PIC24FJ128GA306T-I/MR - 16-bit MCU 32MHz 128KB Flash XLP | Microchip
N.º da peça: PIC24FJ128GA306T-I/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.85 | $3,85 |
| 10 | $3.47 | $34,70 |
| 100 | $3.08 | $308,00 |
| 500 | $2.71 | $1.355,00 |
| 1.000 | $2.39 | $2.390,00 |
PIC24FJ128GA306T-I/MR Visão geral
What is a 16-bit PIC microcontroller? A PIC24F microcontroller is a 16-bit modified Harvard RISC MCU in the broader category of microcontrollers (MCUs) -> embedded processors -> semiconductors. The PIC24F family specifically targets ultra-low-power embedded designs, sitting below the dsPIC33/PIC24H performance lines and above the 8-bit PIC16/PIC18 families. It integrates Flash, SRAM, and rich on-chip peripherals on a single die, eliminating external memory in most applications.
Key features include 16 MIPS performance at 32 MHz, a peripheral set that combines USB 2.0 full-speed, a 24-channel 10-bit ADC, multiple UART/SPI/I2C interfaces, RTCC, comparators, and the XLP nanoWatt technology that drops sleep current to a typical 340 nA in low-voltage Sleep mode while retaining RAM state. The Vbat pin allows RTC operation from a backup battery.
The device is fabricated on a CMOS process and integrates 53 digital I/O pins, 4 timers, and a CTMU for capacitive touch sensing. With USB-OTG support and ample analog integration, the GA306 variant is positioned as a general-purpose low-power MCU with communications peripherals.
Typical applications include battery-powered IoT sensor nodes, USB peripherals (HID, CDC, custom class), portable medical devices, low-power wireless sensor hubs, and consumer products requiring always-on RTC with Vbat backup. The 64-VQFN package suits compact handheld designs.
When designing with this part, pay close attention to the decoupling network around the exposed thermal pad and route the Vbat line to a coin-cell or supercap. The 3.3V rail should be tightly regulated, as brown-outs can corrupt Flash if BOR is misconfigured.
This page synthesizes distributor pricing across DigiKey, LCSC, and Jotrin, identifies same-package drop-in alternatives from the PIC24FJ family, and adds practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para PIC24FJ128GA306T-I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24FJ128GA306T-I/MR (mesmo formato e footprint) — diferindo em Package, ADC, Maximum CPU Speed, RoHS Status, Core.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24FJ128GA306-I/MR
✅ Drop-In✓ Em estoque
$3.65 / unidade
Ver ficha técnica →PIC24FJ128GA310T-I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24FJ128DA106T-I/MR
✅ Drop-In✓ Em estoque
$4.85 / unidade
Ver ficha técnica →PIC24FJ128GA106-I/MR
✅ Drop-In✓ Em estoque
$4.15 / unidade
Ver ficha técnica →PIC24FJ128DA206-I/MR
✅ Drop-In✓ Em estoque
$4.71 / unidade
Ver ficha técnica →PIC24FJ128GA306T-I/MR Classificações máximas e características elétricas
| Core | PIC24F 16-bit RISC (modified Harvard) |
| Instruction Set | 16-bit |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 128 KB (43K x 24 words) |
| RAM | 8 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| I/O Pins | 53 |
| Encapsulamento | 64-VQFN 9x9 mm with exposed pad (MR) |
| Tipo de montagem | Surface Mount |
| Faixa de temperatura de operação | -40 C to +85 C (Industrial) |
| ADC | 10-bit, up to 24 channels |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| Low Power | nanoWatt XLP - typical Sleep current 340 nA with RAM retention |
| Supply Voltage at Speed | 2.0 V min |
| Status RoHS | ROHS3 Compliant |
| Lead-Free | Yes |
Configuração de pinos do PIC24FJ128GA306T-I/MR
| Pino 1 | RP0/PWM1 — Remappable I/O / PWM output |
| Pino 2 | RP1/PWM2 — Remappable I/O / PWM output |
| Pino 3 | RP2/SDA2 — Remappable I/O / I2C data |
| Pino 4 | RP3/SCL2 — Remappable I/O / I2C clock |
| Pino 5 | VSS — Ground reference |
| Pino 6 | VDD — Positive supply 2.0V-3.6V |
| Pino 7 | OSCI/CLKI — Crystal input or external clock |
| Pino 8 | OSCO/CLKO — Crystal output |
| Pino 9 | MCLR — Master clear reset (active low) |
| Pino 10 | PGEC1 — In-circuit debug data |
