Microchip Technology

PIC24F16KA302-I/SO - 16-bit 32MHz XLP MCU 16KB Flash | Microchip

N.º da peça: PIC24F16KA302-I/SO ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
1.8 V to 3.6 V Vdss 20 nA typical (with RTCC) Id 28-pin SOIC (SO), 0.300" wide body Package 32 MHz / 16 MIPS Speed 16 KB (5.5K x 24 instructions) Memory
A partir de $1.74 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-29
Preços por volume
Qtd. Preço unitário Total
1 $2.79 $2,79
10 $2.51 $25,10
100 $2.23 $223,00
500 $1.95 $975,00
1.000 $1.74 $1.740,00
ℹ️ Todos os preços estão em USD

PIC24F16KA302-I/SO Visão geral

The Microchip Technology PIC24F16KA302-I/SO is a 16-bit PIC® microcontroller built on the eXtreme Low Power (XLP) technology platform, delivering up to 32 MHz (16 MIPS) performance with 16 KB Flash, 2 KB RAM, and 512 B EEPROM in a 28-pin SOIC (SO) wide-body package. It operates from 1.8 V to 3.6 V across an industrial -40 °C to +85 °C temperature range, targeting battery-powered and energy-harvesting designs where quiescent current dominates battery life.

A microcontroller (MCU) is an integrated circuit containing a processor core, program and data memory, peripherals, and I/O on a single die. The 16-bit PIC24F architecture sits in the hierarchy: PIC24F microcontroller -> 16-bit MCU -> embedded controller -> semiconductor IC. The PIC24F core uses a modified Harvard architecture with a 16-bit wide data path, giving the family more headroom for arithmetic-intensive signal processing than 8-bit MCUs while keeping cost and power below 32-bit Cortex-M0+ parts.

Key features include XLP Deep Sleep current as low as 20 nA with RTCC, DSBOR and DSWDT running; a 12-bit ADC with up to 17 analog inputs; an integrated Charge Time Measurement Unit (CTMU) for capacitive touch and precise time measurement; multiple serial interfaces (UART, SPI, I2C); and configurable Peripheral Pin Select (PPS) on select ports. The 28-SOIC wide-body variant (-SO) provides 17 usable I/O pins on a 0.300" body, well-suited for hand-soldering and small-form-factor production.

Architecturally, the PIC24F16KA302 belongs to the KA3 family and shares its peripheral set with the KA1 (smaller pin-count) siblings, enabling firmware portability across 20/28/44/48-pin variants. The CTMU is the standout peripheral, allowing mTouch capacitive touch sensing and accurate time-of-flight measurement for flow meters without an external timing IC. Combined with deep-sleep nanoWatt XLP technology, this makes the device attractive for sensor nodes that wake, sample, transmit, and return to sleep within microamps of average current.

Typical applications include IoT sensor endpoints, battery-powered medical devices such as glucose meters, wearable fitness bands, remote controls, smart thermostats, and industrial data loggers. The 12-bit ADC and CTMU allow direct interface with resistive/capacitive sensors, and the low 1.8 V minimum supply supports direct Li-coin-cell operation without boost circuitry.

When designing in this MCU, allocate adequate decoupling (100 nF + 10 µF) near VDD/AVDD pins and follow Microchip's recommended ICSP programming header layout for in-circuit firmware updates. Verify that your total I/O count including debug pins is within the 17-pin budget before committing to the 28-SOIC footprint; if you need more I/O, the 44-pin PIC24F16KA304 in the same family offers pin-for-pin firmware compatibility.

This page synthesizes distributor pricing, same-family and cross-family drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, giving engineers a one-stop reference for component selection.

Alternativas drop-in para PIC24F16KA302-I/SO — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com PIC24F16KA302-I/SO (mesmo formato e footprint) — diferindo em Operating Temperature, Maximum CPU Speed, ADC, Package, RoHS Status.

