P5010NSN1QMB - QorIQ P5010 SoC, 64-bit Power Arch, 2.0GHz, 1295-FCBGA | NXP
N.º da peça: P5010NSN1QMB ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $425 | $425,00 |
| 10 | $395.5 | $3.955,00 |
| 100 | $360 | $36.000,00 |
| 500 | $335.75 | $167.875,00 |
| 1.000 | $318.25 | $318.250,00 |
P5010NSN1QMB Visão geral
A QorIQ communications processor is a multi-core Power Architecture SoC family from NXP designed for networking, wireless base-station, and embedded infrastructure applications. QorIQ P-series parts sit in the system hierarchy as application processors -> communications processors -> SoC -> NXP QorIQ family, integrating CPU cores, memory controllers, high-speed SerDes, packet-processing accelerators, and peripheral IP into a single chip to reduce board area and BOM.
Key features include one e5500 core built on Power Architecture technology, 32 KB I-cache and 32 KB D-cache per core, a shared 1 MB L2 frontside cache, the DPAA (Data Path Acceleration Architecture) engine, on-chip SEC crypto engine, and multiple high-speed SerDes lanes configurable as PCIe, SRIO, or Aurora. The 1295-FCBGA package exposes the full complement of SerDes lanes and external memory interfaces required for high-end networking line cards.
The P5010 is architected around a coherent SMP fabric connecting the e5500 core to memory and I/O controllers. The e5500 core is dual-issue, out-of-order, and supports hardware virtualization, hypervisor extensions, and AltiVec SIMD-style DSP operations. Integrated DPAA provides packet parsing, queue management, and buffer management without consuming CPU cycles, freeing the core for control-plane and exception processing.
Typical applications include enterprise routing and switching line cards, wireless baseband processing (3G/4G small-cell), network-attached storage controllers, industrial embedded control with deterministic networking, and secure gateway appliances. The standard temperature grade (0 to 105C) targets commercial and industrial networking equipment rather than fully automotive environments.
When designing with the P5010, route DDR3 traces with matched length and 50-ohm controlled impedance. Use a multi-layer PCB with dedicated ground planes adjacent to the high-speed SerDes lanes. Provide a heatsink or thermal interface to manage the 30W+ TDP at full 2.0 GHz operation, and follow NXP layout guidelines for the FCBGA substrate.
This page synthesizes distributor stock, parametric proximity to others in the same package family, and practical design guidance not found in the manufacturer datasheet, giving engineers an actionable reference alongside the official document.
Alternativas drop-in para P5010NSN1QMB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com P5010NSN1QMB (mesmo formato e footprint) — diferindo em Core Architecture, Package, Manufacturer, Mounting Type, Number of Cores.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
P5020NSN1QMB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P5010NSN1MMB
✅ Drop-In✓ Em estoque
$205 / unidade
Ver ficha técnica →P5020NSN1MMB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P5010NSN1QMB Classificações máximas e características elétricas
| Architecture | Power Architecture e5500 (64-bit) |
| Core Count | 1 core |
| Maximum Core Frequency | 2.0 GHz |
| Cache (L1 Instruction per core) | 32 KB |
| Cache (L1 Data per core) | 32 KB |
| Cache (L2 shared frontside) | 1 MB |
| Memory Controller | DDR3 with ECC support |
| PCIe | PCI Express Gen 2 controllers integrated |
| Ethernet | Dual Gigabit Ethernet |
| High-Speed Interconnect | Serial RapidIO (SRIO) |
| Hardware Acceleration | DPAA (Data Path Acceleration Architecture) engine |
| Security Engine | SEC crypto engine integrated |
| Encapsulamento | 1295-FCBGA (37.5 x 37.5 mm) |
| Temperatura de operação | 0C to +105C |
| Encryption | Hardware-accelerated |
Guia de Configuração de Pinos do P5010NSN1QMB 1295-fcbga (37.5 x 37.5 mm)
Configuração de pinos para P5010NSN1QMB (pacote 1295-fcbga (37.5 x 37.5 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para P5010NSN1QMB.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
P5010NSN1QMB é adequado para 6 aplicaçãos: Enterprise Routing and Switching Line Cards, Wireless Base Station (4G Small-Cell), Network-Attached Storage (NAS) Controller, Industrial Deterministic Networking Gateways, Secure Gateway and VPN Appliance, Embedded Avionics and Defense Networking.
Enterprise Routing and Switching Line Cards
The P5010NSN1QMB's integrated DPAA packet processing engine, dual Gigabit Ethernet MACs, and SerDes lanes configurable as PCIe or SRIO make it ideal for mid-range enterprise router and switch line cards. The single e5500 core handles the control plane (routing protocol daemons, management plane, exception packets), while DPAA offloads the data plane at line rate. The DDR3 ECC memory controller supports deep routing tables without parity errors. Compared to a software-only forwarding architecture, the DPAA offload typically frees 60-70% of CPU cycles for control-plane and security processing.
Recomendado
Wireless Base Station (4G Small-Cell)
The P5010NSN1QMB is a strong fit for 4G small-cell baseband processing where its AltiVec-style SIMD DSP extensions accelerate turbo-decoding and FFT operations, and the SEC engine handles the radio interface encryption. The integrated SRIO interfaces connect to baseband DSP co-processors or RF front-end ASICs. Operating at 0 to 105C, the standard temperature grade fits outdoor small-cell enclosures with appropriate thermal design. For full 5G small-cell workloads, the dual-core P5020 on the same footprint doubles the throughput.
