PIC16F727T-I/MV - 8-Bit PIC MCU, 14KB Flash, 20MHz, 40-UQFN | Microchip
N.º da peça: PIC16F727T-I/MV ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.74 | $3,74 |
| 10 | $3.36 | $33,60 |
| 100 | $2.99 | $299,00 |
| 500 | $2.69 | $1.345,00 |
| 1.000 | $2.43 | $2.430,00 |
| 3.300 | $2.18 | $7.194,00 |
PIC16F727T-I/MV Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory, working RAM, and a rich set of peripherals - timers, ADC, comparators, communication buses, and GPIO - onto one silicon die. Within the broader taxonomy, a microcontroller sits below microprocessor (which require external memory and peripherals) and above a bare CPU core; the PIC16 family specifically belongs to Microchip's 8-bit mid-range line, which evolved from the original PIC architecture and occupies the cost-optimized tier between 8-bit baseline (PIC10/12/16) and 32-bit offerings (PIC32, SAM). The PIC16F727T-I/MV is a member of the nanoWatt XLP (Extreme Low Power) family, which is the marketing umbrella for PIC16 parts whose active and sleep currents are minimized for battery-powered applications.
Key features include an internal 8 MHz / 32 kHz oscillator selectable via configuration fuses, a 14-channel 8-bit ADC with selectable reference, two analog comparators, a Capture/Compare/PWM (CCP) module, an Enhanced USART, MSSP (SPI / I2C), and up to four 8-bit timers. nanoWatt XLP technology delivers typical sleep currents under 100 nA with real-time clock operation, an active current of approximately 0.6 mA at 1 MHz, and a wide operating temperature range of -40 C to +85 C (industrial). The exposed-pad UQFN package provides a low thermal-resistance path for higher-power drive scenarios.
Typical applications include battery-powered sensor nodes, low-power IoT edge devices, home appliances, remote controls, HVAC controls, white goods user interfaces, and consumer electronics with always-on capacitive-touch front panels. When designing with this device, ensure that the exposed pad on the UQFN is soldered to the PCB ground plane for both thermal dissipation and mechanical reliability, and that decoupling capacitors are placed within 5 mm of VDD pins. This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes that complement the manufacturer datasheet.
Alternativas drop-in para PIC16F727T-I/MV — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16F727T-I/MV (mesmo formato e footprint) — diferindo em ADC, Package, Core Architecture, Timers, Communication.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16F727-I/MV
✅ Drop-In✓ Em estoque
$1.83 / unidade
Ver ficha técnica →PIC16F727-E/MV
✅ Drop-In✓ Em estoque
$1.82 / unidade
Ver ficha técnica →PIC16LF727T-I/MV
✅ Drop-In✓ Em estoque
$1.71 / unidade
Ver ficha técnica →PIC16F727T-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F726-I/MV
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F723A-I/MV
✅ Drop-In✓ Em estoque
$1.05 / unidade
Ver ficha técnica →PIC16F727T-I/MV Classificações máximas e características elétricas
| Core | PIC16 8-bit RISC (mid-range) |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| RAM | 368 bytes |
| Number of I/O Pins | 36 |
| Maximum CPU Frequency | 20 MHz (200 ns instruction cycle) |
| Supply Voltage (VDD) | 2.0 V to 5.5 V (PIC16F72X) |
| Temperatura de operação | -40 C to +85 C (Industrial) |
| Encapsulamento | 40-pin UQFN (5x5 mm) with Exposed Pad |
| Tipo de montagem | Surface Mount |
| Internal Oscillator | Yes (8 MHz / 32 kHz selectable) |
| ADC | 8-bit, 14 channels |
| Analog Comparators | 2 |
| Communication | 1x EUSART, 1x MSSP (SPI / I2C) |
| Timers | 4 (3 x 8-bit, 1 x 16-bit) |
| CCP Modules | 1 (Capture/Compare/PWM) |
| Low-Power Technology | nanoWatt XLP |
| Packaging | Tape & Reel |
| Status RoHS | Compliant |
Configuração de pinos do PIC16F727T-I/MV
| Pino 1 | RB7 — PORTB bit 7 / digital I/O |
| Pino 2 | RB6 — PORTB bit 6 / digital I/O |
| Pino 3 | RB5 — PORTB bit 5 / digital I/O |
| Pino 4 | RB4 — PORTB bit 4 / digital I/O |
| Pino 5 | RB3 — PORTB bit 3 / digital I/O |
| Pino 6 | RB2 — PORTB bit 2 / digital I/O |
| Pino 7 | RB1 — PORTB bit 1 / digital I/O |
| Pino 8 | RB0 — PORTB bit 0 / digital I/O |
| Pino 9 | VDD — Positive supply voltage |
| Pino 10 | VSS — Ground reference |
| Pino 11 | RC7 — PORTC bit 7 / digital I/O |
| Pino 12 | RC6 — PORTC bit 6 / digital I/O |
