PIC16F1709-E/ML - 8-Bit 32MHz 14KB Flash MCU | Microchip
N.º da peça: PIC16F1709-E/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1.42 | $1,42 |
| 10 | $1.27 | $12,70 |
| 100 | $1.12 | $112,00 |
| 500 | $0.98 | $490,00 |
| 1.000 | $0.87 | $870,00 |
PIC16F1709-E/ML Visão geral
An 8-bit microcontroller (MCU) is a single-chip processor that uses an 8-bit data bus and is widely deployed in embedded control applications ranging from appliance control and sensor interfacing to battery-powered IoT nodes. The PIC16F1709 sits in the hierarchy: 8-bit MCU -> PIC microcontroller -> PIC16 family -> PIC16F170X sub-family -> Microchip mid-range microcontroller portfolio. Its XLP variant designation indicates ultra-low-power design, with nanoWatt sleep currents that enable multi-year coin-cell operation.
Key features include 14 KB self-programmable Flash, 1 KB RAM, 256 bytes EEPROM, hardware Peripheral Pin Select for flexible I/O mapping, on-chip 10-bit ADC with computation, two operational amplifiers, two high-speed comparators, an 8-bit DAC, Zero Cross Detect for TRIAC control, and Core Independent Peripherals (CLC, COG) that offload tasks from the CPU. The device runs from 1.8 V to 5.5 V across an industrial -40 °C to +125 °C temperature range.
Architecturally, the PIC16F1709 uses Microchip's enhanced mid-range 8-bit core with a hardware multiplier and a 14-bit instruction word. On-chip op amps, comparators, and the DAC are interconnected through an analog multiplexer to the ADC, allowing the device to perform closed-loop sensor conditioning, signal generation, and zero-crossing detection without external components.
Typical applications include LED lighting control with TRIAC dimming, sensor signal conditioning, battery-powered IoT endpoints, motor control (low-power BLDC and brushed), HVAC fan control, and consumer white goods. When designing with this device, ensure that the analog peripherals (OPA, DAC, ZCD) are powered by an AVSS-cleaned rail, and that the exposed pad of the QFN package is soldered to a sufficient copper pour for thermal dissipation.
Alternativas drop-in para PIC16F1709-E/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16F1709-E/ML (mesmo formato e footprint) — diferindo em ADC, Comparators, DAC, I/O Pins, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16F1709-I/ML
✅ Drop-In✓ Em estoque
$1.28 / unidade
Ver ficha técnica →PIC16F1709T-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F1719-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F1708-I/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1.22 / unidade
Ver ficha técnica →PIC16F1705-I/ML
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC16F1709-E/ML Classificações máximas e características elétricas
| Core Architecture | PIC16 Enhanced Mid-Range 8-bit |
| Maximum CPU Speed | 32 MHz |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| Data SRAM | 1024 bytes (1 KB) |
| EEPROM | 256 bytes |
| Operating Voltage | 1.8 V to 5.5 V |
| I/O Pins | 18 |
| ADC | 10-bit, up to 28 channels |
| DAC | 8-bit, 1 channel |
| Comparators | 2 high-speed |
| Operational Amplifiers | 2 on-chip |
| Zero Cross Detect (ZCD) | Yes, 1 module |
| CLC (Configurable Logic Cell) | Yes |
| COG (Complementary Output Generator) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| EUSART / I2C / SPI | 1 / 1 / 1 |
| Encapsulamento | 20-pin QFN (4x4 mm) |
| Temperatura de operação | -40 °C to +125 °C (E suffix) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do PIC16F1709-E/ML
| Pino 1 | RA5 — General purpose I/O / analog input |
| Pino 2 | RA4 — General purpose I/O / analog input |
