PIC24F32KA304-I/MV - 16-Bit 32MHz XLP Microcontroller | Microchip
N.º da peça: PIC24F32KA304-I/MV ✓ AtivoPIC24F32KA304-I/MV Visão geral
A microcontroller is the central processing element of an embedded control system, combining a processor core, program memory, data memory, timers, communication peripherals, and analog interfaces on one integrated circuit. The PIC24F device family provides a migration path from 8-bit embedded platforms to a 16-bit architecture without requiring an entirely different software or hardware design methodology. PIC24F devices are also compatible with selected dsPIC33 pin arrangements, according to the manufacturer data sheet.
The PIC24F32KA304-I/MV provides 32 KB of Flash memory organized as 11K x 24 words, along with 2 KB of data RAM and 512 bytes of EEPROM for nonvolatile parameter storage. Its 17 I/O pins provide access to digital inputs and outputs alongside the integrated 12-bit ADC and capacitive measurement unit. The 32 MHz maximum clock supports real-time control, sampling, communications, and user-interface updates without relying on an external processor.
The XLP architecture is central to this part's positioning. The manufacturer identifies DSBOR, DSWDT, and RTCC as peripherals that can continue operating during Deep Sleep, supporting low-power measurement and control in battery-powered equipment. DSBOR retains brown-out monitoring, DSWDT provides watchdog supervision, and the real-time clock and calendar allows low-duty-cycle timing functions to continue when the core sleeps.
Typical uses include compact battery-powered environmental monitors, portable industrial data loggers, connected sensing nodes, low-power control panels, and embedded systems that periodically wake to acquire data. The 48-pin UQFN package also allows a small PCB footprint, although its exposed-pad construction requires careful thermal and assembly planning.
Designers should budget decoupling close to the supply pins, validate the exposed-pad solder and thermal arrangement, and use the manufacturer's XLP configuration guidance to control wake-up behavior. The verified part listing identifies the device as available for immediate shipment from DigiKey, while inventory and lifecycle conditions should always be reconfirmed at the point of procurement.
This product page combines verified distributor specifications, package and pricing data, application guidance, and design notes that help engineers evaluate the PIC24F32KA304-I/MV beyond a distributor listing alone.
Alternativas drop-in para PIC24F32KA304-I/MV — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24F32KA304-I/MV (mesmo formato e footprint) — diferindo em ADC, Core, I/O Pins, Low-Power Technology, Operating Temperature.
PIC24F32KA304-E/MV
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24F32KA304-I/MV Classificações máximas e características elétricas
| Product Type | 16-bit Flash Microcontroller |
| Product Series | PIC24F XLP |
| Frequência máxima de clock | 32 MHz |
| Instruction Throughput | 16 MIPS |
| Program Memory Type | Flash |
| Program Memory Size | 32 KB (11K x 24 words) |
| Data RAM | 2 KB |
| EEPROM | 512 bytes |
| ADC Resolution | 12 bits |
| I/O Port Count | 17 |
| Supply Voltage Range | 1.8 V to 3.6 V |
| Package Type | 48-pin UQFN (6 x 6 mm) |
| Tipo de montagem | Surface Mount |
| Low-Power Technology | XLP with Deep Sleep, DSBOR, DSWDT, and RTCC |
| Peripheral | CTMU capacitive measurement unit |
| Shipping Format | Tube |
| Lifecycle Stage | Active |
| Lead-Free Packaging | Yes |
Guia de Configuração de Pinos do PIC24F32KA304-I/MV 48-pin uqfn (6 x 6 mm)
Configuração de pinos para PIC24F32KA304-I/MV (pacote 48-pin uqfn (6 x 6 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PIC24F32KA304-I/MV.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PIC24F32KA304-I/MV é adequado para 6 aplicaçãos: Battery-Powered Environmental Sensing Nodes, Portable Industrial Data Loggers, Capacitive-Touch User Interfaces, Low-Power Connected Sensor Nodes, Battery-Powered Security and Access Controls, Compact Process-Control and Sensor Hubs.
Battery-Powered Environmental Sensing Nodes
The PIC24F32KA304-I/MV fits compact environmental monitors because its 1.8 V to 3.6 V operating range supports low-voltage battery systems and its 32 MHz core provides responsive control between sleep intervals. The 12-bit ADC can acquire analog sensor outputs, while the XLP Deep Sleep architecture allows the MCU to reduce activity when sampling is not required. DSBOR can monitor supply conditions and RTCC can maintain timekeeping during sleep, helping a design record measurement intervals without running the core continuously.
Recomendado
Portable Industrial Data Loggers
A portable data logger can use the PIC24F32KA304-I/MV to combine sampling and control in one compact 48-pin UQFN device. Its 32 KB of Flash stores firmware and calibration data, while 2 KB of RAM supports working buffers and 512 bytes of EEPROM preserves configuration without continuous Flash writes. At 16 MIPS, the MCU can service timers, digital sensors, and communications concurrently. Deep Sleep is valuable when the logger must preserve battery charge between scheduled recording sessions.
