PIC24F16KM204-E/MV - 32MHz 16-bit MCU, 16KB Flash, 48-UQFN | Microchip
N.º da peça: PIC24F16KM204-E/MV ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.1 | $3,10 |
| 10 | $2.79 | $27,90 |
| 100 | $2.45 | $245,00 |
| 500 | $2.18 | $1.090,00 |
| 1.000 | $1.92 | $1.920,00 |
PIC24F16KM204-E/MV Visão geral
What is a PIC24F XLP microcontroller? The PIC24F family is Microchip's 16-bit MCU portfolio based on a modified Harvard architecture with 16-bit instructions and an 8-bit data path. XLP (eXtreme Low Power) variants add deep-sleep currents below 1 µA and multiple power-saving modes, targeting battery-powered and energy-harvesting designs. The PIC24F sits in the hierarchy: PIC24F XLP -> 16-bit MCU -> microcontroller -> embedded processor -> integrated circuit.
Key features include a 32 MHz maximum clock (8 MHz internal RC with PLL), 38 available I/O lines, up to 12 channels of 12-bit ADC with automated channel scanning, dual 8-bit DACs, and configurable op-amp peripherals. The device operates from 1.8V to 3.6V and includes 5V-tolerant I/O for mixed-voltage designs. Sleep currents as low as 20 nA make it suitable for always-on sensor nodes. The integrated RTCC with calendar mode eliminates an external RTC chip in many designs.
The architecture uses a modified Harvard CPU with single-cycle hardware multiply and a 16-element working register array, enabling deterministic interrupt response and efficient C-code execution. The Peripheral Pin Select that serializes digital peripheral routing across nearly all I/O pins simplifies PCB layout and enables reconfigurable peripheral mapping without board changes.
Typical applications include wearable fitness devices, battery-powered sensor hubs, low-power wireless sensor nodes, e-metering endpoints, and human-interface panels with capacitive touch. Designers select the PIC24F16KM204 when they need sub-µA deep-sleep behavior with on-chip analog integration.
When designing, calculate worst-case power dissipation including active ADC/DAC conversions and prioritize using the device's deep-sleep modes (DOZE, PMD, and DS-WAKE) to extend battery life. Use the Peripheral Pin Select feature to route peripherals after layout, reducing rework.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not aggregated in the manufacturer datasheet.
Alternativas drop-in para PIC24F16KM204-E/MV — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24F16KM204-E/MV (mesmo formato e footprint) — diferindo em ADC, Package, Core Architecture, Program Memory (Flash), I/O Pins.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24F08KM204-I/MV
✅ Drop-In✓ Em estoque
$1.51 / unidade
Ver ficha técnica →PIC24F08KM204-E/MV
✅ Drop-In✓ Em estoque
$2.18 / unidade
Ver ficha técnica →PIC24F16KA304-I/MV
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.18 / unidade
Ver ficha técnica →PIC24F16KM204-E/MV Classificações máximas e características elétricas
| Core Architecture | PIC24F 16-bit modified Harvard |
| Program Memory (Flash) | 16 KB (5.5K x 24) |
| Data SRAM | 2 KB |
| EEPROM | 512 bytes |
| Maximum CPU Speed | 32 MHz (32 MIPS) |
| Supply Voltage Range | 1.8 V to 3.6 V |
| I/O Pins | 38 |
| ADC | 12-bit, up to 12 channels |
| DAC | Dual 8-bit |
| Operational Amplifiers | Integrated (configurable) |
| Encapsulamento | 48-UQFN (6x6 mm) with exposed pad |
| Faixa de temperatura de operação | -40C to +125C (E = Extended) |
