PIC18F6722T-I/PT - 8-bit 40MHz 128KB Flash MCU 64-TQFP
N.º da peça: PIC18F6722T-I/PT ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $11.92 | $11,92 |
| 10 | $10.74 | $107,40 |
| 100 | $9.56 | $956,00 |
| 500 | $8.62 | $4.310,00 |
| 1.000 | $7.85 | $7.850,00 |
PIC18F6722T-I/PT Visão geral
An MCU (microcontroller) is a single-chip computer that integrates a CPU core, non-volatile program memory, working RAM, EEPROM data storage, peripherals and I/O on one silicon die. Within Microchip's taxonomy, the PIC18F family sits between the mid-range PIC16F line and the high-performance dsPIC line, offering an 8-bit data path with 16-bit instructions and nanoWatt power-management modes. The PIC18F6722 belongs to the PIC18F8722 family, optimized for large low-power connectivity applications needing abundant RAM and multiple serial interfaces.
Key features of the PIC18F6722T-I/PT include 54 digital I/O pins, four serial ports (two synchronous supporting I2C and SPI, two asynchronous LIN-capable USARTs), a 10-bit ADC with up to 16 channels, nanoWatt technology for power-constrained designs, and supply voltage from 4.2 V to 5.5 V. The 64-pin TQFP package exposes a generous pin budget for graphics, motor, sensor and human-machine-interface front-ends, while 3,936 bytes of RAM enable sizeable communication buffers for stacks like TCP/IP or MODBUS without external memory.
Architecturally, the device uses Microchip's enhanced Harvard architecture with a 16-bit instruction word and an 8-bit data path, providing C-friendly operation while retaining deterministic interrupt latency. The nanoWatt feature set includes idle, sleep and deep-sleep modes with on-the-fly oscillator switching - critical for battery or energy-harvesting nodes. Internal ECC-less Flash and self-programmability simplify in-field firmware updates via bootloader or ICSP.
Typical applications include industrial sensor hubs with multiple serial sensor buses, building automation controllers using LIN or RS-485, low-power wireless gateways paired with transceivers such as MRF24J40 or RN4020, point-of-sale terminals, and white-goods user interfaces. The wide pin count also suits TFT-display and touch-panel front-ends, with the 10-bit ADC handling analog sensor readout in parallel with digital comms.
Design tip: route the ICSP/PGD/PGC pins carefully to keep them accessible for in-circuit programming, and place a 100 nF decoupling capacitor within 5 mm of each VDD/VSS pair; the 64-pin TQFP exposes eight such pairs.
This page combines distributor pricing, drop-in compatible alternatives and practical design notes that are not available from the manufacturer datasheet alone.
Alternativas drop-in para PIC18F6722T-I/PT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC18F6722T-I/PT (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Core Architecture, ADC, I/O Pins.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC18F6722-I/PT
✅ Drop-In✓ Em estoque
$5.32 / unidade
Ver ficha técnica →PIC18F6722T-E/PT
✅ Drop-In✓ Em estoque
$9.28 / unidade
Ver ficha técnica →PIC18F6722-E/PT
✅ Drop-In✓ Em estoque
$10.1 / unidade
Ver ficha técnica →PIC18LF6722T-I/PT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC18LF6722-I/PT
✅ Drop-In✓ Em estoque
$8.74 / unidade
Ver ficha técnica →PIC18F6720T-E/PT
✅ Drop-In✓ Em estoque
$6.95 / unidade
Ver ficha técnica →PIC18F6722T-I/PT Classificações máximas e características elétricas
| Core Architecture | PIC 8-bit enhanced Harvard |
| Family | PIC18F8722 Family |
| Program Memory Type | Flash |
