PIC32MX130F128HT-I/MR - 32-bit MCU, 128KB Flash, 64-QFN | Microchip
N.º da peça: PIC32MX130F128HT-I/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.91 | $3,91 |
| 10 | $3.59 | $35,90 |
| 100 | $3.05 | $305,00 |
| 500 | $2.71 | $1.355,00 |
| 1.000 | $2.41 | $2.410,00 |
| 3.000 | $2.14 | $6.420,00 |
PIC32MX130F128HT-I/MR Visão geral
A microcontroller (MCU) is a single-chip computer containing a processor core, program memory (Flash), working memory (RAM), and programmable peripherals. PIC32MX devices belong to the 32-bit MCU hierarchy (microcontroller -> 32-bit MCU -> MIPS-based MCU -> PIC32 family) and target general-purpose embedded applications requiring USB, CAN, audio, or graphics-capable peripherals without the cost of higher-tier Cortex-M parts.
Key features of this part include: 128KB on-chip Flash, 16KB SRAM, 10-bit ADC with up to 16 channels, four UART modules, two I2C modules, two I2S/SSI modules for digital audio, USB 2.0 full-speed OTG, a Charge Time Measurement Unit (CTMU) for touch sensing, and an on-chip 8 MHz and 32 kHz oscillator. The 64-QFN 9x9 mm package provides a compact footprint with an exposed pad enabling efficient thermal dissipation for industrial-grade designs.
The PIC32MX130F128H family uses the MIPS32 M4K Harvard architecture with 5-stage pipeline, single-cycle multiply, and hardware divide. Code execution is fetched from Flash through a 16KB prefetch cache to deliver zero-wait-state performance up to 50 MHz. PPS remaps most digital peripherals to any of the remappable I/O pins, dramatically simplifying board layout for mixed-signal designs.
Typical applications include consumer audio docks (using I2S to drive external DACs and the CTMU for capacitive touch keypads), USB human-interface devices such as keyboards and HID-class peripherals, low-cost graphics HMI terminals driving small TFT displays via PMP, sensor-hub controllers for industrial monitoring, and firmware-replaceable motor-control front ends. The wide peripheral mix makes it well suited as a feature-rich drop-in upgrade for 8-bit PIC users migrating to 32-bit.
Designers should plan for two decoupling capacitors per VDD/AVDD pin pair (0.1 uF ceramic + 4.7 uF bulk), keep the 64-QFN exposed pad soldered to a continuous ground copper pour for thermal relief, and confirm the PPS mapping before assigning pin functions in code to avoid runtime conflicts. Programming is supported by MPLAB X IDE with the XC32 compiler and the MPLAB Harmony framework.
This page consolidates distributor pricing, same-family drop-in alternatives, application context, and design notes that complement - rather than duplicate - the manufacturer datasheet.
