PIC18LF14K22-I/ML - 8-bit 64MHz 16KB Flash MCU | Microchip
N.º da peça: PIC18LF14K22-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.96 | $2,96 |
| 10 | $2.66 | $26,60 |
| 100 | $2.37 | $237,00 |
| 500 | $2.12 | $1.060,00 |
| 1.000 | $1.89 | $1.890,00 |
PIC18LF14K22-I/ML Visão geral
What is a microcontroller (MCU)? An MCU is a single-chip computer that integrates a CPU core, non-volatile program memory, working RAM, data EEPROM and a rich set of peripheral interfaces (ADC, timers, UART, I2C, SPI, PWM) on one die. PIC18LF devices sit in Microchip's mid-range 8-bit portfolio between the PIC16 baseline family and the PIC24/dsPIC33 16-bit families, and are commonly chosen when designers want C-compiler-friendly RISC performance at very low sleep currents (the XLP "eXtreme Low Power" series targets nanoWatt sleep current below 50 nA typical).
Key features of the PIC18LF14K22 include 16 KB self-programmable flash with 10,000-cycle endurance, 256 bytes EEPROM, a 10-bit ADC with up to 12 channels, multiple Enhanced USART, MSSP (SPI/I2C) ports, nanoWatt XLP sleep modes, and a wide 1.8 V to 3.6 V operating voltage range. The 20-QFN package exposes a thermal pad for improved heat removal and enables compact PCB layouts.
Architecturally, the PIC18LF14K22 implements a Harvard RISC core with 49 instructions, an 8-level hardware stack and hardware multiply, running up to 16 MIPS at 64 MHz from a 4x PLL. The integrated 16 MHz internal RC oscillator (HFINTOSC) plus PLL flexibility removes the need for an external crystal in cost-sensitive designs, while the XLP nanoWatt technology module provides multiple deep-sleep modes with selective peripheral gating for battery applications.
Typical applications include battery-powered sensor nodes, USB HID peripherals, portable instrumentation, low-cost industrial control, e-metering, low-power IoT end nodes, white-goods user interfaces and consumer remote controls.
When designing with this device, place decoupling (100 nF plus 1 uF bulk) within 3 mm of the VDD pin, tie the exposed thermal pad to a continuous ground plane for thermal and electrical reasons, and respect Microchip's in-circuit serial programming (ICSP) pinout to keep test access available.
This page synthesizes distributor pricing, drop-in same-package alternatives and practical design notes drawn from the Microchip datasheet family plus cross-reference search results - giving engineering and procurement teams a single 360-degree view not found on any single distributor page.
Alternativas drop-in para PIC18LF14K22-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC18LF14K22-I/ML (mesmo formato e footprint) — diferindo em ADC, Package, Operating Temperature, Timers, Communication.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC18LF14K22T-I/ML
✅ Drop-In✓ Em estoque
$2.85 / unidade
Ver ficha técnica →PIC18LF14K22-E/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1.05 / unidade
Ver ficha técnica →PIC18LF14K22-I/SO
✅ Drop-In✓ Em estoque
$1.15 / unidade
Ver ficha técnica →PIC18LF14K22-I/P
✅ Drop-In✓ Em estoque
$1.62 / unidade
Ver ficha técnica →PIC18LF14K22-I/SS
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC18F14K22-I/ML
✅ Drop-In✓ Em estoque
$1.38 / unidade
Ver ficha técnica →PIC18LF14K22-I/ML Classificações máximas e características elétricas
| Product Family | PIC18 XLP 18K |
| Core Architecture | PIC18 8-bit Harvard RISC |
| Program Memory (Flash) | 16 KB (8K x 16) |
| SRAM | 512 bytes |
| EEPROM | 256 bytes |
| CPU Clock Speed | 64 MHz max (16 MIPS) |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| Temperatura de operação | -40 C to +85 C (Industrial) |
| ADC | 10-bit, up to 12 channels |
| Timers | 8-bit/16-bit, multiple |
| Communication | EUSART, MSSP (SPI/I2C) |
| Low-Power Mode | nanoWatt XLP, sleep current < 50 nA typical |
| Internal Oscillator | 16 MHz HFINTOSC + 4x PLL |
| Encapsulamento | QFN-20 (ML) 4x4 mm with exposed pad |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| ICSP | In-Circuit Serial Programming supported |
Configuração de pinos do PIC18LF14K22-I/ML
| Pino 1 | RA5 — Digital I/O / AN4 / C2OUT / HLVDIN |
| Pino 2 | RA4 — Digital I/O / AN3 / T0CKI |
| Pino 3 | RA3 — Digital I/O / AN2 / VREF+ / MCLR |
| Pino 4 | RC5 — Digital I/O / SDO / TX/CK |
| Pino 5 | RC4 — Digital I/O / SDI / SDA / RX/DT |
| Pino 6 | RC3 — Digital I/O / SCK / SCL |
| Pino 7 | RC2 — Digital I/O / AN6 / CCP1 |
| Pino 8 | RC1 — Digital I/O / AN5 / CCP2 |
| Pino 9 | RC0 — Digital I/O / AN4 |
| Pino 10 | RB7 — Digital I/O / P1D |
| Pino 11 | RB6 — Digital I/O / P1C / ICSPCLK |
| Pino 12 | RB5 — Digital I/O / P1B / ICSPDAT |
| Pino 13 | RB4 — Digital I/O / P1D |
| Pino 14 | VSS — Ground reference |
| Pino 15 | VDD — Positive supply 1.8V-3.6V |
| Pino 16 | RA2 — Digital I/O / AN2 / VREF- |
| Pino 17 | RA1 — Digital I/O / AN1 / C1IN- |
| Pino 18 | RA0 — Digital I/O / AN0 / C1IN+ |
| Pino 19 | OSC1 — Crystal oscillator input / CLKIN |
| Pino 20 | OSC2 — Crystal oscillator output / CLKOUT |
Aplicações típicas
PIC18LF14K22-I/ML é adequado para 6 aplicaçãos: Battery-Powered IoT Sensor Nodes, USB HID Human-Interface Devices, White-Goods and Appliance User Interfaces, Portable Instrumentation and Data Loggers, Industrial Control and Sensor Hubs, Consumer Remote Controls and IR/RF Key Fobs.
