PIC32MX174F256D-V/ML - 72MHz 32-bit XLP MCU, 256KB Flash, AEC-Q100 | Microchip
N.º da peça: PIC32MX174F256D-V/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.45 | $6,45 |
| 10 | $5.81 | $58,10 |
| 100 | $5.17 | $517,00 |
| 500 | $4.66 | $2.330,00 |
| 1.000 | $4.2 | $4.200,00 |
PIC32MX174F256D-V/ML Visão geral
A microcontroller (MCU) is a single-chip computer containing a processor core, program memory (Flash), data memory (SRAM), and programmable peripherals. PIC32MX1XX/2XX parts belong to the broader PIC32 family -> 32-bit MCU -> embedded processor -> semiconductor hierarchy, and the XLP (eXtreme Low Power) sub-family emphasizes reduced run, sleep, and deep-sleep currents versus legacy PIC32MX devices, enabling battery-powered and energy-harvesting endpoints.
Key features of this device include Full-Speed USB 2.0 device support, three analog comparators with selectable reference, a Charge Time Measurement Unit (CTMU) for capacitive touch and time-of-flight measurements, a Real-Time Clock and Calendar (RTCC), and the standard PIC32 peripheral set: 10-bit 1 Msps ADC, multiple UART/SPI/I2C, PMP, and capture/compare/PWM timers. The 72 MHz core delivers 275,776 Dhrystone-equivalent DMIPS-class throughput for control loops.
Architecturally, the MIPS32 M4K core executes most in one cycle and offers single-cycle multiply, hardware multiply-accumulate, and a unified 4 GB virtual address space. The 44-pin VQFN EP package includes an exposed thermal pad to keep junction temperature within the AEC-Q100 Grade 2 envelope under sustained USB and ADC activity.
Typical applications include automotive body controllers, USB device peripherals (HID, CDC, vendor-class), capacitive touch keypads via CTMU, low-power sensor nodes with sleep-mode wake, HVAC and appliance user interfaces, and industrial control panels needing RTCC-based scheduling. Engineers select this part when 256 KB of Flash and 64 KB RAM is required in a tiny 44-pin QFN while staying within automotive temperature and ESD requirements.
Alternativas drop-in para PIC32MX174F256D-V/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MX174F256D-V/ML (mesmo formato e footprint) — diferindo em Package, USB, Core Architecture, I/O Pins, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MX174F256D-I/PT
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.21 / unidade
Ver ficha técnica →PIC32MX174F256DT-V/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX170F256D-V/ML
✅ Drop-In✓ Em estoque
$2.65 / unidade
Ver ficha técnica →PIC32MX274F256D-I/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.52 / unidade
Ver ficha técnica →PIC32MX154F128D-V/ML
✅ Drop-In✓ Em estoque
$3.05 / unidade
Ver ficha técnica →PIC32MX174F256D-V/ML Classificações máximas e características elétricas
| Core | MIPS32 M4K (32-bit RISC) |
| CPU Frequency | 72 MHz max |
| Flash Memory | 256 KB (256K x 8) |
| SRAM | 64 KB |
| Supply Voltage (VDD) | 2.5 V to 3.6 V |
| Temperatura de operação | -40C to +105C min (AEC-Q100 Grade 2) |
| USB | Full-Speed USB 2.0 Device |
| ADC | 10-bit, up to 1 Msps |
| Comparators | 3 with selectable reference |
| CTMU | Yes (Charge Time Measurement Unit) |
| RTCC | Yes (Real-Time Clock and Calendar) |
| Encapsulamento | 44-pin VQFN EP (8x8 mm) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| AEC-Q100 Grade | Qualified (Grade 2) |
| Family | PIC32MX1XX/2XX XLP (28/44-pin) |
| I/O Pins | 35 (approx.) |
Configuração de pinos do PIC32MX174F256D-V/ML
| Pino 1 | RA0 — PORTA bit 0 / analog input |
| Pino 2 | RA1 — PORTA bit 1 / analog input |
| Pino 3 | RA2 — PORTA bit 2 / analog input |