Microchip Technology
Operating Temperature: -40 °C to +85 °C (Industrial)
Maximum CPU Speed: 32 MHz (16 MIPS at 3.3 V)
Microchip Technology
Operating Temperature: -40C to +85C (Industrial, I-temp)
ADC: 12-bit, up to 9 channels
Package: 20-pin SOIC (SO), 0.300 inch body width
Microchip Technology
Operating Temperature: -40 C to +85 C (Industrial)
Maximum CPU Speed: 32 MHz (32 MIPS)
ADC: 12-bit, up to 16 channels

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

PIC24F16KA302-I/SP

✅ Drop-In
📦 28-pin SPDIP (SP)
same die, 28-pin SPDIP through-hole package (vs 28-SOIC surface-mount); otherwise identical Flash/RAM/ADC/CTMU

📋 Alternativa de referência (fora do catálogo)

PIC24F16KA302T-I/SO

✅ Drop-In
📦 28-pin SOIC (SO)
same die, tape-and-reel packaging for SMT production; identical electrical specs as PIC24F16KA302-I/SO

📋 Alternativa de referência (fora do catálogo)

PIC24F16KA304-I/SP

✅ Drop-In
📦 28-pin SPDIP (SP)
doubled Flash to 32 KB and RAM to 4 KB; same ADC/CTMU/XLP, same industrial temperature, same pinout in 28-SPDIP

📋 Alternativa de referência (fora do catálogo)

PIC24F08KA302-I/SO

✅ Drop-In
📦 28-pin SOIC (SO)
Flash halved to 8 KB; same RAM/ADC/CTMU/XLP, same 28-SOIC pinout, same industrial temperature

📋 Alternativa de referência (fora do catálogo)

PIC24F16KA301-I/SO

✅ Drop-In
📦 28-pin SOIC (SO)
Flash 8 KB (-50%), RAM 1 KB (-50%); same ADC/CTMU/XLP, same 28-SOIC pinout in 20-pin/28-pin family (KA301 is 20-pin SPDIP, this entry is a price-tier cousin)

📋 Alternativa de referência (fora do catálogo)

ℹ️ 1 peça(s) de outro encapsulamento ocultada(s) — um encapsulamento diferente exige retrabalho na PCB e não é uma substituição drop-in verdadeira. Fale conosco se precisar de sugestões de outros encapsulamentos.

PIC24F16KA302-I/SO Classificações máximas e características elétricas

Architecture 16-bit PIC24F (modified Harvard)
Core PIC24F
Family PIC24F KA3 series (XLP)
Program Memory (Flash) 16 KB (5.5K x 24 instructions)
Data RAM 2 KB
EEPROM 512 B
Maximum CPU Speed 32 MHz / 16 MIPS
Supply Voltage (VDD) 1.8 V to 3.6 V
I/O Pins 17
ADC 12-bit, up to 17 channels
CTMU Charge Time Measurement Unit (capacitive touch / time measurement)
Comparators 2
Timers (8-bit / 16-bit) Multiple 16-bit and 32-bit timers
RTCC Real-Time Clock/Calendar (runs in Deep Sleep)
Deep Sleep Current 20 nA typical (with RTCC)
Serial Interfaces UART, SPI, I2C
Temperatura de operação -40 °C to +85 °C (Industrial, -I suffix)
Encapsulamento 28-pin SOIC (SO), 0.300" wide body
Tipo de montagem Surface Mount
Status RoHS Compliant

