PIC16F18313-I/RF - 8-bit XLP MCU 3.5KB Flash | Microchip
N.º da peça: PIC16F18313-I/RF ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1.13 | $1,13 |
| 10 | $1.02 | $10,20 |
| 100 | $0.91 | $91,00 |
| 500 | $0.81 | $405,00 |
| 1.000 | $0.73 | $730,00 |
| 3.000 | $0.66 | $1.980,00 |
PIC16F18313-I/RF Visão geral
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data path, integrating CPU core, non-volatile Flash program memory, working RAM, EEPROM data storage, and a rich set of analog/digital peripherals. In the modern component taxonomy, the PIC16F18313 sits as: 8-bit MCU -> microcontroller -> embedded processor -> semiconductor IC. XLP variants such as the F18313 add sleep currents down to the low-nA range, which positions them below general-purpose 8-bit MCUs in the power hierarchy and makes them a frequent choice for battery-powered edge nodes.
Key features include Core Independent Peripherals (CIPs) such as Configurable Logic Cells (CLC), Complementary Waveform Generator (CWG), Numerically Controlled Oscillator (NCO) and Zero-Cross Detect (ZCD). The device provides a 10-bit ADC with Computation (ADC2), a 5-bit DAC, two analog comparators and Peripheral Pin Select (PPS) for flexible I/O mapping. The CLC enables hardware-based state machines without CPU intervention, reducing active-mode current and firmware complexity.
Technical depth is delivered through the enhanced mid-range core with 49 instructions, hardware Multiply (8x8), a 32 MHz internal oscillator with +/- 2% accuracy after calibration, and an Integrated Temperature Indicator. The device also includes an enhanced Universal Synchronous/Asynchronous Receiver/Transmitter (EUSART) and MSSP for SPI/I2C, enabling robust wired communication in a 3x3 mm footprint.
Typical applications include IoT sensor nodes, battery-powered wearables, low-power wireless HMI controls, white goods user interfaces, automotive body electronics (sub-system level) and consumer remote controls. The combination of low sleep current and small UDFN footprint suits space-constrained coin-cell products.
When designing with this part, plan the PPS routing early - the F18313 offers remappable digital peripherals but the analog inputs are fixed. Ensure the UDFN exposed pad is soldered with adequate thermal relief to the ground plane for stable Vdd operation.
Alternativas drop-in para PIC16F18313-I/RF — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16F18313-I/RF (mesmo formato e footprint) — diferindo em ADC, DAC, Package, Comparators, I/O Pins.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16F18313-E/RFVAO
✅ Drop-In✓ Em estoque
$0.55 / unidade
Ver ficha técnica →PIC16F18313-E/RFVAO
✅ Drop-In✓ Em estoque
$0.55 / unidade
Ver ficha técnica →PIC16F1823T-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F18313-I/RF Classificações máximas e características elétricas
| Product Family | PIC16F XLP 8-bit Microcontroller |
| Core Architecture | Enhanced Mid-Range 8-bit (49 instructions) |
| Program Memory | 3.5 KB Flash (2K x 14) |
| Data RAM | 256 bytes |
| Data EEPROM | 256 bytes |
| Frequência máxima de clock | 32 MHz |
| Operating Voltage (Vdd) | 2.3 V to 5.5 V |
| Temperatura de operação | -40 C to +85 C (Industrial) |
| Encapsulamento | 8-pin UDFN 3x3 mm with Exposed Pad |
| Tipo de montagem | Surface Mount |
| I/O Pins | 6 (with PPS remap) |
| ADC | 10-bit ADC with Computation (ADC2) |
| DAC | 5-bit DAC |
| Comparators | 2 analog comparators |
| Communication | 1x EUSART, 1x MSSP (SPI/I2C) |
| CIPs | CLC, CWG, NCO, ZCD |
| Status RoHS | Compliant |
Configuração de pinos do PIC16F18313-I/RF
| Pino 1 | RA5 — Bidirectional I/O / analog input / PPS remappable |
| Pino 2 | RA4 — Bidirectional I/O / analog input / PPS remappable |
| Pino 3 | RA3 — Bidirectional I/O / analog input / MCLR/GP3 per datasheet |
| Pino 4 | Vss — Ground reference |
| Pino 5 | VDD — Positive supply 2.3 V to 5.5 V |
| Pino 6 | RA1 — Bidirectional I/O / analog input / PPS remappable |
| Pino 7 | RA0 — Bidirectional I/O / analog input / PPS remappable |
| Pino 8 | RA2 — Bidirectional I/O / analog input / PPS remappable |
Aplicações típicas
PIC16F18313-I/RF é adequado para 6 aplicaçãos: Coin-Cell IoT Sensor Node, Wearable Activity / Health Patch, Battery-Powered Remote Control, White Goods User Interface, Automotive Body Sub-System (Interior Lighting / Wiper Controller), Industrial Sensor Transmitter (4-20 mA Loop / WirelessHART Edge Node).
Coin-Cell IoT Sensor Node
The PIC16F18313-I/RF suits coin-cell IoT sensor nodes because its XLP architecture delivers nA-range sleep current with retained RAM and a 32 MHz HFINTOSC for fast active-mode transactions. The 10-bit ADC2 with oversampling and hardware averaging reduces the CPU wake time per measurement, directly extending battery life. Combined with PPS-driven SPI sensor polling and the CLC for autonomous wake-up, the part achieves years of operation on a CR2032. Its 3x3 mm UDFN footprint leaves room for the cell holder on a single coin-cell node PCB.
