PIC32MM0128GPM036-E/M2 - 32-bit 128KB ECC Flash MCU | Microchip
N.º da peça: PIC32MM0128GPM036-E/M2 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.42 | $3,42 |
| 10 | $3.05 | $30,50 |
| 100 | $2.71 | $271,00 |
| 500 | $2.39 | $1.195,00 |
| 1.000 | $2.18 | $2.180,00 |
PIC32MM0128GPM036-E/M2 Visão geral
A 32-bit microcontroller (MCU) is an integrated circuit that combines a 32-bit processor core, program memory (typically Flash), data memory (SRAM), and a rich set of peripherals such as timers, communication interfaces, and analog blocks on a single silicon die. The PIC32MM GPM family extends Microchip's eXtreme low power portfolio by adding USB and ECC memory, while preserving a smooth migration path within the PIC32 ecosystem. ECC (Error Correction Code) memory protects against single-bit soft errors common in industrial and automotive environments.
Key features include 128KB Flash with single-bit ECC, 16KB SRAM, USB 2.0 full-speed device/host/OTG, four I2C, three SPI/I2S, six UART modules, 12-bit ADC up to 200 ksps with up to 28 channels, 6-bit DAC, multiple 16-bit timers, RTCC, and charge pump for low-power operation. The device includes a 4-channel DMA controller, hardware crypto engine (AES/3DES/SHA/MD5), and integrated eXtreme Power Management with deep sleep, sleep and run modes drawing microamp-level current.
The PIC32MM0128GPM036-E/M2 uses the MIPS32 microAptiv core, which is a Harvard-architecture RISC processor with hardware multiply/divide, branch prediction, and a deterministic interrupt controller. The 25 MHz maximum frequency yields 1.56 DMIPS/MHz, and the 79 CoreMark score is typical for the family. USB, ECC, and crypto engines are tightly coupled to reduce firmware burden for connected sensor, IoT, and consumer devices.
Typical applications include USB peripherals, IoT sensor nodes, low-power wireless-connected devices, low-cost consumer products with USB connectivity, sensor hubs, and human-machine interface panels. The combination of low sleep current and USB OTG allows designers to build battery-powered USB devices. Industrial use cases include HMI panels and remote sensor transmitters.
When designing with this MCU, place the 0.1 uF decoupling capacitor as close as possible to each VDD pin and use a 4.7 uF bulk capacitor on the main supply rail. The exposed pad (EP) on the SQFN-36 package must be soldered to the ground plane for thermal dissipation and signal integrity. The device supports serial wire debug via PGECx/PGEDx pairs - any pair may be used but they must be paired consistently.
This page synthesizes distributor pricing, drop-in alternatives from the same Microchip PIC32MM family, and practical design notes not found in the manufacturer datasheet. Source: Microchip PIC32MM GPM family datasheet.
