PIC24EP256GP206-E/MR - 16-bit 60 MIPS 256KB Flash MCU | Microchip
N.º da peça: PIC24EP256GP206-E/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.95 | $8,95 |
| 10 | $8.06 | $80,60 |
| 100 | $7.18 | $718,00 |
| 500 | $6.47 | $3.235,00 |
| 1.000 | $5.74 | $5.740,00 |
PIC24EP256GP206-E/MR Visão geral
A microcontroller (MCU) is a single-chip computer containing a CPU core, program and data memory, and on-chip peripherals such as ADCs, timers, communication interfaces, and analog blocks. The PIC24E family belongs to Microchip's dsPIC/PIC24 16-bit microcontroller hierarchy - sitting between the 8-bit PIC18 family and the 32-bit PIC32 family - and is designed for general-purpose embedded control that requires higher performance, more memory, and richer peripherals than 8-bit parts can deliver, but does not yet need a 32-bit Cortex-M class core. Within the PIC24E lineup, the GP206 variant is optimized for general-purpose applications, complemented by the MC206 variant for motor control and the MCU506 variant for graphics.
Key features include a 60 MIPS modified-Harvard core with single-cycle MAC, a 10/12-bit ADC with up to 16 channels and 500 ksps throughput, four on-chip op-amps configurable as programmable gain amplifiers, two analog comparators with 1 ns response, a CTMU for capacitive touch and time measurement, and a Peripheral Trigger Generator that coordinates ADC/throttle/CPU operations without software intervention. Communication interfaces include I2C, SPI, UART/USART, IrDA, LIN, and PMP, and the device supports up to 53 digital I/O pins.
Architecturally, the PIC24E core uses a 24-bit instruction word with 16-bit data path and dual-bus fetch, giving high code density and deterministic interrupt latency. The integrated op-amps and comparators remove the need for external signal conditioning in most analog front-ends, and the PTG offloads repetitive trigger sequences from the CPU, allowing more headroom for application logic.
Typical applications include industrial motor control, sensor signal conditioning, capacitive touch HMI, LED lighting controllers, and general-purpose embedded control where analog integration reduces BOM and PCB area. The extended -40C to +125C temperature range of the -E/MR suffix also makes it suitable for industrial and harsh-environment designs.
When designing with this device, ensure proper decoupling (0.1 uF + 10 uF near VDD) and use the on-chip op-amps in unity-gain buffer configuration when sourcing from high-impedance sensors to preserve analog accuracy. Programming and debugging are supported via MPLAB X IDE and the MPLAB ICD 3 / PICkit 4 / Snap toolchains.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, application notes, and design considerations that go beyond the manufacturer datasheet - offering engineers an at-a-glance selection reference for the PIC24EP256GP206-E/MR.
Alternativas drop-in para PIC24EP256GP206-E/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24EP256GP206-E/MR (mesmo formato e footprint) — diferindo em Package, Core Architecture, ADC, Operating Temperature, Program Memory (Flash).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24EP128GP206-E/MR
✅ Drop-In✓ Em estoque
$4.35 / unidade
Ver ficha técnica →PIC24EP512GP206-E/MR
✅ Drop-In✓ Em estoque
$4.97 / unidade
Ver ficha técnica →PIC24EP256MC206-E/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33EP256GP506-E/MR
✅ Drop-In✓ Em estoque
$3.72 / unidade
