PIC18LF26K80-I/SP - 8-Bit 64MHz 64KB Flash MCU w/ ECAN | Microchip
N.º da peça: PIC18LF26K80-I/SP ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.85 | $4,85 |
| 10 | $4.36 | $43,60 |
| 100 | $3.78 | $378,00 |
| 500 | $3.32 | $1.660,00 |
| 1.000 | $2.94 | $2.940,00 |
| 3.000 | $2.65 | $7.950,00 |
PIC18LF26K80-I/SP Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory (Flash), working RAM, and a rich set of peripherals such as timers, ADC, communication controllers, and GPIO onto one silicon die. Within the broader semiconductor hierarchy, an MCU belongs to the embedded IC family, sitting under the categories of microprocessor, microcomputer, and finally integrated circuit. The PIC18 family is Microchip's mid-range 8-bit architecture, and the 'K80' sub-family specifically adds an ECAN (Enhanced Controller Area Network) module and CTMU (Charge Time Measurement Unit) for capacitive touch and precise time-of-flight measurements.
Key features that distinguish the PIC18LF26K80-I/SP include 24 digital I/O pins, an 8-channel 12-bit ADC, two analog comparators, 5 PWM channels, an MSSP (Master Synchronous Serial Port) configurable as SPI or I2C, two EUSART modules, and 5 timers. The ECAN controller is one of the headline differentiators versus cheaper PIC18F parts, enabling automotive and industrial CAN bus nodes without an external transceiver controller (an external CAN transceiver IC is still required). The XLP nanoWatt technology drives sleep current down to nanoamp levels, ideal for battery-backed or energy-harvesting nodes.
Typical applications include automotive body and comfort ECAN nodes, HVAC controllers, building-automation sensor nodes, USB-to-CAN bridges (when paired with a USB MCU), industrial CAN-based sensor telemetry, capacitive-touch user interfaces, and low-power remote sensor nodes. The 1.8 V minimum supply extends battery life in portable instruments.
When designing with this part, ensure your programmer/debugger supports the PIC18 K80 family - older PIC18 tools that pre-date the K-series may not recognize the device ID. Decouple VDD/VSS with at least 100 nF plus 10 uF bulk caps within 5 mm of the pins.
Alternativas drop-in para PIC18LF26K80-I/SP — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC18LF26K80-I/SP (mesmo formato e footprint) — diferindo em Package, ADC, Mounting Type, Program Memory (Flash), MSL Level.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC18F26K80-I/SP
✅ Drop-In✓ Em estoque
$2.66 / unidade
Ver ficha técnica →PIC18LF25K80-I/SP
✅ Drop-In✓ Em estoque
$2.36 / unidade
Ver ficha técnica →PIC18F25K80-I/SP
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC18LF26K80-I/SP Classificações máximas e características elétricas
| Core Architecture | PIC18 8-bit RISC |
| Program Memory (Flash) | 64 KB (32K x 16) |
| RAM Size | 3.6 KB |
| EEPROM Size | 1 KB |
| Maximum CPU Speed | 64 MHz (16 MIPS) |
| Operating Voltage Range | 1.8 V to 3.6 V (LF variant) |
| Digital I/O Pins | 24 |
| ADC Channels | 8 |
| ADC Resolution | 12-bit |
| Timers | 5 |
| PWM Channels | 5 |
| Analog Comparators | 2 |
| EUSART Modules | 2 |
| MSSP (SPI/I2C) | 1 |
| ECAN Module | Yes (Enhanced CAN) |
| CTMU Module | Yes |
| Encapsulamento | 28-SPDIP (0.300 inch, 7.62 mm) |
| Tipo de montagem | Through-Hole |
| Temperatura de operação | -40C to +85C (Industrial) |
| Status RoHS | Compliant |
| Nível MSL | 1 (not moisture-sensitive) |
| Lead-Free | Yes |
Configuração de pinos do PIC18LF26K80-I/SP
| Pino 1 | RA3/AN3 — Digital I/O / Analog input 3 |
| Pino 2 | RA4 — Digital I/O |
| Pino 3 | RA5/AN4 — Digital I/O / Analog input 4 |
