P4081NSN7MMC - 8-Core QorIQ P4 1.2GHz SoC | NXP Semiconductors
N.º da peça: P4081NSN7MMC ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $269.5 | $2.695,00 |
| 100 | $250.75 | $25.075,00 |
| 500 | $235.2 | $117.600,00 |
| 1.000 | $222.4 | $222.400,00 |
P4081NSN7MMC Visão geral
A QorIQ communications SoC is a high-performance multi-core processor designed for networking, telecom, and embedded data-plane workloads where deterministic throughput, hardware acceleration, and rich I/O are equally important to raw CPU frequency. Within the power-management taxonomy the P4081 sits at the intersection of MPU (microprocessor unit), multicore SoC, and communications platform. The QorIQ family as a whole replaced the legacy PowerQUICC line and is positioned between general-purpose application processors and dedicated network ASICs.
Key features of the P4081 include eight e500mc cores with hardware hypervisor and virtualization support, dedicated L2 cache, a 64-bit DDR2/3 memory controller with ECC, multiple GbE and 10 Gigabit Ethernet MACs, PCIe Gen1/Gen2, and Serial RapidIO 1.3 interfaces. The chip is fabricated in a 45 nm CMOS process and requires 1.5 V, 1.8 V, 2.5 V and 3.3 V power rails. The combination of dual-cluster quad-core topology and a hardware-accelerated datapath makes it well suited to control-plane and data-plane workloads running concurrently.
Architecturally the P4081 places cores, L2 cache, the memory controller and the network/IO fabric on a single die; the Corenet coherent fabric allows each core to share memory and accelerator resources without software coherence management overhead. This tightly integrated SoC design removes the chip-to-chip latency of multi-chip designs used in earlier PowerPC platforms.
Typical applications of the P4081NSN7MMC include enterprise routers and switches, multi-service gateways, wireless baseband controllers, network security appliances, and industrial control or storage controllers that require both high compute density and rich packet-oriented IO.
When designing with this device, allocate the largest copper plane to the 1.5 V and 1.8 V cores because the 45 nm process is sensitive to supply noise; a 12+ layer PCB with buried capacitance is recommended for layout, and the BGA requires a socket or direct solder attach.
This page synthesizes distributor availability, supply-chain status, and pin-compatible QorIQ family variants not consolidated in the original NXP datasheet, giving you a one-stop reference for sourcing and replacement decisions.
Alternativas drop-in para P4081NSN7MMC — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com P4081NSN7MMC (mesmo formato e footprint) — diferindo em Ethernet, Mounting Type, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
P4081NSN7KKC
✅ Drop-In✓ Em estoque
$138.9 / unidade
Ver ficha técnica →P4040NSN7MMC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P4080NSN7MMC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P4081NSE7MMC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P4081NSE7KKC
✅ Drop-In✓ Em estoque
$170 / unidade
Ver ficha técnica →P4081NSN7MMC Classificações máximas e características elétricas
| Core Architecture | PowerPC e500mc |
| Core Count | 8 |
| Maximum Core Frequency | 1.2 GHz |
| Largura do barramento de dados | 32-bit |
| Family | QorIQ P4 |
| Memory Controller | DDR2/DDR3 with ECC (64-bit) |
| Ethernet | 1 GbE and 10 GbE (multiple MACs) |
| PCIe | PCI Express Gen1/Gen2 |
| Serial RapidIO | SRIO 1.3 |
| Process Technology | 45 nm CMOS |
| Supply Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Temperatura de operação | 0°C to +105°C |
| Encapsulamento | 1295-ball FCBGA |
| Package Size | 37.5 x 37.5 mm |
| Tipo de montagem | Surface Mount |
Guia de Configuração de Pinos do P4081NSN7MMC 37.5 x 37.5 mm
Configuração de pinos para P4081NSN7MMC (pacote 37.5 x 37.5 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para P4081NSN7MMC.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
P4081NSN7MMC é adequado para 6 aplicaçãos: Enterprise Routers and Switches, Multi-Service Gateways, Wireless Baseband Controllers, Network Security Appliances, Industrial Control and Storage Controllers, Aerospace and Defense Data Planes.
Enterprise Routers and Switches
The P4081NSN7MMC's eight e500mc cores at 1.2 GHz, integrated 10 GbE MACs, and SerDes lanes for PCIe and Serial RapidIO make it a natural fit for enterprise router and switch control planes. The 64-bit DDR3 controller with ECC supports deep routing tables and ACL lookups at line rate without external memory. Coherent L2 cache across cores simplifies multi-core routing protocol stacks, while the SEC 5.x engine accelerates IPsec and MACsec for VPN-capable branch routers. The 1295-FCBGA package exposes enough SerDes for multiple 10 GbE SFP+ uplinks plus stacking ports.
Recomendado
Multi-Service Gateways
Multi-service gateways that terminate DSL, fiber, and LTE traffic on a single chassis benefit from the P4081NSN7MMC's mix of high compute density and rich I/O. With eight cores plus hardware queues and SEC engines, the device can simultaneously run routing, NAT, deep packet inspection, and IPsec termination without software context-switch stalls. The integrated PCIe Gen2 root complex enables attachment of Wi-Fi, DSL, or DOCSIS MAC silicon. Heisener pricing of approximately $235 at 500-piece quantities keeps the BOM manageable for branch-office SKUs.
Recomendado
Wireless Baseband Controllers
In LTE small-cell and 5G baseband subsystems, the P4081NSN7MMC serves as the real-time baseband controller alongside DSP or ASIC accelerators. The Serial RapidIO fabric is ideal for low-latency chip-to-chip links to PHY and DSP devices, while PCIe connects to RF front-end cards and backhaul interfaces. Eight cores at 1.2 GHz handle Layer-2/3 stacks, OAM, and timing-sensitive scheduler logic in parallel. The 0°C to +105°C commercial grade is well matched to climate-controlled operator equipment rooms.
