PIC16F1829LINT-E/SS - 8-Bit 32MHz LIN MCU, 14KB Flash, 20-SSOP | Microchip
N.º da peça: PIC16F1829LINT-E/SS ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.2 | $4,20 |
| 10 | $3.78 | $37,80 |
| 100 | $3.36 | $336,00 |
| 500 | $2.94 | $1.470,00 |
| 1.000 | $2.62 | $2.620,00 |
PIC16F1829LINT-E/SS Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), data memory (RAM/EEPROM), and peripheral interfaces on one die. PIC microcontrollers from Microchip use a Harvard RISC architecture optimised for deterministic interrupt response and low power operation, with the XLP (eXtreme Low Power) family targeting battery-powered and always-on designs. A LIN (Local Interconnect Network) MCU combines the microcontroller logic with the physical-layer LIN transceiver, simplifying the BOM of LIN slave nodes by removing the need for a separate transceiver IC.
Key features of the PIC16F1829LINT-E/SS include the integrated MCP2021A-class LIN transceiver supporting LIN 1.3/2.0/2.1 and SAE J2602, internal oscillator with ±1% typical accuracy, nanoWatt XLP sleep modes drawing typically under 100 nA, mTouch capacitive touch sensing peripherals, 17 I/O pins, and integrated peripherals such as 10-bit ADC, comparators, PWM, EUSART, and I²C/SPI. The 20-SSOP package provides compact surface-mount assembly for body-electronics modules where board space is constrained.
The architecture combines a 14-bit instruction word with a 32 MHz internal oscillator, delivering 8 MIPS instruction throughput. Its 8x8 hardware multiplier and C compiler-friendly instruction set simplify firmware development in MPLAB X IDE with the XC8 toolchain. Peripherals are routed through Microchip's Peripheral Pin Select (PPS), allowing flexible remapping of digital functions to physical pins.
Typical applications include automotive LIN/J2602 slave nodes such as window lift switches, mirror controllers, seat modules, HVAC damper actuators, and lighting controls, as well as LIN-based industrial sensor nodes and consumer body-comfort modules. The integrated transceiver eliminates the need for external protection and bus-power components in many designs.
When designing with this part, confirm that the LIN master pull-up arrangement and slave termination match the LIN specification chosen (LIN 2.x typically uses a 1 kΩ master pull-up and internal slave pull-up via the MCP2021A path), and verify the 5V-tolerant LIN bus on actual transients using an ISO 7637 test pulse pattern. Program and debug via the ICSP interface using PICkit 3 or MPLAB ICD 3.
This page synthesises distributor pricing, drop-in alternatives, and practical design notes not found in the standalone datasheet, plus a side-by-side parametric comparison with sibling PIC16F1829 LIN variants.
Alternativas drop-in para PIC16F1829LINT-E/SS — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16F1829LINT-E/SS (mesmo formato e footprint) — diferindo em Package, ADC, Core Architecture, Timers, Communication Interfaces.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16F1829LIN-I/SS
✅ Drop-In✓ Em estoque
$1.93 / unidade
Ver ficha técnica →PIC16F1829LINT-E/SSVAO
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F1829LINT-I/SS
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1.39 / unidade
Ver ficha técnica →PIC16F1829LIN-E/SS
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.55 / unidade
Ver ficha técnica →PIC16F1829LINT-E/SS Classificações máximas e características elétricas
| Product Family | PIC® XLP™ mTouch™ 16F with LIN/J2602 |
| Core Architecture | 8-bit PIC RISC (enhanced mid-range), 14-bit instruction word |
| Maximum CPU Frequency | 32 MHz |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| Data SRAM | 1 KB |
| Data EEPROM | 256 bytes |
| Integrated LIN Transceiver | Yes (LIN 1.3/2.0/2.1, SAE J2602, MCP2021A-class) |
| Supply Voltage (VDD) | 1.8 V to 5.5 V |
| I/O Pins | 17 |
| ADC | 10-bit, up to 12 channels |
| Timers | 5 (Timer0/1/2/4/6) |
| Communication Interfaces | EUSART, I²C/SPI, LIN |
| PWM Channels | Up to 4 (10-bit) |
| Capacitive Touch (mTouch) | Yes (CTMU peripheral) |
| Operating Temperature Range (E grade) | -40 °C to +125 °C |
| Encapsulamento | 20-pin SSOP (5.30 mm body width) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Debug Support | Integrated ICD, no debug header required; PICkit 3 / MPLAB ICD 3 |
Configuração de pinos do PIC16F1829LINT-E/SS
| Pino 1 | RA5 — General-purpose I/O / ICSP programming clock |
| Pino 2 | RA4 — General-purpose I/O |
| Pino 3 | RA3 — General-purpose I/O / MCLR input |
