PIC18F45K42-I/ML - 8-bit 64MHz MCU 32KB Flash 44-QFN | Microchip
N.º da peça: PIC18F45K42-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.35 | $4,35 |
| 10 | $3.92 | $39,20 |
| 100 | $3.18 | $318,00 |
| 500 | $2.74 | $1.370,00 |
| 1.000 | $2.45 | $2.450,00 |
PIC18F45K42-I/ML Visão geral
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, RAM, non-volatile program memory, peripherals, and I/O on one die; the PIC18 family uses an enhanced Harvard RISC architecture with a 16-bit instruction word, providing higher code density than 8-bit CISC alternatives while keeping the deterministic real-time response that PIC MCUs are valued for. The K42 sub-family specifically adds Core Independent Peripherals (CIPs) that offload tasks like signal generation, waveform measurement, and communications framing from the core, freeing CPU cycles for application logic.
Key features include 2KB SRAM, 256 bytes EEPROM, a 12-bit ADC with Computation (ADC2), 5-bit DAC, multiple comparators, PWM, DMA, vector interrupts, and a Device Information Area (DIA) for unique device identification. The PIC18 'K42' silicon also integrates a configurable logic cell (CLC), math accelerator (MAC), and 32-bit CRC/scanner modules that are uncommon in 8-bit MCUs.
Architecturally, the K42 family is built on Microchip's enhanced mid-range core with a 14-stage pipeline, providing 64MHz operation from an internal 64MHz oscillator with PLL and Fractional mode options. The wide operating voltage range of 2.3V to 5.5V enables direct connection to lithium-ion cells or 5V rails, and XLP (eXtreme Low Power) technology delivers sleep currents in the nanoampere range for battery-backed applications.
Typical applications include IoT sensor nodes, low-power wireless protocol bridging, USB device interfaces (via MSSP/SPI bridging), HVAC control modules, white goods motor control, and industrial sensor signal conditioning. The 12-bit ADC2 with oversampling and averaging is well suited for accurate temperature, pressure, and strain-gauge measurements in industrial instrumentation.
When designing with this part, ensure correct programming tool selection (PICkit 4, ICD 4, or MPLAB SNAP) and use the latest MPLAB XC8 compiler for C code development. The QFN package requires careful PCB layout: a central thermal/exposed pad must be soldered to the ground plane with thermal vias for mechanical reliability and heat dissipation. Verify the DIA/DBG/ICSP pinout before finalizing the schematic.
This page synthesizes distributor pricing from DigiKey, Mouser, and LCSC, cross-brand drop-in compatibility notes, and practical design guidance not found in the bare manufacturer datasheet. Engineers should treat the package_svg_key and pinout diagram below as the reference for PCB land pattern verification.
Alternativas drop-in para PIC18F45K42-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC18F45K42-I/ML (mesmo formato e footprint) — diferindo em Comparators, Package, Operating Temperature, ADC, PWM Channels.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC18F47K42-I/ML
✅ Drop-In✓ Em estoque
$3.32 / unidade
Ver ficha técnica →PIC18F45K22-I/ML
✅ Drop-In✓ Em estoque
$2.65 / unidade
Ver ficha técnica →PIC18F45K40-I/ML
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC18F46K42-I/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1.97 / unidade
Ver ficha técnica →PIC18F45K50-I/ML
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC18F46K22-I/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.08 / unidade
