PIC16F1509-I/GZ - 14KB Flash 8-bit MCU, 20-UQFN | Microchip
N.º da peça: PIC16F1509-I/GZ ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1.92 | $1,92 |
| 10 | $1.72 | $17,20 |
| 100 | $1.38 | $138,00 |
| 500 | $1.15 | $575,00 |
| 1.000 | $0.95 | $950,00 |
PIC16F1509-I/GZ Visão geral
An 8-bit PIC microcontroller is a Harvard-architecture RISC processor designed for embedded control applications. The PIC16F1509 sits within the Microchip PIC16 mid-range family, which provides a balance of code density, peripheral integration, and low power consumption. PIC16F150x devices target cost-sensitive applications requiring mixed analog and digital I/O, such as user-interface control, sensor conditioning, and low-power IoT end nodes.
Key features include 14KB self-programmable Flash, 512B SRAM, 10-bit ADC with computation, support for up to four 10-bit PWM outputs, configurable logic cells (CLC), complementary waveform generators (CWG), and zero-cross detect (ZCD) peripherals. The device supports nanoWatt XLP sleep currents as low as 20 nA in sleep mode with RTCC enabled, allowing battery-powered designs to extend operating life. Internal oscillator options up to 16 MHz reduce BOM cost by removing the external crystal.
The PIC16F1509 uses an enhanced mid-range core with a 14-bit instruction word. The 49-instruction set provides deterministic execution, with most instructions completing in one instruction cycle. Integrated peripherals such as CWG, CLC, and NCO enable designers to generate waveforms and logic functions without external components, which is a notable improvement over older PIC16F baselines.
Typical applications include LED lighting controllers with dimming and color mixing, small appliance controls, sensor signal conditioning, battery chargers, and consumer user-interface boards. The wide operating voltage range and XLP nanoWatt technology make it a common choice for power-aware designs.
When designing with this part, ensure that the UQFN exposed pad is soldered to the PCB ground plane for thermal dissipation and that decoupling capacitors are placed as close to the VDD pins as possible. Use MPLAB X IDE and XC8 compiler for code development.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving engineers a faster path from specification to qualified sourcing.
Alternativas drop-in para PIC16F1509-I/GZ — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16F1509-I/GZ (mesmo formato e footprint) — diferindo em Package, Program Memory (Flash), ADC, Core Architecture, Operating Temperature Range.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16LF1509-I/GZ
✅ Drop-In✓ Em estoque
$0.81 / unidade
Ver ficha técnica →PIC16F1509-E/GZ
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F1509T-I/GZ
✅ Drop-In✓ Em estoque
$0.97 / unidade
Ver ficha técnica →PIC16F1509-I/GZVAO
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F1579-I/GZ
✅ Drop-In✓ Em estoque
$0.95 / unidade
Ver ficha técnica →PIC16F1509-I/GZ Classificações máximas e características elétricas
| Core Architecture | 8-bit PIC enhanced mid-range |
| Family | PIC16F150x (XLP) |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| Data RAM | 512 bytes |
| Frequência máxima de clock | 20 MHz |
| Operating Voltage | 2.3 V to 5.5 V |
| I/O Pins | 18 |
| PWM Outputs | Up to four 10-bit PWM |
| Encapsulamento | 20-UQFN (4x4 mm) |
| Temperature Grade | Industrial (-40°C to +85°C) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Low-Power Feature | nanoWatt XLP (sleep current ~20 nA typ) |
Configuração de pinos do PIC16F1509-I/GZ
| Pino 1 | RA2 — Bidirectional I/O / analog input |
| Pino 2 | RA3 — Bidirectional I/O / analog input / MCLR |
| Pino 3 | RA4 — Bidirectional I/O / analog input |
| Pino 4 | RA5 — Bidirectional I/O / analog input |
| Pino 5 | VSS — Ground reference |
| Pino 6 | RB0 — Bidirectional I/O / analog input |
| Pino 7 | RB1 — Bidirectional I/O / analog input |
| Pino 8 | RB2 — Bidirectional I/O / analog input |
| Pino 9 | RB3 — Bidirectional I/O / analog input |
| Pino 10 | RB4 — Bidirectional I/O / analog input |
| Pino 11 | RB5 — Bidirectional I/O / analog input |
| Pino 12 | RB6 — Bidirectional I/O / ICSPCLK |
| Pino 13 | RB7 — Bidirectional I/O / ICSPDAT |
| Pino 14 | VDD — Positive supply voltage |
| Pino 15 | RC0 — Bidirectional I/O / analog input |
| Pino 16 | RC1 — Bidirectional I/O / analog input |
| Pino 17 | RC2 — Bidirectional I/O / analog input |
| Pino 18 | RA7 — Bidirectional I/O / analog input |
| Pino 19 | RA0 — Bidirectional I/O / analog input |
| Pino 20 | RA1 — Bidirectional I/O / analog input |
Aplicações típicas
PIC16F1509-I/GZ é adequado para 6 aplicaçãos: LED Lighting Controller, Battery-Powered Sensor Node, Small Appliance Control Board, User Interface / HMI Front Panel, Battery Charger / Power Bank Controller, Consumer Toy and Hobby Electronics.
LED Lighting Controller
The PIC16F1509-I/GZ is well suited to drive multi-channel LED lighting with up to four 10-bit PWM outputs and a complementary waveform generator (CWG) for half-bridge LED driver stages. Operating from 2.3V to 5.5V, it accepts power directly from USB or 3.3V regulators. The CWG peripheral can drive MOSFETs without CPU intervention, freeing the core for dimming curves and color-mixing math. The XLP 20 nA sleep mode enables battery-powered accent lighting. Place a 10µF bulk and 0.1µF ceramic on VDD, and route the exposed pad to ground for thermal relief.