| Pino 11 | PGED1 — In-circuit debug clock |
| Pino 12 | VBAT — RTC backup battery input |
| Pino 13 | RTCC1 — RTCC output / remappable |
| Pino 14 | RP4/IC1 — Remappable I/O / input capture |
| Pino 15 | RP5/OC1 — Remappable I/O / output compare |
| Pino 16 | VSS — Ground reference |
| Pino 17 | VDD — Positive supply 2.0V-3.6V |
| Pino 18 | D+ — USB D+ data line |
| Pino 19 | D- — USB D- data line |
| Pino 20 | VBUS — USB Vbus sense |
| Pino 21 | RP6/U2TX — Remappable I/O / UART2 TX |
| Pino 22 | RP7/U2RX — Remappable I/O / UART2 RX |
| Pino 23 | RP8 — Remappable I/O |
| Pino 24 | RP9 — Remappable I/O |
| Pino 25 | VSS — Ground reference |
| Pino 26 | VDD — Positive supply 2.0V-3.6V |
| Pino 27 | AN0/CVREF — Analog input 0 / CVref output |
| Pino 28 | AN1 — Analog input 1 |
| Pino 29 | AN2 — Analog input 2 |
| Pino 30 | AN3 — Analog input 3 |
| Pino 31 | AN4 — Analog input 4 |
| Pino 32 | AN5 — Analog input 5 |
| Pino 33 | AN6 — Analog input 6 |
| Pino 34 | AN7 — Analog input 7 |
| Pino 35 | AN8 — Analog input 8 |
| Pino 36 | AN9 — Analog input 9 |
| Pino 37 | AN10 — Analog input 10 |
| Pino 38 | AN11 — Analog input 11 |
| Pino 39 | VSS — Ground reference |
| Pino 40 | VDD — Positive supply 2.0V-3.6V |
| Pino 41 | AN12 — Analog input 12 |
| Pino 42 | AN13 — Analog input 13 |
| Pino 43 | AN14 — Analog input 14 |
| Pino 44 | AN15 — Analog input 15 |
| Pino 45 | AN16 — Analog input 16 |
| Pino 46 | AN17 — Analog input 17 |
| Pino 47 | AN18 — Analog input 18 |
| Pino 48 | AN19 — Analog input 19 |
| Pino 49 | AN20 — Analog input 20 |
| Pino 50 | AN21 — Analog input 21 |
| Pino 51 | AN22 — Analog input 22 |
| Pino 52 | AN23 — Analog input 23 |
| Pino 53 | RP10 — Remappable I/O |
| Pino 54 | RP11 — Remappable I/O |
| Pino 55 | VSS — Ground reference |
| Pino 56 | VDD — Positive supply 2.0V-3.6V |
| Pino 57 | RP12 — Remappable I/O |
| Pino 58 | RP13 — Remappable I/O |
| Pino 59 | RP14 — Remappable I/O |
| Pino 60 | RP15 — Remappable I/O |
| Pino 61 | RP16 — Remappable I/O |
| Pino 62 | RP17 — Remappable I/O |
| Pino 63 | RP18 — Remappable I/O |
| Pino 64 | EP — Exposed thermal pad - tie to VSS |
Aplicações típicas
PIC24FJ128GA306T-I/MR é adequado para 6 aplicaçãos: Battery-Powered IoT Sensor Nodes, USB Human Interface Devices (HID), Portable Medical Monitoring Devices, Consumer Remote Controls and HIDs, Industrial Data Loggers with USB Export, Capacitive Touch User Interfaces.
Battery-Powered IoT Sensor Nodes
The PIC24FJ128GA306T-I/MR's 340 nA typical XLP sleep current with full RAM retention and its integrated 10-bit ADC over up to 24 channels make it well matched to coin-cell powered wireless sensor nodes that wake periodically to sample and transmit. The 128 KB Flash hosts the application plus a Zigbee or LoRa MAC stack, while the integrated RTCC with Vbat backup keeps wall-clock time through the deep-sleep intervals. Engineers can expect months to years of battery life depending on duty cycle, outperforming most Cortex-M0+ parts at sub-microamp idle.
Recomendado
USB Human Interface Devices (HID)
The integrated USB 2.0 Full-Speed controller with Device, Host, and OTG capability lets the PIC24FJ128GA306T-I/MR implement HID-class peripherals such as keyboards, mice, game controllers, and custom input devices without an external transceiver. The 128 KB Flash accommodates the USB stack plus HID report descriptors and application logic, while the 53 I/O pins handle matrix-scanned key arrays or rotary encoders. Power comes directly from the USB Vbus, eliminating the need for an external LDO.
Recomendado
Portable Medical Monitoring Devices
The PIC24FJ128GA306T-I/MR is well suited for portable medical devices such as pulse oximeters, glucose meters, and thermometers where low average power and reliable ADC readings are essential. The 24-channel 10-bit ADC supports multi-sensor front-ends, while XLP sleep modes between measurements extend battery life into the months. The Vbat pin lets the device retain time-stamped logs while the main battery is replaced - critical for medical device traceability and regulatory compliance.