| Pino 4 | RA2 — General-purpose I/O |
| Pino 5 | RA1 — General-purpose I/O / ICSPDAT |
| Pino 6 | RA0 — General-purpose I/O |
| Pino 7 | VSS — Ground |
| Pino 8 | LIN — LIN bus physical interface (integrated LIN transceiver) |
| Pino 9 | VBAT — Battery supply for integrated LIN transceiver regulator |
| Pino 10 | VDD — Digital supply voltage (1.8 V to 5.5 V) |
| Pino 11 | RC0 — General-purpose I/O |
| Pino 12 | RC1 — General-purpose I/O |
| Pino 13 | RC2 — General-purpose I/O |
| Pino 14 | RC3 — General-purpose I/O |
| Pino 15 | RC4 — General-purpose I/O |
| Pino 16 | RC5 — General-purpose I/O |
| Pino 17 | RC6 — General-purpose I/O |
| Pino 18 | RC7 — General-purpose I/O |
| Pino 19 | RB7 — General-purpose I/O |
| Pino 20 | RB6 — General-purpose I/O |
Aplicações típicas
PIC16F1829LINT-E/SS é adequado para 6 aplicaçãos: Automotive Window Lift Switch Module, Side Mirror Control Node (LIN Slave), Seat Adjustment / Seat Position Sensor Module, HVAC Damper / Air-Flap Actuator, Automotive Interior Lighting Controller (LIN RGB/LED), LIN-Based Industrial Sensor Node.
Automotive Window Lift Switch Module
The PIC16F1829LINT-E/SS is a strong fit for automotive window lift switch modules that connect to a body controller via a LIN/J2602 bus, because the integrated LIN transceiver eliminates the need for a separate MCP2021A-class device and the SSOP-20 footprint is small enough for in-switch PCB integration. The 14 KB Flash accommodates a LIN slave stack plus switch-debounce logic, while the 32 MHz core and 8 MIPS throughput handle the LIN schedule and PWM motor-control commands with sub-millisecond latency. Designers place the part at the bus end with the integrated transceiver providing internal slave pull-up and bus-pin fault tolerance, simplifying the BOM to MCU + capacitor + connector.
Recomendado
Side Mirror Control Node (LIN Slave)
Side mirror fold and adjustment motors are commonly controlled by LIN/J2602 slaves, and the PIC16F1829LINT-E/SS delivers an integrated MCU + LIN transceiver + on-die regulator combination in one SSOP-20 package, dramatically reducing board area inside the mirror housing. Its PWM peripherals drive the mirror motors with 10-bit resolution while the EUSART serves the LIN transport layer; the 1 KB SRAM buffers LIN frames and switch-event queues. The -40 to +125 °C -E temperature grade tolerates mirror-housing thermal cycles in direct sun and cold-weather operation, and the nanoWatt XLP sleep mode keeps quiescent current under 100 µA when the vehicle is parked.
Recomendado
Seat Adjustment / Seat Position Sensor Module
Powered seat modules use LIN slaves for position memory and motor control, and the PIC16F1829LINT-E/SS combines a 32 MHz CPU with the mTouch CTMU peripheral for capacitive seat-occupancy detection in a single 20-SSOP device. The 14 KB Flash holds the LIN stack, seat-memory map, and capacitive-sense firmware; the 10-bit ADC reads seat-position potentiometers and Hall sensors; and the integrated LIN/J2602 transceiver talks directly to the body controller without a separate transceiver IC. The wide 1.8 V to 5.5 V supply range lets the part run from a regulated 5 V rail while the LIN bus pin handles the 12 V vehicle bus through the internal regulator path.
Recomendado
HVAC Damper / Air-Flap Actuator
HVAC air-flap actuators in automotive climate-control systems are LIN/J2602 slaves, and the PIC16F1829LINT-E/SS provides the slave logic + integrated transceiver combination in a 20-SSOP package that fits the actuator housing. Its PWM outputs drive the DC motor while the 10-bit ADC reads the flap-position potentiometer for closed-loop control; the 32 MHz core runs the LIN schedule, position-control loop, and fault diagnostics within the LIN frame budget. The -E temperature grade supports engine-compartment-adjacent HVAC duct temperatures, and the nanoWatt XLP sleep current keeps parasitic battery drain low when the HVAC is off.
Recomendado
Automotive Interior Lighting Controller (LIN RGB/LED)
Ambient interior lighting strips and RGB LED nodes are increasingly driven by LIN/J2602 slaves, and the PIC16F1829LINT-E/SS provides a single-chip solution with integrated LIN transceiver, multiple PWM channels for LED dimming, and enough Flash for LIN + lighting FSM code in SSOP-20. Its 10-bit PWM resolution delivers smooth dimming at low duty cycles, the EUSART handles the LIN physical layer, and the mTouch CTMU enables touch-controlled overhead-console light switches. The wide VDD range supports 5 V regulated rails commonly used in LED driver stages.
