PIC16F18855-I/SO - 8-Bit MCU, 14KB Flash, 32MHz, 28-SOIC | Microchip
N.º da peça: PIC16F18855-I/SO ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.1 | $2,10 |
| 10 | $1.88 | $18,80 |
| 100 | $1.66 | $166,00 |
| 500 | $1.45 | $725,00 |
| 1.000 | $1.29 | $1.290,00 |
PIC16F18855-I/SO Visão geral
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data bus that integrates a CPU, non-volatile program memory, volatile data memory, and a rich set of peripheral modules. PIC microcontrollers from Microchip use a RISC Harvard architecture optimised for low power, deterministic interrupt response, and ease of programming through the MPLAB X IDE ecosystem. The PIC16F18855 belongs to the eXtreme Low Power (XLP) family, targeting general-purpose and battery-powered applications.
Key features of the PIC16F18855-I/SO include 14KB Flash, 1KB SRAM, 256B EEPROM, a 32MHz internal oscillator, Core Independent Peripherals (CIPs) such as CRC/SCAN and HLT, multiple communication peripherals, and ultra-low-power sleep modes. The 14KB Flash supports in-circuit serial programming (ICSP) for flexible field updates, while the 256-byte EEPROM provides non-volatile data storage without taxing program memory. Operating from 1.8V to 5.5V, the device is suitable for both 3.3V and 5V systems.
Architecturally, the PIC16F18855 combines an enhanced mid-range 8-bit core with peripheral pin select, configurable logic cells, and multiple timer/counter modules. The integrated ADC, comparators, and PWM peripherals enable closed-loop control with no external components. CIPs like the Configurable Logic Cell (CLC), Numerically Controlled Oscillator (NCO), and Complementary Waveform Generator (CWG) offload tasks from the core, freeing the CPU for system-level functions.
Typical applications include consumer appliances, IoT sensor nodes, industrial control modules, low-power remote controls, battery-powered instrumentation, and automotive interior accessories. Its combination of XLP sleep current under 1 uA and rapid wake-up from sleep makes it ideal for energy-harvesting and energy-conscious designs.
When designing with the PIC16F18855-I/SO, pay attention to supply decoupling (100nF ceramic close to each VDD pin) and follow Microchip's errata when selecting peripherals in deep sleep. Use ICSP for in-system programming and reserved pins per the device's pin allocation table for unused functions.
This page synthesizes distributor pricing from DigiKey/Mouser/LCSC, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, providing an engineer-focused supplement to Microchip's documentation for evaluation and BOM planning.
Alternativas drop-in para PIC16F18855-I/SO — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16F18855-I/SO (mesmo formato e footprint) — diferindo em ADC, Package, Core Architecture, Operating Temperature, DAC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16F18857-I/SO
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1.42 / unidade
Ver ficha técnica →PIC16F18856-I/SO
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC16F18875-I/SO
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC16F18854-I/SO
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$0.82 / unidade
Ver ficha técnica →PIC16F18855-E/SO
✅ Drop-In✓ Em estoque
$1.05 / unidade
Ver ficha técnica →PIC16F18855-I/SO Classificações máximas e características elétricas
| Core Architecture | 8-bit PIC enhanced mid-range |
| Family | PIC16F1885X/7X |
| Program Memory (Flash) | 14 KB (8K x 14) |
| SRAM | 1 KB |
| EEPROM | 256 B |
| Maximum CPU Frequency | 32 MHz |
| Supply Voltage (VDD) | 1.8 V to 5.5 V |
| Temperatura de operação | -40 C to +85 C (Industrial: -I suffix) |
| Package / Pin Count | 28-SOIC (SO) |
| Tipo de montagem | Surface Mount |
| Timers | Multiple 8/16-bit timers |
| ADC | 10-bit ADC (multi-channel) |
| Communication Peripherals | I2C, SPI, EUSART |
| Core Independent Peripherals | CLC, NCO, CWG, CRC/SCAN, HLT |
| Low-Power Modes | XLP Sleep / Deep Sleep (<1 uA typical) |
| Programming Interface | ICSP (In-Circuit Serial Programming) |
