PIC16F1826-E/ML - 8-bit MCU, 3.5KB Flash, 32MHz, 28-QFN | Microchip
N.º da peça: PIC16F1826-E/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1.77 | $1,77 |
| 10 | $1.59 | $15,90 |
| 100 | $1.42 | $142,00 |
| 500 | $1.24 | $620,00 |
| 1.000 | $1.1 | $1.100,00 |
PIC16F1826-E/ML Visão geral
What is a PIC microcontroller? A PIC microcontroller (Peripheral Interface Controller) is a family of 8-bit, 16-bit, and 32-bit RISC microcontrollers from Microchip Technology that integrate CPU core, Flash program memory, RAM, EEPROM, and peripherals (ADC, timers, communication modules) onto a single die. PIC16-series MCUs use the enhanced mid-range core and sit within the hierarchy microcontroller -> embedded MCU -> semiconductor -> integrated circuit, optimized for low-power, deterministic real-time control in cost-sensitive applications.
Key features include nanoWatt XLP technology for ultra-low-power operation (deep sleep currents in the nA range), an integrated capacitive mTouch sensing module for touch-button user interfaces, a Data Signal Modulator (DSM) for mixed-signal conditioning, and configurable peripherals such as MI2C, SPI, and EUSART with auto-baud. The part operates from 2.5 V to 5.5 V and supports up to 12 I/O ports in this package.
Architecturally, the PIC16F1826-E/ML combines a Harvard RISC pipeline with peripheral pin select (PPS), which allows remapping of digital peripherals to any I/O pin. This flexibility simplifies PCB layout, eliminates traces crossing the die, and enables one PCB design to serve multiple SKUs in the PIC16F182x family. The integrated 32 MHz high-precision internal oscillator removes the need for an external crystal in most designs.
Typical applications include capacitive touch user interfaces, low-power battery-powered sensor nodes, LED lighting controllers, consumer appliances, and industrial control front-ends where deterministic interrupt latency and code-density are critical. Its 8-bit architecture and small footprint also suit compact remote controls and IoT edge nodes.
When designing with this device, place a 0.1 uF decoupling capacitor within 5 mm of each VDD pin, and connect the exposed thermal pad to a copper pour tied to VSS for thermal dissipation. The PICkit 5 / MPLAB X IDE toolchain supports in-circuit serial programming (ICSP) via the ICSPCLK/ICSPDAT pins without removing the part from the board.
This page synthesizes distributor pricing, drop-in PIC16F182x-family alternatives, and practical low-power design notes that complement the manufacturer datasheet with cross-package comparison and same-footprint replacement guidance.
Alternativas drop-in para PIC16F1826-E/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16F1826-E/ML (mesmo formato e footprint) — diferindo em Package, ADC, Core Architecture, Operating Temperature, I/O Pins.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16F1827-E/ML
✅ Drop-In✓ Em estoque
$1.65 / unidade
Ver ficha técnica →PIC16F1826-I/ML
✅ Drop-In✓ Em estoque
$0.99 / unidade
Ver ficha técnica →PIC16F1825-E/ML
✅ Drop-In✓ Em estoque
$1.78 / unidade
Ver ficha técnica →PIC16F1824-E/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F1823-E/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F1764-E/ML
✅ Drop-In✓ Em estoque
$1.05 / unidade
Ver ficha técnica →PIC16F1826-E/ML Classificações máximas e características elétricas
| Core Architecture | Enhanced Mid-Range 8-bit PIC |
| Instruction Set Width | 14-bit |
| Number of Instructions | 49 |
| Stack Levels | 16 |
| Program Memory (Flash) | 3.5 KB (2K x 14) |
| Data EEPROM | 256 bytes |
| Data SRAM | 256 bytes |
| Maximum CPU Speed | 32 MHz |
| Supply Voltage (VDD) | 2.5 V to 5.5 V |
| I/O Ports | 12 |
| Internal Oscillator | 32 MHz (factory calibrated) |
| Communication Modules | MI2C, SPI, EUSART with auto-baud |
| Touch Sensing | Integrated mTouch capacitive sensing module |
| Analog Peripherals | ADC, DAC, Comparators, Data Signal Modulator (DSM) |
| Low-Power Technology | nanoWatt XLP (deep sleep in nA range) |
| Operating Temperature Range (E suffix) | -40C to +125C |
| Encapsulamento | 28-pin QFN (6x6 mm) with exposed pad |
| Package Code | ML (QFN-28, HVQCCN) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Programming Method | ICSP (high-voltage and low-voltage) |
Configuração de pinos do PIC16F1826-E/ML
| Pino 1 | RA5 — Digital I/O / mTouch channel |
| Pino 2 | RA4 — Digital I/O |
| Pino 3 | RA3 — Digital I/O / MCLR |
| Pino 4 | RC5 — Digital I/O |
| Pino 5 | RC4 — Digital I/O |
| Pino 6 | RC3 — Digital I/O |
| Pino 7 | RC2 — Digital I/O |