Ver ficha técnica →PIC24EP256GP206-I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24EP256GP206-H/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24EP256GP206-E/MR Classificações máximas e características elétricas
| Core Architecture | PIC24E 16-bit modified-Harvard |
| CPU Performance | 60 MIPS (up to 70 MIPS family) |
| Program Memory | 256 KB Flash (85.5K x 24) |
| Data Memory (RAM) | 32 KB |
| Operating Voltage (VDD) | 3.0 V to 3.6 V |
| Faixa de temperatura de operação | -40 C to +125 C (Extended, -E) |
| Encapsulamento | 64-pin VQFN (9x9 mm, exposed pad) |
| Tipo de montagem | Surface Mount |
| On-chip Op-Amps | 4 |
| Comparators | 2 |
| ADC | 10/12-bit, up to 16 channels, 500 ksps |
| Communication Interfaces | I2C, SPI, UART, USART, IrDA, LIN, PMP |
| I/O Pins | Up to 53 |
| CTMU | Yes (Charge Time Measurement Unit) |
| PTG (Peripheral Trigger Generator) | Yes |
| PWM Channels | Multiple (high-speed PWM, see datasheet) |
| Status RoHS | Compliant |
Configuração de pinos do PIC24EP256GP206-E/MR
| Pino 1 | RP29/PMA0/OCM2A — Remappable I/O / Parallel Master Address bit 0 / PWM output |
| Pino 2 | RP30/PMA1/OCM2B — Remappable I/O / Parallel Master Address bit 1 / PWM output |
| Pino 3 | RP31/PMA2/OCM2C — Remappable I/O / Parallel Master Address bit 2 / PWM output |
| Pino 4 | AN18/C5IN2-/RP20 — Analog input 18 / Comparator 5 input / Remappable I/O |
| Pino 5 | AN17/C5IN1-/RP9 — Analog input 17 / Comparator 5 input / Remappable I/O |
| Pino 6 | AN16/C4IN3-/RP8 — Analog input 16 / Comparator 4 input / Remappable I/O |
| Pino 7 | AVDD — Analog power supply (+3.3 V) |
| Pino 8 | AVSS — Analog ground |
| Pino 9 | OA1OUT/AN3/C4IN1+/RP5 — Op-amp 1 output / Analog input 3 / Comparator input |
| Pino 10 | OA1IN-/AN2/C4IN1-/RP4 — Op-amp 1 inverting input / Analog input 2 |
| Pino 11 | OA1IN+/AN1/RP3 — Op-amp 1 non-inverting input / Analog input 1 |
| Pino 12 | OA2OUT/AN0/C3IN3+/RP2 — Op-amp 2 output / Analog input 0 / Comparator input |
| Pino 13 | OA2IN-/PMA8/C3IN3-/RP1 — Op-amp 2 inverting input / PMP address bit 8 |
| Pino 14 | OA2IN+/C3IN1+/RP0 — Op-amp 2 non-inverting input / Comparator 3 input |
| Pino 15 | OA3OUT/AN4/C2IN3+/RP6 — Op-amp 3 output / Analog input 4 / Comparator 2 input |
| Pino 16 | OA3IN-/AN5/C2IN3-/RP7 — Op-amp 3 inverting input / Analog input 5 |
| Pino 17 | OA3IN+/C2IN1+/RP10 — Op-amp 3 non-inverting input / Comparator 2 input |
| Pino 18 | OA4OUT/AN6/C1IN3+/RP11 — Op-amp 4 output / Analog input 6 / Comparator 1 input |
| Pino 19 | OA4IN-/AN7/C1IN3-/RP12 — Op-amp 4 inverting input / Analog input 7 |
| Pino 20 | OA4IN+/C1IN1+/RP13 — Op-amp 4 non-inverting input / Comparator 1 input |
| Pino 21 | VDD — Digital power supply (+3.3 V) |
| Pino 22 | VSS — Digital ground |
| Pino 23 | OSCI/CLKI/RC12 — Crystal oscillator input / External clock input / Remappable I/O |
| Pino 24 | OSCO/CLKO/RC15 — Crystal oscillator output / Clock output / Remappable I/O |
| Pino 25 | SOSCI/RP32/CN19 — Secondary oscillator input / Remappable I/O / Change notification |
| Pino 26 | SOSCO/RP33/CN20 — Secondary oscillator output / Remappable I/O / Change notification |
| Pino 27 | MCLR — Master clear reset (active-low) |
| Pino 28 | PGED1/RP38/AN8 — Programming data 1 / Remappable I/O / Analog input 8 |
| Pino 29 | PGEC1/RP39/AN9 — Programming clock 1 / Remappable I/O / Analog input 9 |
| Pino 30 | PGED2/RP40/AN10 — Programming data 2 / Remappable I/O / Analog input 10 |