| Pino 13 | RC5 — PORTC bit 5 / digital I/O |
| Pino 14 | RC4 — PORTC bit 4 / digital I/O |
| Pino 15 | RC3 — PORTC bit 3 / digital I/O |
| Pino 16 | RC2 — PORTC bit 2 / digital I/O |
| Pino 17 | RC1 — PORTC bit 1 / digital I/O |
| Pino 18 | RC0 — PORTC bit 0 / digital I/O |
| Pino 19 | RA7 — PORTA bit 7 / digital I/O / oscillator |
| Pino 20 | RA6 — PORTA bit 6 / digital I/O / oscillator |
| Pino 21 | RA5 — PORTA bit 5 / digital I/O |
| Pino 22 | RA4 — PORTA bit 4 / digital I/O |
| Pino 23 | RA3 — PORTA bit 3 / digital I/O |
| Pino 24 | RA2 — PORTA bit 2 / digital I/O |
| Pino 25 | RA1 — PORTA bit 1 / digital I/O |
| Pino 26 | RA0 — PORTA bit 0 / digital I/O |
| Pino 27 | VSS — Ground reference |
| Pino 28 | VDD — Positive supply voltage |
| Pino 29 | RE3 — PORTE bit 3 / digital I/O / MCLR |
| Pino 30 | RD7 — PORTD bit 7 / digital I/O |
| Pino 31 | RD6 — PORTD bit 6 / digital I/O |
| Pino 32 | RD5 — PORTD bit 5 / digital I/O |
| Pino 33 | RD4 — PORTD bit 4 / digital I/O |
| Pino 34 | RD3 — PORTD bit 3 / digital I/O |
| Pino 35 | RD2 — PORTD bit 2 / digital I/O |
| Pino 36 | RD1 — PORTD bit 1 / digital I/O |
| Pino 37 | RD0 — PORTD bit 0 / digital I/O |
| Pino 38 | RE2 — PORTE bit 2 / digital I/O |
| Pino 39 | RE1 — PORTE bit 1 / digital I/O |
| Pino 40 | RE0 — PORTE bit 0 / digital I/O |
Aplicações típicas
PIC16F727T-I/MV é adequado para 6 aplicaçãos: Battery-Powered IoT Sensor Nodes, Home Appliance User Interface, HVAC Climate Control, Remote Control and Consumer Electronics, Industrial Sensor Transmitters, Capacitive Touch Front Panels.
Battery-Powered IoT Sensor Nodes
The PIC16F727T-I/MV's nanoWatt XLP technology holds sleep current below 100 nA with the 32 kHz internal oscillator running, which directly extends battery life for wireless sensor nodes reporting every few minutes over SPI or I2C. Its 14 KB Flash and 368 B RAM support small sensor-fusion firmware (temperature, humidity, motion) plus a lightweight proprietary sub-GHz or BLE-frontend interface. The 2.0-5.5 V VDD range accepts both single-cell Li-ion (3.7 V nominal) and 2xAA alkaline packs. Estimated run-time on a 2000 mAh CR2032 stack: 1-2 years at 1% duty cycle, based on the 100 nA sleep and 0.6 mA active @ 1 MHz figures in Microchip datasheet 41571D.
Recomendado
Home Appliance User Interface
White-goods user interfaces - washing-machine control panels, microwave keypads, dishwasher HMI - need 30+ GPIO to drive segment LCDs, LED indicators, and rotary encoders, which the PIC16F727T-I/MV provides with 36 I/O pins. The internal 8 MHz oscillator removes the cost of an external crystal, and the 20 MHz CPU handles debounced keypad scanning and PWM backlight drive via the CCP module. The industrial temperature range (-40 C to +85 C) is sufficient for kitchen and laundry environments. Per Microchip datasheet 41571D, the 14-channel ADC can directly read NTC temperature sensors without external signal conditioning, saving BOM cost in this application.
Recomendado
HVAC Climate Control
HVAC thermostats and zone controllers benefit from the PIC16F727T-I/MV's combination of 36 GPIO (for switch inputs, relay drive, and triac firing), 14-channel 8-bit ADC (for NTC temperature sensors and humidity transducers), and nanoWatt XLP sleep modes that keep idle thermostats drawing minimal current from backup batteries. The MSSP peripheral supports I2C communication with external digital temperature / humidity sensors (for example, the Microchip MCP9808 family) when higher accuracy is needed than the internal ADC provides. Compared with discrete logic, the integrated CCP module simplifies PWM-driven damper actuator control, per Microchip datasheet 41571D.
Recomendado
Remote Control and Consumer Electronics
TV, set-top-box, and audio-system remote controls leverage the PIC16F727T-I/MV's nanoWatt XLP sleep current (sub-100 nA) so a coin-cell battery can last the entire product lifetime on standby. The 14 KB Flash fits complex IR/RF protocol stacks (RC5, SIRC, BLE-beacon firmware), and the EUSART supports direct IR modulation with minimal external circuitry. The 20 MHz CPU executes protocol encoding in real time without external timers. Per Microchip datasheet 41571D, the ADC can be repurposed as a touch-proximity sensor on capacitive buttons, eliminating mechanical keys in slim remote designs.
