PIC16LF1527T-I/MR - 8-bit XLP MCU, 28KB Flash, 64-VQFN | Microchip
N.º da peça: PIC16LF1527T-I/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.46 | $3,46 |
| 10 | $3.07 | $30,70 |
| 100 | $2.48 | $248,00 |
| 500 | $2.1 | $1.050,00 |
| 1.000 | $1.85 | $1.850,00 |
PIC16LF1527T-I/MR Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory, volatile data memory, peripherals, and digital I/O into one package. The 8-bit PIC family uses a Harvard RISC architecture optimised for deterministic interrupt response and compact code density. Within the power-management hierarchy, the PIC16LF1527 sits in the XLP (eXtreme Low Power) sub-family, sitting below the dsPIC33 and PIC32 families in Microchip's 16-bit / 32-bit tier and above the baseline PIC10/12/16 baseline parts in computational capability. Its low-voltage (LF) variant operates below 3.6 V, distinguishing it from the PIC16F1527 which tolerates 5 V.
Key features include the nanoWatt XLP sleep current of approximately 20 nA typical, an integrated 10-bit ADC, multiple PWM/CCP/ECCP modules, I2C/SPI/EUSART peripherals, and a wide operating temperature range of -40 C to +85 C (Industrial, "I"). The device supports in-circuit serial programming (ICSP) and in-circuit debug (ICD) via two pins, eliminating the need for an external programmer socket.
Architecturally, the PIC16LF1527T-I/MR uses a 14-bit instruction word core with a 16-bit data path, 8-level hardware stack, and interrupt-driven peripheral arbitration. The 64-VQFN (9x9) package provides an exposed pad for thermal dissipation and reduced ground inductance. Tape-and-reel packaging ("T") supports high-volume SMT assembly lines.
Typical applications include low-power IoT sensor nodes, battery-powered handheld instruments, consumer appliance controllers, automotive body and HMI modules, and industrial telemetry where the LF (low-voltage) variant, XLP sleep current, and 64-VQFN footprint minimise PCB area while maximising battery life. Designers choose this part when 28 KB of Flash is sufficient and 3.3 V-only operation is acceptable.
A practical design tip: route the exposed thermal pad (EP) to a single continuous ground plane stitched with multiple vias for both thermal and electrical performance. Always de-couple VDD with a 100 nF ceramic capacitor placed within 3 mm of the supply pin.
This page synthesises distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer datasheet alone, providing engineers with a complete decision framework for selecting and sourcing the PIC16LF1527T-I/MR.
Alternativas drop-in para PIC16LF1527T-I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16LF1527T-I/MR (mesmo formato e footprint) — diferindo em Package, Core Architecture, Program Memory (Flash), Supply Voltage (VDD), CPU Speed.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16F1527T-I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16LF1526T-I/MR
✅ Drop-In✓ Em estoque
$1.3 / unidade
Ver ficha técnica →PIC16LF1527-I/MR
✅ Drop-In✓ Em estoque
$1.75 / unidade
Ver ficha técnica →PIC16LF1527-E/MR
✅ Drop-In✓ Em estoque
$1.92 / unidade
Ver ficha técnica →PIC16F1527-I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16LF1526-I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16LF1527T-I/MR Classificações máximas e características elétricas
| Core Architecture | 8-bit PIC RISC (Harvard) |
| Family | PIC16F/LF152x (XLP nanoWatt) |
| Instruction Word | 14-bit |
| Maximum CPU Speed | 20 MHz (20 MIPS) |
| Program Memory (Flash) | 28 KB (16K x 14 words) |
| Data RAM | 1536 bytes |
| Data EEPROM | 256 bytes |
| Supply Voltage (VDD) | 2.5 V to 3.6 V |
| I/O Pins | 18 |
| Faixa de temperatura de operação | -40 C to +85 C (Industrial) |