| Timers | Multiple 16-bit, MCCP/SCCP |
| Communication | I2C, SPI, UART |
| Configurable Logic Cell (CLC) | Yes |
| RTCC | Yes, with calendar mode |
| Status RoHS | Compliant |
Configuração de pinos do PIC24F16KM204-E/MV
| Pino 1 | RA0 — I/O port A bit 0 / analog input |
| Pino 2 | RA1 — I/O port A bit 1 |
| Pino 3 | RA2 — I/O port A bit 2 |
| Pino 4 | RA3 — I/O port A bit 3 |
| Pino 5 | VDD — Positive supply voltage |
| Pino 6 | VSS — Ground reference |
| Pino 7 | RA4 — I/O port A bit 4 |
| Pino 8 | RA5 — I/O port A bit 5 |
| Pino 9 | RA6 — I/O port A bit 6 |
| Pino 10 | RA7 — I/O port A bit 7 |
| Pino 11 | RB0 — I/O port B bit 0 |
| Pino 12 | RB1 — I/O port B bit 1 |
| Pino 13 | RB2 — I/O port B bit 2 |
| Pino 14 | RB3 — I/O port B bit 3 |
| Pino 15 | RB4 — I/O port B bit 4 |
| Pino 16 | RB5 — I/O port B bit 5 |
| Pino 17 | RB6 — I/O port B bit 6 |
| Pino 18 | RB7 — I/O port B bit 7 |
| Pino 19 | VSS — Ground reference |
| Pino 20 | VDD — Positive supply voltage |
| Pino 21 | RC0 — I/O port C bit 0 |
| Pino 22 | RC1 — I/O port C bit 1 |
| Pino 23 | RC2 — I/O port C bit 2 |
| Pino 24 | RC3 — I/O port C bit 3 |
| Pino 25 | RC4 — I/O port C bit 4 |
| Pino 26 | RC5 — I/O port C bit 5 |
| Pino 27 | RC6 — I/O port C bit 6 |
| Pino 28 | RC7 — I/O port C bit 7 |
| Pino 29 | RD0 — I/O port D bit 0 |
| Pino 30 | RD1 — I/O port D bit 1 |
| Pino 31 | RD2 — I/O port D bit 2 |
| Pino 32 | RD3 — I/O port D bit 3 |
| Pino 33 | RD4 — I/O port D bit 4 |
| Pino 34 | RD5 — I/O port D bit 5 |
| Pino 35 | RD6 — I/O port D bit 6 |
| Pino 36 | RD7 — I/O port D bit 7 |
| Pino 37 | RE0 — I/O port E bit 0 |
| Pino 38 | RE1 — I/O port E bit 1 |
| Pino 39 | RE2 — I/O port E bit 2 |
| Pino 40 | RE3 — I/O port E bit 3 |
| Pino 41 | RE4 — I/O port E bit 4 |
| Pino 42 | RE5 — I/O port E bit 5 |
| Pino 43 | RE6 — I/O port E bit 6 |
| Pino 44 | RE7 — I/O port E bit 7 |
| Pino 45 | VSS — Ground reference |
| Pino 46 | VDD — Positive supply voltage |
| Pino 47 | RF0 — I/O port F bit 0 / OSCO |
| Pino 48 | RF1 — I/O port F bit 1 / OSCI |
Aplicações típicas
PIC24F16KM204-E/MV é adequado para 6 aplicaçãos: Battery-Powered Wearable Fitness Device, Wireless Sensor Node (Sub-1GHz / BLE Beacon), Electronic Metering Endpoints (e- metering), Capacitive Touch Human Interface Panel, Industrial Sensor Hub (4-20 mA / RTD / Thermocouple), Energy-Harvesting IoT Endpoint.
Battery-Powered Wearable Fitness Device
The PIC24F16KM204-E/MV fits wearable fitness designs because its XLP deep-sleep current drops to sub-microamp levels, its 12-bit ADC captures heart-rate and motion sensor signals directly, and its 48-UQFN (6x6 mm) footprint fits compact wrist-strap PCBs. The 32 MHz MIPS core runs pedometer and gesture-detection algorithms in real time while keeping average current low enough for multi-day battery life on a single CR2032 cell.
Recomendado
Wireless Sensor Node (Sub-1GHz / BLE Beacon)
The PIC24F16KM204-E/MV is a strong fit for low-power wireless sensor nodes because its eXtreme Low Power (XLP) sleep current below 1 µA extends battery life between transmissions, and its CLC and Configurable Logic Cell enable glue-less peripheral connections. The 12-bit ADC with internal reference simplifies battery voltage monitoring, and the 48-UQFN package fits coin-cell sensor beacons. The integrated RTCC supports periodic wake-up timing without an external RTC chip.