Recomendado
LIN-Based Industrial Sensor Node
Industrial sensor clusters on LIN sub-buses (machine-tool annunciators, conveyor-cell sensors) can use the PIC16F1829LINT-E/SS as a LIN slave with the integrated transceiver, replacing a discrete MCU + MCP2021A-class pair and shrinking the PCB to fit inside sensor housings. The 14 KB Flash accommodates the LIN stack plus sensor-calibration tables, the 10-bit ADC reads analog sensors, and the PWM can drive a status LED or buzzer. The -E temperature grade supports factory-floor thermal environments, although for non-automotive industrial users the PIC16F1829LIN-I/SS variant is typically sufficient.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16F1829LINT-E/SS — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16F1829LIN-I/SS | PIC16F1829LINT-E/SSVAO | PIC16F1829LINT-I/SS | PIC16F1829LIN-E/SS |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 20-SSOP | 20-SSOP - same | 20-SSOP - same | 20-SSOP - same | 20-SSOP - same |
| Integrated LIN Transceiver | Yes (LIN 1.3/2.0/2.1/J2602) | Yes (LIN/J2602) | Yes (LIN/J2602) | Yes (LIN/J2602) | Yes (LIN/J2602) |
| Flash Program Memory | 14 KB | 14 KB | 14 KB | 14 KB | 14 KB |
| SRAM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Maximum CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Temperature | -40 °C to +125 °C (E grade) | -40 °C to +85 °C (I grade) | -40 °C to +125 °C (E grade, AEC-Q100) | -40 °C to +85 °C (I grade) | -40 °C to +125 °C (E grade) |
| Supply Voltage Range | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| I/O Pins | 17 | 17 | 17 | 17 | 17 |
Principais diferenciais
- Integrated LIN/J2602 transceiver in the same package (vs PIC16F1829-I/SS (non-LIN base MCU))
- Extended -40 to +125 °C automotive temperature grade (vs PIC16F1829LIN-I/SS (industrial grade))
- 14 KB Flash with 1 KB RAM at 32 MHz (vs Lower-memory PIC16F1825/1827 LIN variants)
Notas de projeto
Power the PIC16F1829LINT-E/SS digital VDD pin from a regulated 1.8 V to 5.5 V rail and connect the integrated LIN transceiver's VBAT pin to the 12 V vehicle bus through a reverse-battery and load-dump protection network (typically a series diode, TVS clamp, and bulk capacitor). Place a 100 nF decoupling capacitor as close as possible to the VDD pin and a 10 µF bulk capacitor on VBAT to absorb LIN bus load-dump transients. The integrated regulator provides a clean logic-level rail for the digital core from the noisy VBAT input.
At 32 MHz CPU clock and full peripheral activity, the PIC16F1829LINT-E/SS draws roughly 5-8 mA from VDD plus LIN transceiver currents up to 50 mA on transmit; the SSOP-20 package has θJA around 90-100 °C/W on a 1-oz 4-layer FR4 PCB, giving a junction-to-ambient rise of ~5-8 °C at typical 100 mA total, which is well within the -40 to +125 °C operating range. For mirror-housing or seat-module enclosures with limited airflow, ensure copper-pour stitching under the SSOP-20 thermal pad (none on SSOP-20, so route pours on the opposite side) to spread heat.
Place the LIN bus pin trace as short as possible to the connector, with the LIN bus pull-up (internal or external 1 kΩ on master / 30 kΩ on slave via MCP2021A path) and a reverse-polarity protection diode close to the connector. Use a 4-layer PCB with a continuous ground plane under the SSOP-20 to provide thermal spreading and a low-impedance return for the LIN bus currents. Keep digital switching signals (PWM outputs, clock traces) away from the LIN pin and VBAT trace to avoid coupling noise into the bus.
Do NOT use a non-LIN PIC16F1829 variant (such as PIC16F1829-I/SS) as a drop-in replacement on a PCB designed for the LIN/J2602 part - the LIN pin is dedicated on this SKU and standard PIC16F1829 variants do not include the integrated transceiver. Also verify that the LIN bus master pull-up is present in the network, because the integrated transceiver on this slave part does not include a master pull-up. Finally, confirm the temperature-grade suffix (-E vs -I) matches the deployment environment before locking the BOM.
Informações de conformidade
AEC-Q100 qualification applies to the -VAO suffix variant (PIC16F1829LINT-E/SSVAO); the standard -E grade is designed for automotive environments but request the AEC-Q100 certificate from Microchip for the specific lot if your project mandates the certification. RoHS and REACH compliance per Microchip product environmental information.
