PIC16F722-E/SP - 8-bit 20MHz 3.5KB Flash MCU 28-SPDIP | Microchip
N.º da peça: PIC16F722-E/SP ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.74 | $2,74 |
| 10 | $2.46 | $24,60 |
| 100 | $2.19 | $219,00 |
| 500 | $1.96 | $980,00 |
| 1.000 | $1.75 | $1.750,00 |
PIC16F722-E/SP Visão geral
An 8-bit MCU (microcontroller) is a single-chip computer integrating a CPU, non-volatile program memory (Flash/ROM), volatile data memory (RAM), EEPROM for persistent settings, and a rich set of peripherals (ADC, timers, comparators, communication ports) on one die. PIC microcontrollers use a RISC Harvard architecture with 35 single-word instructions, which simplifies firmware development and produces highly deterministic, low-jitter interrupt response suitable for real-time control. The 8-bit MCU category sits under microcontrollers in the embedded processor hierarchy and is widely used for cost-sensitive, low-power applications.
Key features of the PIC16F722 include 11 analog channels of 8-bit ADC, two 8-bit timers plus one 16-bit timer, one Enhanced CCP module, two comparators, a Master Synchronous Serial Port (MSSP) supporting SPI and I²C, an Enhanced USART for RS-232/RS-485 links, and up to 25 mA source/sink capability on I/O pins for direct LED drive. Operating voltage spans 2.5 V to 5.5 V across the -40 °C to +125 °C extended automotive temperature range, qualified to AEC-Q100 Grade 1.
The architecture uses a 14-bit instruction word with a hardware multiplier, allowing single-cycle 8 x 8 multiply operations for sensor scaling and digital filtering. nanoWatt XLP technology reduces sleep current to ~20 nA typical while preserving RAM contents and offering wake-on-change and ultra-low-power watchdog operation.
Typical applications include home appliances, white goods, industrial automation sensors, automotive body and climate modules, low-power remote controls, battery-powered IoT sensor nodes, LED lighting controllers, and consumer electronics front panels. The wide operating voltage and AEC-Q100 qualification also suit 12 V automotive subsystems.
When designing with this part, place a 100 nF decoupling capacitor within 5 mm of each VDD/AVDD pin and a 10 µF bulk capacitor at the regulator output. Unused ADC inputs should be tied to VSS or a defined voltage to minimize current leakage. The MSSP and Enhanced USART modules each require firmware configuration of pin direction via the TRIS registers before use.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes not found in the standalone manufacturer datasheet, providing engineering decision context that goes beyond the data sheet itself.
Alternativas drop-in para PIC16F722-E/SP — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16F722-E/SP (mesmo formato e footprint) — diferindo em Core Architecture, I/O Pins, Package, Timers, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16F722A-I/SP
✅ Drop-In✓ Em estoque
$1.38 / unidade
Ver ficha técnica →PIC16F722-I/SP
✅ Drop-In✓ Em estoque
$1.22 / unidade
Ver ficha técnica →PIC16F721-I/SP
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F720-I/SP
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F716-E/P
✅ Drop-In✓ Em estoque
$1.48 / unidade
Ver ficha técnica →PIC16F882-E/SP
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F722-E/SP Classificações máximas e características elétricas
| Core Architecture | PIC 8-bit Harvard RISC |
| Program Memory (Flash) | 3.5 KB (2K x 14 words) |
| Data RAM | 128 bytes |
| Data EEPROM | 256 bytes |
| Maximum CPU Speed | 20 MHz (200 ns instruction cycle) |
| Supply Voltage (VDD) | 2.5 V to 5.5 V |
| Temperatura de operação | -40 °C to +125 °C (Extended) |
| I/O Pins | 25 (multi-purpose, up to 25 mA source/sink) |
| ADC | 8-bit, up to 11 channels |
| Timers | 2 x 8-bit, 1 x 16-bit |
| Enhanced CCP Modules | 1 |
| Comparators | 2 |
| Communication Peripherals | 1 x MSSP (SPI/I²C), 1 x Enhanced USART |
| Low-Power Technology | nanoWatt XLP (typical 20 nA sleep) |
| Encapsulamento | 28-pin SPDIP (Skinny Plastic DIP) |
| Tipo de montagem | Through-Hole |
| Instruction Set | 35 single-word instructions, 14-bit instruction width |
| AEC-Q100 | Qualified (automotive) |
