PIC18LF46J11T-I/ML - 8-Bit 48MHz 64KB Flash MCU | Microchip
N.º da peça: PIC18LF46J11T-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.95 | $4,95 |
| 10 | $4.46 | $44,60 |
| 100 | $3.96 | $396,00 |
| 500 | $3.57 | $1.785,00 |
| 1.000 | $3.17 | $3.170,00 |
PIC18LF46J11T-I/ML Visão geral
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory (Flash), volatile data memory (RAM), and peripheral set onto one silicon die. MCUs form the lowest tier of the embedded computing hierarchy and serve as the decision-making core inside cost-sensitive products such as sensor nodes, white goods, and USB peripherals. The 8-bit PIC architecture uses a Harvard RISC design with a single accumulator and a hardware multiplier, optimized for deterministic interrupt response and low code size per instruction.
The PIC18LF46J11 features Peripheral Pin Select (PPS), allowing most digital peripherals to be remapped to any I/O pin via software configuration, which simplifies routing in mixed-signal designs. It includes a 10-bit ADC with up to 13 channels, two analog comparators, two CCP/ECCP modules, four 16-bit timers, two I2C/SPI ports, and two enhanced USART modules. Communication interfaces include I2C, SPI, and UART/USART, enabling direct connection to sensors, displays, EEPROM, and host processors without external glue logic.
The 64KB self-programmable Flash supports run-time firmware updates via ICSP (In-Circuit Serial Programming) or the on-chip bootloader, while the 3.8KB RAM and 256-byte EEPROM provide ample scratch space for protocol stacks. Power management features include nanoWatt XLP technology, idle/doze/sleep modes, ultra-low-power wake-up, and a Deep Sleep mode with RTC retention.
Typical applications include industrial sensor interfaces, USB device peripherals, energy harvesting controllers, low-power wireless sensor nodes, and small-form-factor consumer electronics. The wide VDD range makes it compatible with both single-cell Li-ion and 3.3V regulated rails.
When designing with the PIC18LF46J11, leave thermal relief around the exposed pad (EP) of the QFN-44 package to ensure ground continuity and reduce die-to-PCB thermal resistance; missing EP soldering is a common reliability issue with QFN parts. Use MPLAB X IDE with XC8 compiler for code development, and budget PPS remapping early in schematic capture because most peripherals are pin-flexible.
Alternativas drop-in para PIC18LF46J11T-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC18LF46J11T-I/ML (mesmo formato e footprint) — diferindo em Package, Timers, Operating Temperature, ADC, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC18LF46J11-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC18F46J11T-I/ML
✅ Drop-In✓ Em estoque
$3.46 / unidade
Ver ficha técnica →PIC18LF46J50T-I/ML
✅ Drop-In✓ Em estoque
$3.15 / unidade
Ver ficha técnica →PIC18LF46J53T-I/ML
✅ Drop-In✓ Em estoque
$3.05 / unidade
Ver ficha técnica →PIC18LF46K22T-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC18F46K22T-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC18LF46J11T-I/ML Classificações máximas e características elétricas
| Core | PIC18 RISC 8-bit |
| Program Memory (Flash) | 64 KB (32K x 16) |
| RAM Size | 3.8 KB (3.8K x 8) |
| EEPROM Size | 256 bytes |
| Maximum CPU Speed | 48 MHz (12 MIPS) |
| Operating Voltage (VDD) | 2.0 V to 3.6 V |
| I/O Pins | 34 |
| ADC | 10-bit, up to 13 channels |
| Timers | 4 x 16-bit |
| Communication | 2x I2C, 2x SPI, 2x EUSART |
| Analog Comparators | 2 |
| CCP / ECCP Modules | 2 |
| Encapsulamento | 44-QFN (8x8 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (Industrial, 'I' suffix) |
| Packaging Form | Tape & Reel ('T' suffix) |
| Power-Saving Features | nanoWatt XLP, Deep Sleep, Idle modes |
