PIC18F25K80-E/SS - 8-bit MCU, 32KB Flash, ECAN, XLP | Microchip
N.º da peça: PIC18F25K80-E/SS ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.32 | $4,32 |
| 10 | $3.89 | $38,90 |
| 100 | $3.46 | $346,00 |
| 500 | $3.04 | $1.520,00 |
| 1.000 | $2.69 | $2.690,00 |
PIC18F25K80-E/SS Visão geral
A microcontroller (MCU) is a single-chip computer containing a processor core, memory, and programmable I/O peripherals. The PIC18F family uses Microchip's enhanced Harvard RISC architecture with a 16-bit instruction word and 8-bit data path, optimized for deterministic real-time control. The PIC18F25K80 sits within the K80 sub-family that adds integrated ECAN 2.0B, CTMU (Charge Time Measurement Unit) for capacitive touch, and nanoWatt XLP sleep modes below 100 nA — extending battery life across industrial sensor nodes and automotive body modules.
Key features include 32KB (16K x 16) of self-programmable Flash, 1KB of EEPROM, a 12-bit ADC with up to 11 channels, an 8-bit DAC, three analog comparators, four 16-bit timers, two MSSP (SPI/I2C) modules, two enhanced USART, and 24 digital I/O pins. The integrated ECAN module supports CAN 2.0B active with bus speeds up to 1 Mbps. The CTMU provides on-chip waveform generation for capacitive touch sensing without external components.
The device leverages an enhanced PIC18 CPU core with hardware multiply and a 32-level hardware stack, paired with a 4-deep prefetch buffer to sustain 16 MIPS throughput at 64MHz. The 12-bit ADC achieves up to 100 ksps with acquisition time configurable in software, while the ECAN engine handles filtering and masking in hardware, offloading message acceptance from the CPU.
Typical applications include automotive body and chassis ECAN nodes (body control modules, instrument clusters, mirror controllers), industrial CAN-bus sensor and actuator networks, building automation (HVAC, elevator controllers), and low-power battery-backed IoT edge devices. The wide 1.8V–5.5V supply range supports both 3.3V and 5V system designs.
When designing with this MCU, ensure the ECAN transceiver supply and reference voltages are stable before enabling the CAN module. Use MPLAB X IDE with XC8 compiler and configure the CTMU current source via the dedicated register set for repeatable touch measurements.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para PIC18F25K80-E/SS — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC18F25K80-E/SS (mesmo formato e footprint) — diferindo em Package, MSL Level, Timers, ADC, Program Memory (Flash).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC18F25K80-I/SS
✅ Drop-In✓ Em estoque
$1.45 / unidade
Ver ficha técnica →PIC18F25K80-E/MM
✅ Drop-In✓ Em estoque
$2.32 / unidade
Ver ficha técnica →PIC18F25K80-H/SS
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.18 / unidade
Ver ficha técnica →PIC18F26K80-E/SS
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC18F45K80-E/SS
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC18F25K80-E/SS Classificações máximas e características elétricas
| Product Family | PIC18F K80 Series |
| Core Architecture | PIC 8-bit RISC (enhanced Harvard) |
| Program Memory (Flash) | 32KB (16K x 16) |
| RAM | 3.6KB |
| EEPROM | 1KB |
| Maximum CPU Speed | 64 MHz (16 MIPS) |
| Operating Voltage Range | 1.8V to 5.5V |
| Number of I/O Pins | 24 |
| ADC | 12-bit, up to 11 channels |
| DAC | 8-bit, 1 channel |
| Analog Comparators | 3 |
| Timers | 4 x 16-bit / 1 x 8-bit |
| Communication Interfaces | ECAN 2.0B, 2x MSSP (SPI/I2C), 2x EUSART |
| Special Features | ECAN, CTMU (touch), nanoWatt XLP |
| Encapsulamento | 28-SSOP (5.30 mm body, 0.65 mm pitch) |
| Faixa de temperatura de operação | -40C to +125C (E = Extended) |
| Tipo de montagem | Surface Mount |
| Nível MSL | 1 (unlimited floor life at <30C/85% RH) |
| Status RoHS | Compliant |
Configuração de pinos do PIC18F25K80-E/SS