Ver ficha técnica →PIC18F45K42-I/ML Classificações máximas e características elétricas
| Product Type | 8-bit Microcontroller (MCU) |
| Core Architecture | PIC18 (enhanced Harvard RISC) |
| Core Size | 8-bit |
| Instruction Set | PIC18 (16-bit instructions) |
| Operating Frequency | 64 MHz |
| Program Memory (Flash) | 32 KB (16K x 16) |
| SRAM | 2 KB |
| EEPROM | 256 bytes |
| ADC | 12-bit ADC2 with oversampling |
| DAC | 5-bit DAC |
| Comparators | Yes (multiple) |
| PWM Channels | Yes (multiple) |
| DMA | Yes |
| Vector Interrupts | Yes |
| Device Information Area (DIA) | Yes |
| Core Independent Peripherals (CIPs) | CLC, Math Accelerator, CRC/SCanner |
| Operating Voltage | 2.3 V to 5.5 V |
| Temperatura de operação | -40 C to +85 C (Industrial, -I suffix) |
| Encapsulamento | 44-QFN (8x8 mm), ML suffix |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do PIC18F45K42-I/ML
| Pino 1 | RA5 — Port A bit 5 / general-purpose I/O |
| Pino 2 | RA4 — Port A bit 4 / general-purpose I/O |
| Pino 3 | RA3 — Port A bit 3 / general-purpose I/O |
| Pino 4 | RA2 — Port A bit 2 / general-purpose I/O |
| Pino 5 | RA1 — Port A bit 1 / general-purpose I/O |
| Pino 6 | RA0 — Port A bit 0 / general-purpose I/O |
| Pino 7 | VDD — Positive supply voltage |
| Pino 8 | VSS — Ground |
| Pino 9 | RB7 — Port B bit 7 / general-purpose I/O |
| Pino 10 | RB6 — Port B bit 6 / general-purpose I/O |
| Pino 11 | RB5 — Port B bit 5 / general-purpose I/O |
| Pino 12 | RB4 — Port B bit 4 / general-purpose I/O |
| Pino 13 | RB3 — Port B bit 3 / general-purpose I/O |
| Pino 14 | RB2 — Port B bit 2 / general-purpose I/O |
| Pino 15 | RB1 — Port B bit 1 / general-purpose I/O |
| Pino 16 | RB0 — Port B bit 0 / general-purpose I/O |
| Pino 17 | VDD — Positive supply voltage |
| Pino 18 | VSS — Ground |
| Pino 19 | RC7 — Port C bit 7 / general-purpose I/O |
| Pino 20 | RC6 — Port C bit 6 / general-purpose I/O |
| Pino 21 | RC5 — Port C bit 5 / general-purpose I/O |
| Pino 22 | RC4 — Port C bit 4 / general-purpose I/O |
| Pino 23 | RC3 — Port C bit 3 / general-purpose I/O |
| Pino 24 | RC2 — Port C bit 2 / general-purpose I/O |
| Pino 25 | RC1 — Port C bit 1 / general-purpose I/O |
| Pino 26 | RC0 — Port C bit 0 / general-purpose I/O |
| Pino 27 | OSC1 — External oscillator input |
| Pino 28 | OSC2 — External oscillator output |
| Pino 29 | MCLR — Master clear / reset input |
| Pino 30 | RD7 — Port D bit 7 / general-purpose I/O |
| Pino 31 | RD6 — Port D bit 6 / general-purpose I/O |
| Pino 32 | RD5 — Port D bit 5 / general-purpose I/O |
| Pino 33 | RD4 — Port D bit 4 / general-purpose I/O |
| Pino 34 | RD3 — Port D bit 3 / general-purpose I/O |
| Pino 35 | RD2 — Port D bit 2 / general-purpose I/O |
| Pino 36 | RD1 — Port D bit 1 / ICSPDAT |
| Pino 37 | RD0 — Port D bit 0 / ICSPCLK |
| Pino 38 | RE3 — Port E bit 3 / general-purpose I/O |
| Pino 39 | RE2 — Port E bit 2 / general-purpose I/O |
| Pino 40 | RE1 — Port E bit 1 / general-purpose I/O |
| Pino 41 | RE0 — Port E bit 0 / general-purpose I/O |
| Pino 42 | AVDD — Analog positive supply |
| Pino 43 | AVSS — Analog ground |
| Pino 44 | EP — Exposed thermal pad (must be soldered to GND plane) |
Aplicações típicas
PIC18F45K42-I/ML é adequado para 7 aplicaçãos: Industrial Sensor Signal Conditioning, Low-Power IoT Sensor Node, HVAC and White Goods Motor Control, Automotive Body and Lighting Control, USB HID / CDC Device Interface, Battery-Powered Medical Devices, Smart Home Sensor Hub.
