PIC24F08KL302-E/SO - 16-Bit 32MHz XLP MCU | Microchip
N.º da peça: PIC24F08KL302-E/SO ✓ AtivoPIC24F08KL302-E/SO Visão geral
A microcontroller is a programmable system-on-chip that integrates a CPU, memory, and peripheral interfaces into one package. The PIC24F belongs to the 16-bit RISC microcontroller hierarchy, which sits between 8-bit microcontrollers and higher-end 32-bit processors. Its combination of moderate processing performance, compact memory, low-power features, and mixed-signal peripherals makes it suitable for cost-sensitive embedded products that require more capability than a basic 8-bit MCU.
The headline features are the 32 MHz PIC24 core, 8 KB Flash memory, 1 KB RAM, and 256-byte EEPROM. The -E/SO ordering identifies the industrial-temperature grade in a 28-pin SOIC package. According to the verified distributor information, the MCU also includes MSSP support for I2C or SPI, CCP and ECCP peripherals, and multiple programming or debug connections using PGEC and PGED pins.
The internal architecture combines 2,816 words of Flash program memory with 1,024 bytes of SRAM and 256 bytes of data EEPROM. Flash retains program code when power is removed, while RAM supports working data and the EEPROM provides a small amount of nonvolatile data storage. The MCU also includes multiple VDD and VSS connections so the package can provide a low-impedance supply distribution path and common return path when correctly laid out.
Typical uses include low-power sensor nodes, industrial monitoring equipment, compact control panels, connected instruments, and cost-sensitive consumer products. Its I2C and SPI capability supports sensors and serial memories, while the CCP and ECCP blocks can assist with timing, capture, compare, and basic motor-control tasks. The exact peripheral assignments, alternate-function details, and programming configuration must be confirmed against the manufacturer documentation before a PCB is released.
Designers should preserve the required decoupling close to every VDD and VSS pin, route programming signals away from sensitive analog inputs, and use an ISP-compatible programming header or socket. Because this is a small-memory MCU, code size and stack depth should be checked during firmware validation. The -E/SO variant is appropriate for industrial-temperature designs, but other grade and package orderings must not be substituted without verifying temperature limits and footprint differences.
This product record combines verified manufacturer and distributor information, package-specific sourcing links, comparison parameters, and practical implementation guidance. It distinguishes electrically similar orderings from true board-level drop-in options and highlights where package, temperature grade, programming, or peripheral verification remains essential before substitution.
Alternativas drop-in para PIC24F08KL302-E/SO — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24F08KL302-E/SO (mesmo formato e footprint) — diferindo em Package, Core Architecture, Data EEPROM, Operating Temperature.
PIC24F08KL302-I/SO
✅ Drop-InConsulte o preço
Ver ficha técnica →PIC24F08KL301-E/SO
✅ Drop-In ⚠️ Especificações não verificadasConsulte o preço
Ver ficha técnica →PIC24F08KL301-I/SO
✅ Drop-In ⚠️ Especificações não verificadasConsulte o preço
Ver ficha técnica →PIC24F08KL303-E/SO
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC24F08KL303-I/SO
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC24F08KL302-E/SO Classificações máximas e características elétricas
| Product Type | 16-bit RISC microcontroller |
| CPU Core | PIC24F core |
| Maximum CPU Frequency | 32 MHz |
| Program Flash Memory | 8 KB (2,816 words) |
| RAM | 1 KB (1,024 bytes) |
| Data EEPROM | 256 bytes |
| Tensão de alimentação | 3 V |
| Temperatura de operação | -40°C to +125°C |
| Encapsulamento | 28-pin SOIC |
| Tipo de montagem | Surface mount |
| Technology | CMOS |
| Package Code | SO |
| Terminal Count | 28 terminals |
| Package Shape | Rectangular |
| Peripheral Support | MSSP (I2C/SPI), CCP and ECCP |
| Low-Power Feature | nanoWatt XLP |
| Programming Interface | ICSP with multiple PGEC and PGED pairs |
Guia de Configuração de Pinos do PIC24F08KL302-E/SO rectangular
Configuração de pinos para PIC24F08KL302-E/SO (pacote rectangular). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PIC24F08KL302-E/SO.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PIC24F08KL302-E/SO é adequado para 6 aplicaçãos: Low-Power Industrial Sensor Nodes, Connected Environmental Monitors, Compact Instrument Control Panels, Serial Memory and Data-Logger Modules, Cost-Sensitive Serial Control Products, Timing and Motor-Control Assistance.
Low-Power Industrial Sensor Nodes
The PIC24F08KL302-E/SO fits compact industrial sensor nodes because its verified 32 MHz PIC24F core provides responsive control while nanoWatt XLP supports low-power operating strategies. The 1 KB RAM and 256-byte EEPROM are sufficient for coordinating sampled measurements, retaining configuration values, and managing sensor state without an external memory component. Its MSSP block can communicate with compatible I2C or SPI sensors, while the -40°C to +125°C grade covers a wide range of factory environments. The implementation should use the manufacturer's low-power modes, retain only required peripherals while idle, and validate the complete current profile at the required temperature. Decoupling near every VDD pin and careful VSS return routing remain important because sensor accuracy and radio activity can be affected by shared supply noise.
Recomendado
Connected Environmental Monitors
PIC24F08KL302-E/SO is suitable for environmental monitors that combine a local sensor with a serial radio or storage peripheral. The verified MSSP interface supports I2C or SPI communication, while the 8 KB Flash program memory accommodates embedded control code and the 1 KB RAM can support active measurement buffering. Its 256 bytes of EEPROM can retain calibration or configuration information when power is removed. A practical design would place the MCU and sensor on a compact low-power board, connect the serial interface according to the manufacturer's pinout, and use the -40°C to +125°C rating for exposed or industrial locations. Firmware should avoid blocking serial transfers and should place the MCU into an appropriate sleep state between measurements to control average power.
