PIC16F15324T-I/JQ - 8-bit MCU, 7KB Flash, 32MHz, UQFN-16 | Microchip
N.º da peça: PIC16F15324T-I/JQ ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1.48 | $1,48 |
| 10 | $1.32 | $13,20 |
| 100 | $1.22 | $122,00 |
| 500 | $1.08 | $540,00 |
| 1.000 | $0.97 | $970,00 |
| 3.300 | $0.86 | $2.838,00 |
PIC16F15324T-I/JQ Visão geral
An 8-bit microcontroller (MCU) is a small, self-contained computer-on-a-chip that integrates a CPU, non-volatile program memory, RAM, and a set of peripherals. Within the broader hierarchy, the PIC16F15324 belongs to the microcontroller class of integrated circuits, which sits under embedded processors, then semiconductors. The 'F' suffix denotes Flash-based reprogrammability, while the 'XLP' (eXtreme Low Power) designation indicates Microchip's ultra-low-power technology platform aimed at battery-operated and energy-harvesting applications.
Key features include 4x PWMs, a hardware Comparator, a 5-bit DAC, a 10-bit ADC, 4x Configurable Logic Cells (CLC), a Complementary Waveform Generator (CWG), 2x EUSART, and SPI/I2C peripherals. Core Independent Peripherals (CIPs) handle tasks without CPU intervention, reducing power and freeing the core for application logic. The device operates from 2.5V to 5.5V across an industrial -40C to +85C temperature range.
The architecture pairs an enhanced mid-range 8-bit core with intelligent analog and CIP blocks, allowing event-driven responsiveness and low active current. The internal 32MHz oscillator eliminates external clock components, simplifying BOM and shrinking PCB area for cost-sensitive designs.
Typical applications include IoT sensor nodes, low-power wireless remote controls, battery management, LED lighting control, home automation, and small consumer appliances. The wide operating voltage window lets the same part serve 3.3V and 5V rails from common battery chemistries.
When designing with this part, prioritize using the CLC and CWG blocks to off-load timing-critical logic from the CPU. Ensure the UQFN exposed pad is soldered to a sufficient copper pour to meet thermal dissipation needs at full 32MHz operation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not duplicated in the manufacturer datasheet, providing actionable procurement and engineering guidance.
Alternativas drop-in para PIC16F15324T-I/JQ — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16F15324T-I/JQ (mesmo formato e footprint) — diferindo em Package, ADC, Comparators, Operating Temperature, EUSART.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16F15323T-I/JQ
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F15325T-I/JQ
✅ Drop-In✓ Em estoque
$0.78 / unidade
Ver ficha técnica →PIC16F15324T-I/JQVAO
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC16F15344T-I/JQ
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC16F15354T-I/JQ
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC16F15324T-I/JQ Classificações máximas e características elétricas
| Core Processor | PIC |
| Core Size | 8-bit |
| Program Memory Size | 7KB (4K x 14) Flash |
| RAM Size | 512 bytes |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage Range | 2.5 V to 5.5 V |
| Faixa de temperatura de operação | -40 C to +85 C |
| ADC | 10-bit |
| DAC | 5-bit |
| PWM Channels | 4 |
| Comparators | 1 |
| CLC (Configurable Logic Cells) | 4 |
| CWG (Complementary Waveform Generator) | 1 |
| EUSART | 2 |
| SPI / I2C | Yes (1x each) |
| Encapsulamento | 16-pin UQFN (4x4 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Nível MSL | 1 |
| Status RoHS | Compliant |
| Series | PIC16F153xx (XLP family) |
Configuração de pinos do PIC16F15324T-I/JQ
| Pino 1 | RA5 — Bidirectional I/O / ADC / CLC input |
| Pino 2 | RA4 — Bidirectional I/O / ADC / CLC input |
| Pino 3 | RA3/MCLR — Bidirectional I/O or Master Clear (reset) input |
| Pino 4 | RA2 — Bidirectional I/O / ADC / CLC input |
| Pino 5 | RA1 — Bidirectional I/O / ADC / CLC input / DAC output |
| Pino 6 | RA0 — Bidirectional I/O / ADC / CLC input |
| Pino 7 | VSS — Ground reference |
| Pino 8 | VDD — Positive power supply (2.5V-5.5V) |
| Pino 9 | RA7 — Bidirectional I/O / oscillator / CLC |
| Pino 10 | RA6 — Bidirectional I/O / oscillator / CLC |
| Pino 11 | RC5 — Bidirectional I/O / PWM / CLC / EUSART |
| Pino 12 | RC4 — Bidirectional I/O / PWM / CLC / EUSART |
| Pino 13 | RC3 — Bidirectional I/O / PWM / CLC / SPI/I2C |
| Pino 14 | RC2 — Bidirectional I/O / PWM / CLC / SPI/I2C |
| Pino 15 | RC1 — Bidirectional I/O / PWM / CLC / EUSART |
| Pino 16 | RC0 — Bidirectional I/O / PWM / CLC / EUSART |
Aplicações típicas
PIC16F15324T-I/JQ é adequado para 6 aplicaçãos: IoT Sensor Nodes, Battery Management Systems, LED Lighting Control, Home Automation Hubs, Small Consumer Appliances, Remote Control Units.
IoT Sensor Nodes
The PIC16F15324T-I/JQ is well suited for battery-powered IoT sensor nodes thanks to its XLP platform with sub-microamp sleep currents. The 10-bit ADC wakes the core on threshold crossings, while CLC blocks handle threshold logic without CPU intervention. With 7KB Flash, the part runs custom protocol stacks or simple MQTT-SN libraries. Operating voltage of 2.5V to 5.5V accommodates 2x AA alkaline or single-cell Li-ion directly, eliminating boost/buck converters. The UQFN-16 (4x4) footprint enables compact node designs under 10mm x 10mm.
