of Cores | 4 |
| Core Frequency (max) | 1.5 GHz |
| Silicon Revision | Rev 2 |
| Process Technology | 45 nm |
| Encapsulamento | 1295-FCPBGA (37.5 x 37.5 mm) |
| Temperatura de operação | -40C to +105C |
| Memory Interface | DDR3 / DDR3L with ECC |
| PCI Express | PCIe Gen 2 controllers |
| Ethernet | 1 GbE and 10 GbE MACs |
| Serial Interfaces | SATA 2.0, Serial RapidIO (SRIO) |
| Tipo de montagem | Surface Mount (FCPBGA) |
Guia de Configuração de Pinos do P3041NXN7PNC 1295-fcpbga (37.5 x 37.5 mm)
Configuração de pinos para P3041NXN7PNC (pacote 1295-fcpbga (37.5 x 37.5 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para P3041NXN7PNC.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
P3041NXN7PNC é adequado para 6 aplicaçãos: Enterprise Router Control Plane, Wireless Base Station Baseband, Network-Attached Storage Controller, Industrial Control and Automation, Aerospace and Defense Embedded Compute, Data Center Appliance Line Card.
Enterprise Router Control Plane
The P3041NXN7PNC fits enterprise router control-plane designs because its four 1.5 GHz e500mc cores deliver the parallel packet-processing throughput required for routing-table management, OSPF/BGP convergence, and ACL lookups, while the integrated 1 GbE / 10 GbE MACs and PCIe Gen 2 controllers attach directly to line cards and switch fabrics without external bridges. DPAA offload engines free the cores from queue, buffer, and cryptographic housekeeping so the cores stay focused on control-plane state. Estimated: 4 cores at 1.5 GHz provide roughly 4x the thread parallelism of a single-core control-plane CPU, while keeping board complexity low by absorbing PHY, MAC, and PCIe functions. Compared with a CPU + external switching ASIC architecture, the P3041NXN7PNC reduces the bill of materials and the PCB layer count.
Recomendado
Wireless Base Station Baseband
The P3041NXN7PNC suits wireless base station baseband processing where the four cores handle PHY-layer scheduling, MAC scheduling, and backhaul packetization concurrently. Its DDR3/3L controllers with ECC provide the memory bandwidth and integrity needed for high-throughput LTE or 5G NR baseband buffers, while the -40C to +105C temperature range tolerates outdoor cabinet environments. Serial RapidIO links the SoC to DSP/FPGA accelerators for PHY processing, reducing latency versus external Ethernet. Estimated: at 1.5 GHz each core, the P3041NXN7PNC delivers enough single-thread performance for baseband scheduling without an external CPU. Compared with discrete CPU plus DSP designs, this integrated approach cuts power and board area.
Recomendado
Network-Attached Storage Controller
The P3041NXN7PNC is well matched to NAS controllers because the four cores parallelize file-system metadata operations, RAID rebuilds, and iSCSI/NFS request handling, while the SATA 2.0 ports attach directly to drive backplanes and the 10 GbE MAC uplinks the storage array to the network. ECC-protected DDR3 ensures data integrity under heavy I/O load. DPAA accelerators offload checksum and cryptographic operations that saturate NAS throughput. Estimated: four cores can sustain higher concurrent SMB/NFS connections than dual-core controllers before queueing delays appear. Compared with x86-based NAS SoCs, the P3041NXN7PNC typically draws less power per stored gigabyte.
Recomendado
Industrial Control and Automation
The P3041NXN7PNC supports industrial control and automation applications because its industrial -40C to +105C temperature range and four-core processing deliver deterministic multi-axis motion control and protocol translation. PCIe and SRIO interfaces connect to FPGA-based I/O modules, while dual GbE ports handle deterministic industrial Ethernet protocols such as EtherCAT, PROFINET, or TSN. The Power Architecture ecosystem offers long-term support for industrial certification. Estimated: four cores allow separate tasks for real-time control, safety logic, and HMI without missing cycle deadlines. Compared with microcontroller + ASIC architectures, the SoC integration reduces board complexity and certification overhead.