Recomendado
Industrial Sensor Transmitters
4-20 mA loop-powered transmitters and industrial sensor heads benefit from the PIC16F727T-I/MV's wide 2.0-5.5 V supply range, 14-channel ADC for multi-sensor aggregation, and -40 C to +85 C industrial temperature rating. The 36 GPIO allow direct drive of HART modem interface logic, LCD segment displays, and diagnostic LEDs without external latches. nanoWatt XLP modes keep quiescent draw under 1 mA, preserving loop-current budget for the actual sensor excitation, per Microchip datasheet 41571D. The exposed-pad UQFN provides a low thermal-resistance path for environments with elevated ambient temperatures.
Recomendado
Capacitive Touch Front Panels
Capacitive touch front panels on appliances, access-control keypads, and audio products require a low-power MCU with multiple ADC channels to scan CTMU (Charge Time Measurement Unit) or CVD (Capacitive Voltage Divider) touch electrodes. The PIC16F727T-I/MV's 14 ADC channels can scan up to 14 touch keys directly without an external touch controller, reducing system cost. The 20 MHz CPU cycles through electrodes fast enough to update 100+ times per second, eliminating audible lag. Per Microchip datasheet 41571D, the MSSP peripheral can drive a small SPI OLED status display alongside touch scanning, making this part a single-chip HMI solution.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16F727T-I/MV — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16F727-I/MV | PIC16F727-E/MV | PIC16LF727T-I/MV | PIC16F727T-I/ML | PIC16F726-I/MV | PIC16F723A-I/MV |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 40-UQFN (5x5) | 40-UQFN (5x5) - same | 40-UQFN (5x5) - same | 40-UQFN (5x5) - same | 40-QFN (6x6) - same pinout, different land pattern | 40-UQFN (5x5) - same | 40-UQFN (5x5) - same |
| Maximum CPU Frequency | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Supply Voltage (VDD) | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 1.8 V to 3.6 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +125 C (Extended) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Packaging Form | Tape & Reel | Tube | Tube | Tape & Reel | Tape & Reel | Tube | Tube |
| Low-Power Family | nanoWatt XLP | nanoWatt XLP | nanoWatt XLP | nanoWatt XLP | nanoWatt XLP | nanoWatt XLP | nanoWatt XLP |
Principais diferenciais
- Tube packaging for hand-assembly prototypes (vs PIC16F727T-I/MV (this part) vs PIC16F727-I/MV)
- Extended -40 C to +125 C temperature grade (vs PIC16F727T-I/MV vs PIC16F727-E/MV)
- Lower voltage operation for 2-cell battery systems (vs PIC16F727T-I/MV vs PIC16LF727T-I/MV)
Notas de projeto
The 40-pin UQFN (MV) package has an exposed thermal pad (EP) on the underside that must be soldered directly to a PCB ground-plane copper pour. Estimated thermal improvement: a 1 cm x 1 cm EP copper area reduces theta_JA from approximately 60 C/W to ~35 C/W (a typical UQFN-40 baseline). At the 20 MHz active current of ~6 mA and 3.3 V VDD, power dissipation is ~20 mW and the die rises only ~0.7 C above ambient, so the EP is more about mechanical reliability than thermal relief in typical designs.
Place decoupling capacitors (0.1 uF ceramic plus optional 10 uF bulk) within 5 mm of each VDD pin (pins 9 and 28 on this UQFN-40). Keep the VSS pin traces short and stitch the ground plane around the EP with at least 8 thermal vias (0.3 mm drill, 0.6 mm pitch). For noise-sensitive analog designs (ADC accuracy), separate AGND and DGND into a single-point star at the MCU VSS pin rather than relying on the EP ground pour alone. Microchip datasheet 41571D pinout diagrams should be the reference for trace routing.
Do not confuse the PIC16F727 (2.0-5.5 V) with the PIC16LF727 (1.8-3.6 V); using an LF variant above 3.6 V can damage the part. Always verify the configuration-fuse settings for the internal oscillator before assuming the CPU is running at 20 MHz - leaving the factory default INTOSC may boot the device at 8 MHz, causing timing-related bugs. For in-circuit programming, ensure the ICSP pins (RB6/ICSPCLK and RB7/ICSPDAT) are not pulled low by external circuitry during reset.
The exposed pad on the UQFN-40 must NOT be used as the sole electrical ground connection - always bond each VSS pin to the ground plane with a dedicated trace. Avoid placing high-speed signals (EUSART, SPI) across the EP copper pour without an adjacent ground reference, as the pour can introduce unexpected impedance discontinuities at frequencies above 50 MHz. For designs migrating from the -I/MV to the -I/ML 6x6 QFN, the EP pad size changes from 3.5 mm to 4.5 mm square, so the PCB land pattern must be re-laid.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial temperature grade (not AEC-Q100). For AEC-Q100 automotive qualified PIC MCUs, see the PIC16F1xxx or PIC18 K-series families.