Recomendado
Network-Attached Storage (NAS) Controller
The P5010NSN1QMB can act as the main CPU in a network-attached storage controller where its e5500 core runs a Linux NAS software stack, the integrated GbE MACs serve client traffic, and the SerDes lanes connect to a SAS/SATA controller ASIC. The SEC engine handles encrypted volumes and TLS-accelerated SMB/NFS transfers. DDR3 with ECC supports large memory caches that accelerate RAID rebuild and ZFS deduplication. Compared to ARM-based NAS processors, the Power Architecture core delivers higher single-thread throughput for metadata operations.
Recomendado
Industrial Deterministic Networking Gateways
The P5010NSN1QMB's hardware-accelerated encryption, deterministic SRIO interfaces, and ruggedized 0 to 105C temperature grade make it suitable for industrial gateways bridging factory floor protocols (EtherCAT, PROFINET, EtherNet/IP) to enterprise networks. The single e5500 core runs gateway firmware deterministically while the integrated GbE and PCIe ports connect to radio modules, sensors, and HMI panels. Compared to general-purpose Cortex-A gateways, the Power Architecture core offers stronger real-time interrupt latency guarantees.
Recomendado
Secure Gateway and VPN Appliance
The integrated SEC crypto engine on the P5010NSN1QMB accelerates IPsec, TLS, and MACsec at multi-Gigabit line rates, while the e5500 core runs the gateway control-plane software stack. Dual GbE ports provide WAN and LAN separation; PCIe lanes connect to crypto accelerators or additional NICs. The DDR3 ECC memory controller prevents bit-flip-induced crypto key corruption. Compared to x86 VPN appliances, the QorIQ SoC delivers higher crypto throughput per watt, enabling fanless industrial deployment.
Recomendado
Embedded Avionics and Defense Networking
With its deterministic SRIO interfaces, hardware-accelerated SEC encryption, and 0 to 105C operating temperature range, the P5010NSN1QMB is deployed in defense and avionics networking subsystems where deterministic latency, ruggedized temperature, and long product lifecycle matter more than raw clock speed. The e5500 core runs VxWorks or INTEGRITY RTOS with DO-178 certifiable evidence. Compared to consumer-grade CPUs, the QorIQ lifecycle support extends 10+ years and the Power Architecture delivers higher determinism than Cortex-A.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para P5010NSN1QMB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | P5020NSN1QMB | P5010NSN1MMB | P5020NSN1MMB |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Package | 1295-FCBGA (37.5x37.5) | 1295-FCBGA (37.5x37.5) - same | 1295-FCBGA (37.5x37.5) - same | 1295-FCBGA (37.5x37.5) - same |
| Core Count | 1 core | 2 cores | 1 core | 2 cores |
| Maximum Core Frequency | 2.0 GHz | 2.0 GHz | 1.6 GHz | 1.6 GHz |
| Architecture | Power Architecture e5500 | Power Architecture e5500 | Power Architecture e5500 | Power Architecture e5500 |
| L2 Cache | 1 MB shared frontside | 1 MB shared frontside | 1 MB shared frontside | 1 MB shared frontside |
| DPAA Acceleration | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C |
| Memory Controller | — | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC |
Principais diferenciais
- Integrated DPAA packet processing offload engine (vs P5020NSN1QMB)
- Single-core SKU for power-constrained designs (vs P5020NSN1QMB)
- NXP QorIQ long-lifecycle support (vs Generic ARM Cortex-A communications processors)
Notas de projeto
The P5010NSN1QMB requires a high-density multi-layer PCB (typically 12+ layers) with dedicated ground planes adjacent to the SerDes and DDR3 routing layers. Maintain 50-ohm controlled impedance on all SerDes lanes (PCIe Gen 2 rated at 5 Gbps; SRIO rated up to 5 Gbps). Match DDR3 trace lengths within the skew budget specified in the NXP QorIQ P5010 Hardware Specifications document. Use a PCB stackup designer tool to validate the stackup before fabrication.
Estimated: at full 2.0 GHz operation with typical software load, the P5010NSN1QMB dissipates 25-35 W. Mount a passive heatsink with thermal interface material on the FCBGA top side, or design the chassis for active airflow across the SoC. The 0 to 105C standard temperature grade allows commercial and industrial deployments but does NOT cover automotive; choose the AEC-Q100 qualified T-series if automotive compliance is required.
Provide multiple low-voltage rails (typically 1.0V core, 1.5V DDR3, 1.8V/3.3V I/O) with bulk decoupling within 25 mm of the FCBGA. Use a sequenced power controller (such as NXP's PF0100 or compatible PMIC) to ensure core voltage ramps before I/O voltage per the QorIQ power-up specification. Place 0.1uF and 10uF decoupling capacitors adjacent to every power pin per the reference design.
Do not confuse P5010 part-number suffixes: the "N1" speed grade is 1.6 GHz core / 1.2 GHz platform, while "N1QMB" denotes the qualified standard-temperature variant. Do not substitute the extended-temperature "C" or "E" variants without verifying the boot ROM and SEC engine firmware are compatible. Do not omit the mandatory reset supervisor and JTAG connector; without JTAG, recovery from a misconfigured RCW (Reset Configuration Word) requires an external programmer.
Informações de conformidade
RoHS and REACH compliant per NXP product declaration. Standard temperature grade (0 to 105C) - not AEC-Q100 automotive qualified; choose T-series for automotive. Conflict minerals declaration on file per NXP corporate policy.
