PIC32MX210F016BT-I/ML - 32-bit 40MHz MCU 16KB Flash | Microchip
N.º da peça: PIC32MX210F016BT-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.3 | $3,30 |
| 10 | $2.97 | $29,70 |
| 100 | $2.41 | $241,00 |
| 500 | $2.05 | $1.025,00 |
| 1.000 | $1.69 | $1.690,00 |
PIC32MX210F016BT-I/ML Visão geral
A 32-bit microcontroller (MCU) is a microprocessor-based controller whose data path, registers and ALU are 32 bits wide, enabling higher throughput, larger addressable memory and richer peripherals than 8-bit or 16-bit MCUs. PIC32MX devices sit in the power-management IC family hierarchy as low-power MCU SoCs that combine a CPU core, on-chip memory, timers, communication peripherals and analog blocks into a single chip. The MIPS32 M4K core used here is a Harvard-architecture RISC core widely deployed in PIC32MX1xx/2xx/3xx/4xx/5xx/6xx/7xx families.
Key features include 16 KB Flash, 4 KB SRAM, 40 MHz maximum CPU speed, 10-bit ADC with up to 10 channels, two UART modules, two I2C modules, two SPI modules, five 16-bit timers/counters, and Peripheral Pin Select (PPS) for flexible signal routing. The device integrates separate PLLs for CPU and USB clocks, USB 2.0 full-speed device/host/OTG, and configurable power management modes for energy-constrained designs.
The architecture relies on a single-cycle multiply unit, a hardware DMA engine (up to 4 channels with automatic data-size detection) and an internal 8 MHz oscillator with PLL multiplication. The exposed pad on the QFN package provides a low-thermal-resistance path, while the 32-bit MIPS core delivers 1.56 DMIPS/MHz performance, suiting control loops and protocol stacks that exceed 8-bit MCU capability.
Typical applications include consumer electronics, industrial control nodes, USB peripherals, sensor hubs, low-cost graphical user interfaces, and home appliances. The combination of small Flash, ample I/O and USB makes it well suited to HID-class devices, motor control boards, and audio/graphics front-ends that need 32-bit headroom without stepping up to Cortex-M class pricing.
When designing with this part, ensure the exposed pad is soldered to a sufficiently large copper pour for thermal relief and ground integrity. Decouple VDD/VUSB with 100 nF + 4.7 uF ceramics placed within 3 mm of the pins, and follow Microchip's PIC32MX Family Reference Manual for DMA and PPS configuration to avoid pin conflicts.
This page synthesizes distributor pricing, drop-in alternatives within the same 28-QFN footprint, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para PIC32MX210F016BT-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MX210F016BT-I/ML (mesmo formato e footprint) — diferindo em Package, ADC, Operating Temperature, Active Current Consumption, Core.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MX220F016B-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX210F016B-I/ML
✅ Drop-In✓ Em estoque
$2.18 / unidade
Ver ficha técnica →PIC32MX230F016B-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX130F064B-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX110F016B-I/ML
✅ Drop-In✓ Em estoque
$1.82 / unidade
Ver ficha técnica →PIC32MX120F032B-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX210F016BT-I/ML Classificações máximas e características elétricas
| Core | MIPS32 M4K |
| Largura do barramento de dados | 32-bit |
| Maximum CPU Frequency | 40 MHz |
| Program Memory Size | 16 KB (16K x 8) Flash |
| RAM Size | 4 KB (4K x 8) |
| Supply Voltage Range | 2.3 V to 3.6 V |
| Number of I/O Pins | 19 |
| Encapsulamento | 28-VQFN Exposed Pad (6x6 mm) |
| ADC | 10-bit |
| Faixa de temperatura de operação | -40 C to +85 C |
| Tipo de montagem | Surface Mount |
| Packaging | Tube (cut-tape option) |
| Status RoHS | Compliant |
| Peripherals | Brown-out Detect, DMA, POR, PWM, WDT |
| Connectivity | I2C, SPI, UART, USB |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| Oscillator Type | Internal |
Configuração de pinos do PIC32MX210F016BT-I/ML
| Pino 1 | RA0 — General purpose I/O / analog input |
| Pino 2 | RA1 — General purpose I/O / analog input |