| Status RoHS | Compliant |
| Nível MSL | 1 |
Configuração de pinos do PIC16F18855-I/SO
| Pino 1 | RA2 — Bidirectional I/O / analog input |
| Pino 2 | RA3 — Bidirectional I/O / analog input |
| Pino 3 | RA4 — Bidirectional I/O / analog input |
| Pino 4 | RA5 — Bidirectional I/O / analog input |
| Pino 5 | RA6 — Bidirectional I/O / analog input |
| Pino 6 | RA7 — Bidirectional I/O / analog input |
| Pino 7 | VSS — Ground reference |
| Pino 8 | RB0 — Bidirectional I/O / analog input |
| Pino 9 | RB1 — Bidirectional I/O / analog input |
| Pino 10 | RB2 — Bidirectional I/O / analog input |
| Pino 11 | RB3 — Bidirectional I/O / analog input |
| Pino 12 | RB4 — Bidirectional I/O |
| Pino 13 | RB5 — Bidirectional I/O |
| Pino 14 | RB6 — Bidirectional I/O / ICSPCLK |
| Pino 15 | RB7 — Bidirectional I/O / ICSPDAT |
| Pino 16 | RC0 — Bidirectional I/O / analog input |
| Pino 17 | RC1 — Bidirectional I/O / analog input |
| Pino 18 | RC2 — Bidirectional I/O / analog input |
| Pino 19 | RC3 — Bidirectional I/O / analog input |
| Pino 20 | RC4 — Bidirectional I/O |
| Pino 21 | RC5 — Bidirectional I/O |
| Pino 22 | RC6 — Bidirectional I/O |
| Pino 23 | RC7 — Bidirectional I/O |
| Pino 24 | RE3 — Bidirectional I/O / MCLR |
| Pino 25 | VDD — Positive supply voltage |
| Pino 26 | RA0 — Bidirectional I/O / analog input |
| Pino 27 | RA1 — Bidirectional I/O / analog input |
| Pino 28 | VDD — Positive supply voltage |
Aplicações típicas
PIC16F18855-I/SO é adequado para 6 aplicaçãos: Battery-Powered IoT Sensor Nodes, Consumer Appliance Control, Industrial Control Modules, Remote Control and Human-Interface Devices, Automotive Interior Accessories, Low-Power Instrumentation.
Battery-Powered IoT Sensor Nodes
The PIC16F18855-I/SO is well suited to IoT sensor nodes because of its XLP deep-sleep current under 1 uA combined with a 32 MHz core for fast active-mode processing. The device's 1.8V to 5.5V supply range allows direct operation from 2x AA alkaline or single Li-ion cells. The integrated 10-bit ADC, I2C/SPI, and EUSART let it front-end temperature, humidity, motion, and gas sensors without external bridge ICs, while CIPs (CLC, NCO, CWG) offload pulse generation and signal conditioning, extending battery life in remote or energy-harvested sensor networks.
Recomendado
Consumer Appliance Control
Appliance controls including coffee makers, blenders, and air purifiers benefit from the PIC16F18855-I/SO's combination of 14 KB Flash (enough for state-machine UI logic), 32 MHz CPU (smooth display refresh), and integrated PWM peripherals for motor/solenoid/valve control. CWG and CLC peripherals generate complementary PWM for switching converter drivers, while the 256-byte EEPROM stores user settings (last mode, calibration data) across power cycles. The wide 1.8V to 5.5V input simplifies power-supply design in cost-sensitive mass-produced appliances.
Recomendado
Industrial Control Modules
In factory-automation I/O modules, the PIC16F18855-I/SO delivers deterministic interrupt response, 32 MHz of processing, and EUSART/I2C/SPI for field-bus or sensor-hub interfacing. CWG and 16-bit timers drive triac/SCR phase-angle firing for AC loads up to 2 kHz, and the 10-bit ADC reads 4-20 mA loop backsensing or thermistor inputs. The -40C to +85C industrial temperature range supports panel-mount cabinet environments. CRC/SCAN hardware validates memory integrity in safety-related PLC modules, reducing BOM cost by replacing an external watchdog IC.
Recomendado
Remote Control and Human-Interface Devices
The PIC16F18855-I/SO's IR-capable timers, low-power sleep, and 32 MHz core fit universal remote controls, HVAC wall thermostats, and wireless keypads. The 14 KB Flash accommodates protocol stacks (RC5/RC6, NEC, Zigbee-BLE host commands), while the 1 KB SRAM allows command buffering and backlight/display refresh. Hardware CWG drives LED indicator brightness through PWM without core intervention, and EEPROM stores user preference data. Battery life is extended by deep-sleep wake on key-press interrupt from the integrated IOC module.