| Pino 3 | RA3 — General purpose I/O / analog input / MCLR |
| Pino 4 | RA2 — General purpose I/O / analog input |
| Pino 5 | RA1 — General purpose I/O / analog input / OPA1IN- |
| Pino 6 | RA0 — General purpose I/O / analog input / OPA1IN+ |
| Pino 7 | VSS — Ground |
| Pino 8 | RB7 — General purpose I/O |
| Pino 9 | RB6 — General purpose I/O / ICSPCLK |
| Pino 10 | RB5 — General purpose I/O |
| Pino 11 | RB4 — General purpose I/O |
| Pino 12 | RC2 — General purpose I/O / COG1FLT |
| Pino 13 | RC1 — General purpose I/O / OPA2IN- |
| Pino 14 | RC0 — General purpose I/O / OPA2IN+ |
| Pino 15 | RC7 — General purpose I/O |
| Pino 16 | RC6 — General purpose I/O |
| Pino 17 | RC5 — General purpose I/O |
| Pino 18 | RC4 — General purpose I/O |
| Pino 19 | VDD — Positive supply voltage |
| Pino 20 | EP — Exposed thermal pad (must be soldered to ground pour) |
Aplicações típicas
PIC16F1709-E/ML é adequado para 6 aplicaçãos: LED Lighting TRIAC Dimming Control, Battery-Powered IoT Sensor Nodes, Appliance and White-Goods Control, HVAC Fan and Blower Control, Sensor Signal Conditioning Front-End, Portable Medical and Health Monitors.
LED Lighting TRIAC Dimming Control
The PIC16F1709-E/ML is purpose-built for LED TRIAC dimming because it integrates a Zero Cross Detect (ZCD) module that captures the AC mains zero-crossing event and a Complementary Output Generator (COG) that synthesizes phase-angle-controlled gate pulses without CPU intervention. Its on-chip op amps allow closed-loop current sensing across the LED string while the 8-bit DAC sets reference thresholds. Operating from 1.8 V to 5.5 V after a small offline supply, it sustains dimming from < 1% to 100% with low flicker. The XLP nanoWatt sleep modes let the design meet ENERGY STAR standby budgets.
Recomendado
Battery-Powered IoT Sensor Nodes
The PIC16F1709-E/ML suits coin-cell IoT nodes thanks to its XLP technology delivering nanoWatt sleep currents (down to ~20 nA typical) and a wide 1.8 V to 5.5 V operating range that supports 2xAA and CR2032 chemistries directly. Its 10-bit ADC with Computation (ADC²) performs hardware-averaged sensor reads while the CPU sleeps, and the two on-chip op amps condition thermistor or electrochemical cells without external ICs. Peripheral Pin Select remaps serial interfaces to any I/O, simplifying PCB layout in space-constrained nodes such as BLE beacons or HVAC wireless sensors.
Recomendado
Appliance and White-Goods Control
For washing machines, dishwashers, and induction cooktops, the PIC16F1709-E/ML delivers 32 MHz performance, 14 KB of firmware headroom, and integrated analog peripherals that replace external signal-chain ICs. The two op amps interface directly with load-current shunts, the comparators handle zero-crossing and overcurrent protection, and the COG module generates complementary PWM for synchronous-rectifier motor pre-drivers. The -40 °C to +125 °C (E suffix) temperature range survives under-hood and kitchen-hood thermal stress while RoHS compliance and a 4x4 mm QFN ease high-volume assembly.
Recomendado
HVAC Fan and Blower Control
In variable-speed HVAC blowers, the PIC16F1709-E/ML uses its 10-bit ADC and on-chip op amps to read back-EMF and tachometer signals from BLDC or brushed motors, while the COG and PWM modules generate switching waveforms with dead-band control. The Zero Cross Detect module synchronizes TRIAC-based AC line switching where mains-referenced loads coexist with the DC motor driver. Its Core Independent Peripherals offload critical timing from the CPU, allowing the firmware stack to manage comms (EUSART, I2C, SPI) and safety housekeeping in parallel without jitter.