Recomendado
Network Security Appliances
The P4081NSN7MMC's on-die SEC 5.x engine accelerates bulk encryption for next-generation firewalls and UTM appliances, including IPsec, SSL/TLS, MACsec, and SRTP. Combined with eight e500mc cores that can run pattern matching and DPI workloads, the device offers inline throughput without an offload coprocessor. The 10 GbE MACs handle north-south traffic at line rate, while PCIe expansion slots support additional crypto accelerators. For VPN concentrators, the 64-bit DDR3 controller with ECC ensures large session table lookups remain error-free.
Recomendado
Industrial Control and Storage Controllers
Industrial control and storage systems benefit from the P4081NSN7MMC's deterministic multi-core topology and PCI Express for storage and peripheral expansion. Eight e500mc cores run deterministic control loops while leaving headroom for management, telemetry, and protocol stacks. The integrated DDR3/ECC controller hosts RAMdisk-based logging without external memory chips. Industrial chassis leveraging the 1295-FCBGA package typically pair it with SATA or SAS controllers over PCIe to deliver NAS or SAN aggregation products. The NXP Linux SDK provides long-term kernel support for industrial software maintenance windows.
Recomendado
Aerospace and Defense Data Planes
Defense and aerospace platforms that require deterministic data-plane processing rely on the P4081NSN7MMC's eight-core e500mc architecture paired with hardware SEC engines for encrypted telemetry, mission computer, and unmanned vehicle command/control links. The FCBGA package withstands high-vibration environments when properly socketed or board-mounted with underfill. Serial RapidIO is the standard interconnect for mission-critical avionics buses. NXP's extended life-cycle support programs and the ruggedized -E variants give defense integrators a longer field-deployment window. Estimated power dissipation of 25-30 W aligns with avionics thermal envelopes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para P4081NSN7MMC — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | P4081NSN7KKC | P4040NSN7MMC | P4080NSN7MMC | P4081NSE7MMC |
|---|---|---|---|---|---|
| Package | 1295-FCBGA (37.5x37.5) | 1295-FCBGA (37.5x37.5) - same | 1295-FCBGA (37.5x37.5) - same | 1295-FCBGA (37.5x37.5) - same | 1295-FCBGA (37.5x37.5) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Count | 8 | 8 | 4 (-50%) | 8 | 8 |
| Maximum Core Frequency | 1.2 GHz | 1.5 GHz (+25%) | 1.2 GHz | 1.2 GHz | 1.2 GHz |
| SEC Encryption Engine | Enabled (SEC 5.x) | Enabled (SEC 5.x) | Enabled (SEC 5.x) | Disabled | Enabled (SEC 5.x) |
| Operating Temperature | 0°C to +105°C | 0°C to +105°C | 0°C to +105°C | 0°C to +105°C | -40°C to +105°C (extended) |
| DDR Memory Support | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Lifecycle Status | Last Time Buy (EOL) | Last Time Buy (EOL) | Last Time Buy (EOL) | Last Time Buy (EOL) | Last Time Buy (EOL) |
Principais diferenciais
- Encryption-enabled 8-core variant (vs P4080NSN7MMC)
- Higher clock-grade availability (vs P4081NSN7KKC vs P4081NSN7MMC)
- Extended temperature option (vs P4081NSE7MMC vs P4081NSN7MMC)
Notas de projeto
Estimated: the P4081NSN7MMC dissipates approximately 25-30 W under full multi-core load. The 1295-FCBGA package has a typical theta-JA of 9-12 °C/W on a JEDEC 8-layer test board with airflow, which yields a junction-to-ambient rise of approximately 30 °C/W × 27 W = 225 °C at 25 °C ambient — clearly above safe limits without a heatsink or heat-spreader. Always specify a lid-down integrated heat spreader or TIM-2 thermal interface to a finned heatsink for production deployments.
The 1.0 mm pitch 1295-ball FCBGA requires a 12+ layer PCB stack-up with high-performance FR-4 or low-loss dielectric, buried capacitance for the 1.5 V/1.8 V core rails, and microvia-in-pad escaping for BGA signal breakout. Per NXP's hardware design guide, allocate the largest copper plane to the Vcore and GVDD rails and use 10+ vias per ball for power/ground. Pre-tin the BGA pads using the manufacturer's recommended profile because the 45 nm silicon is sensitive to thermal shock.
The P4081NSN7MMC requires sequenced 1.5 V, 1.8 V, 2.5 V and 3.3 V rails with strict ramp-ordering to avoid latch-up. Estimated: at 25 W board power, the 1.5 V Vcore rail must deliver at least 8 A continuous. Use a multiphase buck regulator with monolithic power stages for Vcore (such as TI's TPS40422), and pair it with bulk ceramic capacitors for load-step transients. Place decoupling within 100 mils of each BGA via with a 0.1 µF + 10 µF + 100 µF capacitor stack.
Watch for these common pitfalls: (1) enabling SEC 5.x encryption in software without licensing the appropriate NXP binary blob — the boot process will hang; (2) misconfiguring the DDR3 controller for ECC when SO-DIMMs lack parity bits, causing intermittent memory errors; (3) using a non-NXP-recommended thermal interface material that voids the FCBGA lid solder-joint reliability over thermal-cycling test. Always refer to the latest revision of the NXP QorIQ P4 hardware specifications.
Informações de conformidade
RoHS and REACH compliance per NXP environmental data portal. Lead-free (Pb-free) solder balls. Halogen-free status not explicitly listed in the cited sources. Conflict-minerals statement per NXP standard policy.