| Encapsulamento | 64-pin VQFN (MR), 9 x 9 mm with exposed pad |
| Tipo de montagem | Surface Mount |
| Packaging Style | Tape & Reel ("T") |
| ADC | 10-bit |
| Communication Peripherals | EUSART, I2C, SPI |
| Status RoHS | Compliant (lead-free, per DigiKey listing) |
Configuração de pinos do PIC16LF1527T-I/MR
| Pino 1 | RA0/AN0 — Digital I/O port A bit 0 / analog channel 0 |
| Pino 2 | RA1/AN1 — Digital I/O port A bit 1 / analog channel 1 |
| Pino 3 | RA2/AN2 — Digital I/O port A bit 2 / analog channel 2 |
| Pino 4 | RA3/AN3 — Digital I/O port A bit 3 / analog channel 3 |
| Pino 5 | RA4/AN4 — Digital I/O port A bit 4 / analog channel 4 |
| Pino 6 | RA5/AN5 — Digital I/O port A bit 5 / analog channel 5 |
| Pino 7 | RA6/AN6 — Digital I/O port A bit 6 / analog channel 6 |
| Pino 8 | RA7/AN7 — Digital I/O port A bit 7 / analog channel 7 |
| Pino 9 | VSS — Ground reference |
| Pino 10 | VDD — Positive supply 2.5 V to 3.6 V |
| Pino 11 | RB0/INT — Digital I/O port B bit 0 / external interrupt |
| Pino 12 | RB1 — Digital I/O port B bit 1 |
| Pino 13 | RB2 — Digital I/O port B bit 2 |
| Pino 14 | RB3 — Digital I/O port B bit 3 |
| Pino 15 | RB4 — Digital I/O port B bit 4 |
| Pino 16 | RB5 — Digital I/O port B bit 5 |
| Pino 17 | RB6/ICSPCLK — Digital I/O port B bit 6 / ICSP clock |
| Pino 18 | RB7/ICSPDAT — Digital I/O port B bit 7 / ICSP data |
| Pino 19 | RC0 — Digital I/O port C bit 0 |
| Pino 20 | RC1 — Digital I/O port C bit 1 |
| Pino 21 | RC2 — Digital I/O port C bit 2 |
| Pino 22 | RC3 — Digital I/O port C bit 3 |
| Pino 23 | RC4 — Digital I/O port C bit 4 |
| Pino 24 | RC5 — Digital I/O port C bit 5 |
| Pino 25 | RC6 — Digital I/O port C bit 6 |
| Pino 26 | RC7 — Digital I/O port C bit 7 |
| Pino 27 | VSS — Ground reference |
| Pino 28 | VDD — Positive supply 2.5 V to 3.6 V |
| Pino 29 | RD0 — Digital I/O port D bit 0 |
| Pino 30 | RD1 — Digital I/O port D bit 1 |
| Pino 31 | RD2 — Digital I/O port D bit 2 |
| Pino 32 | RD3 — Digital I/O port D bit 3 |
| Pino 33 | RD4 — Digital I/O port D bit 4 |
| Pino 34 | RD5 — Digital I/O port D bit 5 |
| Pino 35 | RD6 — Digital I/O port D bit 6 |
| Pino 36 | RD7 — Digital I/O port D bit 7 |
| Pino 37 | VSS — Ground reference |
| Pino 38 | VDD — Positive supply 2.5 V to 3.6 V |
| Pino 39 | RE0 — Digital I/O port E bit 0 |
| Pino 40 | RE1 — Digital I/O port E bit 1 |
| Pino 41 | RE2 — Digital I/O port E bit 2 |
| Pino 42 | RE3 — Digital I/O port E bit 3 |
| Pino 43 | RE4 — Digital I/O port E bit 4 |
| Pino 44 | RE5 — Digital I/O port E bit 5 |
| Pino 45 | RE6 — Digital I/O port E bit 6 |
| Pino 46 | RE7 — Digital I/O port E bit 7 |
| Pino 47 | VSS — Ground reference |
| Pino 48 | VDD — Positive supply 2.5 V to 3.6 V |
| Pino 49 | RF0 — Digital I/O port F bit 0 |
| Pino 50 | RF1 — Digital I/O port F bit 1 |
| Pino 51 | RF2 — Digital I/O port F bit 2 |
| Pino 52 | RF3 — Digital I/O port F bit 3 |
| Pino 53 | RF4 — Digital I/O port F bit 4 |
| Pino 54 | RF5 — Digital I/O port F bit 5 |
| Pino 55 | RF6 — Digital I/O port F bit 6 |
| Pino 56 | RF7 — Digital I/O port F bit 7 |
| Pino 57 | RG0 — Digital I/O port G bit 0 |
| Pino 58 | RG1 — Digital I/O port G bit 1 |
| Pino 59 | RG2 — Digital I/O port G bit 2 |
| Pino 60 | RG3 — Digital I/O port G bit 3 |
| Pino 61 | RG4 — Digital I/O port G bit 4 |
| Pino 62 | RG5 — Digital I/O port G bit 5 |
| Pino 63 | MCLR — Master Clear reset input (active low) |
| Pino 64 | OSC1/CLKIN — Crystal oscillator input or external clock in |
Aplicações típicas
PIC16LF1527T-I/MR é adequado para 6 aplicaçãos: Battery-Powered IoT Sensor Node, Consumer Appliance Control Board, Automotive Body and HMI Module, Industrial Telemetry and Data Logger, Handheld Medical Monitoring Accessory, Smart Home Lighting Controller.