Recomendado
Sensor Signal Conditioning Front-End
The PIC16F1709-E/ML's two integrated operational amplifiers, two high-speed comparators, and 8-bit DAC form a complete analog front-end for bridge sensors, RTDs, or pH probes. The op amps condition differential signals at gain up to ~100x, while the comparators implement window detection and the 10-bit ADC digitizes the conditioned output. The on-chip DAC generates excitation voltages or offset cancellation, eliminating the need for a separate analog conditioner. PPS remaps SPI/I2C peripherals for direct connection to ADCs, DACs, or external EEPROM without I/O conflicts.
Recomendado
Portable Medical and Health Monitors
The PIC16F1709-E/ML is well-suited for portable medical accessories such as pulse oximeters, blood-pressure cuffs, and wearable health patches where low power, small footprint, and integrated analog are critical. The XLP sleep currents extend battery life across multi-month deployments, and the on-chip op amps directly interface with photo-plethysmography (PPG) photodiode transimpedance circuits. The DAC provides LED current biasing, while the 10-bit ADC digitizes PPG waveforms. Hardware CIP (CLC, COG) offloads pulse timing from the CPU, ensuring deterministic sampling without interrupt jitter.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16F1709-E/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16F1709-I/ML | PIC16F1709T-I/ML | PIC16F1719-I/ML | PIC16F1708-I/ML | PIC16F1705-I/ML |
|---|---|---|---|---|---|---|
| Package | 20-pin QFN (4x4 mm) | 20-pin QFN (4x4 mm) - same | 20-pin QFN (4x4 mm) - same | 20-pin QFN (4x4 mm) - same | 20-pin QFN (4x4 mm) - same | 20-pin QFN (4x4 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 14 KB | 14 KB | 14 KB | 28 KB | 7 KB | 14 KB |
| SRAM | 1 KB | 1 KB | 1 KB | 2 KB | 512 B | 1 KB |
| Op Amps | 2 | 2 | 2 | 2 | 2 | 1 |
| COG Module | Yes | Yes | Yes | Yes | Yes | No |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
Principais diferenciais
- Industrial -40C to +125C operating range with same die (vs PIC16F1709-I/ML)
- 2x Flash headroom for bootloader and data logging (vs PIC16F1708-I/ML)
- Includes COG module for motor-drive applications (vs PIC16F1705-I/ML)
Notas de projeto
The 20-pin QFN (4x4 mm) package has an exposed thermal pad (EP) on pin 20 that MUST be soldered to a ground copper pour on the PCB for rated thermal and electrical performance. Use at least 4 thermal vias (0.3 mm drill, 0.5 mm pitch) under the pad to connect to an inner ground plane. A non-soldered EP will trigger thermal shutdown under load and degrade ADC accuracy by raising die temperature.
Place a 100 nF ceramic decoupling capacitor as close as possible to the VDD pin, plus a bulk 1-10 uF tantalum or ceramic capacitor on the same rail. The PIC16F1709's ADC is sensitive to VDD noise; if powering from a switching regulator, add a ferrite bead and a separate analog AVSS-cleaned rail. The two op amps and DAC draw from VDD, so noisy rails couple directly into conditioned sensor outputs.
Do not confuse the E temperature suffix (-40C to +125C) with the I suffix (-40C to +85C) when ordering - the E variant is required for under-hood, outdoor, and industrial-grade applications. The 20-pin QFN cannot be socketed or hand-soldered easily; reflow with profile per J-STD-020 is mandatory. When migrating PIC code, verify Peripheral Pin Select (PPS) mappings, since PPS remaps differ across PIC16F170X/171X siblings.
PPS allows remapping of digital peripherals (EUSART, SPI, I2C, PWM) to any I/O pin, but analog pins (RA0/RA1, RC0/RC1 for op amps) are fixed by silicon. When routing high-speed SPI or PWM outputs, keep traces short and avoid running them parallel to op-amp input traces. Use the COG module's hardware dead-band control rather than software delays for motor drive to avoid shoot-through.
Informações de conformidade
RoHS and lead-free compliance per Microchip product page. AEC-Q100 grade is not applicable for this part; automotive-grade PIC parts are suffixed -Q1 or in the PIC16F1xxx automotive family. REACH compliance confirmed by Microchip substance declarations.