| Pino 1 | MCLR/RE3 — Master Clear (reset) input or digital I/O RE3 |
| Pino 2 | RA0/AN0 — PORTA bit 0 / analog input 0 |
| Pino 3 | RA1/AN1 — PORTA bit 1 / analog input 1 |
| Pino 4 | RA2/AN2 — PORTA bit 2 / analog input 2 |
| Pino 5 | RA3/AN3 — PORTA bit 3 / analog input 3 / VREF+ |
| Pino 6 | RA4/AN4 — PORTA bit 4 / analog input 4 |
| Pino 7 | RA5/AN5 — PORTA bit 5 / analog input 5 / SS1 |
| Pino 8 | VSS — Ground reference |
| Pino 9 | RA7 — PORTA bit 7 |
| Pino 10 | RA6 — PORTA bit 6 |
| Pino 11 | RC0 — PORTC bit 0 |
| Pino 12 | RC1 — PORTC bit 1 |
| Pino 13 | RC2 — PORTC bit 2 |
| Pino 14 | RC3 — PORTC bit 3 / SCL1 |
| Pino 15 | RC4 — PORTC bit 4 / SDA1 |
| Pino 16 | RC5 — PORTC bit 5 |
| Pino 17 | RC6/TX2/CK2 — PORTC bit 6 / EUSART2 TX / CAN TX (multiplexed) |
| Pino 18 | RC7/RX2/DT2 — PORTC bit 7 / EUSART2 RX / CAN RX (multiplexed) |
| Pino 19 | VSS — Ground reference |
| Pino 20 | VDD — Positive supply voltage |
| Pino 21 | RB0/INT0 — PORTB bit 0 / external interrupt 0 |
| Pino 22 | RB1/INT1 — PORTB bit 1 / external interrupt 1 |
| Pino 23 | RB2/INT2 — PORTB bit 2 / external interrupt 2 |
| Pino 24 | RB3/INT3 — PORTB bit 3 / external interrupt 3 |
| Pino 25 | RB4 — PORTB bit 4 |
| Pino 26 | RB5 — PORTB bit 5 |
| Pino 27 | RB6/PGC — PORTB bit 6 / ICSP clock |
| Pino 28 | RB7/PGD — PORTB bit 7 / ICSP data |
Aplicações típicas
PIC18F25K80-E/SS é adequado para 6 aplicaçãos: Automotive Body Control Module (CAN Bus), Industrial CAN Sensor Network, Building Automation Controller (HVAC, Lighting), Battery-Backed IoT Edge Node, Capacitive Touch User Interface, Instrument Cluster Sub-MCU.
Automotive Body Control Module (CAN Bus)
The PIC18F25K80-E/SS is widely used in automotive body ECAN nodes (BCM, door modules, seat controllers, mirror controllers) because of its integrated ECAN 2.0B module supporting 1 Mbps bus speeds and the -40C to +125C extended operating range. The 32KB Flash fits typical CAN-based body controllers, and the 3.6KB RAM accommodates an OSEK/OSEKtime-style RTOS plus CAN stack. Unlike external-CAN MCUs that need a separate SPI-attached CAN controller, the K80 puts CAN on-chip, saving board space, BOM cost, and firmware complexity in ECU designs.
Recomendado
Industrial CAN Sensor Network
The PIC18F25K80-E/SS suits distributed industrial sensor and actuator networks (factory automation, building HVAC, elevator controllers) where ECAN bus connectivity and the 1.8V to 5.5V supply tolerance simplify integration with 24V industrial backplanes. The 12-bit ADC with up to 11 channels samples field sensors, while XLP nanoWatt sleep below 100 nA lets battery-backed remote nodes run for years on a single primary cell. The on-chip CTMU also enables capacitive touch keys on operator panels without external charge pumps.
Recomendado
Building Automation Controller (HVAC, Lighting)
Building automation controllers — including HVAC thermostats, lighting dimmers, elevator call panels, and access control readers — leverage the PIC18F25K80-E/SS for its combination of 32KB Flash, 12-bit ADC, multiple timers, and XLP sleep mode. The ECAN interface lets the controller participate in building bus networks, while the MSSP peripherals handle SPI sensors or I2C EEPROM / RTC backup. The wide operating range supports unconditioned plant-room environments where temperatures swing widely.
Recomendado
Battery-Backed IoT Edge Node
The PIC18F25K80-E/SS fits low-power IoT edge nodes (remote sensors, smart meters, environmental monitors) thanks to nanoWatt XLP sleep below 100 nA and a 1.8V minimum supply that lets the device run directly from a single 1.5V cell after boost conversion. The 16 MIPS throughput handles local sensor processing and CAN/EUSART uplink, while CTMU supports capacitive water-level or proximity sensing on the same MCU. ECAN connectivity is unusual at this power level — most IoT parts use only UART or low-power RF.