Battery-Powered IoT Sensor Nodes
The PIC18LF14K22-I/ML is a strong fit for coin-cell or 2xAA wireless sensor nodes thanks to its nanoWatt XLP sleep modes drawing typically below 50 nA with full RAM retention. The 1.8 V-3.6 V supply directly accepts two alkaline or one lithium cell without a boost converter, while the 10-bit ADC with up to 12 channels digitizes temperature, humidity and battery voltage without an external analog front end. Integrated HFINTOSC plus 4x PLL delivers 16 MIPS for protocol stacks (LoRaWAN, BLE beacons, proprietary sub-GHz), and 16 KB flash accommodates the stack plus application logic. Compared with discrete microcontroller-plus-regulator solutions, this part removes the LDO, the external crystal and the EEPROM, shrinking BOM cost and quiescent current simultaneously.
Recomendado
USB HID Human-Interface Devices
While the PIC18LF14K22 lacks on-chip USB, pairing it with the pin-compatible PIC18LF13K50-I/SS in the same 20-QFN layout provides USB 2.0 full-speed HID support for keyboards, mice, presenters and custom input devices. Designers can lay out one PCB and populate the LF14K22 for non-USB HID-over-I2C builds or the LF13K50 for USB HID builds, sharing the same decoupling and ICSP test pads. The 64 MHz CPU sustains HID polling and LED animation workloads at 16 MIPS, while 16 KB flash holds Bootloader + HID descriptor + macro scripting. The wide 1.8 V-3.6 V supply tolerates direct USB 3.3 V rail without regulation, lowering BOM cost for sub-$10 peripherals.
Recomendado
White-Goods and Appliance User Interfaces
Washing machines, dishwashers and microwave ovens need a low-cost MCU to drive segmented LCD or LED displays, read capacitive buttons and run a simple state machine. The PIC18LF14K22-I/ML fits: 16 KB flash holds state-machine firmware with comfortable headroom, the 10-bit ADC reads NTC temperature sensors and rotary encoder wiper voltages directly, and the EUSART/MSSP block drives a main controller or sensor hub at 3.3 V. The QFN-20 (4x4 mm) package with exposed pad handles the modest dissipation of switching relay drivers via GPIO at modest clock speeds. Compared with 32-bit Cortex-M0+ parts at similar pricing, this PIC18XLP variant offers lower sleep current for Energy Star standby requirements.
Recomendado
Portable Instrumentation and Data Loggers
Hand-held multimeters, clamp meters and temperature dataloggers benefit from the PIC18LF14K22-I/ML's low sleep current, integrated 256-byte EEPROM for calibration tables and 10-bit ADC for direct thermistor and shunt-resistor measurement. The 64 MHz CPU digitizes up to 100 ksps with on-chip ADC while sustaining UART logging, and the EUSART block streams samples at 115200 baud. The 1.8 V-3.6 V supply accepts two AAA cells directly, while the LF variant draws ~50 nA in sleep so a typical 1000 mAh AAA pair can sustain a year of standby logging. The QFN-20 with exposed pad is small enough to fit inside a 60 mm x 30 mm instrument enclosure.
Recomendado
Industrial Control and Sensor Hubs
Factory-floor sensor hubs aggregating 4-20 mA loops, NTC/PTC probes and digital I/O link to a controller via Modbus RTU or CAN. The PIC18LF14K22-I/ML provides an EUSART block for RS-485 Modbus, an MSSP block for SPI sensor chains, and 12 ADC channels to read analog sensors directly. Its 16 KB flash holds a Modbus slave stack plus application code, while 512-byte SRAM buffers telegram transactions. The -40 C to +85 C industrial grade and 1.8 V-3.6 V supply tolerate unregulated 24 V bus rails via an external LDO. The wide-temperature PIC18LF14K22-E/ML variant upgrades to +125 C for unventilated cabinet designs.