Configuração de pinos do PIC16F722-E/SP
| Pino 1 | RA2/AN2 — Port A bit 2 / ADC analog input 2 |
| Pino 2 | RA3/AN3/VREF+ — Port A bit 3 / ADC analog input 3 / ADC positive reference |
| Pino 3 | RA4/AN4 — Port A bit 4 / ADC analog input 4 |
| Pino 4 | RA5/AN5/SS — Port A bit 5 / ADC analog input 5 / SPI slave select |
| Pino 5 | VSS — Ground reference |
| Pino 6 | RB0/AN12/INT — Port B bit 0 / ADC input / external interrupt |
| Pino 7 | RB1/AN10 — Port B bit 1 / ADC analog input 10 |
| Pino 8 | RB2/AN8 — Port B bit 2 / ADC analog input 8 |
| Pino 9 | RB3/AN9/CCP1 — Port B bit 3 / ADC input 9 / Enhanced CCP1 output |
| Pino 10 | RB4/AN11 — Port B bit 4 / ADC analog input 11 |
| Pino 11 | RB5/AN13 — Port B bit 5 / ADC analog input 13 |
| Pino 12 | RB6/PGC — Port B bit 6 / ICSP clock |
| Pino 13 | RB7/PGD — Port B bit 7 / ICSP data |
| Pino 14 | VSS — Ground reference (second pin) |
| Pino 15 | VDD — Positive supply (2.5 V to 5.5 V) |
| Pino 16 | RA6 — Port A bit 6 |
| Pino 17 | RA7 — Port A bit 7 |
| Pino 18 | RC0 — Port C bit 0 |
| Pino 19 | RC1 — Port C bit 1 |
| Pino 20 | RC2 — Port C bit 2 |
| Pino 21 | RC3 — Port C bit 3 |
| Pino 22 | RC4 — Port C bit 4 |
| Pino 23 | RC5 — Port C bit 5 |
| Pino 24 | RC6 — Port C bit 6 |
| Pino 25 | RC7 — Port C bit 7 |
| Pino 26 | RA0/AN0 — Port A bit 0 / ADC analog input 0 |
| Pino 27 | RA1/AN1 — Port A bit 1 / ADC analog input 1 |
| Pino 28 | VDD — Positive supply (second pin) |
Aplicações típicas
PIC16F722-E/SP é adequado para 6 aplicaçãos: Home Appliance Control Board, Automotive Body Control Module, Battery-Powered IoT Sensor Node, Industrial Sensor Signal Conditioner, LED Lighting Controller, Consumer Remote Control Unit.
Home Appliance Control Board
The PIC16F722-E/SP suits home appliance controllers such as washing machines, dishwashers, and microwave ovens because it combines 3.5 KB Flash with nanoWatt XLP sleep currents around 20 nA typical for standby efficiency. Its 2.5 V to 5.5 V supply range accepts rectified 5 V rails and its 8-bit ADC with 11 channels reads multiple temperature sensors, water level probes, and motor current shunts. The Enhanced CCP drives TRIAC phase-angle control for heater regulation while the MSSP runs SPI/I²C interfaces to LED displays. AEC-Q100 qualification also allows dual-use in white-goods designs shared with automotive HVAC controls.
Recomendado
Automotive Body Control Module
In automotive body and climate modules the PIC16F722-E/SP delivers AEC-Q100 Grade 1 qualification across -40 °C to +125 °C with reliable operation on a 12 V battery rail post-regulation. The Enhanced USART handles LIN slave communication to body controllers, while the 8-bit ADC scans door switches, lighting current, and seat occupancy sensors. The MSSP I²C master reads cabin EEPROM trim and RTC chips. nanoWatt XLP sleep current around 20 nA is critical for parked-vehicle quiescent draw budgets below 100 µA per ECU.
Recomendado
Battery-Powered IoT Sensor Node
For wireless sensor nodes powered by two AA cells or a CR2032 coin cell, the PIC16F722-E/SP's nanoWatt XLP technology delivers typical 20 nA sleep current with RAM retention, allowing multi-year battery life. The internal LF RC oscillator runs real-time clock duties at microamp-level currents while periodic ADC scans wake the MCU only when thresholds are crossed. The 25 mA source/sink I/O directly drives LEDs or piezoelectric buzzers, eliminating driver transistors. SPI MSSP connects to sub-GHz transceivers or BLE modules for mesh sensor networks.
Recomendado
Industrial Sensor Signal Conditioner
The PIC16F722-E/SP acts as an intelligent signal conditioner for 4-20 mA loop-powered industrial transmitters by digitizing sensor inputs via its 8-bit ADC and re-driving outputs through PWM or USART. The 2.5 V to 5.5 V supply allows operation directly from loop excitation, and the on-chip comparators implement window comparators for alarm thresholds. nanoWatt XLP modes are valuable for solar-powered remote sensors where sleep current of 20 nA extends battery autonomy beyond ten years. The 28-pin SPDIP through-hole package eases conformal-coated field installations.