| Status RoHS | Compliant (Lead-free) |
| Nível MSL | 3 (per JEDEC J-STD-020) |
Configuração de pinos do PIC18LF46J11T-I/ML
| Pino 1 | RP0/RB0 — I/O port B bit 0 / Peripheral Pin Select remappable input/output |
| Pino 2 | RP1/RB1 — I/O port B bit 1 / Peripheral Pin Select |
| Pino 3 | RP2/RB2 — I/O port B bit 2 / Peripheral Pin Select |
| Pino 4 | RP3/RB3 — I/O port B bit 3 / Peripheral Pin Select |
| Pino 5 | RP4/RB4 — I/O port B bit 4 / Peripheral Pin Select |
| Pino 6 | RP5/RB5 — I/O port B bit 5 / Peripheral Pin Select |
| Pino 7 | RP6/RB6 — I/O port B bit 6 / ICSPCLK |
| Pino 8 | RP7/RB7 — I/O port B bit 7 / ICSPDAT |
| Pino 9 | VSS — Ground reference |
| Pino 10 | VDD — Positive supply voltage (2.0V to 3.6V) |
| Pino 11 | RA0 — I/O port A bit 0 / analog input AN0 |
| Pino 12 | RA1 — I/O port A bit 1 / analog input AN1 |
| Pino 13 | RA2 — I/O port A bit 2 / analog input AN2 |
| Pino 14 | RA3 — I/O port A bit 3 / analog input AN3 / VREF+ |
| Pino 15 | RA4 — I/O port A bit 4 / analog input AN4 |
| Pino 16 | RA5 — I/O port A bit 5 / analog input AN5 |
| Pino 17 | VSS — Ground reference |
| Pino 18 | VDD — Positive supply voltage (2.0V to 3.6V) |
| Pino 19 | OSC1/CLKI/RA7 — Oscillator input / external clock / port A bit 7 |
| Pino 20 | OSC2/CLKO/RA6 — Oscillator output / clock output / port A bit 6 |
| Pino 21 | RC0 — I/O port C bit 0 / analog input AN6 |
| Pino 22 | RC1 — I/O port C bit 1 / analog input AN7 |
| Pino 23 | RC2 — I/O port C bit 2 / analog input AN8 |
| Pino 24 | RC3 — I/O port C bit 3 / analog input AN9 / SCL1 |
| Pino 25 | RC4 — I/O port C bit 4 / analog input AN10 / SDA1 |
| Pino 26 | RC5 — I/O port C bit 5 / analog input AN11 / SDO1 |
| Pino 27 | RC6 — I/O port C bit 6 / TX1 |
| Pino 28 | RC7 — I/O port C bit 7 / RX1 |
| Pino 29 | RE3 — I/O port E bit 3 / MCLR |
| Pino 30 | RD0 — I/O port D bit 0 / PSP0 |
| Pino 31 | RD1 — I/O port D bit 1 / PSP1 |
| Pino 32 | RD2 — I/O port D bit 2 / PSP2 |
| Pino 33 | RD3 — I/O port D bit 3 / PSP3 |
| Pino 34 | RD4 — I/O port D bit 4 |
| Pino 35 | RD5 — I/O port D bit 5 |
| Pino 36 | RD6 — I/O port D bit 6 |
| Pino 37 | RD7 — I/O port D bit 7 |
| Pino 38 | VSS — Ground reference |
| Pino 39 | VDD — Positive supply voltage (2.0V to 3.6V) |
| Pino 40 | RF0 — I/O port F bit 0 |
| Pino 41 | RF1 — I/O port F bit 1 |
| Pino 42 | RF2 — I/O port F bit 2 |
| Pino 43 | RF3 — I/O port F bit 3 |
| Pino 44 | RF4 — I/O port F bit 4 |
| Pino EP | EP (Exposed Pad) — Must be soldered to ground plane for thermal and electrical performance |
Aplicações típicas
PIC18LF46J11T-I/ML é adequado para 6 aplicaçãos: Industrial Sensor Interface Nodes, Battery-Powered IoT Devices, USB Device Peripherals (via sibling part), Consumer Appliance Control, Low-Cost Data Loggers, HMI Display Controllers.
Industrial Sensor Interface Nodes
The PIC18LF46J11T-I/ML is well suited to industrial sensor interface nodes because of its 64KB Flash for protocol stack storage, 34 I/O pins for multi-sensor fan-out, and 13-channel 10-bit ADC for direct transducer interfacing. Its -40C to +85C industrial temperature rating covers factory-floor environments, while nanoWatt XLP Deep Sleep currents below 100 nA typical enable multi-year battery operation on a single coin cell for remote or inaccessible sensor locations.
Recomendado
Battery-Powered IoT Devices
The PIC18LF46J11T-I/ML powers battery-powered IoT devices efficiently thanks to nanoWatt XLP technology with Deep Sleep currents below 100 nA typical, allowing duty-cycled sensor wake-ups from a single 3V coin cell lasting multiple years. The 2.0V-3.6V VDD range accommodates Li-ion, alkaline, or regulated 3.3V rails, while Peripheral Pin Select allows the same hardware to flex between I2C sensors, SPI radios, or UART modems via software remapping.