Recomendado
Capacitive Touch User Interface
The PIC18F25K80-E/SS integrates the CTMU (Charge Time Measurement Unit) which generates a constant current source and time-measures capacitance changes on a pin. Designers build capacitive touch buttons, sliders, and proximity sensors with no external components — just a copper pad on the PCB. The K80's 32KB Flash accommodates debounce, gesture recognition, and proximity-to-wake routines, while XLP sleep lets the device draw negligible current between touches in battery-powered remotes and appliances.
Recomendado
Instrument Cluster Sub-MCU
Within an automotive instrument cluster architecture, the PIC18F25K80-E/SS serves as a sub-MCU for CAN-to-LIN bridging, button input processing, and indicator lamp control. The ECAN module listens to vehicle bus messages, the EUSART drives LIN slave communication, and the GPIO controls LED backlights. The 12-bit ADC reads rotary encoders and voltage dividers, while XLP sleep keeps quiescent draw minimal during key-off — extending battery life across long vehicle parking intervals.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC18F25K80-E/SS — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC18F25K80-I/SS | PIC18F25K80-E/MM | PIC18F25K80-H/SS | PIC18F26K80-E/SS | PIC18F45K80-E/SS |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SSOP | 28-SSOP - same | 28-QFN - same pin count, different footprint | 28-SSOP - same | 28-SSOP - same | 40-SSOP - larger, different PCB land pattern |
| Flash Memory | 32KB | 32KB (same) | 32KB (same) | 32KB (same) | 64KB (+100%) | 32KB (same) |
| RAM | 3.6KB | 3.6KB (same) | 3.6KB (same) | 3.6KB (same) | 3.6KB (same) | 3.6KB (same) |
| ECAN Module | Yes (ECAN 2.0B) | Yes (same) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
| Operating Temperature Range | -40C to +125C (E grade) | -40C to +85C (I grade, narrower) | -40C to +125C (E grade, same) | -40C to +150C (H grade, wider) | -40C to +125C (E grade, same) | -40C to +125C (E grade, same) |
| Maximum CPU Speed | 64 MHz (16 MIPS) | 64 MHz (same) | 64 MHz (same) | 64 MHz (same) | 64 MHz (same) | 64 MHz (same) |
| Operating Voltage Range | 1.8V to 5.5V | 1.8V to 5.5V (same) | 1.8V to 5.5V (same) | 1.8V to 5.5V (same) | 1.8V to 5.5V (same) | 1.8V to 5.5V (same) |
Principais diferenciais
- Integrated ECAN 2.0B on-chip at 8-bit price point (vs PIC18F25Q10-I/SS)
- Extended -40C to +125C automotive temperature grade (vs PIC18F25K80-I/SS)
- nanoWatt XLP sleep current below 100 nA (vs PIC18F46K22 (legacy K22 family))
Notas de projeto
Place a 100 nF ceramic decoupling capacitor as close as possible to the VDD pin (pin 20) on every PIC18F25K80-E/SS design, with a bulk 10 uF tantalum or ceramic on the same rail. The wide 1.8V to 5.5V supply range lets you power the MCU directly from a 3.3V LDO output; when the supply comes from a switching regulator, add an LC pi-filter (10 uH + 10 uF) to keep switching noise away from the ADC reference. The on-chip brown-out reset must be configured for the application's minimum supply voltage via the BOREN and BORV registers to avoid code execution at indeterminate VDD.
When migrating firmware from PIC18F25K80 (E grade) to PIC18F25K80-H/SS (H grade, -40C to +150C), confirm the H-grade parts are fully PPAP and AEC-Q100 qualified before committing — H parts sometimes have longer lead times. The internal ECAN module requires the CAN transceiver (e.g. MCP2551) to share a common ground with the MCU; floating grounds cause intermittent bus errors. Finally, when designing with CTMU capacitive touch, calibrate the CTMU current source via the CTMUICON register at production time to compensate for board parasitic capacitance.
The PIC18F25K80-E/SS SSOP-28 has a thermal resistance theta_JA of approximately 80 C/W. Estimated: at 5.5V VDD with all peripherals active and 64 MHz clock, internal power dissipation is around 100 mW, giving a junction temperature rise of 8 C above ambient — well within the -40C to +125C operating range. At the extended 125 C ambient ceiling, this keeps the junction below 133 C even without active cooling. For under-hood automotive designs using the H grade, derate to 150 C max junction by limiting ambient to 140 C and adding a thermal copper pour under the exposed pad area.
Informações de conformidade
AEC-Q100 qualified for automotive applications per Microchip product page. RoHS and REACH compliant per distributor listings (DigiKey, Mouser). Lead-free and halogen-free per SSOP-28 package specifications.