| Pino 3 | RA2 — General purpose I/O / analog input |
| Pino 4 | RA3 — General purpose I/O / analog input |
| Pino 5 | RA4 — General purpose I/O |
| Pino 6 | VDD — Positive supply voltage |
| Pino 7 | VSS — Ground reference |
| Pino 8 | OSC1/CLKI/RA5 — Crystal input or general I/O |
| Pino 9 | OSC2/CLKO/RA6 — Crystal output or general I/O |
| Pino 10 | PGEC1/AN0/RB0 — Programming clock / analog / I/O |
| Pino 11 | PGED1/AN1/RB1 — Programming data / analog / I/O |
| Pino 12 | AN2/RB2 — Analog input / I/O |
| Pino 13 | AN3/RB3 — Analog input / I/O |
| Pino 14 | AN4/RB4 — Analog input / I/O |
| Pino 15 | AN5/RB5 — Analog input / I/O |
| Pino 16 | AN6/RB6 — Analog input / I/O |
| Pino 17 | AN7/RB7 — Analog input / I/O |
| Pino 18 | VUSB — USB transceiver supply |
| Pino 19 | D-/RB9 — USB D- or I/O |
| Pino 20 | D+/RB10 — USB D+ or I/O |
| Pino 21 | RB11 — General purpose I/O |
| Pino 22 | RB12 — General purpose I/O |
| Pino 23 | RB13 — General purpose I/O |
| Pino 24 | RB14 — General purpose I/O |
| Pino 25 | RB15 — General purpose I/O |
| Pino 26 | RC0 — General purpose I/O |
| Pino 27 | RC1 — General purpose I/O |
| Pino 28 | RC2 — General purpose I/O |
Aplicações típicas
PIC32MX210F016BT-I/ML é adequado para 7 aplicaçãos: USB HID Peripheral Devices, Industrial Sensor Hubs, Consumer Electronics Control Boards, Low-Cost Data Acquisition Modules, Home Automation Gateways, Educational and Maker Boards, Battery-Powered Wearable Controllers.
USB HID Peripheral Devices
The PIC32MX210F016BT-I/ML's integrated USB 2.0 full-speed Device/Host/OTG with dedicated PLL and 40 MHz MIPS M4K core makes it ideal for USB HID-class peripherals such as keyboards, mice, game controllers and custom HID interfaces. The 16 KB Flash fits HID report descriptors plus composite device stacks, while 4 KB SRAM handles HID report buffers and protocol state. Its 28-QFN (6x6 mm) footprint drops easily onto compact PCBs, and the USB module's DMA support offloads packet handling from the CPU for low-latency response.
Recomendado
Industrial Sensor Hubs
The PIC32MX210F016BT-I/ML suits industrial sensor-hub nodes that aggregate analog and digital sensors over UART, I2C and SPI. Its 10-bit ADC with multiple channels handles low-speed sensor sampling, while the 32-bit MIPS core runs filtering and Modbus/IO-Link protocols within 16 KB Flash. The exposed thermal pad on the 28-QFN package helps dissipate heat in enclosed industrial enclosures, and the 2.3-3.6 V supply tolerance accommodates 3.3 V industrial rails with battery backup.
Recomendado
Consumer Electronics Control Boards
The PIC32MX210F016BT-I/ML fits consumer appliance control boards needing 32-bit performance for touch UI, motor PWM and LED driving. Five 16-bit timers handle multiple PWM channels for brushless DC motor control, and PPS enables flexible signal routing for display drivers or capacitive touch ICs. The 28-QFN (6x6 mm) keeps the BOM compact for thin consumer enclosures, while the 19 GPIO cover button matrices, status LEDs and serial interfaces typical of small appliances.
Recomendado
Low-Cost Data Acquisition Modules
The PIC32MX210F016BT-I/ML's 10-bit ADC, dual UART and SPI ports enable compact data-acquisition front-ends for environmental monitoring and lab instruments. The DMA engine offloads sample transfers to RAM, freeing the M4K core for FFT and statistics. With 16 KB Flash and 4 KB SRAM, designers can implement basic streaming protocols or local logging. The QFN package's exposed pad simplifies thermal management when sampling at high channel-switching rates.
Recomendado
Home Automation Gateways
The PIC32MX210F016BT-I/ML serves as a bridge MCU in home automation gateways that aggregate Zigbee, Bluetooth or sub-GHz radios over UART/SPI and forward state to the cloud over USB or Wi-Fi companion modules. Its USB OTG capability allows field firmware upgrade from a USB stick, and the 32-bit core runs MQTT-SN or proprietary protocols within 16 KB Flash. The 28-QFN package supports compact PCBAs designed behind wall switches or plug-in adapters.
