PIC18F46K80-H/ML - 8-bit 64MHz 64KB Flash MCU | Microchip
N.º da peça: PIC18F46K80-H/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.2 | $7,20 |
| 10 | $6.55 | $65,50 |
| 100 | $5.85 | $585,00 |
| 500 | $5.3 | $2.650,00 |
| 1.000 | $4.85 | $4.850,00 |
PIC18F46K80-H/ML Visão geral
A PIC18F 8-bit MCU belongs to the high-performance PIC18 family of microcontrollers, which are reduced instruction set computing (RISC) Harvard-architecture devices. The PIC18F46K80-H/ML extends this lineage with integrated CAN connectivity, 12-bit ADC, and a CTMU (Charge Time Measurement Unit) for capacitive touch and precise timing, making it suitable for automotive, industrial, and building-control applications.
Key differentiating features of this variant include AEC-Q100 qualification for automotive use, an extended temperature range, 35 programmable I/O lines, six ECAN receive/transmit buffers with three dedicated transmit buffers, and the nanoWatt XLP sleep mode that drops current draw to the nanoampere range. Its 1.8 V to 5.5 V operating voltage range allows direct connection to 3.3 V and 5 V systems, while the 12-bit A/D converter with up to 12 channels supports sensor interfacing.
The H temperature grade indicates operation from -40 °C to +150 °C (high-temperature automotive range), distinguishing this part from the standard I-grade (-40 °C to +85 °C) and E-grade (-40 °C to +125 °C) variants. Internally, the device uses Microchip's enhanced flash architecture with self-programmability and a configurable oscillator block that supports internal operation without external crystals.
Typical applications include automotive body and chassis ECAN nodes, building automation controllers, elevator control systems, industrial sensor hubs, and capacitive-touch user interfaces. The CTMU enables touch buttons and sliders without an external touch IC, while the ECAN peripheral handles CAN 2.0B communication at up to 1 Mbit/s.
When designing with this MCU, allocate the exposed thermal pad (EP) to a continuous ground plane for thermal dissipation and noise immunity. Decouple VDD and AVVDD with 100 nF ceramic capacitors placed within 3 mm of the pins, and route the ECAN TX/RX lines as a differential pair with 120 Ω termination at the bus ends.
This page synthesizes distributor pricing, parametric comparisons, and engineering design notes that complement the manufacturer datasheet, helping procurement and design teams evaluate the PIC18F46K80-H/ML alongside other members of the PIC18F K80 family.
Alternativas drop-in para PIC18F46K80-H/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC18F46K80-H/ML (mesmo formato e footprint) — diferindo em Package, Operating Temperature, ADC, I/O Pins, Program Memory (Flash).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC18F46K80-I/ML
✅ Drop-In✓ Em estoque
$4.23 / unidade
Ver ficha técnica →PIC18F46K80-E/ML
✅ Drop-In✓ Em estoque
$4.18 / unidade
Ver ficha técnica →PIC18F45K80-H/ML
✅ Drop-In✓ Em estoque
$4.31 / unidade
Ver ficha técnica →PIC18F4585-H/ML
✅ Drop-In✓ Em estoque
$7.85 / unidade
Ver ficha técnica →PIC18F4680-H/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC18F46K42T-I/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.04 / unidade