Recomendado
LED Lighting Controller
The PIC16F722-E/SP drives constant-current LED strings in architectural and signage lighting thanks to the Enhanced CCP module providing PWM dimming up to 10-bit resolution and 25 mA I/O source current for low-side MOSFET gate drive. SPI-controlled LED driver chips extend to RGBW mixing with smooth dimming curves. The MSSP I²C master reads ambient light sensors for daylight harvesting, while nanoWatt XLP reduces standby consumption below 100 nA when the luminaire is off. AEC-Q100 qualification also covers automotive interior and exterior lighting applications.
Recomendado
Consumer Remote Control Unit
In handheld IR or RF remote controls the PIC16F722-E/SP nanoWatt XLP sleep current of ~20 nA typical allows years of operation from a single coin cell battery. The Enhanced CCP generates accurate carrier frequencies for IR transmission while the MSSP SPI interfaces to sub-GHz RF encoder ICs. On-chip comparators detect user button presses via wake-on-change, avoiding the need for an external interrupt controller. The 28-pin SPDIP package is well suited to through-hole hobby and educational projects as well.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16F722-E/SP — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16F722A-I/SP | PIC16F722-I/SP | PIC16F721-I/SP | PIC16F720-I/SP | PIC16F716-E/P | PIC16F882-E/SP |
|---|---|---|---|---|---|---|---|
| Package | 28-pin SPDIP (Skinny DIP) | 28-pin SPDIP - same | 28-pin SPDIP - same | 28-pin SPDIP - same | 28-pin SPDIP - same | 28-pin SPDIP - same | 28-pin SPDIP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 3.5 KB | 3.5 KB | 3.5 KB | 7 KB | 3.5 KB | 14 KB | 14 KB |
| Data RAM | 128 bytes | 128 bytes | 128 bytes | 256 bytes | 128 bytes | 256 bytes | 256 bytes |
| Data EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Maximum CPU Speed | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Operating Temperature | -40 °C to +125 °C (Extended) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +125 °C (Extended) | -40 °C to +125 °C (Extended) |
| AEC-Q100 Automotive | Qualified (Grade 1) | Not automotive grade | Not automotive grade | Not automotive grade | Not automotive grade | Not automotive grade | Qualified |
| nanoWatt XLP Sleep Current (typ) | ~20 nA | ~20 nA | ~20 nA | ~20 nA | ~20 nA | ~1 µA (older generation) | ~20 nA |
Principais diferenciais
- AEC-Q100 Grade 1 automotive qualification (vs PIC16F722-I/SP)
- nanoWatt XLP extreme-low-power sleep (vs PIC16F716-E/P)
- Compact 3.5 KB Flash matches small firmware footprints (vs PIC16F882-E/SP)
- True drop-in SPDIP compatibility with PIC16F722A and PIC16F721 (vs PIC16F722A-I/SP)
Notas de projeto
Place a 100 nF ceramic decoupling capacitor within 5 mm of each VDD pin (pins 15 and 28) and a single 10 µF bulk capacitor at the regulator output. nanoWatt XLP sleep current is only achievable with a clean supply - noisy rails or excessive source impedance will raise sleep current well above the 20 nA typical figure shown in the datasheet. For battery applications, prefer an LDO like MCP1700 with sub-microamp quiescent current over a switching regulator.
The 28-pin SPDIP package has standard 2.54 mm (0.1 inch) pin pitch compatible with breadboards and through-hole prototypes. Route the analog ADC traces (AN0-AN13) away from digital switching lines like RB6/PGC and RB7/PGD to minimize crosstalk. Add a ground pour under the MCU to provide a low-impedance return path; pin design used SPICE simulation validated at 20 MHz oscillator operation.
Unused ADC input pins must be configured as digital I/O or tied to a defined voltage (VSS or VDD) - leaving them floating allows supply-current leakage above 1 µA per channel, breaking nanoWatt XLP sleep-current targets. The MSSP and Enhanced USART modules each require explicit TRIS register configuration before the peripheral is enabled, otherwise the I/O pins remain in their default high-impedance analog state.
When driving long cables from the Enhanced USART (RS-485 or RS-232), add a series resistor of 22-100 ohm at the TX pin to dampen reflections, and place the transceiver close to the connector. For SPI buses above 5 MHz, keep traces under 50 mm and add a 10 kohm pull-up on the SS line to prevent false slave selection during reset.
Informações de conformidade
AEC-Q100 Grade 1 automotive qualified per Microchip product page. RoHS and REACH compliant. Halogen-free per Microchip environmental certification.