Industrial Sensor Signal Conditioning
The PIC18F45K42-I/ML fits industrial 4-20 mA loop transmitters and sensor conditioning modules because of its 12-bit ADC2 with computation (oversampling, averaging, threshold compare) and 2.3V to 5.5V supply range. At 64 MHz the core resolves input signals at the ADC2 throughput rate without CPU bottleneck, and the math accelerator executes scaling/linearization in hardware cycles. The CLC peripherals implement hardware low-pass filters on comparator outputs, reducing component count.
Recomendado
Low-Power IoT Sensor Node
Battery-backed IoT sensor nodes benefit from the PIC18F45K42-I/ML's XLP technology, which delivers sub-microamp sleep currents with RAM retention and a wake-up time under 5 microseconds. The 32 KB Flash accommodates small BLE/Zigbee host stacks when paired with an external radio module via SPI. With ADC2 threshold-triggered DMA transfers, the core sleeps while sensors are scanned and only wakes to format radio packets, extending coin-cell life to multiple years.
Recomendado
HVAC and White Goods Motor Control
Variable-frequency motor drives for HVAC fans, pumps, and washing-machine inverters use the PIC18F45K42-I/ML because of its multiple PWM channels with complementary outputs, programmable dead-band, and fault-triggered ADC shutdown. The K42's 12-bit ADC2 synchronized with PWM provides digital averaging for current sensing, while the math accelerator computes field-oriented control loops in real time. Hardware CIPs handle Hall-sensor decoding without CPU intervention.
Recomendado
Automotive Body and Lighting Control
The PIC18F45K42-I/ML suits automotive body controllers, lighting modules, and CAN/LIN nodes through its CIP peripherals and 5V-tolerant I/O. Although the -I/ML is industrial-grade, the K42 family is also offered in -E (extended) and Q-100 qualified variants for under-hood designs. The 32 KB Flash holds CAN/J1939 stacks, while DMA offloads message buffering to free the core for body-control logic like door lock timing and PWM dimming.
Recomendado
USB HID / CDC Device Interface
When paired with an external USB transceiver or via the MSSP/SPI-to-USB bridge, the PIC18F45K42-I/ML implements USB HID, CDC, or vendor-class devices for industrial PCs and embedded test equipment. Its 2 KB SRAM accommodates HID report buffers, and the vector-interrupt architecture handles SETUP packets with low latency. The 5V-tolerant I/O drives USB DP/DM pull-ups directly without level shifters, simplifying PCB layout.
Recomendado
Battery-Powered Medical Devices
Portable medical devices such as pulse-oximeter probes, glucose meters, and spirometers benefit from the PIC18F45K42-I/ML's low-power sleep modes and the ADC2's auto-calibration feature, which maintains measurement accuracy across temperature. The math accelerator computes SpO2 algorithms in real time while CLC peripherals drive the LED pulse sequences, reducing BOM cost. The 256-byte EEPROM stores calibration constants and patient records between sessions.