Recomendado
Battery Management Systems
In battery management, the PIC16F15324T-I/JQ uses its 10-bit ADC to monitor cell voltage and current, while the 5-bit DAC sets comparator thresholds for protection trips. The CWG peripheral drives synchronous rectification MOSFETs in switching charger topologies. The 32MHz core provides 8 MIPS throughput, sufficient for coulomb counting and state-of-charge algorithms. The wide 2.5V-5.5V input range lets the MCU share the battery rail without preregulators, critical in space-constrained packs.
Recomendado
LED Lighting Control
The PIC16F15324T-I/JQ's 4 PWM channels and CWG (Complementary Waveform Generator) provide flexible dimming and dead-band control for LED drivers. The CLC blocks implement custom logic for color-mixing or DLI (Digital Lighting Interface) protocols without CPU load. With 512B RAM, the part supports multi-channel effects with smooth transitions. Operating at 2.5V-5.5V, it directly interfaces with 3.3V LED driver ICs and 5V analog dimming circuits in architectural lighting strips.
Recomendado
Home Automation Hubs
For home automation hubs and edge devices, the PIC16F15324T-I/JQ's 2x EUSART and SPI/I2C peripherals support multiple wireless co-processors (Sub-GHz, BLE, LoRa). The 32MHz core runs the main application logic while CIPs handle bus arbitration. With 7KB Flash, the MCU can host a custom Zigbee or Z-Wave stack fragment, or act as a sensor aggregator. The UQFN-16 (4x4) footprint fits into compact smart-switch form factors.
Recomendado
Small Consumer Appliances
In small consumer appliances like coffee makers, blenders, or kitchen timers, the PIC16F15324T-I/JQ drives 4 PWM channels for motor speed control, reads capacitive touch via the ADC and CLC blocks, and drives character displays via SPI. Its -40C to +85C industrial temperature range handles kitchen and laundry environments. The 32MHz throughput delivers smooth UI animations while CIPs handle safety-critical timing in parallel.
Recomendado
Remote Control Units
The PIC16F15324T-I/JQ is well matched to RF remote controls, where its XLP sleep current in the nA range allows coin-cell batteries to last 5-10 years. The CLC blocks implement button-scanning debouncing without CPU wake-up. The CWG can drive IR LEDs directly for legacy IR control. With EUSART available, the MCU interfaces with Sub-GHz or BLE transmitter ICs in modern smart remotes. The 4x4 UQFN package fits into slim remote enclosures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16F15324T-I/JQ — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16F15323T-I/JQ | PIC16F15325T-I/JQ | PIC16F15324T-I/JQVAO | PIC16F15344T-I/JQ | PIC16F15354T-I/JQ |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | UQFN-16 (4x4) | UQFN-16 (4x4) - same | UQFN-16 (4x4) - same | UQFN-16 (4x4) - same | UQFN-16 (4x4) - same | UQFN-16 (4x4) - same |
| Flash Memory | 7KB | 3.5KB | 14KB | 7KB | 7KB | 14KB |
| RAM Size | 512 B | 256 B | 1 KB | 512 B | 512 B | 1 KB |
| Maximum CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 2.5V - 5.5V | 2.5V - 5.5V | 2.5V - 5.5V | 2.5V - 5.5V | 2.5V - 5.5V | 2.5V - 5.5V |
| ADC Resolution | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit |
| PWM Channels | 4 | 4 | 4 | 4 | 4 | 4 |
| Automotive Grade | No | No | No | Yes (VAO) | No | No |
Principais diferenciais
- Larger memory headroom than PIC16F15323 (vs PIC16F15323T-I/JQ)
- Cost-effective memory headroom upgrade path (vs PIC16F15325T-I/JQ)
- Automotive grade option in same footprint (vs PIC16F15324T-I/JQVAO)
Notas de projeto
Estimated: at full 32MHz operation with all peripherals active, the PIC16F15324T-I/JQ typically draws around 4-5 mA from a 5V supply. Power dissipation is therefore below 25 mW, which is negligible for the UQFN-16 package. However, when the part is soldered to a small copper pour in a sealed enclosure, ensure the exposed pad is soldered to a ground copper area of at least 10mm x 10mm to keep junction temperature rise under 10C above ambient. This avoids thermal limiting at the upper industrial -40C to +85C range.
Place a 100nF decoupling capacitor as close as possible to the VDD pin (pin 8) and a bulk 10uF tantalum or ceramic capacitor on the same node. Keep the VSS connection (pin 7) short and wide to the ground pour. The UQFN exposed pad must be soldered to a continuous ground copper pour with multiple thermal vias to the bottom layer for both electrical ground and thermal dissipation. Avoid routing noisy switching signals under the exposed pad.
When migrating code from the PIC16F15313 family, verify the interrupt vector table matches the PIC16F15324 layout - the additional peripherals introduce new interrupt sources (CLC, CWG) that must be cleared or masked. Also confirm the RA3 pin is configured as digital I/O rather than MCLR if you need that pin as GPIO; otherwise the part will reset on RA3 low. Use the Configuration Word settings to disable unused peripherals and minimize active current.
Route the ICSP programming signals (ICSPCLK/ICSPDAT on RB6/RB7 equivalent pins) away from high-frequency switching traces to avoid programming glitches. Keep the MCLR line short and add a 10k pull-up to VDD if not using the internal weak pull-up. If the application uses ADC, dedicate a clean analog ground island for the ADC reference capacitor and AVSS routing to maximize ADC accuracy at 10-bit resolution.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. Standard industrial grade only - choose /JQVAO suffix variant for automotive (AEC-Q100) qualification. Halogen-free per Microchip environmental compliance data.
