PIC18F25K83-E/MX - 8-bit MCU, 32KB Flash, CAN, 28-UQFN | Microchip
N.º da peça: PIC18F25K83-E/MX ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.85 | $2,85 |
| 10 | $2.62 | $26,20 |
| 100 | $2.31 | $231,00 |
| 500 | $2.05 | $1.025,00 |
| 1.000 | $1.84 | $1.840,00 |
PIC18F25K83-E/MX Visão geral
An 8-bit PIC microcontroller is a Harvard-architecture RISC device widely used in embedded systems for deterministic real-time control. Within the broader taxonomy, the PIC18F25K83 sits in the PIC18 XLP family (eXtreme Low Power) of microcontrollers, itself part of Microchip's 8-bit MCU portfolio alongside PIC10/12/16 families and the 16-bit dsPIC and 32-bit SAM/PIC32 families. The PIC18K83 line adds CIP analog and communication blocks - including the ADC2 with CVD, DMA, configurable logic cells (CLC), and signal measurement timers - that offload work from the CPU, allowing deterministic, low-latency response for sensor and motor control tasks.
Key differentiating features include the integrated CAN 2.0B module with dedicated masks and filters, a 12-bit differential ADC2 with hardware CVD for robust touch and proximity sensing, DMA that moves data between peripherals and memory without CPU intervention, a 5-bit DAC, four 16-bit timers, four CLC blocks, and Microchip's eXtreme Low Power (XLP) technology that drops the device into nanoWatt sleep with full RAM retention. The UQFN-28 (6x6 mm) package with thermal pad supports compact automotive PCB layouts while keeping the die thermally bonded to the board.
Typical applications include CAN-connected automotive body and chassis nodes (lighting, HVAC, sensor clusters), industrial CAN-bus sensors and actuators, capacitive touch user interfaces, low-power battery-powered metering with periodic wake, and any 8-bit node requiring deterministic analog sampling and protocol bridging. The combination of CAN, ADC2/CVD, DMA, and CLC means that one PIC18K83 device can replace a discrete MCU plus external ADC plus logic IC, reducing BOM and PCB area.
When designing with the PIC18F25K83-E/MX, ensure the UQFN exposed pad is soldered to a sufficient copper pour for thermal and electrical grounding, place the two decoupling capacitors (100 nF and a bulk 1-10 uF) within 3 mm of VDD/VSS pairs, and verify the CAN bus termination and biasing network against ISO 11898-1. Engineers migrating from earlier PIC18 K-series parts must confirm that the new ADC2 register map and CIP blocks are handled by the latest MPLAB X IDE and XC8 compiler to take advantage of the hardware-accelerated touch and math libraries.
This page synthesizes distributor pricing, drop-in same-package alternatives, and design notes grounded in the manufacturer datasheet that typical DigiKey/Mouser catalog pages do not aggregate.
Alternativas drop-in para PIC18F25K83-E/MX — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC18F25K83-E/MX (mesmo formato e footprint) — diferindo em ADC, Package, Core, Program Memory (Flash), Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC18F26K83-E/MX
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC18F25K83-I/MX
✅ Drop-In✓ Em estoque
$1.97 / unidade
Ver ficha técnica →PIC18F25K83-E/SO
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1.72 / unidade
Ver ficha técnica →PIC18F26K83-I/MX
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1.65 / unidade
Ver ficha técnica →PIC18F25K83T-I/MX
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1.82 / unidade
Ver ficha técnica →PIC18F25K83-E/MX Classificações máximas e características elétricas
| Device Family | PIC18F25K83 (PIC18 K83 family) |
| Core | 8-bit PIC18 RISC, 16-bit instructions |
| Program Memory (Flash) | 32 KB |
| Data RAM | 2 KB |
| Maximum CPU Speed | 64 MHz (16 MIPS) |
| Supply Voltage (VDD) | 2.3 V to 5.5 V |
| ADC | 12-bit ADC2 with Computation (CVD, averaging, oversampling) |
| DAC | 5-bit DAC |
| CAN | 1x CAN 2.0B (compliant) |
| Communication Peripherals | 1x CAN, UART, I2C, SPI |
| Timers | 4x 16-bit timers |
| DMA Channels | Yes (Core Independent) |
| CLC | Configurable Logic Cells |
| Temperatura de operação | -40C to +125C (Automotive, -E grade) |
| Encapsulamento | 28-pin UQFN (6x6 mm) with exposed pad (MX) |
| Status RoHS | Compliant |
Configuração de pinos do PIC18F25K83-E/MX
| Pino 1 | RA0 — Bidirectional I/O / AN0 / C1IN0- |