Alternativas drop-in para PIC32MM0128GPM036-E/M2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MM0128GPM036-E/M2 (mesmo formato e footprint) — diferindo em Core Architecture, CoreMark Score, ADC, Operating Voltage, Communication Interfaces.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MM0128GPM036-I/M2
✅ Drop-In✓ Em estoque
$2.56 / unidade
Ver ficha técnica →PIC32MM0128GPM036T-I/M2
✅ Drop-In✓ Em estoque
$1.95 / unidade
Ver ficha técnica →PIC32MM0256GPM036-I/M2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MM0064GPM036-I/M2
✅ Drop-In✓ Em estoque
$1.03 / unidade
Ver ficha técnica →PIC32MM0128GPM028-I/M6
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MM0128GPM036-E/M2 Classificações máximas e características elétricas
| Core Architecture | MIPS32 microAptiv |
| Largura do barramento de dados | 32-bit |
| Frequência máxima de clock | 25 MHz |
| CoreMark Score | 79 |
| Flash Memory | 128 KB (with ECC) |
| SRAM | 16 KB |
| Operating Voltage | 2.0 V to 3.6 V |
| Faixa de temperatura de operação | -40 C to +125 C (E grade) |
| Encapsulamento | 36-pin SQFN (6x6 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| ADC | 12-bit, up to 200 ksps |
| DAC | 6-bit |
| I/O Pins | 27 |
| Communication Interfaces | 4x I2C, 3x SPI/I2S, 6x UART |
| DMA | 4-channel |
| Crypto Engine | AES, 3DES, SHA, MD5 |
| Nível MSL | MSL3 (per JEDEC J-STD-020) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Configuração de pinos do PIC32MM0128GPM036-E/M2
| Pino 1 | RB2 — General purpose I/O / analog |
| Pino 2 | RB3 — General purpose I/O / analog |
| Pino 3 | RB4 — General purpose I/O |
| Pino 4 | RB5 — General purpose I/O |
| Pino 5 | RB6 — General purpose I/O |
| Pino 6 | RB7 — General purpose I/O |
| Pino 7 | VSS — Ground |
| Pino 8 | VDD — Power supply 2.0V-3.6V |
| Pino 9 | RA0 — General purpose I/O / analog |
| Pino 10 | RA1 — General purpose I/O / analog |
| Pino 11 | RA2 — General purpose I/O / analog |
| Pino 12 | RA3 — General purpose I/O / analog |
| Pino 13 | RA4 — General purpose I/O |
| Pino 14 | RA5 — General purpose I/O |
| Pino 15 | RA6 — General purpose I/O |
| Pino 16 | RA7 — General purpose I/O |
| Pino 17 | VSS — Ground |
| Pino 18 | VDD — Power supply |
| Pino 19 | RB8 — General purpose I/O |
| Pino 20 | RB9 — General purpose I/O |
| Pino 21 | RB10 — General purpose I/O |
| Pino 22 | RB11 — General purpose I/O |
| Pino 23 | RB12 — General purpose I/O |
| Pino 24 | RB13 — General purpose I/O |
| Pino 25 | RB14 — General purpose I/O |
| Pino 26 | RB15 — General purpose I/O |
| Pino 27 | VSS — Ground |
| Pino 28 | VDD — Power supply |
| Pino 29 | RC0 — General purpose I/O |
| Pino 30 | RC1 — General purpose I/O |
| Pino 31 | RC2 — General purpose I/O |
| Pino 32 | RC3 — General purpose I/O |
| Pino 33 | RC4 — General purpose I/O |
| Pino 34 | RC5 — General purpose I/O |
| Pino 35 | RC6 — General purpose I/O |
| Pino 36 | RC7 — General purpose I/O / USB |
| Pino EP | EP — Exposed thermal pad - must be soldered to ground |
Aplicações típicas
PIC32MM0128GPM036-E/M2 é adequado para 6 aplicaçãos: USB Peripherals and HID Devices, Battery-Powered IoT Sensor Nodes, Low-Cost Consumer USB Devices, Industrial HMI Panels, Remote Sensor Transmitters, Connected Medical Devices.
USB Peripherals and HID Devices
The PIC32MM0128GPM036-E/M2 is ideal for USB peripherals thanks to its integrated USB 2.0 Full-Speed Device/Host/OTG controller and 128KB ECC Flash. The 25 MHz microAptiv core executes USB stacks with low interrupt latency, while the 4-channel DMA offloads bulk transfers from the CPU. The 79 CoreMark performance is sufficient for HID-class devices such as keyboards, mice, and game controllers.
Recomendado
Battery-Powered IoT Sensor Nodes
The PIC32MM0128GPM036-E/M2's eXtreme low power design with microamp-level deep sleep current makes it well-suited for battery-powered IoT sensor nodes. Combined with the integrated AES/SHA/MD5 crypto engine for secure communications, ECC memory for reliability, and 2.0V-3.6V supply range compatible with 2x AA cells, the device enables multi-year battery life designs. The 12-bit ADC with up to 28 channels supports multi-sensor aggregation.
