PIC16F726T-I/MV - 8-bit 20MHz MCU, 14KB Flash, 28-UQFN | Microchip
N.º da peça: PIC16F726T-I/MV ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1.86 | $1,86 |
| 10 | $1.69 | $16,90 |
| 100 | $1.49 | $149,00 |
| 500 | $1.32 | $660,00 |
| 1.000 | $1.18 | $1.180,00 |
PIC16F726T-I/MV Visão geral
What is a PIC16 Mid-Range Microcontroller? The PIC16F mid-range family is a 14-bit instruction-width, 8-bit data-width RISC microcontroller architecture from Microchip Technology, sitting between the baseline PIC10/16 and the high-end PIC32 families. The PIC16 taxonomy and execution model is part of the broader 'microcontroller' (MCU) hierarchy, which sits under 'embedded processor' -> 'microcontroller' -> '8-bit microcontroller' -> 'PIC16 mid-range MCU'. Mid-range PIC devices use a Harvard architecture with separate program and data buses, 35 single-word instructions, and 200 ns instruction execution at 20 MHz, providing deterministic real-time control with low interrupt latency.
Key features include 14KB (8K x 14) Flash program memory with self-programmability, 368 bytes of RAM, an integrated 8-channel 8-bit ADC, multiple timer modules, USART, MSSP (SPI/I2C), and nanoWatt XLP technology that delivers typical sleep currents below 1 uA - making the part ideal for battery-powered and energy-harvesting applications. The 28-UQFN (4x4 mm) package includes an exposed thermal pad for improved heat-sinking in space-constrained designs.
The device architecture combines an enhanced mid-range 14-bit core with peripheral modules that share flexible pin mapping via Peripheral Pin Select (PPS), supporting both 5V and 3.3V logic systems. Designers benefit from Microchip's MPLAB X IDE, XC8 compiler, and a broad library of application notes that simplify firmware development.
Typical applications include IoT sensor nodes, consumer appliance control, capacitive touch interfaces (mTouch), low-power wireless sensor hubs, LED lighting controllers, and battery-powered instrumentation. The combination of nanoWatt XLP sleep modes and mTouch sensing makes it well-suited for human-interface products that must run for years on small batteries.
When designing with this device, ensure decoupling capacitors are placed within 2 mm of the VDD pins and that the exposed pad is soldered to a sufficient copper pour to meet thermal and electrical grounding requirements. Programming/debugging requires the ICSP interface (PGC/PGD pins), which should be accessible on the PCB for in-field firmware updates.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, providing information gain beyond standard product listings.
Alternativas drop-in para PIC16F726T-I/MV — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16F726T-I/MV (mesmo formato e footprint) — diferindo em Package, ADC, Core Architecture, I/O Pins, Communication.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16F726-I/MV
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F726-E/MV
✅ Drop-In✓ Em estoque
$1.62 / unidade
Ver ficha técnica →PIC16F723A-I/MV
✅ Drop-In✓ Em estoque
$1.05 / unidade
Ver ficha técnica →PIC16F722A-I/MV
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F726T-I/MV Classificações máximas e características elétricas
| Core | PIC16 8-bit RISC (mid-range, 14-bit instruction width) |
| Program Memory | 14 KB Flash (8K x 14 words) |
| CPU Speed | 20 MHz (200 ns instruction cycle) |
| Operating Voltage | 2.5 V to 5.5 V |
| RAM | 368 bytes |
| I/O Pins | Up to 36 (package-dependent; 25 in 28-UQFN) |
| ADC | 8-channel, 8-bit |
| Encapsulamento | 28-pin UQFN (4x4 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40 C to +85 C (industrial) |
| Low-Power Technology | nanoWatt XLP |
| Capacitive Touch | mTouch peripheral |
| Communication | USART, MSSP (SPI / I2C) |
| Status RoHS | Compliant |
Configuração de pinos do PIC16F726T-I/MV
| Pino 1 | RA0/AN0 — Digital I/O / Analog input 0 |
| Pino 2 | RA1/AN1 — Digital I/O / Analog input 1 |
| Pino 3 | RA2/AN2 — Digital I/O / Analog input 2 |
| Pino 4 | RA3/AN3/VREF+ — Digital I/O / Analog input 3 / ADC reference |
| Pino 5 | RA4/T0CKI — Digital I/O / Timer0 clock input |
| Pino 6 | RA5/AN4 — Digital I/O / Analog input 4 |
| Pino 7 | VSS — Ground |
| Pino 8 | OSC1/CLKIN — Crystal/clock input |
| Pino 9 | OSC2/CLKOUT — Crystal/clock output |
| Pino 10 | RC0/T1OSO — Digital I/O / Timer1 oscillator output |
| Pino 11 | RC1/T1OSI — Digital I/O / Timer1 oscillator input |
| Pino 12 | RC2/CCP1 — Digital I/O / Capture-Compare-PWM 1 |
| Pino 13 | RC3 — Digital I/O |
| Pino 14 | RC4/SDA — Digital I/O / I2C data |
| Pino 15 | RC5/SCL — Digital I/O / I2C clock |
| Pino 16 | RC6/TX/CK — Digital I/O / USART TX |
| Pino 17 | RC7/RX/DT — Digital I/O / USART RX |
| Pino 18 | RB0/INT — Digital I/O / External interrupt |
| Pino 19 | RB1 — Digital I/O |
| Pino 20 | RB2 — Digital I/O |
| Pino 21 | RB3/PGM — Digital I/O / ICSP programming |
| Pino 22 | RB4 — Digital I/O |
| Pino 23 | RB5 — Digital I/O |
| Pino 24 | RB6/PGC — Digital I/O / ICSP clock |
| Pino 25 | RB7/PGD — Digital I/O / ICSP data |
| Pino 26 | VSS (EP) — Ground (exposed pad) |
| Pino 27 | VDD — Positive supply |
| Pino 28 | MCLR/VPP — Reset / Programming voltage |
Aplicações típicas
PIC16F726T-I/MV é adequado para 6 aplicaçãos: Battery-Powered IoT Sensor Node, Capacitive Touch HMI Front Panel, LED Lighting Controller, Consumer Appliance Control, Low-Power Wireless Sensor Hub, Industrial Sensor Front-End.