Configuração de pinos do PIC24F16KA302-I/SO

SOIC-28 Package Pinout Diagram SOIC-28W 28-pin, 7.5x17.9mm, P1.27mm, JEDEC MS-013. 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 SOIC-28
Pino 1 MCLR/RA5 — Master Clear (reset) input, also RA5; ICSP programming VPP
Pino 2 RA0 — Digital I/O; analog AN0
Pino 3 RA1 — Digital I/O; analog AN1
Pino 4 RA2 — Digital I/O; analog AN2
Pino 5 RA3 — Digital I/O; analog AN3
Pino 6 RA4 — Digital I/O; analog AN4
Pino 7 VDD — Positive supply (1.8 V to 3.6 V)
Pino 8 VSS — Ground reference
Pino 9 OSC1/RA7 — Crystal oscillator input or digital I/O RA7
Pino 10 OSC2/RA6 — Crystal oscillator output or digital I/O RA6
Pino 11 RB0 — Digital I/O; analog AN5; PGED
Pino 12 RB1 — Digital I/O; analog AN6; PGEC
Pino 13 RB2 — Digital I/O; analog AN7
Pino 14 RB3 — Digital I/O; analog AN8
Pino 15 RB4 — Digital I/O; analog AN9
Pino 16 RB5 — Digital I/O; analog AN10
Pino 17 RB6 — Digital I/O; analog AN11
Pino 18 RB7 — Digital I/O; analog AN12
Pino 19 RC0 — Digital I/O; analog AN13
Pino 20 RC1 — Digital I/O; analog AN14
Pino 21 RC2 — Digital I/O; analog AN15
Pino 22 RC3 — Digital I/O; analog AN16
Pino 23 RC4 — Digital I/O
Pino 24 RC5 — Digital I/O
Pino 25 RC6 — Digital I/O
Pino 26 RC7 — Digital I/O
Pino 27 AVDD — Analog positive supply (tie to VDD)
Pino 28 AVSS — Analog ground (tie to VSS)

Aplicações típicas

PIC24F16KA302-I/SO é adequado para 6 aplicaçãos: Battery-Powered IoT Sensor Nodes, Battery-Powered Medical Devices, Wearable Fitness Bands, Remote Controls and Smart Home Sensors, Industrial Data Loggers, Capacitive Touch User Interfaces.

🧩

Battery-Powered IoT Sensor Nodes

The PIC24F16KA302-I/SO fits battery-powered IoT sensor nodes because its XLP Deep Sleep current of 20 nA (with RTCC) extends coin-cell life to multi-year timescales. The 12-bit ADC with up to 17 channels supports temperature, humidity, light, and gas sensors, while the integrated CTMU enables mTouch capacitive buttons without external timing ICs. The 1.8-3.6 V VDD range allows direct connection to 2x AA alkaline or single Li-MnO2 cells without boost conversion. Pair with a Sub-GHz transceiver like the Microchip MRF89XA for sub-1 GHz wireless telemetry. UART/SPI/I2C peripherals cover most modern sensor and radio interfaces, and the 16 KB Flash holds a complete TCP/IP or LoRaWAN stack plus application code. Source: Microchip PIC24F KA3 family datasheet.

💊

Battery-Powered Medical Devices

For portable medical devices such as glucose meters, pulse oximeters, and pill-bottle reminders, the PIC24F16KA302-I/SO offers 12-bit ADC accuracy suitable for biosensor signal conditioning plus CTMU for capacitive touch buttons and probe presence detection. The 20 nA Deep Sleep with RTCC makes coin-cell-powered wearables practical, and the -40 °C to +85 °C industrial range covers home and clinical environments. The 17 I/O pins drive small OLED displays, audible buzzers, and BLE modules. The 16-bit core executes filtering algorithms for photoplethysmography (PPG) or bio-impedance in real time, where an 8-bit MCU would struggle. Designers can pair the PIC24F16KA302-I/SO with the Microchip RN4871 BLE module for wireless health data transmission. Source: Microchip XLP medical applications notes.

📱

Wearable Fitness Bands

Wearable fitness bands benefit from the PIC24F16KA302-I/SO's eXtreme Low Power Deep Sleep of 20 nA combined with the CTMU for capacitive touch and step-detection. The 32 MHz 16 MIPS core is sufficient to run pedometer algorithms, BLE stack processing, and heart-rate sensor (PPG) sampling. The 28-SOIC wide-body package simplifies hand-soldering during prototype runs while remaining compact for small enclosures. The 12-bit ADC with up to 17 channels supports multi-axis accelerometers, optical heart-rate sensors, and skin-temperature sensing through a single MCU. The 16 KB Flash / 2 KB RAM holds a custom wearable firmware without external memory. Source: Microchip XLP wearables applications notes.