Ver ficha técnica →PIC18F46K80-H/ML Classificações máximas e características elétricas
| Family | PIC® XLP™ 18K |
| Core | 8-bit PIC18 |
| Program Memory Size | 64 KB (32K x 16) Flash |
| RAM Size | 3.6 KB (3.6K x 8) |
| EEPROM Size | 1 KB |
| Maximum CPU Speed | 64 MHz (16 MIPS) |
| Operating Voltage Range | 1.8 V to 5.5 V |
| Number of I/O | 35 |
| Encapsulamento | 44-pin VQFN (8x8 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Faixa de temperatura de operação | -40 °C to +150 °C (H grade) |
| ADC | 12-bit, up to 12 channels |
| CAN (ECAN) | Yes - 6 RX / 3 TX buffers, CAN 2.0B |
| CTMU | Yes (Charge Time Measurement Unit) |
| Oscillator | Internal plus external crystal options |
| AEC-Q100 | Qualified (automotive grade) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| Packaging | Tube |
Configuração de pinos do PIC18F46K80-H/ML
| Pino 1 | RE3/MCLR — Digital input / Master Clear (reset) |
| Pino 2 | RA0/AN0 — PORTA bit 0 / Analog input 0 |
| Pino 3 | RA1/AN1 — PORTA bit 1 / Analog input 1 |
| Pino 4 | RA2/AN2 — PORTA bit 2 / Analog input 2 |
| Pino 5 | RA3/AN3/VREF+ — PORTA bit 3 / Analog input 3 / VREF+ |
| Pino 6 | RA4 — PORTA bit 4 |
| Pino 7 | RA5/AN4 — PORTA bit 5 / Analog input 4 |
| Pino 8 | VSS — Ground reference |
| Pino 9 | RA7/OSC1 — PORTA bit 7 / Oscillator input |
| Pino 10 | RA6/OSC2 — PORTA bit 6 / Oscillator output |
| Pino 11 | RC0/SOSCO — PORTC bit 0 / SOSC oscillator output |
| Pino 12 | RC1/SOSCI — PORTC bit 1 / SOSC oscillator input |
| Pino 13 | RC2/CCP1 — PORTC bit 2 / CCP1 PWM output |
| Pino 14 | RC3/SCL — PORTC bit 3 / I2C SCL |
| Pino 15 | RC4/SDA — PORTC bit 4 / I2C SDA |
| Pino 16 | RC5 — PORTC bit 5 |
| Pino 17 | RC6/TX/CK — PORTC bit 6 / USART TX |
| Pino 18 | RC7/RX/DT — PORTC bit 7 / USART RX |
| Pino 19 | VSS — Ground reference |
| Pino 20 | VDD — Positive supply voltage |
| Pino 21 | RB0/INT0 — PORTB bit 0 / External interrupt 0 |
| Pino 22 | RB1/INT1 — PORTB bit 1 / External interrupt 1 |
| Pino 23 | RB2/INT2 — PORTB bit 2 / External interrupt 2 |
| Pino 24 | RB3/INT3 — PORTB bit 3 / External interrupt 3 |
| Pino 25 | RB4 — PORTB bit 4 |
| Pino 26 | RB5 — PORTB bit 5 |
| Pino 27 | RB6/PGC — PORTB bit 6 / ICSP clock |
| Pino 28 | RB7/PGD — PORTB bit 7 / ICSP data |
| Pino 29 | VSS — Ground reference |
| Pino 30 | VDD — Positive supply voltage |
| Pino 31 | RD0 — PORTD bit 0 |
| Pino 32 | RD1 — PORTD bit 1 |
| Pino 33 | RD2 — PORTD bit 2 |
| Pino 34 | RD3 — PORTD bit 3 |
| Pino 35 | RD4/C1OUT — PORTD bit 4 / Comparator 1 output |
| Pino 36 | RD5/C2OUT — PORTD bit 5 / Comparator 2 output |
| Pino 37 | RD6 — PORTD bit 6 |
| Pino 38 | RD7 — PORTD bit 7 |
| Pino 39 | VSS — Ground reference |
| Pino 40 | VDD — Positive supply voltage |
| Pino 41 | RE0 — PORTE bit 0 |
| Pino 42 | RE1 — PORTE bit 1 |
| Pino 43 | RE2 — PORTE bit 2 |
| Pino 44 | AVSS — Analog ground |
| Pino EP | EP — Exposed thermal pad - connect to ground |
Aplicações típicas
PIC18F46K80-H/ML é adequado para 6 aplicaçãos: Automotive Body and Chassis ECAN Nodes, Industrial Sensor Hubs and Building Automation, Capacitive-Touch User Interfaces, Elevator Control and Drive Modules, Automotive HVAC and Climate Control, Industrial CANopen Slave Devices.