| Pino 4 | RA6/OSC2 — Digital I/O / Oscillator output |
| Pino 5 | RA7/OSC1 — Digital I/O / Oscillator input |
| Pino 6 | VSS — Ground |
| Pino 7 | VDD — Positive supply (1.8 V - 3.6 V) |
| Pino 8 | RB0/AN12 — Digital I/O / Analog input 12 / INT0 |
| Pino 9 | RB1/AN10 — Digital I/O / Analog input 10 |
| Pino 10 | RB2/AN8 — Digital I/O / Analog input 8 |
| Pino 11 | RB3/AN9 — Digital I/O / Analog input 9 |
| Pino 12 | RB4 — Digital I/O |
| Pino 13 | RB5 — Digital I/O |
| Pino 14 | RB6/PGC — Digital I/O / ICSP clock |
| Pino 15 | RB7/PGD — Digital I/O / ICSP data |
| Pino 16 | RC0 — Digital I/O |
| Pino 17 | RC1 — Digital I/O |
| Pino 18 | RC2 — Digital I/O |
| Pino 19 | RC3 — Digital I/O |
| Pino 20 | RC4 — Digital I/O |
| Pino 21 | RC5 — Digital I/O |
| Pino 22 | RC6 — Digital I/O / EUSART TX |
| Pino 23 | RC7 — Digital I/O / EUSART RX |
| Pino 24 | AVDD — Analog supply |
| Pino 25 | AVSS — Analog ground |
| Pino 26 | RA0/AN0 — Digital I/O / Analog input 0 |
| Pino 27 | RA1/AN1 — Digital I/O / Analog input 1 |
| Pino 28 | RA2/AN2 — Digital I/O / Analog input 2 |
Aplicações típicas
PIC18LF26K80-I/SP é adequado para 6 aplicaçãos: Automotive ECAN Body Control Nodes, Industrial Building Automation Sensor Nodes, Capacitive Touch User Interface Panels, Battery-Powered Remote Sensor Telemetry, USB-to-CAN Bridge (Companion MCU Configuration), HVAC Climate Control Modules.
Automotive ECAN Body Control Nodes
The PIC18LF26K80-I/SP's integrated ECAN 2.0B module enables direct connection to automotive CAN bus networks without an external CAN controller. Its 64 MHz / 16 MIPS core provides sufficient headroom for CAN message filtering, J1939 or CANopen stack handling, and actuator PWM control on a 1.8 V-3.6 V supply. The 64 KB Flash accommodates bootloader + application partitioning typical in automotive ECUs, and the 28-SPDIP package is convenient for development bench testing of body-controller prototypes.
Recomendado
Industrial Building Automation Sensor Nodes
Building-automation sensor nodes benefit from the PIC18LF26K80-I/SP's nanoWatt XLP technology, which drives sleep current into the nanoamp region for battery-backed or energy-harvested sensors. The 12-bit 8-channel ADC handles temperature, humidity, and analog sensor inputs with sufficient resolution for HVAC setpoint control. ECAN allows the node to participate in industrial CAN-based sensor networks like CANopen or DeviceNet, and the 3.6 KB RAM supports modest protocol stacks comfortably on a regulated 3.3 V rail.
Recomendado
Capacitive Touch User Interface Panels
The PIC18LF26K80-I/SP's CTMU (Charge Time Measurement Unit) provides hardware-based capacitive touch sensing without external charge-pump circuitry. Combined with the 12-bit ADC and 24 I/O pins, designers can implement multi-key touch panels, sliders, and proximity sensors for industrial HMI or appliance front panels. The nanoWatt XLP technology ensures the touch controller draws minimal current between scans, extending battery life in portable or wall-powered interfaces running on a 3.3 V supply.
Recomendado
Battery-Powered Remote Sensor Telemetry
Remote sensor telemetry nodes benefit from the PIC18LF26K80-I/SP's wide 1.8 V-3.6 V supply range, which directly accepts two AA alkaline cells or a lithium primary cell without an additional boost regulator. The XLP nanoWatt sleep modes drop quiescent current to approximately 20 nA typical, and the ECAN module allows the node to share a CAN bus with other sensors for industrial monitoring. The 24 I/O pins support multiple sensor inputs and wake sources simultaneously on low-voltage battery rails.