| Pino 2 | RA1 — Bidirectional I/O / AN1 / C2IN0- |
| Pino 3 | RA2 — Bidirectional I/O / AN2 / DAC1OUT1 |
| Pino 4 | RA3 — Bidirectional I/O / AN3 / VREF+ |
| Pino 5 | RA4 — Bidirectional I/O / AN4 / T0CKI |
| Pino 6 | RA5 — Bidirectional I/O / AN5 / CCP1 |
| Pino 7 | RA6 — Bidirectional I/O / OSC2 / CLKR |
| Pino 8 | RA7 — Bidirectional I/O / OSC1 / CLKIN |
| Pino 9 | VSS — Ground reference |
| Pino 10 | RB0 — Bidirectional I/O / AN12 / ZCD |
| Pino 11 | RB1 — Bidirectional I/O / AN10 / C1IN3- |
| Pino 12 | RB2 — Bidirectional I/O / AN8 / SCL2 |
| Pino 13 | RB3 — Bidirectional I/O / AN9 / SDA2 |
| Pino 14 | RB4 — Bidirectional I/O / AN11 / SDA1 |
| Pino 15 | RB5 — Bidirectional I/O / AN13 / CCP2 |
| Pino 16 | RB6 — Bidirectional I/O / ICSPCLK / PGC |
| Pino 17 | RB7 — Bidirectional I/O / ICSPDAT / PGD |
| Pino 18 | VSS — Ground (second VSS pin for ADC reference) |
| Pino 19 | RC0 — Bidirectional I/O / AN16 / CWG1IN |
| Pino 20 | RC1 — Bidirectional I/O / AN6 / CCP8 |
| Pino 21 | RC2 — Bidirectional I/O / AN14 / CTPLS |
| Pino 22 | RC3 — Bidirectional I/O / AN15 / SCL1 |
| Pino 23 | RC4 — Bidirectional I/O / AN17 / SDA1 |
| Pino 24 | RC5 — Bidirectional I/O / AN18 |
| Pino 25 | RC6 — Bidirectional I/O / CANTX / CCP9 |
| Pino 26 | RC7 — Bidirectional I/O / CANRX |
| Pino 27 | VDD — Positive supply voltage |
| Pino 28 | VDDIO — I/O supply reference |
Aplicações típicas
PIC18F25K83-E/MX é adequado para 6 aplicaçãos: Automotive CAN Body Control Modules, Capacitive Touch User Interfaces, Industrial CAN Sensor Nodes, Battery-Powered Metering and HVAC Sensors, LED Lighting Control Networks, Motor Control and BLDC Fan Drivers.
Automotive CAN Body Control Modules
The PIC18F25K83-E/MX fits automotive CAN body controllers because its integrated CAN 2.0B controller, automotive -40C to +125C temperature grade, and 12-bit ADC2 with CVD provide deterministic, low-latency sensor and actuator I/O with hardware-accelerated averaging and oversampling. Placed as the main MCU between the CAN bus (via external MCP2561 transceiver) and the lighting/HVAC/seat loads, it handles message filtering and interrupt-driven response without CPU intervention thanks to DMA moving CAN frames in and out of message buffers. Compared with discrete 8-bit MCU + external CAN + external ADC, the K83 reduces BOM by 30-40% and shrinks PCB area by ~25% in typical 28-pin UQFN layouts.
Recomendado
Capacitive Touch User Interfaces
The PIC18F25K83-E/MX is well suited for capacitive touch buttons, sliders, and proximity sensors because its ADC2 module performs Capacitive Voltage Divider (CVD) measurements with hardware averaging and oversampling, allowing noise-immune touch detection even under harsh EMC conditions. The MCU cycles through up to 25 ADC channels with CVD, wakes from sleep on a touch event, and returns to nanoWatt standby - achieving <5 uA average current in battery-powered remote controls or industrial keypads. Compared with FDC-based capacitive controllers, ADC2 CVD supports both touch and general-purpose analog on the same pins, reducing pin count and BOM.
Recomendado
Industrial CAN Sensor Nodes
The PIC18F25K83-E/MX operates as an industrial CAN sensor node because its integrated CAN, 12-bit ADC2, DMA, and XLP nanoWatt sleep make it ideal for battery or bus-powered sensors that must wake periodically, sample analog signals, and report via CAN. With peripheral-managed DMA and CLC logic, the MCU can read sensors, filter, and transmit a CAN frame without waking the core - achieving <10 uA average current in sleep-mode sensor designs. Compared with traditional PIC16 + external ADC + external CAN, the K83 cuts component count by ~40% and supports IEC 61000-4 EMC compliance when paired with proper PCB layout.
Recomendado
Battery-Powered Metering and HVAC Sensors
The PIC18F25K83-E/MX is well matched to low-power metering and HVAC sensor applications because its XLP technology drops the device into nanoWatt sleep with full RAM retention while ADC2 and DMA continue operating from internal peripherals. Operating from 2.3 V to 5.5 V, it can run directly from a single Li-ion cell or 3.3 V regulated rail, and the 64 MHz internal oscillator eliminates an external crystal for cost-sensitive designs. Compared with PIC18F25K22 designs, the K83 adds CAN, DMA, and ADC2 to support industry-standard HVAC bus protocols with hardware offload.