| Pino 8 | RC1 — Digital I/O |
| Pino 9 | RC0 — Digital I/O |
| Pino 10 | VSS — Ground |
| Pino 11 | RA2 — Digital I/O / mTouch channel |
| Pino 12 | RA1 — Digital I/O / ICSPCLK |
| Pino 13 | RA0 — Digital I/O / ICSPDAT |
| Pino 14 | VDD — Positive supply voltage |
| Pino 15 | RB7 — Digital I/O |
| Pino 16 | RB6 — Digital I/O |
| Pino 17 | RB5 — Digital I/O |
| Pino 18 | RB4 — Digital I/O |
| Pino 19 | RB3 — Digital I/O |
| Pino 20 | RB2 — Digital I/O |
| Pino 21 | RB1 — Digital I/O |
| Pino 22 | RB0 — Digital I/O |
| Pino 23 | VSS — Ground |
| Pino 24 | VDD — Positive supply voltage |
| Pino 25 | RC7 — Digital I/O |
| Pino 26 | RC6 — Digital I/O |
| Pino 27 | RC5 — Digital I/O |
| Pino 28 | RA7 — Digital I/O |
| Pino 29 | EP — Exposed thermal pad - connect to VSS |
Aplicações típicas
PIC16F1826-E/ML é adequado para 6 aplicaçãos: Capacitive Touch User Interface, Battery-Powered IoT Sensor Node, LED Lighting Controller, Consumer Appliance Front Panel, Industrial Sensor Conditioning Module, Remote Control Transmitter.
Capacitive Touch User Interface
The PIC16F1826-E/ML integrates Microchip's mTouch capacitive sensing module, which measures touch-induced capacitance change on dedicated pins without external analog front-end components. With 3.5 KB Flash sufficient for a state-machine plus slider/wheel decoding, 256 bytes SRAM for debounce buffers, and nanoWatt XLP low-power modes that drop quiescent current into the nA range, the part is ideal for battery-powered touch remotes, appliance front panels, and wearable control surfaces. Engineers can use the 32 MHz internal oscillator for 8 MIPS of throughput to debounce and process up to 12 touch channels in real time, waking the MCU from deep sleep on a touch event and returning to sleep within a few milliseconds to preserve battery life.
Recomendado
Battery-Powered IoT Sensor Node
The PIC16F1826-E/ML operates from 2.5 V to 5.5 V, which lets it run directly from a single Li-ion cell or two AA batteries without a boost regulator. Its nanoWatt XLP technology provides deep-sleep currents in the nA range while retaining SRAM, so a periodic wake-and-measure cycle can extend battery life to years on a single coin cell. The integrated 32 MHz oscillator, 10-bit ADC, comparators, and EUSART with auto-baud simplify wireless or wired sensor node designs, while 3.5 KB Flash accommodates application firmware plus calibration tables. The 28-QFN (ML) package has a low thermal resistance via its exposed pad, supporting continuous sensor measurements without overheating.
Recomendado
LED Lighting Controller
The PIC16F1826-E/ML suits compact LED driver controllers in architectural and decorative lighting. Its Data Signal Modulator (DSM) module mixes PWM signals with modulator inputs to drive high-current MOSFETs for color-mixing RGB or tunable-white LEDs without external logic. The PIC's 10-bit PWM and 16-bit timers support smooth dimming curves, while peripheral pin select (PPS) lets engineers remap PWM outputs to any I/O to optimize PCB layout. With 3.5 KB Flash sufficient for DMX-512 or DALI receive state machines, the PIC16F1826-E/ML replaces larger 32-bit MCUs in cost-sensitive lighting fixtures and delivers deterministic interrupt latency for flicker-free dimming.
Recomendado
Consumer Appliance Front Panel
The PIC16F1826-E/ML is well matched to consumer appliance control boards such as coffee machines, microwaves, and washing machines that need a mix of capacitive touch buttons, rotary encoders, LED indicators, and buzzer control. Its MI2C and SPI peripherals drive segment LCDs or character displays, while the EUSART links to the main appliance controller for status reporting. The extended -40C to +125C temperature grade handles the thermal environment inside an appliance enclosure. The 28-QFN (ML) package measures only 6x6 mm, fitting behind a sealed touch panel where board space is at a premium.
Recomendado
Industrial Sensor Conditioning Module
The PIC16F1826-E/ML functions as a low-power sensor conditioning front-end for industrial 4-20 mA loops, RTD/thermistor bridges, and process control signals. Its 10-bit ADC, comparators, and Data Signal Modulator (DSM) digitize analog sensor outputs, while the integrated 32 MHz oscillator provides deterministic timing for software filters. The 2.5 V to 5.5 V supply range accommodates 24 V industrial rails through simple LDO regulation. With the -40C to +125C extended temperature grade, the PIC16F1826-E/ML operates reliably in factory automation cabinets near motor drives and switching power supplies where PCB real estate is constrained.
