PIC16CR76-I/ML - 8-Bit 14KB ROM MCU 28-QFN | Microchip
N.º da peça: PIC16CR76-I/ML ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.42 | $6,42 |
| 10 | $5.78 | $57,80 |
| 100 | $5.21 | $521,00 |
| 500 | $4.69 | $2.345,00 |
| 1.000 | $4.18 | $4.180,00 |
PIC16CR76-I/ML Visão geral
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, program memory, RAM, peripherals and I/O on one die. The PIC16CR76-I/ML specifically uses Microchip's RISC-based PIC16C7X architecture, where an external resonator or internal oscillator clocks a 14-bit instruction word core. The 'CR' suffix designates ROM program memory (factory-masked), as opposed to 'F' (Flash) or 'C' (EPROM) variants in the same pinout. 8-bit MCUs sit at the base of the embedded hierarchy: 8-bit MCU -> microcontroller -> embedded processor -> semiconductor IC.
Key features of the PIC16CR76-I/ML include five 8-bit I/O ports, a 10-bit multi-channel Analog-to-Digital Converter, two Capture/Compare/PWM modules, a synchronous/asynchronous USART port (SCI), and a master Synchronous Serial Port (SSP) supporting SPI and I2C. The device supports up to 20 MHz clock operation, providing 5 MIPS of throughput, and operates from 2.5V to 5.5V. Power management is handled by dual on-chip oscillator modes and a watchdog timer with its own on-chip RC oscillator.
The PIC16CR76-I/ML uses Harvard architecture with separated program and data buses, which allows instruction fetch and data access to occur in the same instruction cycle - a hallmark of the PIC16 mid-range family. Built-in in-circuit debugging (ICD) capability via two I/O pins and a hardware breakpoint simplify firmware development. The 28-QFN package provides compact surface-mount integration and exposes a thermal pad for improved heat dissipation in industrial environments.
Typical applications include motor control (small DC and stepper drivers), industrial automation sensor interfaces, automotive body electronics, appliance control boards, security and alarm panels, and consumer remote controls. The masked-ROM version is chosen when production volume justifies a one-time factory mask charge to minimize per-unit cost compared with Flash PIC16F76 equivalents.
Design considerations: ensure the 28-QFN ground pad is soldered to a sufficiently large copper pour for thermal relief; use decoupling capacitors (100 nF ceramic plus 10 uF bulk) within 5 mm of VDD/AVDD pins; and choose mask-ROM parts only when firmware is fully stable, since masked parts cannot be reprogrammed in the field. This page synthesizes distributor pricing, package-compatible alternatives, and design notes that go beyond the datasheet itself.
This page synthesizes distributor pricing, drop-in PIC16F76 Flash equivalents, and practical design notes not found in the manufacturer datasheet, helping procurement and firmware teams evaluate the PIC16CR76-I/ML in context.