| Program Memory Size | 128 KB (64K x 16) |
| RAM Size | 3,936 bytes |
| EEPROM Size | 1,024 bytes |
| Maximum CPU Speed | 40 MHz |
| Supply Voltage (VDD) | 4.2 V to 5.5 V |
| I/O Pins | 54 |
| ADC | 10-bit, up to 16 channels |
| Serial Interfaces | 2x MSSP (I2C/SPI), 2x USART (LIN-capable) |
| Power-Saving Modes | nanoWatt (Idle / Sleep / Deep Sleep) |
| Temperatura de operação | -40C to +85C (Industrial) |
| Encapsulamento | 64-pin TQFP (10x10 mm) |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 |
| Status RoHS | Compliant |
Configuração de pinos do PIC18F6722T-I/PT
| Pino 1 | RC0 — Digital I/O / T1OSO / T1CKI |
| Pino 2 | RC1 — Digital I/O / T1OSI / CCP2 |
| Pino 3 | RC2 — Digital I/O / CCP1 |
| Pino 4 | RC3 — Digital I/O / SCL1 / SCK1 |
| Pino 5 | RC4 — Digital I/O / SDA1 / SDI1 |
| Pino 6 | RC5 — Digital I/O / SDO1 |
| Pino 7 | RC6 — Digital I/O / TX1 / CK1 |
| Pino 8 | RC7 — Digital I/O / RX1 / DT1 |
| Pino 9 | RD0 — Digital I/O / PSP0 |
| Pino 10 | RD1 — Digital I/O / PSP1 |
| Pino 11 | RD2 — Digital I/O / PSP2 |
| Pino 12 | RD3 — Digital I/O / PSP3 |
| Pino 13 | RD4 — Digital I/O / PSP4 |
| Pino 14 | RD5 — Digital I/O / PSP5 / SDO2 |
| Pino 15 | RD6 — Digital I/O / PSP6 / TX2 |
| Pino 16 | RD7 — Digital I/O / PSP7 / RX2 |
| Pino 17 | VSS — Ground reference |
| Pino 18 | VDD — Positive supply (4.2 V to 5.5 V) |
| Pino 19 | RA0 — Digital I/O / AN0 |
| Pino 20 | RA1 — Digital I/O / AN1 |
| Pino 21 | RA2 — Digital I/O / AN2 / VREF- |
| Pino 22 | RA3 — Digital I/O / AN3 / VREF+ |
| Pino 23 | RA4 — Digital I/O / T0CKI |
| Pino 24 | RA5 — Digital I/O / AN4 / SS1 |
| Pino 25 | RA6 — Digital I/O / OSC2 / CLKO |
| Pino 26 | OSC1 — External clock input / RA7 |
| Pino 27 | RE0 — Digital I/O / RD |
| Pino 28 | RE1 — Digital I/O / WR |
| Pino 29 | RE2 — Digital I/O / CS |
| Pino 30 | RE3 — Digital I/O |
| Pino 31 | MCLR — Master Clear reset (active low) |
| Pino 32 | VSS — Ground reference |
| Pino 33 | VDD — Positive supply (4.2 V to 5.5 V) |
| Pino 34 | RF0 — Digital I/O |
| Pino 35 | RF1 — Digital I/O / C2OUT |
| Pino 36 | RF2 — Digital I/O |
| Pino 37 | RF3 — Digital I/O |
| Pino 38 | RF4 — Digital I/O |
| Pino 39 | RF5 — Digital I/O / C1OUT |
| Pino 40 | RF6 — Digital I/O |
| Pino 41 | RF7 — Digital I/O / SS2 |
| Pino 42 | VSS — Ground reference |
| Pino 43 | VDD — Positive supply (4.2 V to 5.5 V) |
| Pino 44 | RG0 — Digital I/O / CCP3 |
| Pino 45 | RG1 — Digital I/O / TX2 / CK2 |
| Pino 46 | RG2 — Digital I/O / RX2 / DT2 |
| Pino 47 | RG3 — Digital I/O / CCP4 |
| Pino 48 | RG4 — Digital I/O / SDA2 |
| Pino 49 | RG5 — Digital I/O / SCL2 |
| Pino 50 | RG6 — Digital I/O |
| Pino 51 | RG7 — Digital I/O |
| Pino 52 | RB0 — Digital I/O / INT0 / FLT0 |
| Pino 53 | RB1 — Digital I/O / INT1 |
| Pino 54 | RB2 — Digital I/O / INT2 |
| Pino 55 | RB3 — Digital I/O / INT3 / CCP2 |
| Pino 56 | RB4 — Digital I/O / KBI0 |
| Pino 57 | RB5 — Digital I/O / KBI1 / PGM |
| Pino 58 | RB6 — Digital I/O / KBI2 / PGC (ICSP clock) |
| Pino 59 | RB7 — Digital I/O / KBI3 / PGD (ICSP data) |
| Pino 60 | VSS — Ground reference |
| Pino 61 | VDD — Positive supply (4.2 V to 5.5 V) |
| Pino 62 | RH0 — Digital I/O |
| Pino 63 | RH1 — Digital I/O |
| Pino 64 | RH2 — Digital I/O |
Aplicações típicas
PIC18F6722T-I/PT é adequado para 6 aplicaçãos: Industrial Sensor Hub / Multi-Protocol Gateway, Building Automation / HVAC Controller, Low-Power Wireless Sensor Node Base, Point-of-Sale Terminal / Kiosk Front-End, White Goods / Home Appliance Control Board, Automotive Sub-Module (Body Electronics).