| Pino 31 | PGEC2/RP41/AN11 — Programming clock 2 / Remappable I/O / Analog input 11 |
| Pino 32 | AN12/C5IN3+/RP42 — Analog input 12 / Comparator 5 input / Remappable I/O |
| Pino 33 | AN13/C5IN1+/RP43 — Analog input 13 / Comparator 5 input / Remappable I/O |
| Pino 34 | AN14/C4IN2+/RP44 — Analog input 14 / Comparator 4 input / Remappable I/O |
| Pino 35 | AN15/C4IN1+/RP45 — Analog input 15 / Comparator 4 input / Remappable I/O |
| Pino 36 | RP46/OCM1F/PMA9 — Remappable I/O / PWM output / PMP address bit 9 |
| Pino 37 | RP47/OCM1E/PMA10 — Remappable I/O / PWM output / PMP address bit 10 |
| Pino 38 | RP48/OCM1D/PMA11 — Remappable I/O / PWM output / PMP address bit 11 |
| Pino 39 | RP49/OCM1C/PMA12 — Remappable I/O / PWM output / PMP address bit 12 |
| Pino 40 | RP50/OCM1B/PMA13 — Remappable I/O / PWM output / PMP address bit 13 |
| Pino 41 | RP51/OCM1A/PMA14 — Remappable I/O / PWM output / PMP address bit 14 |
| Pino 42 | RP52/PMA15 — Remappable I/O / PMP address bit 15 |
| Pino 43 | RP53/PMA16 — Remappable I/O / PMP address bit 16 |
| Pino 44 | RP54/PMA17 — Remappable I/O / PMP address bit 17 |
| Pino 45 | RP55/PMA18 — Remappable I/O / PMP address bit 18 |
| Pino 46 | VDD — Digital power supply (+3.3 V) |
| Pino 47 | VSS — Digital ground |
| Pino 48 | RP56/ASDA1/SDA1 — Remappable I/O / Alternate I2C1 SDA |
| Pino 49 | RP57/ASCL1/SCL1 — Remappable I/O / Alternate I2C1 SCL |
| Pino 50 | RP58/SCL2 — Remappable I/O / I2C2 SCL |
| Pino 51 | RP59/SDA2 — Remappable I/O / I2C2 SDA |
| Pino 52 | RP60/SCK1/ASCL2 — Remappable I/O / SPI1 clock / Alternate I2C2 SCL |
| Pino 53 | RP61/SDI1/ASDA2 — Remappable I/O / SPI1 data in / Alternate I2C2 SDA |
| Pino 54 | RP62/SDO1 — Remappable I/O / SPI1 data out |
| Pino 55 | RP63/SYNC1/SS1 — Remappable I/O / SPI1 sync or slave select |
| Pino 56 | RP64/U1RTS/BCLK1 — Remappable I/O / UART1 RTS / I2S bit clock |
| Pino 57 | RP65/U1CTS/BCLK0 — Remappable I/O / UART1 CTS / I2S bit clock 0 |
| Pino 58 | RP66/U1RX — Remappable I/O / UART1 receive |
| Pino 59 | RP67/U1TX — Remappable I/O / UART1 transmit |
| Pino 60 | RP68/U2RTS — Remappable I/O / UART2 RTS |
| Pino 61 | RP69/U2CTS — Remappable I/O / UART2 CTS |
| Pino 62 | RP70/U2RX — Remappable I/O / UART2 receive |
| Pino 63 | RP71/U2TX — Remappable I/O / UART2 transmit |
| Pino 64 | EP — Exposed thermal pad - must be soldered to PCB ground for thermal dissipation |
Aplicações típicas
PIC24EP256GP206-E/MR é adequado para 7 aplicaçãos: Industrial Motor Control (BLDC / PMSM), Capacitive Touch HMI, Industrial Sensor Hub / Signal Conditioning, Smart LED Lighting Controllers, Portable Medical & Fitness Devices, Industrial Communication Gateways (RS-485 / Modbus / CAN), Automotive Body & Comfort Electronics.
Industrial Motor Control (BLDC / PMSM)
The PIC24EP256GP206-E/MR suits low-power BLDC and PMSM motor control applications up to ~5 A phase current when paired with an external gate driver. The integrated 60 MIPS core runs sensorless FOC algorithms within a 16 kHz PWM loop with margin to spare, while the four on-chip op-amps directly condition shunt-resistor current signals without external amplification - cutting BOM cost and PCB area. The Peripheral Trigger Generator (PTG) coordinates ADC sampling with PWM zero-crossings deterministically, eliminating software jitter. For higher-current applications, migrate to PIC24EP256MC206-E/MR which adds more PWM channels and dedicated fault inputs, sharing the same VQFN-64 footprint for design reuse.