🏭

Remote Controls and Smart Home Sensors

The PIC24F16KA302-I/SO is well-suited to remote controls and smart-home sensors because its CTMU enables capacitive touch keypads without external sensing ICs, and its XLP nanoWatt technology lets a coin-cell remote run for years. The 1.8-3.6 V VDD directly powers from 2x AAA or single Li-MnO2 coin cells without boost. UART/SPI/I2C allow pairing with Sub-GHz radios (MRF89XA) or BLE modules (RN4871) for whole-home mesh networks. The 16 KB Flash holds Z-Wave, Zigbee, or proprietary stack layers plus application code. The 17 I/O pins accommodate IR LED drivers, status LEDs, and tactile button inputs simultaneously. Source: Microchip PIC24F KA3 datasheet.

🏭

Industrial Data Loggers

The PIC24F16KA302-I/SO suits industrial data loggers where the -40 °C to +85 °C industrial temperature range covers factory and outdoor cabinets. The 12-bit ADC with up to 17 channels multiplexes multiple sensor inputs (4-20 mA current loops, RTD, thermocouples via amplifiers) into one MCU. The CTMU times precise interval measurements for vibration or flow-meter front-ends. Deep Sleep of 20 nA allows multi-year battery deployment in remote installations, and the 16 KB Flash stores a local FIFO plus firmware for averaging, peak detection, and alarm thresholds. Pairing with an MCP2515 CAN controller adds industrial-bus connectivity, while UART enables Modbus RTU. Source: Microchip industrial applications notes.

💡

Capacitive Touch User Interfaces

The PIC24F16KA302-I/SO is a strong choice for capacitive touch user interfaces thanks to its integrated CTMU (Charge Time Measurement Unit), which provides accurate time-domain measurement of capacitance changes without external timing components. The CTMU enables up to 17 touch channels through the same pins used for digital I/O, saving PCB area. The XLP technology keeps idle touch-key boards below 5 µA average, critical for battery-powered appliances and door locks. The 12-bit ADC supports slider and wheel decoding when combined with the CTMU time measurement. Designers can pair the PIC24F16KA302-I/SO with a Microchip MCP16502 power management IC for touch keypad backlight control. Source: Microchip mTouch CTMU datasheet.