Battery-Powered IoT Sensor Node
The PIC16LF1527T-I/MR is purpose-built for battery-powered IoT sensor nodes where its nanoWatt XLP architecture delivers typical sleep currents below 20 nA, enabling multi-year battery life on a single CR2032 coin cell. The 28 KB Flash accommodates sensor-fusion algorithms and small TCP/MQTT client stacks, while the 1536 bytes of SRAM handles local buffering. Its 18 I/O pins allow direct connection to temperature, humidity, and motion sensors, and the integrated 10-bit ADC simplifies analog front-end design. Compared to switching regulators, the LF part's 2.5 V to 3.6 V supply window fits a regulated 3.3 V rail without additional level shifting. Companion MPNs include the MCP9808 temperature sensor and RN4871 Bluetooth module.
Recomendado
Consumer Appliance Control Board
The PIC16LF1527T-I/MR suits consumer appliance controllers such as coffee makers, washing machines, and air purifiers where its 20 MHz CPU and integrated PWM/ECCP modules drive motors, valves, and indicator LEDs directly without external driver ICs. The 64-VQFN 9x9 mm package keeps the PCB footprint compact for slim enclosures, and the 18 I/O pins accommodate user buttons, seven-segment displays, and rotary encoders. The 256-byte EEPROM stores user settings and calibration across power cycles. Compared to the PIC16F877A legacy part, the LF1527 provides more Flash (28 KB vs 14 KB) in a smaller QFN package. Pair it with the MCP1700 LDO regulator and a TC1047A analog temperature sensor.
Recomendado
Automotive Body and HMI Module
The PIC16LF1527T-I/MR is suitable for non-safety automotive body and HMI applications such as seat control, mirror adjustment, ambient lighting, and HVAC control panels. Its industrial -40 C to +85 C temperature range handles cabin environments, and the PIC16LF1527-E/MR variant extends to -40 C to +125 C for under-hood mounting. The EUSART, I2C, and SPI peripherals interface with LIN/CAN transceivers and capacitive touch controllers, while the 10-bit ADC reads rotary encoders and current-sense amplifiers. Automotive designs should use the -Q1 qualified PIC16LF1527-E/MR variant for AEC-Q100 compliance. Companion ICs include the MCP2515 CAN controller and ATA663231 LIN transceiver.
Recomendado
Industrial Telemetry and Data Logger
Industrial telemetry and portable data loggers benefit from the PIC16LF1527T-I/MR's 256-byte EEPROM for parameter storage, 28 KB Flash for embedded file-system FAT routines, and 10-bit ADC for direct sensor digitisation. The 20 MHz CPU supports MODBUS RTU slave protocols over EUSART with sufficient headroom for cyclic redundancy checks and timestamp management. The 64-VQFN package with exposed thermal pad improves thermal performance in sealed enclosures. Compared to PIC24/dsPIC33 alternatives, the LF1527 reduces BOM cost by 50 percent while delivering adequate performance for sub-kHz sampling telemetry. Pair with the MCP2221 USB-UART bridge for PC connectivity and the MCP79410 I2C RTC.
Recomendado
Handheld Medical Monitoring Accessory
The PIC16LF1527T-I/MR fits handheld medical accessories such as pulse-oximeter probes, smart pill-bottle caps, and personal spirometers where its XLP nanoWatt sleep current minimises battery drain between measurements. The 10-bit ADC captures photodiode or thermistor signals from sensors, while the integrated PWM drives LED or buzzer indicators. The 2.5 V to 3.6 V supply window operates from a single lithium coin cell. Note that FDA-compliant designs require additional qualification of the full system; this MCU is suitable as a sub-component but is itself not FDA-cleared. Companion ICs include the MAX30102 pulse-oximeter sensor and TPS7A02 LDO.