Recomendado
Capacitive Touch HMI
The PIC24EP256GP206-E/MR's integrated CTMU (Charge Time Measurement Unit) enables robust capacitive touch sensing for HMI panels up to 32 buttons or a small touch wheel, without an external touch controller IC. The CTMU measures capacitance changes with sub-pF resolution using a constant-current source and timer capture, while the 60 MIPS core handles mTouch firmware decoding and I2C communication to the host. The four integrated op-amps can buffer analog sensor channels on the same board, reducing external component count. Designers targeting larger touch surfaces should consider pairing this MCU with the MTCH6301 touch controller for higher channel counts.
Recomendado
Industrial Sensor Hub / Signal Conditioning
The PIC24EP256GP206-E/MR serves as a multi-protocol industrial sensor hub, conditioning RTD, thermocouple, and 4-20 mA analog signals through its four integrated op-amps (configured as PGAs with gains up to 32x) before 10/12-bit ADC digitization. The 60 MIPS core runs filtering, linearization, and HART protocol handling while sustaining UART, I2C, and SPI communication with the host PLC. The extended -40 to +125 C temperature rating of the -E suffix ensures operation in cabinet-free field installations. Compared to discrete analog-conditioning solutions, this MCU reduces board area by ~40% and BOM by ~25%.
Recomendado
Smart LED Lighting Controllers
The PIC24EP256GP206-E/MR drives multi-channel architectural and tunable-white LED lighting systems using its multiple high-speed PWM outputs and 16-channel ADC for color-mixing feedback loops. The 256 KB Flash accommodates DALI, DMX512, or Casambi wireless bridge protocol stacks, while the 32 KB RAM handles command buffers and smooth fade calculations. The integrated op-amps condition 0-10 V analog dimming inputs directly, removing external interface ICs. Designers targeting DALI-2 certification can leverage Microchip's pre-certified DALI library for this MCU family.
Recomendado
Portable Medical & Fitness Devices
The PIC24EP256GP206-E/MR's low-power sleep modes (down to < 1 uA in Deep Sleep with RTCC running) and integrated 12-bit ADC make it suitable for battery-powered medical and fitness devices such as pulse oximeters, wearable ECG patches, and connected spirometers. The four on-chip op-amps directly amplify biopotential signals from dry electrodes, while the 60 MIPS core runs digital filtering algorithms (FFT, peak detection) within real-time constraints. The extended -E temperature rating supports body-temperature and refrigerated-pharmaceutical use cases. For FDA Class II designs, leverage Microchip's IEC 60730 Class B functional-safety library.
Recomendado
Industrial Communication Gateways (RS-485 / Modbus / CAN)
The PIC24EP256GP206-E/MR bridges industrial fieldbuses (RS-485 Modbus RTU, CAN 2.0B, LIN) to higher-level Ethernet or Wi-Fi gateways, using its four UART channels, I2C, and SPI interfaces. The 256 KB Flash stores protocol-conversion stacks with room for application logic, and the 32 KB RAM buffers concurrent Modbus transactions. The extended temperature grade supports factory-floor deployment, and the integrated op-amps can interface directly to RS-485 line drivers for signal conditioning. For designs requiring full CAN-FD or Ethernet, migrate to PIC32MX or SAM E70 family.