Alternativas drop-in para PIC16CR76-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16CR76-I/ML (mesmo formato e footprint) — diferindo em Package, Serial Interfaces, Core Architecture, ADC, Timers.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16F76-I/ML
✅ Drop-In✓ Em estoque
$1.95 / unidade
Ver ficha técnica →PIC16C76-20I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F876A-I/ML
✅ Drop-In✓ Em estoque
$5.4 / unidade
Ver ficha técnica →PIC16F886-I/ML
✅ Drop-In✓ Em estoque
$2.18 / unidade
Ver ficha técnica →PIC16C76T-04I/SO
✅ Drop-In✓ Em estoque
$4.45 / unidade
Ver ficha técnica →PIC16C77-10I/P
✅ Drop-In✓ Em estoque
$6.1 / unidade
Ver ficha técnica →PIC16CR76-I/ML Classificações máximas e características elétricas
| Core Architecture | PIC16C7X 8-bit RISC (14-bit instruction word) |
| Program Memory | 14 KB ROM (masked, factory-programmed) |
| RAM | 368 bytes |
| Data EEPROM | 256 bytes (internal emulation via flash program memory reads) |
| Operating Frequency | DC to 20 MHz |
| Instruction Throughput | 5 MIPS @ 20 MHz |
| Supply Voltage (VDD) | 2.5 V to 5.5 V |
| I/O Pins | 22 (bidirectional, 5 ports) |
| Timers | 3 (Timer0 8-bit, Timer1 16-bit, Timer2 8-bit with PWM) |
| Capture/Compare/PWM | 2 CCP modules |
| Analog-to-Digital Converter | 10-bit, 8 channels |
| Serial Interfaces | AUSART (SCI), SSP (SPI / I2C) |
| Temperatura de operação | -40 C to +85 C (Industrial) |
| Encapsulamento | 28-pin QFN (HVQCCN, 6x6 mm, ML suffix) |
| Tipo de montagem | Surface Mount |
| Nível MSL | MSL3 (JEDEC J-STD-020) |
| Status RoHS | Compliant |
| Watchdog Timer | Yes, with dedicated on-chip RC oscillator |
Configuração de pinos do PIC16CR76-I/ML
| Pino 1 | MCLR/VPP — Master Clear (reset) input / programming voltage |
| Pino 2 | RA0/AN0 — Port A bit 0 / Analog input channel 0 |
| Pino 3 | RA1/AN1 — Port A bit 1 / Analog input channel 1 |
| Pino 4 | RA2/AN2 — Port A bit 2 / Analog input channel 2 |
| Pino 5 | RA3/AN3/VREF+ — Port A bit 3 / Analog input channel 3 / ADC VREF+ |
| Pino 6 | RA4/T0CKI — Port A bit 4 / Timer0 clock input |
| Pino 7 | RA5/AN4/SS — Port A bit 5 / Analog input channel 4 / SPI slave select |
| Pino 8 | OSC1/CLKIN — Oscillator crystal input / external clock input |
| Pino 9 | OSC2/CLKOUT — Oscillator crystal output / clock output (FOSC/4) |
| Pino 10 | RC0/T1OSO/T1CKI — Port C bit 0 / Timer1 oscillator output / Timer1 clock input |
| Pino 11 | RC1/T1OSI/CCP2 — Port C bit 1 / Timer1 oscillator input / CCP2 output |
| Pino 12 | RC2/CCP1 — Port C bit 2 / CCP1 PWM output |
| Pino 13 | RC3/SCK/SCL — Port C bit 3 / SPI clock / I2C clock |
| Pino 14 | RC4/SDI/SDA — Port C bit 4 / SPI data in / I2C data |
| Pino 15 | RC5/SDO — Port C bit 5 / SPI data out |
| Pino 16 | RC6/TX/CK — Port C bit 6 / AUSART transmit / clock |
| Pino 17 | RC7/RX/DT — Port C bit 7 / AUSART receive / data |
| Pino 18 | RD0/PSP0 — Port D bit 0 / Parallel Slave Port bit 0 |
| Pino 19 | RD1/PSP1 — Port D bit 1 / Parallel Slave Port bit 1 |
| Pino 20 | RD2/PSP2 — Port D bit 2 / Parallel Slave Port bit 2 |
| Pino 21 | RD3/PSP3 — Port D bit 3 / Parallel Slave Port bit 3 |
| Pino 22 | RD4/PSP4 — Port D bit 4 / Parallel Slave Port bit 4 |
| Pino 23 | RD5/PSP5 — Port D bit 5 / Parallel Slave Port bit 5 |
| Pino 24 | RD6/PSP6 — Port D bit 6 / Parallel Slave Port bit 6 |
| Pino 25 | RD7/PSP7 — Port D bit 7 / Parallel Slave Port bit 7 |
| Pino 26 | VSS — Ground reference |
| Pino 27 | VDD — Positive supply voltage (2.5V to 5.5V) |
| Pino 28 | RB0/INT — Port B bit 0 / external interrupt input |
Aplicações típicas
PIC16CR76-I/ML é adequado para 7 aplicaçãos: Small Motor Control (DC, Stepper, Brushless), Industrial Sensor Signal Conditioning, Appliance Control Boards, Security and Alarm Panel Controllers, Automotive Body Electronics, Consumer Remote Controls and IR Transceivers, HVAC Damper and Valve Actuators.