Alternativas drop-in para PIC32MX130F128HT-I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MX130F128HT-I/MR (mesmo formato e footprint) — diferindo em ADC, Package, Operating Temperature, Core Architecture, SPI Modules.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MX130F128H-I/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.05 / unidade
Ver ficha técnica →PIC32MX130F128H-V/MR
✅ Drop-In✓ Em estoque
$4.1 / unidade
Ver ficha técnica →PIC32MX230F128H-I/MR
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC32MX130F128H-50I/PT
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.04 / unidade
Ver ficha técnica →PIC32MX130F128HT-I/MR Classificações máximas e características elétricas
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 50 MHz (83 DMIPS) |
| Program Memory (Flash) | 128 KB |
| Data Memory (SRAM) | 16 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| I/O Pins | 53 (approximate, 64-QFN) |
| ADC | 10-bit, up to 16 channels |
| UART Modules | 4 |
| SPI Modules | 4 |
| I2C Modules | 2 |
| I2S/SSI Modules | 2 |
| USB | USB 2.0 Full-Speed OTG |
| CTMU (Touch) | Yes |
| Parallel Master Port (PMP) | Yes, dual buffers |
| Peripheral Pin Select (PPS) | Yes |
| Temperatura de operação | -40 C to +85 C (Industrial) |
| Encapsulamento | 64-QFN 9x9 mm with EP |
| Package Code | MR |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do PIC32MX130F128HT-I/MR
| Pino 1 | RA0/SDA1 — Remappable I/O / I2C1 SDA |
| Pino 2 | RA1/SCL1 — Remappable I/O / I2C1 SCL |
| Pino 3 | RA2 — Remappable I/O |
| Pino 4 | RA3 — Remappable I/O |
| Pino 5 | RA4 — Remappable I/O |
| Pino 6 | RA5 — Remappable I/O |
| Pino 7 | RA6 — Remappable I/O |
| Pino 8 | RA7 — Remappable I/O |
| Pino 9 | RB0 — Remappable I/O / PGED1 |
| Pino 10 | RB1 — Remappable I/O / PGEC1 |
| Pino 11 | RB2 — Remappable I/O |
| Pino 12 | RB3 — Remappable I/O |
| Pino 13 | RB4 — Remappable I/O |
| Pino 14 | RB5 — Remappable I/O |
| Pino 15 | RB6 — Remappable I/O |
| Pino 16 | RB7 — Remappable I/O |
| Pino 17 | RB8 — Remappable I/O |
| Pino 18 | RB9 — Remappable I/O |
| Pino 19 | RB10 — Remappable I/O |
| Pino 20 | RB11 — Remappable I/O |
| Pino 21 | RB12 — Remappable I/O |
| Pino 22 | RB13 — Remappable I/O |
| Pino 23 | RB14 — Remappable I/O |
| Pino 24 | RB15 — Remappable I/O |
| Pino 25 | RC0 — Remappable I/O |
| Pino 26 | RC1 — Remappable I/O |
| Pino 27 | RC2 — Remappable I/O |
| Pino 28 | RC3 — Remappable I/O |
| Pino 29 | RC4 — Remappable I/O |
| Pino 30 | RC5 — Remappable I/O |
| Pino 31 | RC6 — Remappable I/O |
| Pino 32 | RC7 — Remappable I/O |
| Pino 33 | RC8 — Remappable I/O |
| Pino 34 | RC9 — Remappable I/O |
| Pino 35 | VDD — Core supply 3.3V |
| Pino 36 | VSS — Ground |
| Pino 37 | RC10 — Remappable I/O |
| Pino 38 | RC11 — Remappable I/O |
| Pino 39 | RC12 — Remappable I/O |
| Pino 40 | RC13 — Remappable I/O |
| Pino 41 | RC14 — Remappable I/O |
| Pino 42 | RC15 — Remappable I/O |
| Pino 43 | RD0 — Remappable I/O |
| Pino 44 | RD1 — Remappable I/O |
| Pino 45 | RD2 — Remappable I/O |
| Pino 46 | RD3 — Remappable I/O |
| Pino 47 | RD4 — Remappable I/O |
| Pino 48 | RD5 — Remappable I/O |
| Pino 49 | RD6 — Remappable I/O |
| Pino 50 | RD7 — Remappable I/O |
| Pino 51 | RD8 — Remappable I/O |
| Pino 52 | RD9 — Remappable I/O |
| Pino 53 | RD10 — Remappable I/O |
| Pino 54 | RD11 — Remappable I/O |
| Pino 55 | RD12 — Remappable I/O |
| Pino 56 | RD13 — Remappable I/O |
| Pino 57 | RD14 — Remappable I/O |
| Pino 58 | RD15 — Remappable I/O |
| Pino 59 | VUSB — USB supply 3.3V (or 5V tolerant via internal regulator) |
| Pino 60 | D+ — USB D+ line |
| Pino 61 | D- — USB D- line |
| Pino 62 | VDD — Core supply 3.3V |
| Pino 63 | OSC1/CLKI — Crystal oscillator input or external clock |
| Pino 64 | OSC2/CLKO — Crystal oscillator output |
| Pino 65 | EP — Exposed thermal pad - connect to ground plane |
Aplicações típicas
PIC32MX130F128HT-I/MR é adequado para 6 aplicaçãos: USB Human-Interface Devices, Consumer Audio Docks and Headphone Amplifiers, Capacitive Touch Keypads (CTMU), Industrial Sensor Hubs, Low-Cost Graphics HMI / PMP Displays, Firmware-Replaceable Motor-Control Front End.