Automotive Body and Chassis ECAN Nodes
The PIC18F46K80-H/ML is engineered for distributed automotive body and chassis ECAN nodes where compact size, AEC-Q100 qualification, and a -40 °C to +150 °C junction rating are mandatory. Its 64 MHz / 16 MIPS core executes CAN 2.0B stacks, LIN slave tasks, and sensor-fusion routines within a 64 KB Flash budget. The integrated ECAN peripheral with six RX and three TX buffers offloads message handling from the CPU, leaving bandwidth for diagnostics and PWM-driven actuators. The 44-VQFN (8x8 mm) package fits behind instrument clusters and HVAC modules where PCB real estate is scarce, and the H temperature grade tolerates under-hood and cabin-tunnel thermal loads. Pair the device with a TJA1050 or TJA1043 CAN transceiver for a complete node.
Recomendado
Industrial Sensor Hubs and Building Automation
For industrial sensor hubs, building automation controllers, and elevator control units, the PIC18F46K80-H/ML delivers ECAN networking, 12-bit ADC accuracy, and nanoWatt XLP sleep currents below 100 nA. The CTMU performs precise time-domain measurements for capacitive touch keypads, while the 12-channel 12-bit ADC reads temperature, pressure, and current sensors without an external analog front end. The 1.8 V to 5.5 V supply range allows direct battery or 24 V-bus-derived rails, and the AEC-Q100 H-grade spec gives engineers thermal headroom in densely packed control cabinets. Industrial protocols such as CANopen, DeviceNet, and proprietary ECAN stacks fit comfortably in the 64 KB Flash budget.
Recomendado
Capacitive-Touch User Interfaces
The PIC18F46K80-H/ML simplifies capacitive-touch HMI designs because the CTMU peripheral provides on-chip charge-time measurement, eliminating an external touch IC. Up to 12 ADC channels can be repurposed as touch inputs with proper PCB guard-ring layout, supporting buttons, sliders, and wheels in kitchen appliances, industrial panels, and automotive center stacks. The 16 MIPS core executes Microchip's mTouch firmware reference in well under 64 KB Flash, leaving room for application logic and diagnostics. The H temperature grade allows touch panels to be mounted near heat sources such as cooktops or HVAC vents without derating.
Recomendado
Elevator Control and Drive Modules
Elevator control units and door-operator drives demand deterministic 8-bit processing combined with industrial-grade reliability and CAN-based floor-network connectivity. The PIC18F46K80-H/ML provides the ECAN peripheral required for distributed floor and cabin controllers, plus 35 I/O pins to drive relays, LED indicators, and door-motor H-bridges via external drivers. Its 64 KB Flash accommodates safety routines, while the 3.6 KB RAM supports CANopen stack buffers and event logs. The H temperature grade handles the warm electrical-room environments where ambient temperatures can exceed 70 °C.
Recomendado
Automotive HVAC and Climate Control
HVAC and climate-control modules benefit from the PIC18F46K80-H/ML's combination of ECAN body-network connectivity, 12-bit ADC for NTC temperature sensors, and PWM-capable I/O for fan and damper actuators. The 35 I/O pins drive multiple blower speeds, mode-door servos, and rear-defrost switches, while the AEC-Q100 H grade tolerates engine-bay-adjacent mounting with reduced thermal margin. The nanoWatt XLP sleep mode cuts quiescent current to nanoampere levels, satisfying parked-car parasitic-current budgets. The CTMU can also be used for humidity-sensor time-domain interfaces in premium climate modules.