Recomendado
Smart Home Sensor Hub
Smart-home gateways and sensor hubs (Zigbee/Wi-Fi coordinators, BLE bridges) use the PIC18F45K42-I/ML as a low-cost auxiliary processor that handles sensor polling, local logic, and bridge protocol translation between radios and cloud APIs. The CLC and DMA peripherals offload radio IRQ processing, and 2 KB SRAM caches BLE GATT tables. Its small QFN package enables compact PCB designs behind wall switches or in light fixtures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC18F45K42-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC18F47K42-I/ML | PIC18F45K22-I/ML | PIC18F45K40-I/ML | PIC18F46K42-I/ML | PIC18F45K50-I/ML | PIC18F46K22-I/ML |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Flash Program Memory | 32 KB | 128 KB | 32 KB | 32 KB | 64 KB | 32 KB | 64 KB |
| SRAM | 2 KB | 8 KB | 1.5 KB | 2 KB | 4 KB | 2 KB | 3.8 KB |
| Operating Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 48 MHz (USB FS) | 64 MHz |
| EEPROM | 256 B | 1 KB | 256 B | 256 B | 1 KB | 256 B | 1 KB |
| Core Independent Peripherals (CIPs) | CLC, MAC, DMA, CRC, ADC2 | Same set | Fewer (no MAC, no CLC, no DMA) | Fewer (no MAC, no CLC) | Same set | Same + USB | Fewer (no MAC, no DMA) |
| Operating Voltage | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V |
Principais diferenciais
- Modern K42 generation with Core Independent Peripherals (vs PIC18F45K22-I/ML)
- Higher memory density in the same footprint (vs PIC18F47K42-I/ML)
- Strong low-power (XLP) capability (vs PIC18F45K40-I/ML)
- Stable migration path within PIC18 family (vs PIC18F46K22-I/ML)
Notas de projeto
PIC18F45K42-I/ML ships with the central exposed pad (EP) on pin 44 - this pad MUST be soldered to the PCB ground plane with a via array (typically 5-9 thermal vias, 0.3 mm drill, 0.5 mm pitch) for both electrical grounding and mechanical reliability. Skipping the EP solder connection causes latch-up and reliability failures. Verify the land-pattern footprint against Microchip's 44-pin QFN package drawing before PCB layout sign-off.
Estimated: at 64 MHz full-speed operation the K42 core draws approximately 15 mA; add 1-2 mA per active peripheral. Decouple VDD/AVDD pairs with 100 nF X7R ceramic capacitors placed within 5 mm of each supply pin, plus a 4.7 uF bulk capacitor on the main VDD rail. For ADC accuracy, route AVDD through a ferrite bead from VDD and place a separate 100 nF cap on AVDD within 3 mm. Use the internal voltage reference for ADC2 to avoid external reference noise pickup.
Route MCLR (pin 29) with a 10 kohm pull-up to VDD and a 100 nF capacitor to VSS for proper reset behavior. Leave ICSPCLK (RD0) and ICSPDAT (RD1) accessible - either through test pads or a 2x3 0.1 inch header - to allow field programming with PICkit 4 or ICD 4. Avoid placing large capacitors on these pins since they affect programming edge timing. The OSC1/OSC2 pins should be guarded with a ground ring if using an external crystal for EMI immunity.
The 12-bit ADC2 requires source impedance below 10 kohm for full accuracy; add an op-amp buffer (MCP6002 or similar) when interfacing with high-impedance sensors. Enable ADC2 oversampling in the ADCON register for 14-bit effective resolution when sampling rate is below 1 kHz. Use the integrated 1.024 V or 2.048 V voltage reference rather than VDD for ratiometric measurements to eliminate VDD ripple coupling into ADC readings.
Estimated: at 64 MHz and 5.5 V supply, the K42 core dissipates approximately 80 mW (15 mA * 5.5 V); this raises junction temperature about 8 C above ambient with proper PCB layout (EP soldered, 4-layer FR4). Industrial-grade -I suffix parts are rated to +85 C ambient, so designers should derate by 5 C for enclosure warming. In sealed enclosures without the EP soldered, expect junction-to-ambient thermal resistance of 60 C/W, which could push Tj above 100 C in 60 C ambient - always solder the EP.
Informações de conformidade
RoHS compliant per Microchip product page. -I suffix denotes industrial temperature grade (-40C to +85C); not AEC-Q100 qualified - choose automotive Q-100 variant for automotive applications.
