PIC24FJ64GA705-E/M4 - 16-Bit MCU, 64KB Flash, 48-UQFN | Microchip
N.º da peça: PIC24FJ64GA705-E/M4 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.85 | $3,85 |
| 10 | $3.52 | $35,20 |
| 100 | $3.18 | $318,00 |
| 500 | $2.85 | $1.425,00 |
| 1.000 | $2.55 | $2.550,00 |
PIC24FJ64GA705-E/M4 Visão geral
A microcontroller (MCU) is an integrated circuit that combines a CPU, non-volatile program memory (Flash), working memory (RAM), and programmable peripherals on a single die. The PIC24F family is Microchip's 16-bit architecture positioned between 8-bit PIC16/PIC18 and 32-bit PIC32, offering higher performance than 8-bit cores while retaining deterministic interrupt behavior and a small instruction set. Within the broader taxonomy, the PIC24FJ64GA705 belongs to the eXtreme Low Power (XLP) sub-family, suitable for battery-powered and energy-harvesting designs.
Key features of this part include 64 KB ECC Flash, 16 KB RAM, six DMA channels for peripheral-to-memory transfers without CPU overhead, multiple UART/SPI/I2C interfaces, three analog comparators, a real-time clock and calendar (RTCC), and the CTMU block for capacitive touch. The XLP design provides deep sleep currents on the order of hundreds of nanoamps, enabling multi-year battery life in duty-cycled applications. The integrated 12-bit 200 ksps ADC supports up to 14 channels, suitable for sensor aggregation in mixed-signal designs.
The PIC24FJ64GA705 architecture is built on an enhanced Harvard 16-bit core with a modified RISC instruction set. ECC on the Flash improves reliability in harsh environments by detecting and correcting single-bit errors, and DMA offloads repetitive peripheral servicing. The CTMU generates constant-current sources and time measurement hardware, enabling accurate temperature sensing and proximity/touch detection when paired with copper PCB pads.
Typical applications include IoT sensor nodes, battery-powered wireless hubs, industrial control panels, touch-interface human-machine interfaces (HMIs), medical point-of-care instrumentation, and consumer appliances requiring low-power 16-bit processing with rich analog integration.
When designing with this MCU, reserve one analog input as a reference and follow Microchip's recommended decoupling scheme (100 nF on each VDD/VSS pair) to achieve the ADC's rated SNR. For capacitive touch, lay out the sensor patterns per the CTMU application note and account for guard rings on water-resistant designs.
This page synthesizes distributor stock, verified drop-in alternatives, and application-specific design guidance that goes beyond the manufacturer datasheet to support faster design-in.
Alternativas drop-in para PIC24FJ64GA705-E/M4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24FJ64GA705-E/M4 (mesmo formato e footprint) — diferindo em Operating Temperature, Package, ADC, Program Memory (Flash), CTMU.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24FJ64GA705-I/M4
✅ Drop-In✓ Em estoque
$1.95 / unidade
Ver ficha técnica →PIC24FJ64GA705T-E/M4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24FJ256GA705-I/M4
✅ Drop-In✓ Em estoque
$3.55 / unidade
Ver ficha técnica →PIC24FJ64GA705-E/M4 Classificações máximas e características elétricas
| Core Architecture | PIC24F (16-bit) |
| Program Memory (Flash) | 64 KB (22K x 24) with ECC |
| RAM | 16 KB |
| CPU Speed | 32 MHz (16 MIPS) |
| Operating Voltage | 2.0 V to 3.6 V |
| ADC | 12-bit, 200 ksps, up to 14 channels |
| Comparators | 3 |
| CTMU | Yes (Charge Time Measurement Unit) |
| DMA Channels | 6 |
| Communication Interfaces | UART, SPI, I2C |
| I/O Pins | 40 (max) |
| Temperatura de operação | -40C to +125C (E suffix = extended) |
| Encapsulamento | 48-pin UQFN (6x6 mm) |
| Tipo de montagem | Surface Mount |
| Nível MSL | MSL3 (per JEDEC J-STD-020, assumed) |
| Status RoHS | Compliant |
| eXtreme Low Power (XLP) | Yes |
| RTCC | Yes (Real-Time Clock and Calendar) |
Guia de Configuração de Pinos do PIC24FJ64GA705-E/M4 48-pin uqfn (6x6 mm)
Configuração de pinos para PIC24FJ64GA705-E/M4 (pacote 48-pin uqfn (6x6 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PIC24FJ64GA705-E/M4.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PIC24FJ64GA705-E/M4 é adequado para 6 aplicaçãos: Battery-Powered IoT Sensor Hub, Capacitive Touch HMI Panel, Industrial Control and Monitoring, Medical Point-of-Care Instrumentation, Consumer Appliance Control Board, Wireless Sensor Transmitter Node.
Battery-Powered IoT Sensor Hub
The PIC24FJ64GA705-E/M4 fits battery-powered IoT sensor hubs because of its eXtreme Low Power (XLP) deep-sleep currents in the nanoamp range and integrated 12-bit ADC at 200 ksps with up to 14 channels. Aggregating temperature, humidity, and motion sensors, the MCU wakes periodically, samples via DMA without CPU intervention, transmits over UART/SPI, and returns to sleep - achieving multi-year battery life on 2xAA cells. The 16 KB RAM comfortably buffers sensor frames before transmission, and 64 KB Flash accommodates OTA bootloader plus application code. Industrial -40C to +125C support enables outdoor deployment.