Recomendado
Industrial CANopen Slave Devices
CANopen slave nodes in industrial machinery, pumps, and valves use the PIC18F46K80-H/ML for its ECAN peripheral, real-time interrupt structure, and small 44-VQFN footprint. The device implements the CiA 401 generic I/O profile plus vendor-specific objects, leaving roughly half of its 64 KB Flash for application code. Its 16 MIPS throughput handles PDO/SDO processing and synchronous heartbeat messages at 1 Mbit/s, and the H temperature grade tolerates panel-mount enclosures. The 1.8 V to 5.5 V operating range allows direct connection to 24 V-rectified supply rails after a small LDO.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC18F46K80-H/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC18F46K80-I/ML | PIC18F46K80-E/ML | PIC18F45K80-H/ML | PIC18F4585-H/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-VQFN (8x8 mm) | 44-VQFN (8x8 mm) - same | 44-VQFN (8x8 mm) - same | 40-VQFN | 44-QFN |
| Flash Memory | 64 KB | 64 KB | 64 KB | 64 KB | 48 KB |
| RAM | 3.6 KB | 3.6 KB | 3.6 KB | 3.6 KB | 3.3 KB |
| CPU Speed | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 40 MHz / 10 MIPS |
| ECAN | ECAN 2.0B (6 RX / 3 TX) | ECAN 2.0B | ECAN 2.0B | ECAN 2.0B | ECAN 1.0 |
| Temperature Grade | H (-40 to +150 C) | I (-40 to +85 C) | E (-40 to +125 C) | H (-40 to +150 C) | H (-40 to +150 C) |
| AEC-Q100 | Qualified | Qualified | Qualified | Qualified | Qualified |
| Number of I/O | 35 | 35 | 35 | 25 | 44 |
Principais diferenciais
- Highest available temperature grade within the PIC18F46K80 family (vs PIC18F46K80-I/ML)
- Integrated ECAN 2.0B with 6 RX / 3 TX hardware buffers (vs PIC18F4585-H/ML)
- nanoWatt XLP extreme low-power sleep mode (vs PIC18F4680-H/ML)
Notas de projeto
Decouple each VDD pin (20, 30, 40) with a 100 nF X7R ceramic capacitor placed within 3 mm of the package pin and tie all VDD/VSS pairs to a continuous power plane. For AVDD-supplied ADC channels, use a separate filtered AVSS tie and a ferrite bead between VDD and AVDD to reduce digital switching noise coupling into analog measurements. The 1.8 V to 5.5 V range allows the same PCB to operate at 3.3 V or 5 V, but the ADC reference stability at 1.8 V is reduced - prefer 3.3 V operation when ADC accuracy is critical.
Solder the exposed thermal pad (EP) of the 44-VQFN package to a ground plane with multiple thermal vias (typically 9 to 16 vias in a 3x3 array). Without proper EP soldering, the junction-to-ambient thermal resistance rises sharply and the H-grade -40 °C to +150 °C rating can be compromised in enclosed housings. Estimated: at 25 mA active current and 5 V supply, the silicon dissipation is 125 mW, and a properly thermal-via'd EP keeps junction rise under 35 C above ambient even at 85 C ambient.
Do not leave MCLR floating - always tie it to VDD through a 10 kΩ pull-up and to ground through a 100 nF capacitor for clean reset behavior, as required by the PIC18F66K80 family datasheet. The ECAN TX/RX pins require an external CAN transceiver such as TJA1050; the MCU pins are not 5 V CAN-bus tolerant and must never connect directly to the bus. When migrating from PIC18F4585 to PIC18F46K80, note that the ECAN peripheral is enhanced (more buffers, CAN 2.0B active) and existing 4585 code requires re-initialization.
Route the ECAN TX/RX lines as a 120 Ω differential pair from the MCU to the transceiver, keeping trace length below 50 mm and avoiding splits in the underlying ground plane. Place the CTMU current source traces away from switching regulator nodes to preserve touch-measurement accuracy. For capacitive-touch electrodes, surround each pad with a grounded guard ring on the same layer to suppress water-film false triggers.
Informações de conformidade
AEC-Q100 qualified for automotive applications. H temperature grade (-40 C to +150 C junction) supports under-hood and high-ambient industrial deployments. Lead-free and halogen-free per Microchip material declarations.