Recomendado
Automotive Interior Accessories
Although not AEC-Q100 qualified, the PIC16F18855-I/SO is widely used in aftermarket and non-safety automotive interior accessories such as ambient lighting controllers, seat-occupancy switches, and cabin ventilation modules. Its 1.8V-5.5V input withstands 12V battery transients through an external LDO, and the CIPs handle CAN-LIN-style PWM edges inexpensively. The extended-temperature -E variant (PIC16F18855-E/SO) is pin-compatible for under-hood or sun-exposed cabin locations reaching +125C.
Recomendado
Low-Power Instrumentation
Handheld DMMs, data loggers, and medical-point-of-care monitors leverage the PIC16F18855-I/SO's combination of 10-bit ADC accuracy, EEPROM-backed calibration tables, and aggressive XLP modes. The 256-byte EEPROM stores non-volatile unit calibration values, while the 14 KB Flash holds measurement firmware and display UI. Active mode at 32 MHz lets the ADC sample at high rates for true-RMS calculations, while the deep-sleep <1 uA current preserves battery life across long intervals between readings.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16F18855-I/SO — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16F18857-I/SO | PIC16F18856-I/SO | PIC16F18875-I/SO | PIC16F18854-I/SO | PIC16F18855-E/SO |
|---|---|---|---|---|---|---|
| Package | 28-SOIC | 28-SOIC - same | 28-SOIC - same | 28-SOIC - same | 28-SOIC - same | 28-SOIC - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 14 KB | 28 KB | 28 KB | 28 KB | 8 KB | 14 KB |
| SRAM | 1 KB | 2 KB | 2 KB | 2 KB | 1 KB | 1 KB |
| Maximum CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C (Extended) |
| Core Independent Peripherals | CLC, NCO, CWG, CRC/SCAN, HLT | CLC, NCO, CWG, CRC/SCAN, HLT (same) | CLC, NCO, CWG, CRC/SCAN, HLT (same) | Extended CIP set | CLC, NCO, CWG, CRC/SCAN, HLT (same) | CLC, NCO, CWG, CRC/SCAN, HLT (same) |
| ICSP Programming | Yes (RB6/RB7) | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- Doubled Flash versus smaller sibling (vs PIC16F18854-I/SO)
- Industrial temperature grade option (vs PIC16F18855-E/SO)
- Expansion path within same footprint (vs PIC16F18857-I/SO)
Notas de projeto
Place a 100 nF ceramic decoupling capacitor as close as possible to each VDD pin (1 and 28) with traces short and direct. Add a bulk 10 uF tantalum or ceramic capacitor on the common VDD rail within 25 mm. For battery applications, choose an LDO with low quiescent current (e.g. MCP1700) and confirm the combined LDO Iq + PIC deep-sleep current stays within the duty-cycled budget of the application. Estimated: 100 nF ceramic + 10 uF bulk yields ripple below 5 mV at 32 MHz CPU active transients.
In the 28-SOIC package, RE3 shares the MCLR function and is not usable as a general-purpose I/O unless the MCLRE fuse is cleared. Always review the latest Microchip PIC16F1885X/7X errata (DS80000789) before committing to a pinout - some early revisions had ADC channel-pin swap issues. The ICSP clock pin is RB6/ICSPCLK and RB7/ICSPDAT; leave both accessible for production programming access or include test points.
At 32 MHz active CPU and full peripheral load, the PIC16F18855-I/SO dissipates approximately 15 mW from a 3.3 V supply; this is well within the SOIC-28 theta_JA of approximately 80 C/W, yielding a junction temperature rise under 2 C above ambient. For industrial -40 C to +85 C designs no heatsink is needed. In extended-temperature -E variants the same headroom applies up to +125 C ambient before derating supply or clock.
Reserve RB6 and RB7 exclusively for ICSP if in-system programming is required - do not connect external pull-ups stronger than 10 kohm on these pins or they will interfere with the programmer. Keep analog signal traces short and away from RB0/RB1 if those are used as digital outputs to avoid ADC sample crosstalk. Use a ground pour on the top layer under the SOIC to provide both thermal relief and a low-impedance return path for switching I/O.
Informações de conformidade
RoHS and REACH compliance per Microchip product page. Industrial -I temperature range only; not AEC-Q100 qualified - for AEC applications consult the automotive-grade PIC16F18855-E or ATSAM equivalents. Halogen-free per Microchip material declaration.