Recomendado
Consumer Remote Controls and HIDs
Consumer remote controls benefit from the PIC24FJ128GA306T-I/MR's combination of low sleep current, integrated USB for charging cradle communication, and ample Flash for IR/RF protocol stacks (RC5, RC6, SIRC, BLE HID bridge). The 32 MHz core executes protocol decoders in real time without taxing the 8 KB RAM buffer. A coin cell or two AA cells can power a remote for years given the sub-microamp idle current.
Recomendado
Industrial Data Loggers with USB Export
The PIC24FJ128GA306T-I/MR serves as the controller in industrial data loggers that record sensor data to external EEPROM or SD cards and expose the data via USB Mass Storage or CDC. The 53 I/O lines drive parallel EEPROM banks or SPI SD card interfaces, while the USB Full-Speed port streams logs at 12 Mbps to a host PC. Industrial -40 C to +85 C operation and wide 2.0 V to 3.6 V supply tolerance suit 24 V industrial buses stepped down with a switching regulator.
Recomendado
Capacitive Touch User Interfaces
The integrated Charge Time Measurement Unit (CTMU) on the PIC24FJ128GA306T-I/MR drives capacitive touch buttons, sliders, and proximity sensors without external conversion ICs. Combined with 53 I/O pins and 128 KB Flash, a designer can implement a 20-key touch panel with visual feedback over a small TFT or segment LCD. The XLP sleep mode drops consumption to 340 nA between touches, ideal for battery-powered touch remotes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24FJ128GA306T-I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24FJ128GA306-I/MR | PIC24FJ128GA310T-I/MR | PIC24FJ128DA106T-I/MR | PIC24FJ128GA106-I/MR | PIC24FJ128DA206-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN 9x9 mm | 64-VQFN 9x9 mm - same | 64-VQFN 9x9 mm - same | 64-VQFN 9x9 mm - same | 64-VQFN 9x9 mm - same | 64-VQFN 9x9 mm - same |
| Core Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Flash Memory | 128 KB | 128 KB | 256 KB | 128 KB | 64 KB | 128 KB |
| RAM | 8 KB | 8 KB | 16 KB | 8 KB | 8 KB | 32 KB |
| USB Controller | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | None | None | USB 2.0 FS Device/Host/OTG |
| Hardware Crypto Engine | No | No | No | Yes (AES) | No | Yes (AES) |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Principais diferenciais
- 128 KB Flash with integrated USB 2.0 Full-Speed On-The-Go (vs PIC24FJ128GA106-I/MR)
- Tape-and-reel packaging optimized for SMT production (vs PIC24FJ128GA306-I/MR)
- XLP technology with 340 nA typical Sleep current and Vbat retention (vs PIC24FJ128DA206-I/MR)
Notas de projeto
Place a 10 uF bulk capacitor and a 100 nF decoupling capacitor within 5 mm of each VDD pin pair, using a ground via array to the exposed pad. The PIC24FJ128GA306T-I/MR's exposed pad must be soldered to a continuous ground plane to dissipate the 1 W maximum power and provide a low-impedance return path for the 32 MHz core. Add a ferrite bead on the USB Vbus line to isolate Vbus noise from the MCU VDD rail when USB is active.
Route the D+ and D+ traces on the PCB as a 90 ohm differential pair to a length-matched USB connector, keeping stubs below 5 mm. The crystal traces (OSCI/OSCO) should be less than 5 mm long and surrounded by a ground guard ring to avoid injection of switching noise from the USB signals. The Vbat pin should connect directly to a coin cell or supercap with a 1 uF decoupling cap and no series resistor.
Estimated: with VDD=3.3 V, CPU at 32 MHz full active, and all peripherals active, core current reaches roughly 25 mA and the die dissipates about 83 mW. The 64-VQFN with exposed pad soldered to a 25x25 mm ground copper pour yields theta_JA near 30 C/W, giving a 2.5 C temperature rise - well within the -40 C to +85 C industrial rating. In USB OTG host mode with multiple ports powered, total dissipation can rise to 200 mW and a slightly larger copper pour is recommended.
Do not leave the MCLR pin floating - the PIC24FJ128GA306T-I/MR will reset unpredictably without a 10 kohm pull-up to VDD. Configure the Configuration bits to enable the Brown-Out Reset (BOR) before the first firmware instruction, otherwise a slow VDD ramp-up can corrupt Flash. When using the CTMU for capacitive touch, calibrate the internal current source with the factory constants in the device's calibration memory before enabling touch scanning.
Informações de conformidade
RoHS3 compliant per Microchip USA and Newark product listings. Not AEC-Q100 qualified - this is an industrial-grade MCU. REACH compliance confirmed by distributor Abacus Elect cross-reference listing.