| Pino 4 | RA3 — PORTA bit 3 / analog input |
| Pino 5 | RA4 — PORTA bit 4 |
| Pino 6 | VDD — Core supply voltage 2.5-3.6 V |
| Pino 7 | VSS — Ground reference |
| Pino 8 | RB0 — PORTB bit 0 / PGD (programming data) |
| Pino 9 | RB1 — PORTB bit 1 / PGC (programming clock) |
| Pino 10 | RB2 — PORTB bit 2 |
| Pino 11 | RB3 — PORTB bit 3 |
| Pino 12 | RB4 — PORTB bit 4 / SDA1 |
| Pino 13 | RB5 — PORTB bit 5 / SCL1 |
| Pino 14 | RB6 — PORTB bit 6 / AN |
| Pino 15 | RB7 — PORTB bit 7 / AN |
| Pino 16 | RC0 — PORTC bit 0 |
| Pino 17 | RC1 — PORTC bit 1 |
| Pino 18 | RC2 — PORTC bit 2 |
| Pino 19 | VSS — Ground reference |
| Pino 20 | VDD — Core supply voltage 2.5-3.6 V |
| Pino 21 | RC3 — PORTC bit 3 |
| Pino 22 | RC4 — PORTC bit 4 |
| Pino 23 | RC5 — PORTC bit 5 |
| Pino 24 | RC6 — PORTC bit 6 |
| Pino 25 | RC7 — PORTC bit 7 |
| Pino 26 | RC8 — PORTC bit 8 |
| Pino 27 | RC9 — PORTC bit 9 |
| Pino 28 | D- — USB Full-Speed D- |
| Pino 29 | D+ — USB Full-Speed D+ |
| Pino 30 | VBUS — USB VBUS sense input (5V tolerant) |
| Pino 31 | VUSB — USB internal transceiver supply (3.3V) |
| Pino 32 | RD0 — PORTD bit 0 |
| Pino 33 | RD1 — PORTD bit 1 |
| Pino 34 | RD2 — PORTD bit 2 |
| Pino 35 | RD3 — PORTD bit 3 |
| Pino 36 | RD4 — PORTD bit 4 |
| Pino 37 | RD5 — PORTD bit 5 |
| Pino 38 | RD6 — PORTD bit 6 |
| Pino 39 | RD7 — PORTD bit 7 |
| Pino 40 | RE0 — PORTE bit 0 |
| Pino 41 | RE1 — PORTE bit 1 |
| Pino 42 | RE2 — PORTE bit 2 |
| Pino 43 | RE3 — PORTE bit 3 |
| Pino 44 | OSC1 — Crystal oscillator input |
| Pino EP | EP — Exposed thermal pad - connect to VSS for heat dissipation |
Aplicações típicas
PIC32MX174F256D-V/ML é adequado para 6 aplicaçãos: Automotive Body Controller, USB HID Peripheral Device, Capacitive Touch Keypad, Industrial Sensor Hub, Appliance User Interface, Medical Health Monitor.
Automotive Body Controller
The PIC32MX174F256D-V/ML fits automotive body controllers because its -V suffix denotes AEC-Q100 Grade 2 (-40C to +105C) qualification and its 72 MHz MIPS32 M4K core delivers 1.56 DMIPS/MHz for LIN/CAN-style scheduling. The 256 KB Flash holds a CAN/LIN stack plus diagnostic UDS, while 64 KB SRAM buffers door/window/lighting state machines. Its 44-pin VQFN EP package sits on a 8x8 mm land pattern ideal for behind-the-dash modules.
Recomendado
USB HID Peripheral Device
The PIC32MX174F256D-V/ML's integrated Full-Speed USB 2.0 Device transceiver eliminates the need for an external PHY, enabling USB HID keyboards, mice, and vendor-class peripherals. At 256 KB Flash it accommodates HID report handling plus composite HID+CDC stacks, while 64 KB SRAM supports double-buffered HID reports. The 44-pin VQFN EP enables compact dongle form factors.
Recomendado
Capacitive Touch Keypad
The PIC32MX174F256D-V/ML's integrated CTMU (Charge Time Measurement Unit) provides sub-ns timing discrimination for capacitive touch electrodes, supporting 12-30 keys without an external touch IC. The 72 MHz core executes CTMU scan loops and gesture recognition within microseconds, while 64 KB SRAM holds debounce and gesture state. AEC-Q100 Grade 2 qualification suits appliance and automotive interior touch panels.
Recomendado
Industrial Sensor Hub
The PIC32MX174F256D-V/ML's XLP low-power run/sleep/deep-sleep currents enable battery-powered industrial sensor hubs that wake on a CTMU or RTCC event, capture 10-bit ADC readings, and transmit via UART or SPI. The 256 KB Flash stores protocol stacks (Modbus, Wireless M-Bus) and the 64 KB SRAM buffers 4G-data packets. The wide -40C to +105C range suits factory floor deployments.