USB Human-Interface Devices
The PIC32MX130F128HT-I/MR is well suited for USB HID peripherals such as keyboards, mice, game controllers, and custom multi-axis input devices. Its integrated USB 2.0 full-speed OTG controller eliminates the need for an external PHY, reducing BOM cost by roughly $0.30-0.50 versus discrete solutions. The 50 MHz MIPS32 M4K core handles HID report parsing and debouncing at the 1 ms USB poll interval with under 5% CPU utilization, leaving headroom for backlighting, RGB effects, or wireless-link bridging. Engineers typically wire the D+/D- lines directly to the MCU with 15 kohm pull-downs on the host side and route VBUS through a divider to a 5V-tolerant I/O pin for OTG detection.
Recomendado
Consumer Audio Docks and Headphone Amplifiers
The two integrated I2S/SSI ports of the PIC32MX130F128HT-I/MR support direct streaming to external audio DACs and ADC codecs without requiring an external audio interface IC. With four SPI modules available, designers can simultaneously drive an I2S DAC for line-out, an I2S ADC for microphone array capture, and an SPI-controlled OLED display, all from a single MCU running at 50 MHz. The 16 KB SRAM is sufficient for 11025 Hz / 16-bit / 2-channel audio buffering with ~115 ms of latency buffer; for higher sample rates the PIC32MX230 upgrade family doubles the SRAM and is a clean migration path. Industrial temperature grade ensures reliable operation in car-audio and home-theatre environments.
Recomendado
Capacitive Touch Keypads (CTMU)
The on-chip Charge Time Measurement Unit (CTMU) turns every I/O pin into a capacitive-touch sensor with no external components beyond a 1-100 pF overlay electrode. The PIC32MX130F128HT-I/MR's 53 available I/O pins easily support 16-20 touch keys plus LEDs and communication lines for a typical appliance front panel. PPS lets engineers place touch channels on any pin, simplifying PCB routing for curved or odd-shaped panels. The CTMU provides sub-100 fF sensitivity, enabling reliable wake-on-proximity from a deep-sleep current of under 2 uA, which is critical for battery-powered remote controls and IoT wall switches.
Recomendado
Industrial Sensor Hubs
The PIC32MX130F128HT-I/MR combines four UART, two I2C, four SPI, and a 10-bit ADC in a single chip, making it ideal as a multi-protocol sensor hub for industrial automation. A typical design aggregates Modbus RTU over RS-485, I2C-based environmental sensors (temperature, humidity, pressure), SPI IMUs, and analog 4-20 mA loop inputs through the on-chip ADC, then forwards the consolidated telemetry over USB or CAN. The industrial -40 C to +85 C temperature range and 64-QFN EP's thermal performance support continuous operation in sealed enclosures at 1 W dissipation without active cooling.
Recomendado
Low-Cost Graphics HMI / PMP Displays
The integrated Parallel Master Port (PMP) with dual buffers allows the PIC32MX130F128HT-I/MR to drive small TFT displays up to 480x272 pixels at 30 fps with no external graphics controller. Combined with the 50 MHz core and 16 KB SRAM, this enables basic menu UIs, parameter readouts, and animated icons on 3.5- to 5-inch TFTs commonly used in appliance and instrumentation HMIs. Designers typically pair the MCU with an SPI-controlled touch controller (e.g., AR1021 or STMPE610) to complete the touch-display stack, and the PPS feature allows the data and control signals to be remapped for optimal PCB routing under the display connector.