Recomendado
Aerospace and Defense Embedded Compute
The P3041NXN7PNC serves aerospace and defense embedded compute platforms where SWaP-C (size, weight, power, and cost) constraints favor an integrated SoC. The four cores run mission software, sensor fusion, and crypto tasks in parallel, while the ruggedized -40C to +105C temperature envelope supports avionics and ground-vehicle deployments. SRIO links connect to MIL-STD-1553 or ARINC 429 interface cards. Estimated: the SoC's high level of integration reduces PCB real estate versus discrete CPU + memory + I/O designs, critical in vibration-prone enclosures. Compared with conduction-cooled x86 boards, the QorIQ P3 typically cuts power by 30-50 percent per equivalent workload.
Recomendado
Data Center Appliance Line Card
The P3041NXN7PNC fits data-center appliance line cards that need line-rate encryption, packet inspection, and storage offload. The four cores sustain inline cryptographic and compression workloads, while DPAA engines accelerate pattern matching and queue management at multi-gigabit rates. PCIe Gen 2 lanes connect to host servers or switch ASICs, and 10 GbE MACs provide northbound uplinks. Estimated: four cores at 1.5 GHz can sustain roughly 4-8 Gbps of inline IPSec throughput depending on cipher suite. Compared with discrete CPU plus cryptographic accelerator cards, the integrated SoC simplifies BOM and reduces per-port cost.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para P3041NXN7PNC — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | P3041NSE7PNC | P3041NSN7PNC |
|---|---|---|---|
| Package | 1295-FCPBGA (37.5x37.5 mm) | 1295-FCPBGA - same | 1295-FCPBGA - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Family | QorIQ P3 (e500mc) | QorIQ P3 (e500mc) | QorIQ P3 (e500mc) |
| Number of Cores | 4 | 4 | 4 |
| Core Frequency (max) | 1.5 GHz | 1.5 GHz (similar grade) | ~1.3 GHz (lower speed grade, ~10-15% less) |
| Memory Interface | DDR3/DDR3L with ECC | DDR3/DDR3L with ECC | DDR3/DDR3L with ECC |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy |
Principais diferenciais
- Established four-core QorIQ P3 silicon with mature DPAA offload engines (vs P2020)
- Lower power and cost than the eight-core P4080 (vs P4080)
- Integrated 10 GbE MACs reduce external PHY count (vs Discreet CPU + external switch ASIC)
Notas de projeto
Estimated: at typical 8-12 W SoC power dissipation with all four cores active, the FCPBGA package requires a substantial copper thermal pad and, in most chassis, a heatsink to keep junction temperature within the -40C to +105C range. Place thermal vias in a 1.2 mm grid directly under the die flag, per NXP hardware design guidelines. Without adequate cooling, sustained 1.5 GHz operation can push T_J above rated limits in sealed enclosures.
The 1295-ball FCPBGA at 1.0 mm pitch demands at least a 6-layer PCB stack-up with microvia-in-pad construction. Route DDR3 signals first with length matching within 25 mils on the byte lanes and 50 mils across byte groups, and isolate analog, SerDes, and clock domains with ground guard traces. Follow NXP's reference design for the DDR3/3L topology including VTT termination and reference voltages.
Sequence the P3041NXN7PNC rails per the NXP datasheet power-up order to avoid latch-up; use a system PMIC or sequenced LDOs and assert POR only after all rails are stable. Place 10 uF + 1 uF + 0.1 uF ceramic bypass on every voltage pin within 5 mm, and add bulk polymer capacitors on the core rail to absorb load steps when cores enter active states.
The 10 GbE SGMII / XAUI / KR SerDes lanes require controlled-impedance routing with reference planes kept intact; avoid crossing SerDes lanes over power-plane splits. Use the IBIS-AMI models from NXP for channel simulation, and pre-emphasize SerDes outputs based on channel loss to meet IEEE 802.3 link training targets.
Avoid running out-of-tree firmware builds on production hardware - use the NXP SDK for QorIQ P3 to ensure DPAA drivers, u-boot, and Linux kernel are validated against the silicon revision 2 part. Skipping validation can mask subtle issues like SerDes PLL lock failures or DDR3 training errors that surface only at temperature extremes.
Informações de conformidade
Compliance fields are not stated in the verified web data; mark as unknown. AEC-Q100 is not applicable for industrial communications processors. Refer to NXP's product documentation for full compliance declarations.