Small Motor Control (DC, Stepper, Brushless)
The PIC16CR76-I/ML is well suited for small brushed DC and unipolar stepper motor control where cost per axis matters. Its two CCP modules provide hardware PWM generation for H-bridge gate drive signals, while the 10-bit ADC samples back-EMF and current-sense shunt voltages for closed-loop torque regulation. At 5 MIPS the core can execute a Trapezoidal BLDC commutation algorithm in real time at 24 kHz switching frequency without offloading to external logic.
Recomendado
Industrial Sensor Signal Conditioning
Industrial 4-20 mA loop-powered transmitters, RTD conditioning modules, and bridge pressure sensors benefit from the PIC16CR76-I/ML's 10-bit 8-channel ADC, low 2.5V minimum VDD, and industrial -40C to +85C operating range. The on-chip AUSART drives isolated RS-485 transceivers for factory-floor communication, while the SSP block supports SPI/I2C connections to digital sensor front-ends. The ROM-only design protects IP once firmware is stable across long production runs.
Recomendado
Appliance Control Boards
White-goods control boards for washing machines, dishwashers, microwave ovens, and HVAC damper actuators use the PIC16CR76-I/ML for cost-optimized, ROM-firmware designs. The 28-QFN footprint allows compact PCB integration, while 22 I/O pins drive keypads, triac interfaces, seven-segment displays, and AC-zero-cross detectors. The 10-bit ADC reads thermistor or NTC sensors for closed-loop temperature control in ovens and refrigerators.
Recomendado
Security and Alarm Panel Controllers
PIR motion detectors, door/window contact panels, and keypad alarm controllers use the PIC16CR76-I/ML for low-power always-on operation and the integrated AUSART for central-station dial-up reporting. The 10-bit ADC monitors backup battery voltage and PIR analog output, while the SSP drives I2C EEPROM for event-log storage. The masked-ROM configuration prevents firmware reverse engineering in security-sensitive deployments.
Recomendado
Automotive Body Electronics
Body-control modules for lighting, seat-position memory, mirror adjust, and HVAC blend-door actuation historically used PIC16CR76-I/ML thanks to its industrial temperature range and robust QFN packaging. The two CCP channels drive LED PWM dimming and small DC motor H-bridges, while the AUSART interfaces to LIN or K-Line transceivers. Note: For under-hood or AEC-Q100 mandated positions, the automotive-qualified PIC16F76T-I/ML must be substituted.
Recomendado
Consumer Remote Controls and IR Transceivers
Low-cost universal remote controls and IR/RF transceiver hubs use the PIC16CR76-I/ML because the masked ROM provides low per-unit cost at high production volumes. The AUSART drives 38 kHz IR LED modulation, while the CCP modules generate carrier waveforms for sub-GHz RF links like 315/433 MHz OOK transmitters. The wide 2.5V-5.5V supply range supports 2xAA battery direct connection with no LDO required.