Recomendado
Battery-Powered Sensor Node
The PIC16F1509-I/GZ's nanoWatt XLP technology delivers a typical sleep current of 20 nA with RTCC active, making it ideal for battery-powered sensor nodes on coin cells or 2xAA batteries. The internal 16 MHz HFINTOSC eliminates the external crystal cost and BOM space, while the 14KB Flash accommodates firmware for sensor sampling, threshold logic, and BLE/sensor wake-up sequences. The 10-bit ADC directly digitizes thermistor or photodiode signals. Use the LF variant (PIC16LF1509-I/GZ) for sub-3V operation; otherwise the standard part runs from 2.3V to 5.5V.
Recomendado
Small Appliance Control Board
For small appliances such as coffee makers, blenders, or fans, the PIC16F1509-I/GZ delivers 18 I/O pins for keypad scanning, indicator LEDs, and triac or relay drive. The CWG peripheral handles zero-cross detection (ZCD) and triac timing without CPU load, improving line-voltage safety. Industrial -40°C to +85°C operating range covers under-cabinet environments. The 14KB Flash supports state-machine logic for menu-driven UIs. Use optocouplers between the MCU and the AC line drivers for isolation.
Recomendado
User Interface / HMI Front Panel
The PIC16F1509-I/GZ can drive small character LCDs or LED segment displays while scanning capacitive touch buttons via the ADC and CLC peripherals. With 14KB Flash, designers can implement multi-language menus, debounced key inputs, and backlight control. The 2.3V to 5.5V range simplifies 3.3V-5V panel designs. The CLC peripheral implements custom logic such as capacitive sensing gating without external gates, reducing PCB area. Add ESD protection diodes on the front-panel connector traces.
Recomendado
Battery Charger / Power Bank Controller
The PIC16F1509-I/GZ can implement CC/CV charge profiles for single-cell Li-Ion or Li-Poly packs using its 10-bit ADC for voltage and current sensing. The PWM outputs drive MOSFETs or DC-DC converters; the CWG handles synchronous rectification timing. Operating from 2.3V to 5.5V, the MCU can be powered directly from the pack voltage. Industrial temperature grade ensures reliable operation across charger thermal conditions. Add a fuel gauge companion (e.g., LC709203F) for accurate SOC reporting.
Recomendado
Consumer Toy and Hobby Electronics
The PIC16F1509-I/GZ provides the right blend of capability and low cost for hobby and toy products: 14KB Flash for animation patterns, 18 I/O for servo/motor control, and XLP sleep for long battery life. The 20-UQFN 4x4 mm package fits compact enclosures. Internal oscillator eliminates external crystal cost. Pair with a low-cost NCO for sound generation or with a small BLDC driver for robotics. The CLC peripheral implements smart I/O logic without software polling.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16F1509-I/GZ — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16LF1509-I/GZ | PIC16F1509-E/GZ | PIC16F1509T-I/GZ | PIC16F1579-I/GZ |
|---|---|---|---|---|---|
| Package | 20-UQFN (4x4 mm) | 20-UQFN (4x4 mm) - same | 20-UQFN (4x4 mm) - same | 20-UQFN (4x4 mm) - same | 20-UQFN (4x4 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 14 KB | 14 KB | 14 KB | 14 KB | 28 KB |
| RAM | 512 bytes | 512 bytes | 512 bytes | 512 bytes | 1024 bytes |
| I/O Pins | 18 | 18 | 18 | 18 | 18 |
| Operating Voltage | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Extended -40C to +125C | Industrial -40C to +85C | Industrial -40C to +85C |
| PWM Channels | Up to four 10-bit | Up to four 10-bit | Up to four 10-bit | Up to four 10-bit | Four 16-bit hardware PWMs |
| Max Clock Frequency | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
Principais diferenciais
- Same footprint as the low-voltage LF variant (vs PIC16LF1509-I/GZ)
- Extended-temperature sibling available (vs PIC16F1509-E/GZ)
- More memory in same footprint (vs PIC16F1579-I/GZ)
Notas de projeto
Estimated: the 20-UQFN (4x4 mm) package dissipates up to approximately 800 mW at maximum operating temperature. With theta_JA around 39°C/W on a standard JEDEC 4-layer board, junction temperature rises 31°C above ambient at full load. For higher-power applications, increase the PCB copper area under the exposed pad to drop theta_JA below 30°C/W and ensure adequate margin against thermal shutdown.
Solder the UQFN exposed thermal pad to a continuous PCB ground plane with multiple thermal vias. Place 0.1µF ceramic and 10µF bulk decoupling capacitors as close as possible to VDD (pin 14) and VSS (pin 5). Keep switching traces away from the analog ADC inputs and provide a guard trace around sensitive analog signals to minimize crosstalk.
Do not exceed 5.5V on VDD or apply voltage to any pin before VDD is stable - this can latch-up the device. The MCLR/RA3 pin (pin 2) requires careful handling: tie to VDD via 10kΩ if not used as reset. Enable the internal weak pull-ups on unused I/O to avoid floating inputs that draw supply current. Always configure the CONFIG words before code execution to set watchdog, oscillator, and code protection.
Informações de conformidade
RoHS compliant per Microchip product page. PIC16F1509-I/GZVAO variant is automotive screened; standard /GZ variant is industrial grade and not AEC-Q100 qualified.