Industrial Sensor Hub / Multi-Protocol Gateway
The PIC18F6722T-I/PT's dual MSSP (I2C/SPI) and dual LIN-capable USART make it ideal for industrial sensor hubs aggregating multiple field-bus sensors onto a single backhaul. Its 3,936 bytes of RAM buffers MODBUS RTU or TCP/IP frames without external memory, while the 54 I/O pins drive status LEDs, opto-isolated inputs and relay outputs directly. The 4.2-5.5 V supply integrates with 24 V industrial rails stepped down to 5 V, and the -40C to +85C industrial temperature rating handles factory-floor environments. NanoWatt idle/sleep modes drop the MCU into sub-microamp sleep between polled sensor reads, extending battery-backed RTC backup operation during mains outages.
Recomendado
Building Automation / HVAC Controller
The PIC18F6722T-I/PT provides the digital and analog I/O count needed for HVAC and building-automation controllers that drive triacs, read NTC thermistors, scan keypads and report over LIN or RS-485. Its 10-bit ADC with up to 16 channels handles multiple temperature, humidity and pressure sensors in parallel, while the dual LIN-capable USARTs interface to damper actuators and room-sensor sub-modules. The 128 KB Flash accommodates full BACnet or Modbus application stacks plus a bootloader for field firmware updates. NanoWatt sleep modes lower standby power to meet energy-star idle budgets, and the -40C to +85C range handles unconditioned mechanical-room environments.
Recomendado
Low-Power Wireless Sensor Node Base
Pairing the PIC18F6722T-I/PT with a Microchip MRF24J40 2.4 GHz transceiver or RN4020 BLE module creates a flexible wireless sensor node. The MCU's nanoWatt deep-sleep current keeps battery life in the multi-year range, waking only to take an ADC reading and transmit a packet. With 128 KB Flash, designers can implement MiWi, ZigBee or proprietary 802.15.4 stacks locally, and the 3,936 bytes of RAM accommodates 6LoWPAN fragmentation buffers. The 54 I/O pins let the same firmware drive a rich sensor board (SPI ADC, I2C accelerometer, GPIO interrupts) without multiplexing.
Recomendado
Point-of-Sale Terminal / Kiosk Front-End
The PIC18F6722T-I/PT powers compact POS terminals and self-service kiosks where its 54 I/O pins drive key matrices, status LEDs and a TFT display interface. The 128 KB Flash holds graphical UI assets and a USB stack, while 3,936 bytes of RAM buffer USB CDC/HID frames. Dual SPI lets the MCU simultaneously drive a TFT display controller and a contactless card reader SPI peripheral. The 10-bit ADC reads battery voltage, current sensing and tamper switches, and the industrial temperature grade supports outdoor kiosk enclosures exposed to direct sunlight.
Recomendado
White Goods / Home Appliance Control Board
Washing machines, dishwashers and induction cooktops use the PIC18F6722T-I/PT as their main user-interface and motor-control supervisor. The MCU drives triac-controlled loads (pumps, valves, heaters), reads NTC sensors and rotary encoders via the 10-bit ADC, and communicates with the motor inverter over LIN or UART. The 128 KB Flash fits a full state-machine appliance firmware plus diagnostic logs in EEPROM, while nanoWatt sleep keeps standby power well below 0.5 W to meet EU eco-design directives.