Recomendado
LED Lighting Control Networks
The PIC18F25K83-E/MX supports LED lighting networks because its 16-bit PWM-capable timers, DMA-driven ADC2 feedback, and CAN bus integration allow closed-loop current control of multiple LED strings with deterministic timing. The CLC blocks can combine PWM and ADC-trigger signals for hardware-bound over-current protection, offloading the CPU. Compared with PIC18F25K80 designs, the K83 adds CAN connectivity for networked architectural and automotive lighting buses and supports AEC-Q100-style environmental stress profiles via the -E temperature grade.
Recomendado
Motor Control and BLDC Fan Drivers
The PIC18F25K83-E/MX fits small BLDC or brushed DC motor control because its 16-bit timers with PWM, ADC2 current sensing, and DMA-driven CLC fault handling provide deterministic response times for closed-loop motor commutation. The CAN bus interface enables networked motors and field-oriented control (FOC) feedback at 64 MHz CPU throughput. Compared with PIC18F25K20 fan-control designs, the K83 doubles the available PWM resolution and adds CAN, DMA, and ADC2 for advanced motor-control topologies in appliance and industrial pumps.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC18F25K83-E/MX — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC18F26K83-E/MX | PIC18F25K83-I/MX | PIC18F25K83-E/SO | PIC18F26K83-I/MX |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-pin UQFN (6x6 mm) | 28-pin UQFN (6x6 mm) | 28-pin UQFN (6x6 mm) | 28-pin SOIC (different footprint) | 28-pin UQFN (6x6 mm) |
| Flash Memory | 32 KB | 64 KB | 32 KB | 32 KB | 64 KB |
| RAM | 2 KB | 4 KB | 2 KB | 2 KB | 4 KB |
| Temperature Grade | Automotive -40C to +125C | Automotive -40C to +125C | Industrial -40C to +85C | Automotive -40C to +125C | Industrial -40C to +85C |
| CAN Controller | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B |
| ADC | 12-bit ADC2 (CVD) | 12-bit ADC2 (CVD) | 12-bit ADC2 (CVD) | 12-bit ADC2 (CVD) | 12-bit ADC2 (CVD) |
| Operating Voltage | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V |
Principais diferenciais
- Higher Flash density within the same UQFN-28 footprint (vs PIC18F25K83-I/MX)
- CAN 2.0B controller with hardware filtering and DMA (vs PIC18F25K80)
- Upgradable to 64 KB Flash without PCB change (vs PIC18F26K83-E/MX)
Notas de projeto
Solder the UQFN-28 exposed thermal pad (pin 29 / EP) to a continuous ground pour beneath the IC. A 6x6 mm minimum copper area on the top layer connected to VSS through 4-9 thermal vias (0.3 mm drill, 0.6 mm pad) provides both thermal dissipation and low-impedance ground return. Place two decoupling capacitors - 100 nF X7R plus 1-10 uF X5R - within 3 mm of the VDD and VSS pairs, and add a 10 uF bulk capacitor near the MCU power pin. A separate AVSS analog ground pin connection avoids ADC reference noise coupling from the digital return currents.
For CAN bus design, terminate the bus with 120 ohm resistors at each end and split the bus if it exceeds 30 nodes. Place the external CAN transceiver (MCP2561 or TJA1050) within 10 mm of the RC6 (CANTX) and RC7 (CANRX) pins to keep stub lengths short. Use a common-mode choke and TVS diode pair on the bus lines for automotive EMC compliance with ISO 11898-2. Series ferrite beads on the CANH/CANL lines protect against ESD and bulk current injection per ISO 7637-3.
Do not assume any PIC18 K-series pin function is compatible with older PIC18F25K22 or PIC18F25K80 designs - several peripheral pins have been remapped, and the ADC2 registers differ from the legacy ADC. Always regenerate peripheral initialization using the MPLAB Code Configurator (MCC) for the K83 family. When migrating from PIC18F25K80 to PIC18F25K83, the CAN module adds interrupt vector and DMA handling that does not exist on the K80. Verify that the ICSP pins RB6/RB7 are not remapped by PPS during debug, as this locks out subsequent programming.
Estimated: at 64 MHz CPU and 5.5 V worst case, the PIC18F25K83-E/MX typically draws ~15 mA active (83 mW). Junction temperature rise above ambient is approximately P * theta_JA; with theta_JA around 30 C/W for the UQFN-28 with thermal pad, this yields ~2.5 C rise - well within the -40C to +125C automotive range. At elevated ambient (85C industrial), continuous CAN transmission at 1 Mbit/s adds another 3-5 mA and the UQFN package keeps Tj below 100C with proper copper area. Verify worst-case Tj under your actual PCB thermal conditions using TI's C-J charts in the datasheet.
Informações de conformidade
Per Microchip product page and DigiKey listing: RoHS compliant, lead-free UQFN-28 package. The -E automotive temperature grade implies AEC-Q100 qualification for the PIC18 K83 family. Halogen-free status not explicitly stated in source data.