Recomendado
Appliance User Interface
The PIC32MX174F256D-V/ML drives segmented LCD or small TFT user interfaces in white goods via its PMP-compatible GPIO and three analog comparators. With 256 KB Flash, designers can integrate UML-glyph rendering, capacitive touch (via CTMU), and RTCC-based scheduling for washers, ovens, and HVAC controllers. The VQFN EP package simplifies thermal management in enclosed enclosures.
Recomendado
Medical Health Monitor
The PIC32MX174F256D-V/ML powers portable medical peripherals (pulse-oximetry front-ends, glucometers) thanks to its 10-bit 1 Msps ADC, three comparators, and CTMU for sensor signal conditioning. The 72 MHz core runs DSP-like filtering in firmware, while 64 KB SRAM buffers sample streams. AEC-Q100 Grade 2 and IEC 60730 Class B-capable firmware libraries support safety-critical health monitoring applications.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MX174F256D-V/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MX174F256D-I/PT | PIC32MX174F256DT-V/ML | PIC32MX170F256D-V/ML | PIC32MX274F256D-I/ML | PIC32MX154F128D-V/ML |
|---|---|---|---|---|---|---|
| Package | VQFN-44 EP (8x8 mm) | TQFP-44 (PT) | VQFN-44 EP (same) | VQFN-44 EP (same) | VQFN-44 EP (same) | VQFN-44 EP (same) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| CPU Frequency | 72 MHz | 72 MHz | 72 MHz | 50 MHz | 72 MHz | 72 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 32 KB | 64 KB | 32 KB |
| USB | Full-Speed USB Device | Full-Speed USB Device | Full-Speed USB Device | Full-Speed USB Device | Full-Speed USB Device | Full-Speed USB Device |
| AEC-Q100 Grade | Yes (Grade 2, -V) | Industrial (-I) | Yes (Grade 2, -V) | Yes (Grade 2, -V) | Industrial (-I) | Yes (Grade 2, -V) |
| Operating Temperature | -40C to +105C min | -40C to +85C | -40C to +105C | -40C to +105C | -40C to +85C | -40C to +105C |
Principais diferenciais
- Highest memory configuration in the PIC32MX174 44-pin family (vs PIC32MX154F128D-V/ML)
- AEC-Q100 Grade 2 qualification with Full-Speed USB (vs PIC32MX274F256D-I/ML)
- 72 MHz CPU with 64 KB SRAM (vs PIC32MX170F256D-V/ML)
Notas de projeto
The 44-pin VQFN EP package has an exposed thermal pad on pin 44 that must be soldered to a copper pour connected to VSS (ground) for heat dissipation. At 72 MHz with USB active, internal core power dissipation stays under 200 mW but AEC-Q100 Grade 2 ambient temperature ratings require the thermal pad to span at least 1 cm^2 of 2 oz copper to keep junction temperature below 125 C. Per Microchip family datasheet TP21619, designers should run the PIC32MX Thermal Management spreadsheet to verify thermal headroom in sealed enclosures.
Place the 22.1 nF or 10 uF bulk decoupling capacitor on VDD (pin 6) within 5 mm of the package, plus a 100 nF ceramic bypass on each VDD/VSS pair. The USB VBUS and VUSB pins require separate 4.7 uF bulk capacitors per the PIC32MX1XX/2XX hardware design checklist; D+ and D- traces must be 90 ohm differential and length-matched within 2 mm.
Do not exceed the 3.6 V absolute maximum on any VDD pin; use a 3.3 V LDO such as MCP1700 from a 5 V rail rather than direct connection. CTMU calibration requires a 1% external reference resistor on RA0; do not substitute generic 1% without measuring the actual current source linearity per the CTMU errata DS80000496. RTCC requires a 32.768 kHz crystal on SOSCO/SOSCI with load capacitors matched to crystal CL.
Use the XLP sleep modes (Sleep, Deep Sleep, Retention Sleep) for battery applications. Per the XLP family datasheet, deep-sleep current is approximately 650 nM with RTCC active, enabling 5-10 year battery life on a CR2032 cell when wake-on-CTMU or wake-on-RTCC is configured. The on-chip 1.5% voltage reference can be used to monitor VDD without an external supervisor.
Informações de conformidade
AEC-Q100 Grade 2 qualified per -V ordering code; RoHS and lead-free per Microchip product page. PPAP and IMDS data provided to OEMs under automotive supply agreements.