Recomendado
Automotive Sub-Module (Body Electronics)
The PIC18F6722T-I/PT is well suited for non-safety automotive sub-modules such as seat controllers, mirror adjusters, interior lighting and HVAC panels. Both USARTs support LIN 1.3/2.0, the dominant body-electronics bus, and the 54 I/O pins drive LED matrices and H-bridges directly. For full AEC-Q100 compliance, designers should pair this part with a co-MCU that carries the Q100 grade, since the industrial-grade PIC18F6722T-I/PT itself is qualified only to -40C to +85C. The 128 KB Flash supports OEM diagnostic routines and factory calibration data.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC18F6722T-I/PT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC18F6722-I/PT | PIC18F6722T-E/PT | PIC18F6722-E/PT | PIC18LF6722T-I/PT | PIC18LF6722-I/PT | PIC18F6720T-E/PT |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-64 (10x10 mm) | TQFP-64 (10x10 mm) - same | TQFP-64 (10x10 mm) - same | TQFP-64 (10x10 mm) - same | TQFP-64 (10x10 mm) - same | TQFP-64 (10x10 mm) - same | TQFP-64 (10x10 mm) - same |
| Flash Memory | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 64 KB (-50%) |
| RAM | 3,936 bytes | 3,936 bytes | 3,936 bytes | 3,936 bytes | 3,936 bytes | 3,936 bytes | 3,936 bytes |
| EEPROM | 1,024 bytes | 1,024 bytes | 1,024 bytes | 1,024 bytes | 1,024 bytes | 1,024 bytes | 1,024 bytes |
| Maximum CPU Speed | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Supply Voltage | 4.2 V to 5.5 V | 4.2 V to 5.5 V | 4.2 V to 5.5 V | 4.2 V to 5.5 V | 2.0 V to 5.5 V (lower-voltage variant) | 2.0 V to 5.5 V (lower-voltage variant) | 4.2 V to 5.5 V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) |
| Packaging Format | Tape & Reel | Tray | Tape & Reel | Tray | Tape & Reel | Tray | Tape & Reel |
Principais diferenciais
- Full 128 KB Flash - 2x that of PIC18F6720 (vs PIC18F6720T-E/PT)
- Industrial temperature grade matched to factory automation (vs PIC18F6722T-E/PT)
- Dual LIN-capable USARTs for body-electronics (vs PIC18LF6722T-I/PT)
- Tape-and-reel packaging for high-volume SMT lines (vs PIC18F6722-I/PT (tray))
Notas de projeto
The PIC18F6722T-I/PT requires four VDD/VSS pairs (pins 18, 33, 43, 61 for VDD and pins 17, 32, 42, 60 for VSS). Place a 100 nF ceramic decoupling capacitor within 5 mm of each VDD pin and a shared 10 uF bulk capacitor near the IC. Estimate: at 40 MHz and full peripheral activity, core current is approximately 16 mA; a poorly decoupled supply can cause oscillator jitter and ADC noise. For battery-backed designs, drive the MCLR pin with a 10 kohm pull-up and add a diode from VDD to the backup battery for RTC retention.
Route the ICSP/PGD (pin 59) and PGC (pin 58) signals to a 0.1 inch header or test pad and keep them at least 3 mm away from switching converters or motor drive traces. The 64-pin TQFP land pattern should follow IPC-7351 nominal (0.5 mm pitch, 0.30 mm pad width, 1.50 mm pad length). Tie unused I/O pins to either VDD or VSS via 10 kohm resistors to minimize supply current and avoid floating CMOS inputs.
Do NOT assume the PIC18F6722T-I/PT operates at 3.3 V - this is a 5 V part and will be damaged at lower rails. For 3.3 V designs, use PIC18LF6722T-I/PT instead. Estimate: the LF variant operates from 2.0 V to 5.5 V and shares the same TQFP-64 pinout. A common design pitfall is leaving PGM (pin 57) floating during LVP - either drive it high or disable Low-Voltage Programming in CONFIG4L to prevent unintended code corruption.
For SPI bus runs longer than 50 mm, add a 100 ohm series-termination resistor near the MCU driver to dampen ringing. The two MSSP modules can each run up to 10 MHz in SPI master mode, but capacitive loading on the SCL/SDA pins for I2C should be kept below 400 pF total - use a buffer or smaller I2C segments if more devices are required. Place a 4.7 kohm pull-up on SCL/SDA for standard-mode I2C or 3.3 kohm for fast-mode.
Informações de conformidade
Industrial temperature grade -40C to +85C; not AEC-Q100 qualified. RoHS compliant per Microchip product page. Lead-free finish per Microchip packaging specifications.
