PIC24FV16KA301-I/SO - 16-Bit 32MHz XLP Microcontroller
N.º da peça: PIC24FV16KA301-I/SO ✓ AtivoPIC24FV16KA301-I/SO Visão geral
A 16-bit flash microcontroller combines a dedicated RISC core, integrated data memory, programmable peripherals, and on-chip program memory in one device. The PIC24F architecture belongs to the broader embedded-controller hierarchy: microcontroller, embedded processor, semiconductor, and system-on-chip design. This combination allows control, analog measurement, communications, and low-power management functions to share a compact, cost-effective platform.
The principal features include 16 KB of program memory organized as 5.5K × 24 words, 2K × 8 bits of RAM, 32 MHz operation, and 17 available I/O positions. A 12-bit ADC supports analog measurements, while 512 bytes of EEPROM preserve small amounts of nonvolatile configuration or calibration data. The XLP feature set includes peripherals that continue operating in Deep Sleep mode, including DSBOR, DSWDT, and RTCC functionality.
Microchip positions the PIC24FV16KA301 family for 2.5 V, 3.3 V, and 5 V designs. Internal fast-start oscillator options reduce external clock requirements in cost-sensitive systems. The 20-pin SOIC package provides a conventional leaded footprint suitable for through-hole assembly, prototyping, and industrial control products where component availability and inspection are important.
Typical applications include battery-operated sensors, compact industrial monitors, building-control endpoints, low-power data loggers, and embedded control modules. The 12-bit ADC supports analog sensor interfaces, while the 17 I/O pins provide connections for digital inputs, outputs, communications, and control signals. The combination of flash memory, EEPROM, XLP peripherals, and a small package makes the device useful where board area and standby power are constrained.
Designers should verify the exact pin functions, alternate-function selections, clock configuration, and decoupling requirements in the manufacturer datasheet before laying out the PCB. Pay particular attention to voltage-domain limits and the operating mode assigned to unused I/O pins. For designs based on a different package, do not reuse the PCB footprint without checking lead spacing and exposed-pad requirements.
This product record combines core device specifications, verified package information, practical application guidance, and an assessment of drop-in replacement options. It highlights where the PIC24FV16KA301-I/SO fits in low-power embedded systems and which functional and package differences must be reviewed before substituting another MCU.
Alternativas drop-in para PIC24FV16KA301-I/SO — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24FV16KA301-I/SO (mesmo formato e footprint) — diferindo em Maximum CPU Speed, Package, ADC, Operating Temperature, RoHS Status.
PIC24FV16KA301-E/SO
✅ Drop-InConsulte o preço
Ver ficha técnica →PIC24FV16KA301-I/SO Classificações máximas e características elétricas
| Product Type | 16-bit flash microcontroller |
| Program Memory Size | 16 KB (5.5K × 24 words) |
| RAM Size | 2 KB (2K × 8 bits) |
| EEPROM Size | 512 bytes |
| Maximum CPU Speed | 32 MHz |
| Number of I/O Pins | 17 pins |
| ADC Resolution | 12 bits |
| Architecture | PIC RISC |
| Operating Voltage Options | 2.5 V, 3.3 V, and 5 V |
| Oscillator Type | Internal |
| Low-Power Technology | nanoWatt XLP eXtreme Low Power |
| Deep Sleep Peripheral Support | DSBOR, DSWDT, and RTCC |
| Encapsulamento | 20-pin SOIC |
| Tipo de montagem | Through-hole |
| Packaging | Tube |
| Program Memory Type | Flash |
Guia de Configuração de Pinos do PIC24FV16KA301-I/SO 20-pin soic
Configuração de pinos para PIC24FV16KA301-I/SO (pacote 20-pin soic). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PIC24FV16KA301-I/SO.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PIC24FV16KA301-I/SO é adequado para 6 aplicaçãos: Battery-Powered Sensor Nodes, Industrial Process Monitoring, Low-Power Data Loggers, Building Control Endpoints, Embedded Control Modules, Portable Medical Monitoring.
Battery-Powered Sensor Nodes
The PIC24FV16KA301-I/SO fits battery-powered sensor nodes that periodically measure an analog input and remain inactive for long periods. Its 12-bit ADC handles sensor signals, while the 16-bit PIC RISC core provides up to 32 MHz of processing for local filtering and control. The XLP architecture and Deep Sleep-capable DSBOR, DSWDT, and RTCC peripherals help reduce standby energy. Seventeen I/O pins allow the controller to support sensors, indicators, and external wake or status signals without adding a separate host processor.
Recomendado
Industrial Process Monitoring
The PIC24FV16KA301-I/SO is useful in compact industrial process-monitoring equipment that combines analog measurement with local digital control. Its 12-bit ADC can monitor pressure, temperature, or level signals, and the 512-byte EEPROM can retain configuration or calibration values across power cycles. The 32 MHz core supports filtering and communication tasks, while 17 I/O pins provide flexible sensor and control connectivity. Its 20-pin SOIC package is practical for conventional through-hole industrial boards.