Recomendado
Wearable Activity / Health Patch
The PIC16F18313-I/RF is well matched to wearable health patches thanks to its 3x3 mm UDFN footprint, low Vdd range down to 2.3V and integrated 5-bit DAC / 10-bit ADC2 for bio-signal conditioning. The CWG peripheral generates clean PWM drive for low-power haptic feedback, while the NCO produces audio-frequency tones without burning MIPS on CPU toggles. With sleep current well under 1 uA in typical patches, average current stays compatible with small Li-ion batteries. PPS reassignment lets designers route the same MCU across multiple wearable SKUs without respinning layouts.
Recomendado
Battery-Powered Remote Control
The PIC16F18313-I/RF is an excellent fit for IR/RF remote controls because its XLP sleep current and fast wake-up from sleep keep the average current low between presses. The integrated CWG drives 38 kHz IR carrier modulation without CPU overhead, while the EUSART or MSSP can interface to sub-GHz RF modules such as TI CC1101. With 6 remappable I/O, the same 8-pin UDFN device supports IR-only, RF-only or combo remotes, reducing SKU proliferation.
Recomendado
White Goods User Interface
White goods such as washing machines and induction cooktops use the PIC16F18313-I/RF for capacitive-touch and LED-segment user interface modules. The 10-bit ADC2 with hardware computation enables reliable cap-touch via charge-time measurement, while CLC and CWG autonomously drive LED segments and haptic buzzers with no firmware loop. The wide 2.3V to 5.5V interface, the same UDFN part as on a coin-cell node, simplifies inventory by sharing silicon across appliance SKUs.
Recomendado
Automotive Body Sub-System (Interior Lighting / Wiper Controller)
The PIC16F18313-I/RF (or its automotive VAO sibling) is used in interior body controllers such as ambient lighting, mirror adjust and rear wiper control. The 5-bit DAC and 10-bit ADC2 with computation handle LED brightness ramp curves and motor current sensing with no extra op-amp, while CWG produces half-bridge drive for small DC loads. The -40 C to +85 C industrial grade fits cabin modules; for under-hood applications step up to the -40 C to +125 C /RFVAO or /RF extended temperature part in the same UDFN footprint.
Recomendado
Industrial Sensor Transmitter (4-20 mA Loop / WirelessHART Edge Node)
The PIC16F18313-I/RF operates as the sensor-MCU half of an industrial 4-20 mA loop transmitter or WirelessHART edge node, where its 32 MHz speed and ADC2 with computation handle linearization and HART protocol framing. The wide 2.3V to 5.5V interface directly tolerates loop-powered rails, and CLC implements hardware glitch filters on the loop sense path to improve EMC immunity. The 8-pin UDFN package fits the small footprint of a head-mounted temperature or pressure transmitter housing.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16F18313-I/RF — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16F18313-I/P | PIC16F18313-E/RFVAO | PIC16F18313-E/RF | PIC16F1823T-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 8-UDFN 3x3 mm (RF) | 8-pin PDIP (P) - NOT same land pattern | 8-UDFN 3x3 mm (RF) - same | 8-UDFN 3x3 mm (RF) - same | 8-UDFN 3x3 mm (ML) - same family, different variant |
| Flash | 3.5 KB (2K x 14) | 3.5 KB | 3.5 KB | 3.5 KB | 2 KB (-43%) |
| RAM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 128 bytes (-50%) |
| EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Max Clock | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Temperature Grade | -40 C to +85 C (I) | -40 C to +85 C (I) | -40 C to +125 C (E) Automotive VAO | -40 C to +125 C (E) | -40 C to +85 C (I) |
| ADC | 10-bit ADC2 (computation) | 10-bit ADC2 | 10-bit ADC2 | 10-bit ADC2 | 10-bit ADC (no ADC2 computation) |
| CIPs (CLC/CWG/NCO/ZCD) | All four | All four | All four | All four | Subset (no NCO/CLC) |
Principais diferenciais
- Core Independent Peripherals (CLC + NCO) reduce CPU load (vs PIC16F1823T-I/ML)
- Same die with AEC-Q100 / VAO option in identical UDFN footprint (vs PIC16F18313-I/P)
- PPS flexibility lets one part serve many SKUs (vs PIC16F1823T-I/ML)
Notas de projeto
Estimated: at 32 MHz and Vdd = 3.3 V, typical active current is on the order of 2-3 mA; at 4 MHz lower power mode expect ~0.5-0.8 mA. Sleep with peripherals disabled and WDT off should fall well below 1 uA. Add a bulk 1-10 uF plus 100 nF decoupling cap as close as possible to the Vdd pin; place the exposed pad to a low-impedance ground pour for thermal and noise reasons.
UDFN 8-pin 3x3 mm packages are sensitive to insufficient solder joint reliability. Use NSMD pads with a 0.2-0.3 mm solder mask expansion and stencil apertures of approximately 80% of pad size for the EP. Plan the EP as a single thermal via array (typically 5-9 vias 0.3 mm diameter) tied to the same ground net as the analog ground, since Vss and EP are internally connected on the F18313.
Do not assume the F18313 pin functions from older PIC12F/PIC16F1xxx are identical: PPS moves UART/SPI/I2C/PWM but analog inputs remain fixed. Always check the latest DS40001799F datasheet before reuse. The HFINTOSC frequency drifts more than expected if not calibrated at the application Vdd and temperature - use the OSCTUNE register or factory calibration constants.
Place 10-100 ohm series resistors close to the MCU on PPS-remapped digital outputs (especially EUSART, SPI SCK, PWM) to dampen fast transients that couple into the analog ADC channels. Keep analog traces short and away from the EUSART and PWM traces routed via PPS to high-drive pins to minimize digital-to-analog crosstalk on the ADC2 measurement.
Informações de conformidade
Base -I/- part is industrial grade (-40 to +85 C), not AEC-Q100 qualified. Use the /RFVAO variant for AEC-Q100 / automotive qualification. RoHS compliance confirmed by Microchip product page.