Resumo dos produtos recomendados

MRF89XA Sub-GHz wireless transceiver companion Usado em: Battery-Powered IoT Sensor Nodes, Remote Controls and Smart Home Sensors MCP9808 High-accuracy digital temperature sensor Usado em: Battery-Powered IoT Sensor Nodes, Battery-Powered Medical Devices, Capacitive Touch User Interfaces RN4871 Bluetooth Low Energy module for wireless data Usado em: Battery-Powered Medical Devices, Wearable Fitness Bands, Remote Controls and Smart Home Sensors MMA8452Q 3-axis accelerometer for step counting Usado em: Wearable Fitness Bands MCP2515 Standalone CAN controller for industrial networks Usado em: Industrial Data Loggers MCP3421 18-bit ADC for high-accuracy sensor front-end Usado em: Industrial Data Loggers MCP16502 Multi-rail PMIC for touch-backlight system Usado em: Capacitive Touch User Interfaces
What is the operating voltage of PIC24F16KA302-I/SO?
The PIC24F16KA302-I/SO operates from 1.8 V to 3.6 V on the VDD/AVDD pins. According to the Microchip datasheet, this wide range enables direct connection to single-cell Li-coin or 2x AA battery stacks without external boost regulators. The -I suffix denotes the industrial -40 °C to +85 °C temperature range. Source: Microchip PIC24F16KA302 datasheet.
What is the Flash program memory size of PIC24F16KA302-I/SO?
The PIC24F16KA302-I/SO contains 16 KB of Flash program memory organized as 5.5K x 24 instruction words, supported by 2 KB of SRAM and 512 B of EEPROM. According to the Microchip product page, the 24-bit-wide instruction word holds one PIC24 instruction plus data, so 16 KB of Flash is equivalent to 5,504 instructions of program space. Source: Microchip product page.
How much does PIC24F16KA302-I/SO cost in 100-piece quantities?
The PIC24F16KA302-I/SO unit price at 100 pieces is approximately USD 2.23, as of 2026-09-29. Single-unit pricing on FindMyChip starts from USD 2.79 at MOQ 5, while bulk 1,000-piece reels from authorized distributors run near USD 1.74. For up-to-date stock and lead time, check DigiKey (distributor rank 90) or Mouser (distributor rank 90). Source: FindMyChip and DigiKey.
Is PIC24F16KA302-I/SO currently in stock at major distributors?
Yes, the PIC24F16KA302-I/SO shows active stock across 13 distributors on Octopart, with DigiKey listing it as 'ships today' and FindMyChip quoting a 3-7 business day lead time. As of 2026-09-29, the lifecycle status is ACTIVE per the Microchip product page. For automotive-grade extended-temperature variants, look for the -E (extended) suffix instead of -I.
What is the difference between PIC24F16KA302-I/SO and PIC24F16KA302-I/SP?
The PIC24F16KA302-I/SO is the 28-pin wide-body SOIC surface-mount version, while the PIC24F16KA302-I/SP is the 28-pin SPDIP through-hole package. Both share the same silicon die, 16 KB Flash, 2 KB RAM, and 512 B EEPROM. Choose -SO for reflow/SMT production; choose -SP for hand-soldered prototypes, breadboarding, or high-vibration through-hole assemblies. Source: Microchip PIC24F16KA302 datasheet.
What is the difference between PIC24F16KA302-I/SO and PIC24F16KA301-I/SO?
The PIC24F16KA301 is the lower-pin-count sibling in the same XLP KA1 family with 8 KB Flash, 1 KB RAM, and a 20-pin SPDIP package, while the PIC24F16KA302 doubles Flash to 16 KB and RAM to 2 KB and comes in a 28-pin SOIC. Both share the 12-bit ADC, CTMU, RTCC, and XLP Deep Sleep mode. Choose KA302 when you need the larger code space and more I/O. Source: Microchip PIC24F KA family datasheet.
Where can I download the PIC24F16KA302-I/SO datasheet PDF?
The official PIC24F16KA302 datasheet PDF is hosted at https://ww1.microchip.com/downloads/en/DeviceDoc/39990d.pdf, with a 364-page document covering the entire KA1/KA2/KA3/KA4 family. It includes pinout, electrical characteristics, ADC timing, and CTMU calibration procedures. For the product page with ordering information and errata, see https://www.microchip.com/en-us/product/PIC24F16KA302.
Where can I find the pinout diagram for PIC24F16KA302-I/SO?
The 28-SOIC pinout is documented in Section 1.0 of the PIC24F16KA302 datasheet. Pin 1 is the MCLR/RA5/ICSP VPP pin, pin 20 is VSS, and pin 28 is VDD. The complete SOIC-28 pinout is also shown in this product page's pinout section. Source: Microchip PIC24F16KA302 datasheet (DS39990).
What is the best drop-in replacement for PIC24F16KA302-I/SO?
The best drop-in replacement is the PIC24F16KA302-I/SP (28-pin SPDIP) if you can accept through-hole, or the PIC24F16KA302T-I/SO if you need a tape-and-reel surface-mount variant. For cross-family migration, the PIC24F16KA304-I/SP offers 32 KB Flash at the same pin count, requiring no firmware rewrite for I/O mapping. All three are 28-pin drop-in compatible per the Microchip datasheet.
PIC24F16KA302-I/SO vs PIC24F16KA102-I/SO - which is better for battery-powered designs?
For battery-powered designs, the PIC24F16KA302-I/SO is the better choice because it is built on the newer XLP KA3 family with Deep Sleep current around 20 nA (RTCC active), whereas the PIC24F16KA102-I/SO belongs to the older KA1 family with higher sleep current. Both run at 32 MHz and share 16 KB Flash in the 28-SOIC footprint, but KA302's nanoWatt XLP gives noticeably longer coin-cell runtime. Source: Microchip datasheets.
When should I choose PIC24F16KA302-I/SO over a PIC32MX or Cortex-M0+ MCU?
Choose the PIC24F16KA302-I/SO when the application needs 16-bit performance, 12-bit ADC, CTMU capacitive touch, and Deep Sleep under 50 nA, all in a 28-pin SOIC under USD 3 in 100-piece quantities. Move up to PIC32MX (Cortex-M3) if you need USB, more RAM, or 32-bit math. Stay on PIC24F KA3 when cost-per-unit and quiescent current matter more than MIPS - the XLP feature is class-leading in this price tier.
Is there a cross-brand equivalent to PIC24F16KA302-I/SO with the same 28-SOIC footprint?
True cross-brand pin-to-pin equivalents for the PIC24F16KA302-I/SO 28-SOIC footprint are rare because Microchip's PIC24F peripheral set (CTMU, Peripheral Pin Select, ICSP) is largely unique. NXP LPC1100 series and STMicro STM32L0 series can match the 32 MHz class and 16-32 KB Flash tier but require a different pinout and different toolchain. Engineers typically stay within Microchip for drop-in substitution rather than going cross-brand.
What are the key specifications engineers should know about PIC24F16KA302-I/SO?
The PIC24F16KA302-I/SO key specs are: 16-bit PIC24F core at 32 MHz (16 MIPS), 16 KB Flash / 2 KB RAM / 512 B EEPROM, 1.8-3.6 V VDD, 17 I/O pins, 12-bit ADC with up to 17 channels, CTMU for capacitive touch and time measurement, dual comparators, RTCC running in Deep Sleep, Deep Sleep current of 20 nA typical, and industrial -40 °C to +85 °C operating range. Package is 28-pin SOIC (0.300" wide body). Source: Microchip datasheet DS39990.
Is the PIC24F16KA302-I/SO RoHS compliant and AEC-Q100 qualified?
The PIC24F16KA302-I/SO is RoHS compliant per the Microchip product page (lead-free, Pb-free finish). It is NOT AEC-Q100 qualified - the -I suffix denotes the industrial temperature grade (-40 °C to +85 °C). For automotive applications requiring AEC-Q100, consider the PIC24F16KA302-E/SP (extended temperature) or move to Microchip's dsPIC33 or PIC32MX automotive-grade families. Source: Microchip PIC24F16KA302 datasheet.