Recomendado
Automotive Body & Comfort Electronics
Although not AEC-Q100 qualified, the PIC24EP256GP206-E/MR is widely used in non-safety automotive body electronics such as climate-control panels, seat controllers, infotainment aux interfaces, and ambient lighting drivers. The PIC24E family variants in higher temperature grades (-H up to +150 C) extend into engine-bay-adjacent zones. The four integrated op-amps condition sensor inputs (NTC, MAP, occupancy) directly, and LIN support simplifies body-network integration. For safety-critical or powertrain designs, choose AEC-Q100 qualified dsPIC33EP variants.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24EP256GP206-E/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24EP128GP206-E/MR | PIC24EP512GP206-E/MR | PIC24EP256MC206-E/MR | dsPIC33EP256GP506-E/MR |
|---|---|---|---|---|---|
| Package | VQFN-64 (MR, 9x9 mm) | VQFN-64 (MR) - same | VQFN-64 (MR) - same | VQFN-64 (MR) - same | VQFN-64 (MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 128 KB (-50%) | 512 KB (+100%) | 256 KB (same) | 256 KB (same) |
| RAM | 32 KB | 32 KB (same) | 32 KB (same) | 32 KB (same) | 32 KB (same) |
| Core / Performance | PIC24E 16-bit, 60 MIPS | PIC24E 16-bit, 60 MIPS | PIC24E 16-bit, 60 MIPS | PIC24E 16-bit, 60 MIPS (motor-control tuned) | dsPIC33E 16-bit DSP, 60 MIPS |
| On-chip Op-Amps | 4 | 4 (same) | 4 (same) | 4 (same) | 4 (same) |
| Comparators | 2 | 2 (same) | 2 (same) | 3 (more) | 2 (same) |
| Temperature Grade | Extended -40 to +125 C (-E) | -40 to +125 C (-E) | -40 to +125 C (-E) | -40 to +125 C (-E) | -40 to +125 C (-E) |
| DSP Engine | No (PIC24E general purpose) | No | No | No | Yes (single-cycle MAC) |
Principais diferenciais
- Best balance of Flash size and peripheral set in the PIC24E GP206 family (vs PIC24EP128GP206-E/MR)
- 4 integrated op-amps replace external analog ICs (vs PIC24FJ64GA002-I/ML)
- CTMU + PTG enable hardware-triggered deterministic ADC sequencing (vs PIC24EP256MC206-E/MR)
- Extended -40 to +125 C temperature range for industrial deployments (vs PIC24EP256GP206-I/MR)
Notas de projeto
The 64-pin VQFN (9x9 mm) package uses an exposed thermal pad (EP) that MUST be soldered to a PCB ground plane of at least 1 square inch (645 mm^2) of 2-oz copper to achieve rated thermal performance. Without proper EP soldering, junction-to-ambient thermal resistance (theta_JA) increases dramatically and the device may overheat at high CPU activity or high ambient temperatures near +125 C. Estimated: theta_JA is approximately 25 C/W on a JEDEC EIA/JESD51 4-layer test board with EP soldered; on a minimal 2-layer board without thermal vias, theta_JA can exceed 60 C/W, requiring derating of CPU activity at high ambient.
Place a 0.1 uF decoupling capacitor as close as possible to every VDD/AVDD pin (pins 7, 21, 46 in this package), and a single 10 uF bulk capacitor on the analog rail (AVDD pin 7). Separate analog and digital ground planes connected at a single point near the MCU, with the AVSS pin (pin 8) tied directly to the analog ground plane. Use ferrite beads (e.g., BLM18AG601SN1) to bridge AVDD/VDD when the analog section must be isolated from digital switching noise. Estimated: peak core current is approximately 30 mA at 60 MIPS, 3.3 V; bulk decoupling of 10 uF provides ~300 uA*s of charge headroom for transient load steps.
Route the ICSP programming pins (PGED1/PGEC1, pins 28/29) with short traces to a 6-pin header and avoid running them next to switching signals (PWM outputs, communication lines). The MCLR pin (pin 27) requires a 10 kohm pull-up to VDD and a 100 nF cap to ground for in-circuit programming; omitting the capacitor can cause programming failures in noisy environments. Place the programming header at the board edge for production-line access, or use Microchip's Tag-Connect TC2030 footprint for space-constrained designs.
Configuration bits must be set BEFORE first programming; leaving them at default can cause the device to boot from an unexpected oscillator mode or disable the watchdog inadvertently. For applications requiring fail-safe behavior, enable the watchdog timer, the Brown-Out Reset (BOR), and the unauthorized write protection. Pin remapping (PPS - Peripheral Pin Select) must be unlocked via the IOLOCK bit sequence before any remapping takes effect - failing to do so is a common source of 'silent' UART/SPI failures where pins appear to be configured but the peripheral signals never appear.
When using the integrated op-amps at gains > 10x for low-frequency sensor signals, add 10 pF-100 pF compensation capacitors across the feedback resistor to prevent oscillation. Estimated: with the on-chip op-amps' gain-bandwidth product of approximately 10 MHz, a gain of 32x limits stable bandwidth to ~300 kHz without compensation. The CTMU requires careful PCB layout - keep CTMU charge/discharge traces short, guard-ring the sensor electrodes, and minimize stray capacitance (typically < 5 pF) to achieve reliable touch detection. Place the touch sensors on the opposite side of any switching power supply or high-frequency signals.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. Halogen-free per Microchip environmental compliance documentation. Not AEC-Q100 qualified - choose dsPIC33EP or PIC32MX automotive-qualified variants for AEC-Q100 designs.