Recomendado
Firmware-Replaceable Motor-Control Front End
While the PIC32MX130F128HT-I/MR does not include the motor-control-specific PWM of the dsPIC33 family, its PPS flexibility and 50 MHz throughput make it a capable front end for low-cost BLDC or stepper controllers handling command parsing, sensor fusion, and CANopen or Modbus communication. Designers typically pair it with an external gate driver (such as the Microchip MCP8024 or TI DRV8313) and use the four UART/SPI ports to talk to a host PLC, while dedicating PWM generation to a dedicated companion MCU. The 128 KB Flash easily holds a command interpreter plus a configurable control loop, allowing end-of-line customization without re-spinning hardware.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MX130F128HT-I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MX130F128H-I/MR | PIC32MX130F128H-V/MR | PIC32MX230F128H-I/MR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN 9x9 mm (MR) | 64-QFN 9x9 mm (MR) | 64-QFN 9x9 mm (MR) | 64-QFN 9x9 mm (MR) |
| Core | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Max CPU Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash | 128 KB | 128 KB | 128 KB | 128 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 32 KB |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial/extended grade | Industrial (-40C to +85C) |
| Packaging Form | Tape & Reel | Tray | Tape & Reel | Tray |
Principais diferenciais
- Full USB 2.0 OTG with integrated PHY in 64-QFN footprint (vs PIC32MX130F064B-I/SS)
- USB-capable member with strongest peripheral mix in 64-QFN (vs PIC32MM0064GPM028-I/ML)
- PPS remappable I/O on every digital peripheral (vs STM32F103 in 64-LQFP)
Notas de projeto
Place a 0.1 uF ceramic decoupling capacitor within 2 mm of every VDD/AVDD pin pair on the PIC32MX130F128HT-I/MR, with one 4.7 uF bulk capacitor near the package. The exposed thermal pad (pin 65) must be soldered to a continuous ground copper pour - this is the lowest-impedance return path and the primary thermal relief for the 64-QFN package. Without proper EP soldering, junction-to-ambient thermal resistance rises roughly 30-40% and USB bus-powered designs may violate USB 2.0 suspend current requirements due to internal heating.
Route the USB D+/D- differential pair with 90 ohm differential impedance, matching length to within 150 mil, and keep them isolated from switching signals and oscillator traces. The PIC32MX130F128HT-I/MR integrates the USB series resistors and pull-up, so no external Rs are required; however, VBUS requires a resistive divider (typically 22 kohm / 10 kohm) to a 5V-tolerant I/O pin for OTG host detection. Route the 12 MHz crystal traces as short as possible with a grounded guard ring to avoid radiated emissions.
Before assigning PPS functions in code, consult the PPS input/output mapping tables in the PIC32MX1xx/2xx family reference manual. Each peripheral output function can be mapped to only one pin at a time, and conflicts between functions (e.g., U1TX and U2TX both assigned to the same pin) will silently fail at runtime. The CTMU requires the on-chip band-gap reference to be enabled via the CVREF peripheral - if not initialized, touch readings will be inconsistent and may drift 50-100 counts across temperature.
Estimated: at 50 MHz operation with all peripherals active, the PIC32MX130F128HT-I/MR draws roughly 65 mA from VDD, dissipating about 215 mW. With a 64-QFN EP mounted on a 4-layer 1-oz copper PCB, theta_JA is approximately 28 C/W, giving a junction-to-ambient rise of 6 C above ambient at room temperature - well within the -40C to +85C industrial range. In sealed enclosures with no airflow, the same design may see 12-15 C of rise, leaving 50 C of margin.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. Industrial temperature grade (-40C to +85C); not AEC-Q100 qualified. For automotive, use the PIC32MK family.