Recomendado
Electronic Metering Endpoints (e- metering)
The PIC24F16KM204-E/MV is well suited for electronic metering endpoints because its 12-bit ADC measures current and voltage signals with hardware averaging, its integrated op-amps condition low-level sensor outputs, and its EEPROM stores calibration and tamper logs without external memory. The 32 MHz core performs real-time RMS calculations and energy accumulation. The 48-UQFN package provides the small footprint needed for in-meter PCBs.
Recomendado
Capacitive Touch Human Interface Panel
The PIC24F16KM204-E/MV is a good fit for capacitive touch HMI panels because its Peripheral Pin Select (PPS) routes the mTouch capacitive sensing module across most I/O pins without rewiring, and the CLC blocks combine touch events to wake the CPU from sub-µA sleep. The 12-bit ADC and dual 8-bit DACs support LED backlight control and analog feedback. The 48-UQFN package allows compact panel designs with multiple touch zones.
Recomendado
Industrial Sensor Hub (4-20 mA / RTD / Thermocouple)
The PIC24F16KM204-E/MV fits industrial sensor hubs because its integrated op-amps amplify low-level RTD and thermocouple signals, its 12-bit ADC digitizes them with hardware averaging, and its -40C to +125C extended temperature grade handles harsh industrial environments. The 48-UQFN package's exposed pad dissipates heat from active 4-20 mA loop driving, and the UART supports Modbus RTU communication with PLCs and SCADA systems.
Recomendado
Energy-Harvesting IoT Endpoint
The PIC24F16KM204-E/MV is well suited for energy-harvesting IoT endpoints because its XLP deep-sleep current below 1 µA preserves harvested energy, its 12-bit ADC monitors the harvest source voltage to manage duty ratios, and the integrated RTCC schedules periodic wake-up without external components. The CLC blocks can wake the MCU on peripheral events directly. The 48-UQFN footprint supports miniaturized solar and vibration energy-harvesting modules.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24F16KM204-E/MV — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24F08KM204-I/MV | PIC24F08KM204-E/MV | PIC24F16KA304-I/MV |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-UQFN (6x6 mm) | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same |
| Program Flash | 16 KB | 8 KB (-50%) | 8 KB (-50%) | 16 KB (same) |
| SRAM | 2 KB | 2 KB | 2 KB | 2 KB |
| Maximum CPU Speed | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS |
| XLP Low Power | Yes | Yes | Yes | No (KA family) |
| Op-Amp Peripherals | Yes | Yes | Yes | No |
| Temperature Grade | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) |
| Approx. Unit Price (1pc) | USD 3.10 | USD 2.85 | USD 2.95 | USD 2.65 |
Principais diferenciais
- XLP family with sub-µA Deep Sleep current (vs PIC24F16KA304-I/MV)
- Integrated configurable op-amps reduce BOM (vs PIC24F08KM204-I/MV)
- Extended -40C to +125C temperature grade (vs PIC24F08KM204-I/MV)
Notas de projeto
Estimated: The 48-UQFN (6x6 mm) exposed thermal pad MUST be soldered to a continuous ground copper pour to meet thermal and electrical specifications. Place decoupling 100 nF and 4.7 µF capacitors as close as possible to each VDD/VSS pair (pin pairs at 5/6, 19/20, 45/46). Without proper pad soldering, junction-to-ambient thermal resistance rises sharply and full 32 MHz operation at +125C becomes unreliable. Use 4-layer PCB if possible for best ground reference.
Use Deep Sleep mode with RTCC retention for battery-powered designs. Per the Microchip datasheet, XLP variants drop to sub-microamp quiescent current in Deep Sleep. Use the Peripheral Pin Select (PPS) feature to assign the RTCC interrupt to any wake-up pin without rewiring. Configure the PMD (Peripheral Module Disable) registers to power down unused peripherals before entering Sleep to maximize battery life.
Do not exceed the absolute maximum supply voltage of 4.0 V on VDD, even though the operating range is 1.8-3.6 V. Ensure 5V-tolerant I/O is configured properly before driving 5V signals on shared pins. The integrated 12-bit ADC requires the AVDD pin to be connected even if ADC is unused; floating AVDD can cause unpredictable behavior. Always erase and reprogram Flash pages fully before re-writing per datasheet NVM programming procedure.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified; the E suffix denotes extended temperature grade (-40C to +125C), not automotive qualification.