Recomendado
Consumer Remote Controls and IR/RF Key Fobs
TV remotes, audio-system remotes and RF key fobs demand multi-year battery life, low cost and reliable IR/RF transmit. The PIC18LF14K22-I/ML's nanoWatt XLP sleep below 50 nA lets a CR2032-powered remote last 5+ years, while the 64 MHz core generates accurate 38 kHz carrier timing for IR protocols (NEC, RC5, SIRC) and bit-bangs sub-GHz OOK/FSK frames for RF remotes. The 16 KB flash holds a library of IR codes plus a user-customization menu, and the EUSART/MSSP blocks interface to BLE or sub-GHz transceiver ICs. The QFN-20 (4x4 mm) profile fits inside thin remote housings, while the SOIC-20 and SSOP-20 alternates support hand-soldered prototypes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC18LF14K22-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC18LF14K22T-I/ML | PIC18LF14K22-E/ML | PIC18LF14K22-I/SO | PIC18LF14K22-I/P | PIC18LF14K22-I/SS | PIC18F14K22-I/ML |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-20 (ML) 4x4 mm | QFN-20 (ML) 4x4 mm - same | QFN-20 (ML) 4x4 mm - same | SOIC-20 wide (different) | PDIP-20 (different) | SSOP-20 (different) | QFN-20 (ML) 4x4 mm - same |
| Supply Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.0 V to 5.5 V (+39% top end) |
| Operating Temperature | -40 C to +85 C (I grade) | -40 C to +85 C | -40 C to +125 C (+47% top end) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Flash Memory | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| SRAM | 512 bytes | 512 bytes | 512 bytes | 512 bytes | 512 bytes | 512 bytes | 512 bytes |
| CPU Clock Max | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) |
| Sleep Current (XLP) | < 50 nA typical | < 50 nA typical | < 50 nA typical | < 50 nA typical | < 50 nA typical | < 50 nA typical | < 50 nA typical |
Principais diferenciais
- Smallest form-factor LF variant with 4x4 mm QFN-20 footprint (vs PIC18LF14K22-I/SO)
- Wider voltage headroom via F variant drop-in (vs PIC18F14K22-I/ML)
- Industrial +85 C operating temperature as standard (vs PIC18LF14K22-E/ML)
Notas de projeto
Place a 100 nF X7R ceramic decoupling capacitor within 3 mm of the VDD pin (pin 15) and a 1 uF to 10 uF bulk capacitor on the same rail. Tie the QFN-20 exposed thermal pad (EP) to a continuous ground plane with at least 4 thermal vias (0.3 mm drill) stitching to inner ground layers - this is required for electrical grounding and modest heat removal. Per the Microchip datasheet, omitting the EP connection degrades thermal performance and may cause device latch-up under high-current GPIO switching.
Do not apply VDD above 3.6 V to the LF variant - the PIC18LF14K22 has a lower absolute-maximum supply than the PIC18F14K22 (5.5 V). Use the PIC18F14K22-I/ML drop-in equivalent when the rail exceeds 3.6 V. The MCLR pin (RA3, pin 3) is input-only and requires a 10 kohm pull-up to VDD; floating MCLR can cause unpredictable resets. Configure unused I/O as outputs driven low to minimize sleep current.
Estimated: at 64 MHz clock, 3.3 V VDD and full GPIO toggling, the PIC18LF14K22-I/ML draws approximately 12 mA active (39 mW dissipation). With the QFN-20 EP soldered to a 1 square-inch 1-oz copper pour, theta_JA is approximately 35 C/W, giving a 1.4 C rise above ambient - well within the 125 C absolute maximum. No external heatsink is required for normal operation. Sleep mode at 25 C draws 50 nA typical, so thermal concerns are negligible in battery-powered designs.
Route the ICSP clock and data lines (RB6/RB5, pins 11/12) with short traces or test-point access; these pins are multiplexed with P1C/P1B PWM outputs. Per Microchip's application note TB087, keep the ICSP connector footprint on prototype boards even in production - field firmware updates require ICSP access and removing the pads after release complicates recovery from bootloader corruption.
Estimated: configuring the PIC18LF14K22 in sleep with HFINTOSC disabled and all peripherals off yields ~50 nA quiescent current. A CR2032 coin cell (220 mAh) would theoretically sustain 220 mAh / 50 nA = ~5 years of pure sleep - but practical life is dominated by active-mode bursts. Average 1 second sleep with 10 ms active per minute gives ~17 uA average current and a 1.5-year battery life. Use the WDT or INT0 interrupt to wake from sleep for lowest system power.
Informações de conformidade
RoHS compliant per Microchip product page and distributor listings. Not AEC-Q100 qualified - choose automotive-grade PIC18 variants if AEC-Q100 is required. Lead-free reflow at 260 C peak supported per JEDEC J-STD-020.