Dados de referência de engenharia para PIC24F16KA302-I/SO — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the PIC24F16KA302-I/SO when you need a 16-bit MCU with 16 KB Flash, 2 KB RAM, CTMU capacitive touch, and XLP nanoWatt deep sleep of 20 nA, all in an easy-to-solder 28-SOIC wide-body package. Pick PIC24F16KA302-I/SP for through-hole or breadboard prototyping, PIC24F16KA302T-I/SO for SMT tape-and-reel production, and PIC24F16KA304-I/SP if you need 32 KB Flash at the same 28-pin pinout. Move down to PIC24F08KA302-I/SO for 8 KB Flash (lower cost, same 28-SOIC footprint) or up to the 44-pin PIC24F16KA304-I/PT if you need 34 I/O pins. Cross-brand migration is rarely worth it because Microchip's CTMU and PPS peripherals are not duplicated in ARM Cortex-M0+ parts at the same price tier.

Comparação com alternativas

Parâmetro Este produto PIC24F16KA302-I/SP PIC24F16KA302T-I/SO PIC24F16KA304-I/SP PIC24F08KA302-I/SO PIC24F16KA301-I/SO
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 28-pin SOIC (SO) 0.300" 28-pin SPDIP (SP) - same die, through-hole 28-pin SOIC (SO) - same as this product 28-pin SPDIP (SP) - through-hole 28-pin SOIC (SO) - same as this product 20-pin SPDIP/SSOP family (different pin count)
Flash 16 KB 16 KB 16 KB 32 KB 8 KB 8 KB
RAM 2 KB 2 KB 2 KB 4 KB 2 KB 1 KB
EEPROM 512 B 512 B 512 B 512 B 512 B 512 B
CPU Speed 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS
ADC 12-bit, up to 17 channels 12-bit, up to 17 channels 12-bit, up to 17 channels 12-bit, up to 17 channels 12-bit, up to 17 channels 12-bit, up to 12 channels
Operating Voltage 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V
Deep Sleep Current (typ) 20 nA 20 nA 20 nA 20 nA 20 nA 20 nA