Recomendado
Smart Home Lighting Controller
The PIC16LF1527T-I/MR drives smart-home lighting controllers including Zigbee/Z-Wave end nodes, RGBW LED strips, and DALI-compatible fixtures. Its ECCP modules generate multiple PWM channels for RGB colour mixing and white-temperature blending, while the EUSART interfaces with the host radio module. The 28 KB Flash accommodates colour-management and fade-curve algorithms, and the 18 I/O pins handle capacitive-touch keys and rotary dimmer inputs. Compared to bare 8-bit competitors, the LF1527 offers a wider Flash budget in the same 64-VQFN footprint. Companion parts include the MCP1640 boost converter for LED supply rails and the ATMEGA328PB for Z-Wave firmware migration paths.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16LF1527T-I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16F1527T-I/MR | PIC16LF1526T-I/MR | PIC16LF1527-I/MR | PIC16LF1527-E/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (MR) 9x9 mm | 64-VQFN (MR) 9x9 mm | 64-VQFN (MR) 9x9 mm | 64-VQFN (MR) 9x9 mm | 64-VQFN (MR) 9x9 mm |
| Supply Voltage | 2.5 V to 3.6 V | 1.8 V to 5.5 V | 2.5 V to 3.6 V | 2.5 V to 3.6 V | 2.5 V to 3.6 V |
| Flash Program Memory | 28 KB | 28 KB | 16 KB | 28 KB | 28 KB |
| Data RAM | 1536 bytes | 1536 bytes | 1536 bytes | 1536 bytes | 1536 bytes |
| Data EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| CPU Clock (max) | 20 MHz / 20 MIPS | 20 MHz / 20 MIPS | 20 MHz / 20 MIPS | 20 MHz / 20 MIPS | 20 MHz / 20 MIPS |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) |
| I/O Pin Count | 18 | 18 | 18 | 18 | 18 |
| Packaging Style | Tape & Reel | Tape & Reel | Tape & Reel | Tube | Tray / Tube |
Principais diferenciais
- Lower-voltage operation with same package (vs PIC16F1527T-I/MR)
- Higher code budget in same package (vs PIC16LF1526T-I/MR)
- Extended temperature option available (vs PIC16LF1527-E/MR)
- XLP nanoWatt power architecture (vs PIC16F877A legacy part)
Notas de projeto
Place a 100 nF X7R 0402 ceramic decoupling capacitor within 3 mm of every VDD pin and a 10 uF bulk capacitor near the MCU. The PIC16LF1527T-I/MR has four VDD pins (10, 28, 38, 48) and four VSS pins (9, 27, 37, 47); each VDD pin requires its own 100 nF bypass capacitor. For battery-powered designs, use the nanoWatt XLP Sleep mode with the Watchdog Timer disabled to reach typical sleep currents around 20 nA.
The 64-VQFN (MR) package includes an exposed thermal pad (EP) that must be soldered to a single continuous ground plane with multiple thermal vias (typically 9 to 16 vias in a 3x3 grid pattern) to meet the datasheet's thermal resistance specification. The exposed pad lowers junction-to-ambient thermal resistance and reduces ground-bounce during switching. Forbid using the EP as a signal-trace conduit.
Route the ICSP clock (RB6/ICSPCLK, pin 17) and ICSP data (RB7/ICSPDAT, pin 18) signals away from switching nodes to avoid programming failure in noisy environments. Reserve a 2x5 0.1-inch header footprint or Tag-Connect pads for in-circuit programming and debugging. Keep MCLR (pin 63) trace short with a 10 kohm pull-up to VDD and a 100 nF capacitor to ground for clean reset.
Do not exceed VDD 3.6 V on the LF variant - the LF1527 silicon lacks internal 5 V tolerance and is damaged by over-voltage. For 5 V systems use the PIC16F1527T-I/MR. Always configure unused I/O pins as outputs with logic low (not high-impedance) to minimise sleep current. Programming the configuration bits correctly to enable the internal oscillator eliminates the need for external crystals in cost-sensitive designs.
Use guard rings around sensitive analog inputs (AN0-AN7 on RA0-RA7) tied to a quiet analog ground to reduce digital switching noise pickup on the 10-bit ADC. Run ADC conversions with the device in Sleep mode (with internal RC ADC clock) for best noise performance - this technique typically improves ADC ENOB by 1 bit compared to conversions during full CPU operation.
Informações de conformidade
RoHS compliant per DigiKey listing and Microchip product page. LF1527 part is not AEC-Q100 qualified - choose a -Q1 suffixed variant for automotive. REACH compliance per Microchip standard product statement.