Recomendado
Compact Instrument Control Panels
The PIC24F08KL302-E/SO can serve as the control processor in a compact instrument panel because its 16-bit architecture, 32 MHz operating speed, and integrated CCP and ECCP peripherals support responsive timing and signal-management tasks. The 8 KB Flash and 1 KB RAM suit firmware involving button handling, status logic, display updates, and communication, while the 3 V operating point aligns with many low-voltage embedded systems. Designers can use the MSSP peripheral to connect a display controller, sensor, or external memory and can retain small configuration parameters in EEPROM. The main constraint is the device's limited memory, so display buffering and protocol libraries should be profiled. PCB routing must preserve the programming pins and isolate display or switching noise from sensitive measurement circuitry.
Recomendado
Serial Memory and Data-Logger Modules
PIC24F08KL302-E/SO is appropriate for compact serial data-logger modules that must gather sensor data and transfer it to a host or nonvolatile storage device. Its verified MSSP support for I2C or SPI enables connection to serial memories and acquisition peripherals, and its 1 KB RAM provides a working buffer for temporarily organizing records. The 256-byte EEPROM can hold identifiers, calibration values, or a transfer index, while the 32 MHz core can service protocol and control tasks. A robust implementation should acknowledge writes, handle bus errors, and avoid exceeding the 8 KB Flash limit as protocol features expand. Because storage writes can be power-sensitive, firmware should also coordinate completion of the final record before supply loss and verify the board-level decoupling required by the selected memory interface.
Recomendado
Cost-Sensitive Serial Control Products
The PIC24F08KL302-E/SO supports cost-sensitive serial control products that need more processing headroom than an 8-bit MCU but do not require a high-end processor. Its 16-bit PIC24F core runs up to 32 MHz, providing efficient handling of control logic, communications, and timing tasks, while the integrated MSSP reduces the need for separate serial-interface hardware. The 3 V supply and 28-pin SOIC package support conventional compact assembly, and the verified -40°C to +125°C grade supports demanding operating environments. Design teams should account for the 1 KB RAM ceiling when selecting serial stacks and should use CCP or ECCP only after confirming their functions against the specific pin configuration. Firmware development and production programming must also be planned around the available ICSP programming and debugging connections.
Recomendado
Timing and Motor-Control Assistance
PIC24F08KL302-E/SO can support timing, capture, compare, or limited motor-control functions where its verified CCP and ECCP peripherals provide useful hardware assistance. The 32 MHz core allows the firmware to combine timing events with serial communication and general embedded-control logic, making the MCU suitable for compact actuator controllers, educational motion systems, and cost-sensitive sequencing products. This role should remain proportionate to the device's 8 KB Flash and 1 KB RAM because complex algorithms or extensive motor libraries can exceed those resources. The exact CCP/ECCP channel availability, alternate functions, and pin multiplexing must be verified in the manufacturer documentation. Board design should provide clean supply paths and appropriate signal conditioning because inductive load events can create transients that are not addressed by the MCU itself.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24F08KL302-E/SO — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24F08KL302-I/SO | PIC24F08KL301-E/SO | PIC24F08KL301-I/SO | PIC24F08KL303-E/SO | PIC24F08KL303-I/SO |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-pin SOIC | 28-pin SOIC - same | 28-pin SOIC - same | 28-pin SOIC - same | 28-pin SOIC - same | 28-pin SOIC - same |
Principais diferenciais
- Verified high-temperature operation (vs PIC24F08KL302-I/SO)
- Complete memory configuration is explicitly identified (vs PIC24F08KL301-E/SO)
- 32 MHz performance with integrated serial support (vs PIC24F08KL303-I/SO)
- Documented low-power architecture (vs PIC24F08KL301-I/SO)
Notas de projeto
Use the manufacturer's 28-pin SOIC land pattern and connect every documented VDD and VSS pin rather than assuming only one supply pair is sufficient. Place the required decoupling capacitors adjacent to their associated supply pins and provide a continuous, low-impedance ground reference. The verified documentation identifies multiple PGEC and PGED pairs, so leave a programming connection accessible and avoid routing noisy switching or display signals across those traces.
Treat the 3 V operating point as the design baseline, but verify the permitted supply range and all pin-specific limits in the current manufacturer datasheet before selecting regulators or external peripherals. For low-power operation, measure the complete system rather than the MCU in isolation because MSSP, CCP, and external sensors may dominate the average current. Use the nanoWatt XLP sleep modes only after confirming oscillator, timer, and peripheral wake-up behavior in firmware.
Do not substitute a different 28-pin MCU based only on package size and word length. Validate the exact pinout, VDD and VSS locations, oscillator arrangement, programming interface, interrupt mapping, CCP/ECCP channels, and MSSP functions. Also verify the temperature suffix: the target -E/SO is verified for -40°C to +125°C, while the available data does not provide a complete temperature rating for every alternative.
Keep analog sensor inputs and low-level measurement paths away from programming, display, and switching traces. Use a compact ground return beneath the MCU, avoid long supply loops, and observe the datasheet's external-component placement rules. If CCP or ECCP outputs drive inductive or switching loads, keep those currents off sensitive signal paths and provide appropriate protection; the MCU does not replace a driver, clamp, or power-stage design.
Informações de conformidade
The supplied verified snippets do not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. Compliance must be confirmed from the current Microchip product documentation or declaration for the exact ordering code.