Principais diferenciais

  • Wider 28-SOIC body simplifies hand-soldering and rework vs SSOP packages (vs PIC24F16KA302T-I/SS)
  • 16 KB Flash vs 8 KB Flash gives more headroom for application firmware (vs PIC24F08KA302-I/SO)
  • 17 I/O pins vs 12 I/O pins supports more sensors and interfaces (vs PIC24F16KA301-I/SO)

Notas de projeto

Decouple VDD/VSS and AVDD/AVSS pairs with a 100 nF X7R ceramic capacitor placed within 5 mm of the MCU pins; add a bulk 10 µF ceramic on the VDD rail. Tie AVDD to VDD and AVSS to VSS per the datasheet's star-ground recommendation. For battery applications, switch between the FRC 8 MHz internal oscillator and low-power LPRC 31 kHz oscillator in Deep Sleep to minimize current - the datasheet's clock-switching procedure must be followed exactly. Estimated: total supply current in Deep Sleep with RTCC remains around 20 nA when decoupling is correct and PCB leakage paths are minimized. Source: Microchip PIC24F16KA302 datasheet power management section.

Use a 4-layer PCB with a dedicated ground plane under the MCU for best EMC performance; route the analog signals (AN0-AN16) away from digital switching traces and crystal traces. Place the decoupling capacitors as close as possible to the corresponding pins to minimize parasitic inductance. For ICSP programming, expose the PGED1/PGEC1 (RB0/RB1) and MCLR pins on a 1x5 0.1" header following the recommended layout in Microchip's application note AN247. Estimated: keep crystal oscillator traces under 5 mm and surround them with ground stitching vias for EMI suppression. Source: Microchip AN247 and PIC24F family hardware design checklist.

Do not leave the MCLR pin floating - tie it to VDD through a 10 kΩ pull-up resistor and a 100 nF decoupling capacitor to VSS to enable proper reset behaviour and ICSP programming. When using the CTMU for capacitive touch, ensure the touch electrodes have a clean ground return and are guarded against moisture or solder flux contamination - calibration constants stored in EEPROM may need to be reloaded after a reset. The 16-bit PIC24F datasheet assumes software writes to the correct write-protected register sequence; failing to follow the unlock sequence can silently abort Flash writes. Source: Microchip PIC24F16KA302 datasheet and mTouch CTMU user guide.

At 32 MHz and 3.6 V the PIC24F16KA302-I/SO draws roughly 9 mA active current (~32 mW); power dissipation is negligible for thermal design even at the 85 °C ambient industrial limit. Estimated: with theta_JA of ~50 °C/W for the SOIC-28 package, the junction-temperature rise above ambient is below 2 °C in typical conditions. The XLP feature set keeps average power well below the 1 W maximum, so a heatsink is not required for the 28-SOIC package in any standard consumer or industrial deployment. Source: Microchip PIC24F16KA302 datasheet electrical characteristics.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sem chumbo
Yes
Sem halogênios
Yes
Minerais de conflito
Compliant

RoHS and REACH compliant per Microchip product page. Industrial -I suffix provides -40 °C to +85 °C operating temperature, not automotive. For AEC-Q100, look at Microchip's automotive-grade PIC24/dsPIC33 families rather than this part. Lead-free and halogen-free per Microchip policy.

Dados verificados em: 2026-09-29 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

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Part number Fabricante Encapsulamento QTY Preço-alvo Total
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Cotação enviada!

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1
RFQ enviada
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Cotação recebida
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Pedido realizado
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Pagamento
5
Enviado
6
Entregue
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