Recomendado
USB Device Peripherals (via sibling part)
Although the PIC18LF46J11T-I/ML itself lacks a USB peripheral, designs targeting USB connectivity can migrate to the pin-compatible PIC18LF46J53T-I/ML in the same 44-QFN (8x8) package. The 46J11 remains ideal as the host controller or protocol-conversion MCU on the same PCB, with its 64KB Flash and 48 MHz CPU providing ample headroom for HID, CDC, or vendor-class USB stacks via the on-chip bootloader.
Recomendado
Consumer Appliance Control
The PIC18LF46J11T-I/ML fits consumer appliance control boards such as washing machines, coffee makers, and small kitchen appliances because of its 34 I/O pins for keypad, LED, and relay drive, plus 2 CCP/ECCP modules for motor or PWM-controlled heating elements. The 2.0V-3.6V VDD range and low-cost QFN package keep the BOM tight while supporting capacitive touch via the same family sibling PIC18LF46K22T-I/ML.
Recomendado
Low-Cost Data Loggers
The PIC18LF46J11T-I/ML is a strong fit for low-cost data loggers due to its 64KB Flash supporting onboard buffering of up to 32K 16-bit samples, 3.8KB RAM for time-stamp and metadata storage, and the on-chip 10-bit ADC with 13 channels for multi-sensor sampling. The 256-byte EEPROM enables non-volatile storage of calibration constants and logger configuration, while I2C and SPI ports connect to external FRAM or SD cards for high-capacity archives.
Recomendado
HMI Display Controllers
The PIC18LF46J11T-I/ML drives small HMI displays in appliance and industrial panels because of its SPI and I2C master ports for LCD or OLED panels, 34 I/O pins for keypad scanning and LED status, and 48 MHz CPU handling button debounce, menu state machines, and graphic refreshes. The 64KB Flash accommodates full menu trees plus i18n string tables, while nanoWatt XLP sleep modes enable standby power below 1 uA when the panel is inactive.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC18LF46J11T-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC18LF46J11-I/ML | PIC18F46J11T-I/ML | PIC18LF46J50T-I/ML | PIC18LF46J53T-I/ML | PIC18LF46K22T-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Program Memory (Flash) | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| RAM Size | 3.8 KB | 3.8 KB | 3.8 KB | 3.8 KB | 3.8 KB | 4 KB |
| Maximum CPU Speed | 48 MHz (12 MIPS) | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 64 MHz (16 MIPS) |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 1.8 V to 3.6 V |
| ADC Channels | 13 | 13 | 13 | 13 | 13 | 17 |
| USB Peripheral | No | No | No | No | Yes (USB 2.0 OTG) | No |
| Deep Sleep Current | <100 nA typical (nanoWatt XLP) | <100 nA | Higher than LF variant | <100 nA | <100 nA | <50 nA (improved XLP) |
| Packaging Form | Tape & Reel ('T') | Tube (no 'T') | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel |
Principais diferenciais
- Lowest-cost 64KB Flash XLP MCU in 44-QFN package (vs PIC18LF46K22T-I/ML)
- Hardware USB OTG upgrade path available on same footprint (vs PIC18LF46J53T-I/ML)
- Wider VDD tolerance than 'K22' family (vs PIC18LF46K22T-I/ML)
Notas de projeto
The QFN-44 (8x8 mm) package has an exposed thermal pad (EP) on its underside that must be soldered to the PCB ground plane for both electrical reference and thermal dissipation. Skipping EP soldering creates a cold-solder joint reliability hazard and may shift VSS reference, causing ADC errors. Use a thermal via array (typically 9-16 vias) under the EP to optimize heat transfer to inner ground planes, per IPC-7093 design guidelines for QFN packages.
Estimated: at 48 MHz CPU clock with all I/O toggling, core current draw is approximately 15 mA from a 3.3V supply. Place 100 nF decoupling capacitors on each VDD pin (pins 10, 18, 39) within 2 mm of the package body, plus a bulk 10 uF tantalum or ceramic capacitor on the main 3.3V rail. The PIC18LF46J11 also requires a 1 uF bypass on the AVDD rail if the ADC is active to minimize reference noise.
Route the ICSP clock and data signals (RB6/RB7) away from high-frequency switching nodes such as PWM outputs and oscillator traces to avoid programming glitches. Maintain a 4-layer PCB stackup with a dedicated ground plane under the MCU area to provide a low-impedance return path for the 48 MHz signals and to support the QFN EP thermal via array. For Peripheral Pin Select (PPS) flexibility, route at least 2-3 spare I/O per peripheral group to allow firmware-side pin reassignment without PCB rework.
Informações de conformidade
RoHS compliant per Microchip product page; AEC-Q100 qualification not available for the LF46J11 industrial variant; lead-free reflow soldering compatible per JEDEC J-STD-020 MSL-3.