Recomendado
Capacitive Touch HMI Panel
The PIC24FJ64GA705-E/M4 is ideal for capacitive touch HMI panels because the on-chip CTMU generates constant-current sources and time-measurement hardware for self-capacitance or mutual-capacitance touch sensing. With three analog comparators and the 12-bit ADC, the MCU scans 8-16 touch electrodes, applies debounce/filtering firmware, and drives a TFT or segment LCD. The 48-UQFN package footprint supports compact touch-pad PCBs. The XLP sleep current enables battery-powered remote controls that wake on touch and return to nanoamp standby within milliseconds.
Recomendado
Industrial Control and Monitoring
The PIC24FJ64GA705-E/M4 serves industrial control and monitoring well because its -40C to +125C extended temperature range tolerates factory-floor thermal stress, and ECC Flash detects and corrects single-bit errors caused by EMI or cosmic rays. The 6 DMA channels handle UART/SPI sensor streams without CPU stalls, and the RTCC with calendar enables timestamping of alarm events. Typical use cases include PLC I/O modules, motor drive supervisory boards, and energy meter data concentrators that aggregate UART-bus sensors into Modbus or CAN gateways.
Recomendado
Medical Point-of-Care Instrumentation
The PIC24FJ64GA705-E/M4 is well-suited for medical point-of-care instruments because its 12-bit 200 ksps ADC samples multiple biosensor channels - pulse oximetry, glucose strips, temperature - with adequate resolution for clinical-grade readings. ECC Flash improves patient-data reliability, and the XLP sleep modes support handheld, battery-powered designs with days of continuous monitoring. The 16 KB RAM buffers waveform data, and the DMA engine streams ADC results into memory without CPU loading, freeing MIPS for digital filtering and display updates.
Recomendado
Consumer Appliance Control Board
The PIC24FJ64GA705-E/M4 fits consumer appliance control boards because it integrates the touch sensing, ADC, comparators, and communication peripherals needed for washing machines, coffee makers, and induction cooktops, replacing multiple discrete components. The 32 MHz core runs the user interface, sensor fusion, and motor-control supervisory loops at 16 MIPS. The wide 2.0V-3.6V supply tolerates rectified mains power rails after regulation, and 64 KB Flash supports multilingual UI plus diagnostics firmware across product variants.
Recomendado
Wireless Sensor Transmitter Node
The PIC24FJ64GA705-E/M4 is a strong fit for wireless sensor transmitter nodes because it can serve as the host MCU for sub-GHz transceivers like the Microchip MRF89XA or LoRa modules via SPI. The MCU handles sensor sampling, MAC-layer timing, encryption, and low-duty-cycle sleep coordination, while its nanoamp XLP sleep currents enable multi-year battery life on coin cells. The 48-UQFN package suits compact module designs, and the RTCC provides wake-up timing for scheduled transmissions without external crystals.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24FJ64GA705-E/M4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24FJ64GA705-I/M4 | PIC24FJ64GA705T-E/M4 | PIC24FJ256GA705-I/M4 |
|---|---|---|---|---|
| Package | 48-UQFN (6x6 mm) | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Flash Memory | 64 KB | 64 KB - same | 64 KB - same | 256 KB - 4x more |
| RAM | 16 KB | 16 KB - same | 16 KB - same | 16 KB - same |
| CPU Speed | 32 MHz (16 MIPS) | 32 MHz - same | 32 MHz - same | 32 MHz - same |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) - same | -40C to +85C (I) |
| CTMU (Touch) | Yes | Yes - same | Yes - same | Yes - same |
| DMA Channels | 6 | 6 - same | 6 - same | 6 - same |
Principais diferenciais
- Extended temperature grade for harsh environments (vs PIC24FJ64GA705-I/M4)
- Tape-and-reel packaging for high-volume assembly (vs PIC24FJ64GA705-E/M4 (tray))
- 4x Flash headroom for future-proofing (vs PIC24FJ256GA705-I/M4)
Notas de projeto
Estimated: To minimize sleep current, configure all unused pins as digital outputs driving low, disable unused peripherals via PMD registers, and use Deep Sleep mode with RTCC wake. Typical Deep Sleep current with RTCC running is on the order of hundreds of nanoamps (refer to datasheet DC characteristics for the exact figure). For battery life calculations, sum the active current times active duration plus sleep current times sleep duration, accounting for wake-up time.
Place a 100 nF decoupling capacitor within 5 mm of each VDD/VSS pair, and add a bulk 1-10 uF tantalum or ceramic capacitor near the MCU. For the 48-UQFN package, expose the thermal pad (EP) and stitch it to a continuous ground plane for both thermal dissipation and low-inductance return paths. Analog references (AVDD/AVSS) should have their own ferrite-filtered supply if the ADC is used at full 200 ksps to preserve SNR.
Do not exceed 3.6 V on any digital or analog supply pin - the PIC24FJ64GA705 is a 3.3 V part and overvoltage will damage the silicon. When programming via ICSP, ensure PGD/PGC lines are not loaded with heavy capacitance; add series resistors near the MCU if necessary. CTMU touch sensing requires calibration of the constant-current trim bits per Microchip TB3069 to maintain sensitivity across temperature.
Informações de conformidade
RoHS and lead-free confirmed per Microchip product page; REACH compliance per EU regulatory declarations. AEC-Q100 qualification status for this specific -E/M4 part not confirmed in the verified web data; consult Microchip directly for automotive-grade part numbers if AEC-Q100 is required.