Recomendado
Low-Power Data Loggers
The PIC24FV16KA301-I/SO supports compact data loggers that wake periodically, acquire measurements, store results, and return to a low-power state. The 16 KB of flash provides embedded program space, 2 KB of RAM supports buffering, and the 12-bit ADC handles analog inputs. XLP Deep Sleep operation can reduce energy between logging intervals, while the 512-byte EEPROM preserves small configuration records. The 17 available I/O pins can accommodate a sensor, status indicator, serial interface, and external control input.
Recomendado
Building Control Endpoints
The PIC24FV16KA301-I/SO can serve as a building-control endpoint for occupancy, environmental, or equipment-status monitoring. The 17 I/O pins allow multiple digital inputs and outputs to share one controller, while the 12-bit ADC supports analog environmental sensing. Its 32 MHz performance is sufficient for protocol handling, debouncing, state logic, and local diagnostics. XLP peripherals support low-power monitoring strategies where the system must conserve energy during long idle periods.
Recomendado
Embedded Control Modules
The PIC24FV16KA301-I/SO fits small embedded control modules that combine sensing, logic, and local output control. Its 16 KB flash and 2 KB RAM provide dedicated program and working memory without requiring external memory, while 512 bytes of EEPROM preserve limited nonvolatile settings. The 12-bit ADC and 17 I/O pins support mixed analog and digital interfaces, and the 32 MHz core provides headroom for communications and control tasks in a 20-pin SOIC package.
Recomendado
Portable Medical Monitoring
The PIC24FV16KA301-I/SO can support compact portable monitoring products where low standby power, local signal acquisition, and compact packaging are important. The 12-bit ADC is suitable for slow-changing analog measurements, and the 16-bit core can perform scaling, filtering, threshold detection, and event logging. XLP Deep Sleep peripherals help reduce power between measurements, while the 20-pin SOIC package simplifies assembly in leaded medical-instrument boards. Final device qualification and environmental limits must match the intended application.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24FV16KA301-I/SO — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24FV16KA301-E/SO |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Package | 20-pin SOIC | 20-pin SOIC |
| Program Memory | 16 KB (5.5K × 24 words) | 16 KB (5.5K × 24 words) |
| RAM | 2 KB (2K × 8 bits) | 2 KB (2K × 8 bits) |
| EEPROM | 512 bytes | 512 bytes |
| Maximum Speed | 32 MHz | 32 MHz |
| Number of I/O Pins | 17 | 17 |
| ADC Resolution | 12 bits | 12 bits |
| Core Architecture | 16-bit PIC RISC | 16-bit PIC RISC |
| Low-Power Features | nanoWatt XLP with Deep Sleep-capable DSBOR, DSWDT, and RTCC | Same PIC24FV16KA301 family feature set |
| Temperature Suffix | -I/SO | -E/SO |
Principais diferenciais
- Identical package and core resources for PCB reuse (vs PIC24FV16KA301-E/SO)
- Low-power peripherals remain available during Deep Sleep (vs PIC24FV16KA301-E/SO)
- Integrated analog and nonvolatile storage (vs PIC24FV16KA301-E/SO)
Notas de projeto
Confirm the selected voltage domain against every powered I/O pin before finalizing the board. The device supports 2.5 V, 3.3 V, and 5 V operation, but mixed-voltage peripherals can impose separate input and output limits. Place the decoupling network directly beside the supply and ground pins, and use the manufacturer’s recommended capacitor values and ESR guidance rather than carrying assumptions over from another PIC24 family member.
Use the 20-pin SOIC land pattern associated with the exact manufacturer package drawing and preserve adequate clearance between adjacent leads. Because the target uses a conventional SOIC rather than an SSOP, DIP, or exposed-pad package, PCB footprints cannot be exchanged without checking lead pitch and body width. Review programming-test pads and keep them accessible if the design requires in-circuit programming or diagnostics.
Do not treat the -I and -E ordering suffixes as interchangeable without checking their temperature and qualification meanings. Both PIC24FV16KA301-I/SO and PIC24FV16KA301-E/SO share the 20-pin SOIC footprint and core resources, but the suffix can affect environmental suitability. Record the approved part number in the schematic and BOM so procurement does not substitute the wrong grade during production.
For battery-powered operation, calculate the average current from active-processing time, ADC sampling, and Deep Sleep duration rather than relying only on the maximum 32 MHz clock rate. XLP peripherals can retain useful monitoring functions during low-power operation, but their individual contribution to the duty cycle must be included. Validate sleep-entry conditions, wake sources, and I/O states in hardware to prevent leakage or floating inputs from increasing standby demand.
Informações de conformidade
No explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statement appears in the cited product information. Confirm current environmental declarations and qualification status with Microchip before production release.