Recomendado
Educational and Maker Boards
The PIC32MX210F016BT-I/ML is widely adopted in educational kits and maker boards thanks to its low price, USB device support and Microchip's free MPLAB X IDE plus Harmony toolchain. Its 40 MHz 32-bit core introduces students to MIPS architecture, while the 28-QFN (6x6 mm) keeps breakout boards compact. The 16 KB Flash and 4 KB SRAM are enough for LED control, sensor reading and basic RTOS tutorials without exhausting code space immediately.
Recomendado
Battery-Powered Wearable Controllers
The PIC32MX210F016BT-I/ML's configurable low-power modes (Sleep, Idle, Deep Sleep) suit battery-powered wearable controllers such as fitness bands and BLE sensor patches. Its 2.3 V minimum supply supports single-cell Li-Ion down to cutoff, and the USB module enables charging plus data over a single connector. The 28-QFN (6x6 mm) footprint leaves room for additional sensors or BLE radios on the same PCB, while PPS simplifies routing for tight wearable layouts.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MX210F016BT-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MX220F016B-I/ML | PIC32MX210F016B-I/ML | PIC32MX230F016B-I/ML | PIC32MX130F064B-I/ML | PIC32MX110F016B-I/ML | PIC32MX120F032B-I/ML |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-VQFN Exposed Pad (6x6 mm) | 28-VQFN Exposed Pad (6x6 mm) - same | 28-VQFN Exposed Pad (6x6 mm) - same | 28-VQFN Exposed Pad (6x6 mm) - same | 28-VQFN Exposed Pad (6x6 mm) - same | 28-VQFN Exposed Pad (6x6 mm) - same | 28-VQFN Exposed Pad (6x6 mm) - same |
| Program Flash | 16 KB | 32 KB | 16 KB | 16 KB | 64 KB | 16 KB | 32 KB |
| RAM | 4 KB | 8 KB | 4 KB | 4 KB | 8 KB | 4 KB | 8 KB |
| Max CPU Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Number of I/O Pins | 19 | 19 | 19 | 19 | 21 | 19 | 21 |
| Supply Voltage Range | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V |
| USB Support | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | No USB | USB 2.0 Full-Speed OTG |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Principais diferenciais
- Dual Flash option in same footprint (vs PIC32MX110F016B-I/ML)
- Better cost-per-feature than 64 KB sibling (vs PIC32MX130F064B-I/ML)
- Identical silicon, lower-friction packaging (vs PIC32MX210F016B-I/ML)
Notas de projeto
The 28-VQFN package has an exposed thermal pad that MUST be soldered to a ground pour of at least 16 mm^2 to meet the datasheet's thermal and electrical performance. Place 100 nF + 4.7 uF ceramic decoupling capacitors within 3 mm of VDD and VSS pins, and keep D+/D- traces matched within 2 mm and length-matched to the USB connector to avoid signal-integrity issues.
Use the on-chip Low-Voltage Detect (LVD) and Brown-Out Reset (BOR) to protect Flash integrity during supply dips. Configure BOR for a trip voltage near 2.5 V so that a sagging 3.3 V rail does not corrupt program memory. For USB applications, VUSB must be tied to VDD through a ferrite bead and decoupled with 100 nF + 4.7 uF per the PIC32MX Family Reference Manual.
Do not confuse PGEC1/PGED1 (RB0/RB1) with PGEC2/PGED2 when designing the ICSP header. On 28-pin devices only PGEC1/PGED1 are bonded; using alternate pairs will fail programming. Also note that some QFN pads default to analog inputs at reset; configure them as digital with the appropriate ANSx register before reading GPIO, otherwise the digital input buffer stays disabled.
When using the USB OTG module, place a 90.9 ohm +/-1% series resistor on each of D+ and D- as close to the MCU as possible, and ensure the differential pair is routed with 90 ohm impedance. Avoid splitting the ground plane under USB traces; keep a continuous ground return path beneath the differential pair to suppress common-mode noise.
Informações de conformidade
RoHS and REACH compliance per Microchip product page. Industrial temperature grade (-40 C to +85 C) is the only option for the -I suffix variant; the -E suffix provides extended temperature grade.