Recomendado
USB-to-CAN Bridge (Companion MCU Configuration)
When paired with a USB host MCU such as the PIC18LF2550-I/SP, the PIC18LF26K80-I/SP acts as the CAN node controller in a USB-to-CAN bridge, offloading CAN bus arbitration and message filtering. The 64 MHz core easily handles CAN traffic at 1 Mbps while providing spare bandwidth for diagnostic commands from the USB host. ECAN's hardware acceptance filters reduce firmware overhead, and the SPDIP-28 package simplifies bench debugging during interface development.
Recomendado
HVAC Climate Control Modules
HVAC controllers benefit from the PIC18LF26K80-I/SP's combination of 5 PWM channels (for fan speed, damper, and valve control), 8 ADC channels (for temperature and humidity sensing), and ECAN bus connectivity for distributed climate systems. The 64 KB Flash supports complex control algorithms, while the 1.8 V-3.6 V supply allows operation from 3.3 V regulator rails. The 5 timers enable precise PWM generation across multiple actuators simultaneously in climate control applications.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC18LF26K80-I/SP — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC18F26K80-I/SP | PIC18LF25K80-I/SP | PIC18F25K80-I/SP |
|---|---|---|---|---|
| Package | 28-SPDIP | 28-SPDIP - same | 28-SPDIP - same | 28-SPDIP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 64 KB | 32 KB (-50%) | 32 KB (-50%) |
| RAM | 3.6 KB | 3.6 KB | 3.6 KB | 3.6 KB |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 5.5 V |
| ECAN Module | Yes | Yes | Yes | Yes |
| Maximum CPU Speed | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) |
| ADC Resolution | 12-bit, 8 channels | 12-bit, 8 channels | 12-bit, 8 channels | 12-bit, 8 channels |
Principais diferenciais
- Integrated ECAN module in 8-bit MCU with low-voltage operation (vs PIC18LF25K22-I/SP)
- 32K more Flash than K80 sibling (vs PIC18LF25K80-I/SP)
- Lower minimum supply voltage than F variant (vs PIC18F26K80-I/SP)
Notas de projeto
Decouple VDD/VSS with a 100 nF ceramic capacitor placed within 5 mm of the pins, plus a 10 uF bulk tantalum or ceramic capacitor on the same rail. Place a small ferrite bead in series with AVDD/AVSS if analog accuracy is critical, and add a 100 nF + 10 uF pair on AVDD within 5 mm. The PIC18LF26K80-I/SP's XLP nanoWatt sleep mode drops core current below 100 nA typical at 1.8 V - verify this in your specific build because sleep current scales with peripherals enabled.
The 28-SPDIP through-hole package requires a 0.300 inch (7.62 mm) row spacing. Route the ICSP pins (RB6/PGC and RB7/PGD) to a 5-pin header with at least 100 mil pitch for in-circuit programming and debugging. Place the ICSP header at the board edge to avoid clip conflicts. For CAN applications, place the MCP2551 or equivalent transceiver immediately adjacent to the ECAN pins (RC6/RC7) with the bus-side traces kept short and isolated from the MCU-side digital traces.
Estimated power: at 64 MHz / 3.3 V the active current is approximately 15 mA typical per Microchip datasheet figures, so the MCU alone can draw 50 mW. Watch for brown-out events when the supply sags during transmit - add 10 uF bulk capacitance near the MCU to ride through 50 mV dips. Ensure your programmer/debugger (PICkit 3, PICkit 4, ICD 3, ICD 4, or MPLAB Snap) is updated to firmware that recognizes the PIC18 K80 device ID - older PBDIC and firmware will not program the K80 family.
Informações de conformidade
Industrial temperature grade -40C to +85C per datasheet. Not AEC-Q100 qualified - automotive applications requiring AEC-Q100 should use PIC18F26K80-E/SP (extended temperature) or PIC18F66K90 family. Halogen-free status not explicitly stated in available data.