Recomendado
HVAC Damper and Valve Actuators
Building-automation damper actuators and zone-valve controllers integrate the PIC16CR76-I/ML to drive small brushless or stepper motors via the CCP modules while monitoring position feedback through the 10-bit ADC. The SSP port interfaces to BACnet or Modbus transceiver chips for building-network integration, and the wide industrial temperature range supports rooftop and basement installations.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16CR76-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16F76-I/ML | PIC16C76-20I/ML | PIC16F876A-I/ML | PIC16F886-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-pin QFN (ML) | 28-pin QFN (ML) - same | 28-pin QFN (ML) - same | 28-pin QFN (ML) - same | 28-pin QFN (ML) - same |
| Program Memory | 14 KB ROM | 14 KB Flash | 14 KB EPROM | 14 KB Flash | 14 KB Flash |
| RAM | 368 bytes | 368 bytes | 368 bytes | 368 bytes | 368 bytes |
| Max Clock Speed | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| ADC | 10-bit, 8-channel | 10-bit, 8-channel | 10-bit, 8-channel | 10-bit, 8-channel | 10-bit, 11-channel (enhanced) |
| CCP Modules | 2 | 2 | 2 | 2 (enhanced) | 2 (enhanced, ECCP) |
| Operating Voltage | 2.5V to 5.5V | 2.5V to 5.5V | 2.5V to 5.5V | 2.0V to 5.5V | 2.0V to 5.5V |
| Program Memory Type | Masked ROM | Flash (reprogrammable) | EPROM (UV-erasable) | Flash (reprogrammable) | Flash (reprogrammable) |
| Lifecycle Status | NRND | Active | NRND / EOL | Active | Active |
Principais diferenciais
- Cost-optimized masked ROM for very high-volume production (vs PIC16F76-I/ML)
- Identical peripheral set and pinout to active PIC16F76-I/ML (vs PIC16F76-I/ML)
- True drop-in upgrade path to Flash without layout changes (vs PIC16F876A-I/ML)
- Field-programmable alternative still in 28-QFN footprint (vs PIC16F886-I/ML)
- Trade-off: NRND lifecycle limits long-term supply (vs PIC16F76-I/ML)
Notas de projeto
The 28-pin QFN (ML) package on PIC16CR76-I/ML exposes a center thermal pad that should be soldered to a continuous PCB ground copper pour of at least 25 mm x 25 mm for proper heat spreading. Estimated: at 20 MHz clock and full peripheral activity, internal dissipation stays below 100 mW (well within 28-QFN rating), but industrial temperature designs in sealed enclosures still benefit from stitching vias under the thermal pad to inner-layer ground planes. Do not route signal traces under the thermal pad - it must be a continuous copper island per IPC-7351.
Place a 100 nF X7R ceramic decoupling capacitor within 5 mm of each VDD pin and a single 10 uF bulk tantalum or ceramic capacitor near the package. For the AVDD/AVSS analog supply pins (if used separately), add a ferrite bead between VDD and AVDD and decouple AVDD with a 100 nF ceramic. The MCLR pull-up resistor (typically 10 kOhm) and any in-circuit debugger (ICD) isolation resistors must be placed to avoid coupling noise into the reset line.
Critical: PIC16CR76-I/ML uses masked ROM - firmware cannot be changed after wafer fabrication. Always qualify firmware on a PIC16F76-I/ML or PIC16C76 EPROM equivalent before committing to a ROM mask order. Configuration bits (fuses) including oscillator selection, watchdog enable, brown-out voltage and code protection are also mask-programmed. Order a small engineering lot of F76 first, then submit the verified hex file plus configuration-bit map to Microchip for masking. Common mistake: leaving the LVP (low-voltage programming) bit enabled when not using ICD2/ICD3, which can cause unintentional reset during noise events on RB3/PGM.
Keep the OSC1/OSC2 crystal traces short (under 5 mm each) and symmetric. Add a guard ground ring around the crystal and ground the metal can. For high-speed 20 MHz crystals, place load capacitors (typically 15-33 pF) as close as possible to OSC1 and OSC2. Avoid running digital switching signals (PWM, CCP outputs) parallel to the crystal traces to prevent jitter. The AUSART TX/RX traces should be routed away from PWM outputs to minimize cross-coupling into serial data.
The 10-bit ADC on PIC16CR76-I/ML requires careful analog signal routing to achieve full-resolution accuracy. Use a separate analog ground (AGND) tied to VSS at a single point near the package, route analog signals away from digital switching traces, and add an RC low-pass filter (typically 1 kOhm + 100 nF) on analog inputs to limit source impedance below 10 kOhm as required by the ADC acquisition spec. The ADC reference voltage (VREF+/VREF-) should be bypassed with 100 nF and 10 uF capacitors when used in external-reference mode.
Informações de conformidade
RoHS and REACH compliance per Microchip product environmental compliance page. Not AEC-Q100 qualified - for automotive designs use PIC16F76T-I/ML (automotive grade) instead. Lead-free and halogen-free per Microchip ML-package datasheet.