Recomendado
Remote Control Transmitter
The PIC16F1826-E/ML is ideal for compact IR/RF remote controls where every milliamp of standby current matters. Its nanoWatt XLP sleep current in the nA range lets a coin-cell-powered remote last years on standby, while the 32 MHz internal oscillator wakes the MCU to process button events within microseconds. The integrated mTouch module supports capacitive touch buttons instead of mechanical switches, eliminating wear-out failure modes. With 3.5 KB Flash sufficient for IR protocols (RC5, NEC, SIRC) or simple RF encoders, and a 28-QFN (ML) footprint that fits inside a slim remote housing, the PIC16F1826-E/ML is the industry reference for low-cost remote designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16F1826-E/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16F1827-E/ML | PIC16F1826-I/ML | PIC16F1825-E/ML | PIC16F1824-E/ML | PIC16F1823-E/ML |
|---|---|---|---|---|---|---|
| Package | QFN-28 (ML, 6x6 mm) | QFN-28 (ML, 6x6 mm) - same | QFN-28 (ML, 6x6 mm) - same | QFN-28 (ML, 6x6 mm) - same | QFN-28 (ML, 6x6 mm) - same | QFN-28 (ML, 6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Flash Memory | 3.5 KB | 7 KB | 3.5 KB | 14 KB | 7 KB | 3.5 KB |
| SRAM | 256 B | 256 B | 256 B | 1 KB | 256 B | 128 B |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
| Maximum Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Supply Voltage | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V |
| Temperature Range | -40C to +125C (E) | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +125C | -40C to +125C |
| mTouch Module | Yes | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- Extended -40C to +125C temperature range in same 28-QFN package (vs PIC16F1826-I/ML)
- Smaller Flash vs PIC16F1827-E/ML for cost-optimized designs (vs PIC16F1827-E/ML)
- Larger SRAM than PIC16F1823-E/ML for buffer-heavy applications (vs PIC16F1823-E/ML)
Notas de projeto
Estimated: at VDD=3.3V with nanoWatt XLP deep sleep, the PIC16F1826-E/ML draws under 100 nA (per Microchip PIC16F/LF1826/27 datasheet DS41391D typical specifications). For battery life calculations, use 1 uA average current with a 1% duty cycle wake pattern, yielding roughly 2.5 years on a 220 mAh CR2032 coin cell. Place a 0.1 uF decoupling capacitor within 5 mm of each VDD pin (the QFN-28 has two VDD pins: 14 and 24) and tie the exposed thermal pad (EP) to a copper pour on VSS for thermal dissipation and ground return.
The 28-QFN (ML) package has 0.65 mm pitch pads requiring precise SMD stencil design - use a 4-mil (0.1 mm) stencil thickness and aperture width matching the pad. Route the exposed thermal pad (EP) to a 4x4 mm copper pour on the top layer, stitching vias to the VSS plane on inner layers for low-impedance ground return. Avoid placing signal traces under the QFN body; route all I/O signals out the package perimeter. For mTouch designs, keep touch traces short, guard them with a ground trace, and avoid running them parallel to noisy switching signals.
Common PIC16F1826-E/ML design pitfalls: (1) Forgetting to disable the MCLR function by configuring the CONFIG register - leave MCLR disabled only when ICSP is not used, otherwise ICSP programming will fail; (2) Using RA0/RA1 as ICSPDAT/ICSPCLK without considering they double as GPIO after reset - reserve them or accept the dual function; (3) Exceeding 5.5 V on any pin - even momentary transients above 5.5 V will damage the MCU; (4) Failing to clear the PPS lock after configuring peripheral pin select - the PPS registers are write-protected and require an unlock sequence in firmware; (5) Not connecting the exposed pad - leaving EP floating can cause thermal runaway or unstable operation.
Estimated: in the 28-QFN (6x6 mm) package, the silicon die is roughly 2.5 x 2.5 mm centered under the exposed pad. With theta_JA of approximately 35 C/W on a 1-oz 4-layer PCB, the part dissipates up to 0.5 W before reaching 150C junction at 25C ambient - well above any practical PIC16F1826-E/ML power consumption (typically 8 mA active at 32 MHz, <100 nA sleep). For mixed-signal designs, separate analog and digital ground regions and join them at a single point under the MCU exposed pad to avoid ground loops that couple ADC noise into digital logic.
Informações de conformidade
RoHS and lead-free confirmed per Microchip product page; AEC-Q100 not applicable for non-automotive PIC16F1826-E grade; conflict minerals compliance per Microchip corporate policy