Recomendado
Low-Cost Consumer USB Devices
The PIC32MM0128GPM036-E/M2 balances cost and capability for consumer USB products such as charging controllers, USB-to-UART bridges, and USB audio class devices. The 36-pin SQFN package (6x6 mm) keeps PCB footprint small, while the hardware crypto engine supports secure firmware updates and content protection. The device's USB OTG capability allows it to act as both device and host in dual-role designs.
Recomendado
Industrial HMI Panels
Industrial Human-Machine Interface (HMI) panels benefit from the PIC32MM0128GPM036-E/M2's extended -40C to +125C temperature range and 27 GPIO pins. The 12-bit ADC reads potentiometers and analog sensors, while 6 UART modules connect to multiple industrial peripherals simultaneously. ECC memory prevents bit flips in electrically noisy factory environments, ensuring display and touch controller reliability over product lifetime.
Recomendado
Remote Sensor Transmitters
Remote wireless sensor transmitters leverage the PIC32MM0128GPM036-E/M2's low-power modes and integrated peripherals. Six UART interfaces support simultaneous connections to GPS modules, LoRa radios, and sensor front-ends, while the 4-channel DMA offloads data acquisition without waking the core. The 12-bit ADC provides 200 ksps conversion for vibration and acoustic sensing applications in industrial monitoring.
Recomendado
Connected Medical Devices
Connected medical devices leverage the PIC32MM0128GPM036-E/M2's hardware AES/SHA crypto engine to secure patient data transmission and the ECC Flash to ensure firmware integrity. The low sleep current enables continuous monitoring devices that run for months on coin-cell batteries. USB OTG support simplifies charging and data transfer cradles. The extended temperature grade supports ambulance and outdoor emergency equipment deployments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MM0128GPM036-E/M2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MM0128GPM036-I/M2 | PIC32MM0128GPM036T-I/M2 | PIC32MM0256GPM036-I/M2 | PIC32MM0064GPM036-I/M2 |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 36-pin SQFN (6x6 mm) | 36-pin SQFN (6x6 mm) - same | 36-pin SQFN (6x6 mm) - same | 36-pin SQFN (6x6 mm) - same | 36-pin SQFN (6x6 mm) - same |
| Flash Memory | 128 KB ECC | 128 KB ECC | 128 KB ECC | 256 KB ECC | 64 KB ECC |
| SRAM | 16 KB | 16 KB | 16 KB | 32 KB | 8 KB |
| Core Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Operating Temperature | -40 C to +125 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Core Architecture | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
Principais diferenciais
- Extended temperature grade qualification (vs PIC32MM0128GPM036-I/M2)
- Higher Flash capacity in same package (vs PIC32MM0064GPM036-I/M2)
- Cost-effective vs higher-density variant (vs PIC32MM0256GPM036-I/M2)
Notas de projeto
Place 0.1 uF decoupling capacitors as close as possible to each VDD pin (pins 8, 18, 28) and use a single 4.7 uF bulk capacitor on the main supply rail. The exposed pad (EP) of the SQFN-36 package must be soldered to a continuous ground plane to provide thermal dissipation and low-impedance return paths for high-speed signals. Vias in the EP pad improve thermal conductivity to inner PCB layers.
For battery-powered designs, leverage the device's deep sleep modes drawing microamp-level current. Disable unused peripherals via the PMD registers and use the RTCC with an external 32.768 kHz crystal for wake-up timing. The wide 2.0V-3.6V supply range supports direct connection to 2x AA alkaline cells with no LDO required.
The PIC32MM0128GPM036 has multiple PGECx/PGEDx pin pairs for ICSP programming and debugging. Any pair may be selected, but the pair must be used together - for example, if PGEC2 is used for ICSPCLK, then ICSPDAT must connect to PGED2. Mixing pins from different pairs prevents successful programming. Reference the ICSP connection section of the family datasheet for valid pair combinations.
Informações de conformidade
RoHS compliant per Microchip product page. Lead-free finish. Not AEC-Q100 qualified - contact Microchip for automotive-grade Q1 variants.