Recomendado
Capacitive-Touch User Interfaces
The integrated CTMU makes the PIC24F32KA304-I/MV appropriate for compact capacitive keypads or touch controls. The microcontroller can scan a small electrode matrix, evaluate capacitance-related measurements, debounce contacts, and update indicator outputs through its 17 available I/Os. Its 32 MHz performance allows measured response and interface updates without an external controller. The 6 x 6 mm UQFN package also allows the sensing electronics to fit into space-constrained panels while supporting low-power idle behavior.
Recomendado
Low-Power Connected Sensor Nodes
The PIC24F32KA304-I/MV can act as the low-power supervisory controller in a small connected sensing node. Its 17 I/Os can operate sensors, indicators, and a communications module while the integrated ADC handles analog measurements. The XLP design is especially useful when the node spends most of its operating life between brief wake-ups. For designs needing dedicated network connectivity, an Ethernet interface companion such as the ENC424J600 can be paired with the MCU on a larger control board.
Recomendado
Battery-Powered Security and Access Controls
The PIC24F32KA304-I/MV is well suited to low-power access-control modules that must monitor inputs while conserving standby energy. The 12-bit ADC can support analog sensing, the 17 I/Os can read switches or status signals, and the CTMU can implement non-contact sensing tests. RTCC operation during Deep Sleep supports time-based access windows, while DSBOR and DSWDT support supply monitoring and fault supervision. These functions can reduce the need for a separate always-on supervisory device.
Recomendado
Compact Process-Control and Sensor Hubs
The PIC24F32KA304-I/MV can serve as a compact control hub for low-voltage instrumentation that combines digital and analog inputs. Its 12-bit ADC handles sensor conditioning, 17 I/Os drive indicators or actuators, and 32 KB of Flash accommodates application firmware. The 32 MHz clock provides headroom for control loops and protocol handling, while the 48-pin UQFN footprint supports compact boards. XLP Deep Sleep modes let the controller idle between measurement intervals rather than run continuously.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24F32KA304-I/MV — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24F32KA304-E/MV |
|---|---|---|
| Package | 48-UQFN (6x6) | 48-UQFN (6x6) |
| Brand | Microchip Technology | Microchip Technology |
| Architecture | 16-bit PIC XLP | 16-bit PIC XLP family device |
| Maximum Clock Frequency | 32 MHz | 32 MHz |
| Instruction Throughput | 16 MIPS | 16 MIPS |
| Program Flash | 32 KB (11K x 24 words) | 32 KB family Flash configuration |
| Data RAM | 2 KB | 2 KB |
| EEPROM | 512 bytes | 512 bytes |
| Supply Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V family option |
| ADC and Analog Peripheral | 12-bit ADC with CTMU | 12-bit ADC with CTMU |
Principais diferenciais
- Combines 16-bit performance with XLP low-power peripherals (vs PIC24F32KA304-E/MV)
- Integrated CTMU expands measurement capability (vs PIC24F32KA304-I/PT)
- Compact 48-UQFN footprint for space-constrained boards (vs PIC24F32KA304-I/PT)
Notas de projeto
Configure the PIC24F32KA304-I/MV around its XLP low-power operating modes rather than treating Deep Sleep as an unused feature. DSBOR, DSWDT, and RTCC can continue selected functions during sleep, allowing the core to wake only for scheduled acquisition or control work. Validate wake-up behavior, peripheral clocks, and I/O states in the application because pins can behave differently while the core is asleep. The verified supply range is 1.8 V to 3.6 V.
The 48-pin UQFN package requires a land pattern that accommodates its exposed thermal pad and a PCB assembly process capable of producing a reliable solder connection beneath the package. Keep the exposed-pad land free of conflicting signal routing unless the manufacturer's footprint explicitly permits it. Use the data sheet's thermal and assembly guidance rather than estimating thermal performance from package size alone, because board construction and exposed-pad soldering materially affect junction temperature.
Place the device's decoupling capacitors immediately adjacent to the supply and ground pins, and route them using short, low-loop-inductance connections. The 6 x 6 mm UQFN footprint has fine-pitch leads, so inspect the land pattern against the package drawing and ensure assembly-line paste and solder profiles support reliable simultaneous wetting. A separate analog-ground strategy may be appropriate for CTMU and ADC-sensitive designs, following the pin and layout guidance in the manufacturer data sheet.
Informações de conformidade
The verified distributor data identifies the -I/MV package as lead-free plastic. The supplied sources do not provide explicit RoHS, REACH, halogen-free, conflict-minerals, or AEC-Q100 statements, so those fields remain unknown or not applicable. Confirm compliance documents with Microchip Technology or the selected authorized distributor.