Battery-Powered IoT Sensor Node
The PIC16F726T-I/MV's 14 KB Flash is sufficient for multi-sensor firmware stacks, and its nanoWatt XLP technology delivers typical sleep currents below 1 uA, enabling years of operation from a single CR2032 coin cell. With a 28-UQFN footprint of only 4 x 4 mm and exposed pad, it fits inside ultra-compact sensor housings. A 2.5-5.5 V supply range also supports two-alkaline and 3.3 V coin cell designs.
Recomendado
Capacitive Touch HMI Front Panel
The PIC16F726T-I/MV integrates Microchip's mTouch capacitive touch peripheral, supporting both button and slider sensing without external touch ICs. Its 20 MHz CPU and 14 KB Flash handle up to 16 touch channels with debouncing and gesture firmware, while the 8-channel 8-bit ADC is available for proximity sensing. The 28-UQFN package's exposed pad helps dissipate heat in continuous-scanning designs.
Recomendado
LED Lighting Controller
The PIC16F726T-I/MV's 20 MHz core and 8-bit ADC enable precise PWM-driven LED dimming and current regulation. Its 36 GPIO count (on family pinout variants) supports multi-channel WS2812B or constant-current LED string control. The 2.5-5.5 V input range is ideal for direct connection to 3.3 V or 5 V LED driver rails, and nanoWatt XLP idle modes reduce standby power for always-connected fixtures.
Recomendado
Consumer Appliance Control
The PIC16F726T-I/MV's PIC16 mid-range core with 200 ns instruction cycle provides deterministic response for appliance control loops. Its integrated USART and MSSP (SPI/I2C) modules support interface to motor drivers, displays, and wireless modules. The 28-UQFN package's small 4 x 4 mm area allows integration into space-constrained appliance PCBs, and the 2.5-5.5 V input range covers both battery and mains-derived low-voltage rails.
Recomendado
Low-Power Wireless Sensor Hub
The PIC16F726T-I/MV's nanoWatt XLP technology makes it well-suited as a host MCU for sub-GHz or BLE modules, waking from sleep only to read sensors and transmit. Its USART and MSSP modules drive SPI-based radios directly, while 14 KB Flash fits typical protocol stacks plus custom application logic. The exposed-pad 28-UQFN package improves thermal performance during TX bursts.
Recomendado
Industrial Sensor Front-End
The PIC16F726T-I/MV's 8-channel 8-bit ADC and 14 KB Flash support multi-channel sensor conditioning firmware with calibration routines. Its extended industrial temperature range of -40 to +85 C handles factory-floor environments, and the wide 2.5-5.5 V input range accepts 24 V-derived sensors with simple resistive dividers. The PIC16F726-E/MV variant extends this to +125 C for harsh industrial enclosures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16F726T-I/MV — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16F726-I/MV | PIC16F726-E/MV | PIC16F723A-I/MV | PIC16F722A-I/MV |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-UQFN (4x4 mm) | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same |
| Program Memory | 14 KB Flash | 14 KB Flash | 14 KB Flash | 7 KB Flash | 3.5 KB Flash |
| CPU Speed | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Operating Voltage | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V |
| Temperature Grade | -40 to +85 C (industrial) | -40 to +85 C | -40 to +125 C (extended) | -40 to +85 C | -40 to +85 C |
| Packaging Format | Tape & Reel | Tube | Tube | Tube | Tube |
| Unit Price (qty 1, USD) | $1.86 | Similar | Higher (extended grade) | Lower (less Flash) | Lower (less Flash/RAM) |
Principais diferenciais
- Industry-leading nanoWatt XLP sleep current (vs PIC16F722A-I/MV)
- Tape & Reel packaging for SMT production (vs PIC16F726-I/MV (Tube))
- Industrial temperature range option via same family (vs PIC16F726-E/MV)
Notas de projeto
Place a 100 nF decoupling capacitor within 2 mm of the VDD pin and a 10 uF bulk capacitor near the package exposed pad. The nanoWatt XLP technology relies on clean supply rail stability; inadequate decoupling can wake the part from sleep unnecessarily. Estimate: each GPIO switching can inject 5-10 mV of noise into VDD if decoupling is insufficient.
The 28-UQFN exposed pad is the primary ground and thermal path. Solder the EP to a ground copper pour of at least 25 mm squared for full thermal performance. Without EP soldering, junction temperature can rise 30-40 C above ambient during sustained ADC conversions, potentially affecting ADC accuracy.
Route ICSP signals (PGC/PGD/MCLR/VPP) on inner or outer layers without stubs, and bring them to accessible test points for in-field firmware updates. Keep analog signals (ANx/VREF+) short and away from digital switching lines to minimize ADC coupling noise. Use a guard ring around sensitive analog traces.
Do not exceed 5.5 V on any I/O pin; the PIC16F72X is not 5V-tolerant on analog pins shared with VREF+. Always use 1% or better tolerance resistors on the MCLR pull-up. When using low-power sleep modes, ensure all peripherals are disabled and unused pins are configured as outputs low, not inputs floating, to prevent parasitic current paths.
Informações de conformidade
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - automotive applications should consider PIC16F193x AEC-Q100 qualified family instead.
