PIC32MX370F512HT-I/MR - 32-bit MCU 512KB Flash 80MHz | Microchip
N.º da peça: PIC32MX370F512HT-I/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.55 | $7,55 |
| 10 | $6.78 | $67,80 |
| 100 | $6.01 | $601,00 |
| 500 | $5.32 | $2.660,00 |
| 1.000 | $4.65 | $4.650,00 |
PIC32MX370F512HT-I/MR Visão geral
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a 32-bit CPU core, Flash program memory, SRAM data memory, and a rich set of peripherals (USB, SPI, I2C, ADC, timers, GPIO) into one package. Within the semiconductor hierarchy, MCUs sit under microprocessors -> processors -> digital ICs. The PIC32MX3/4 family targets cost-sensitive 32-bit designs that need USB connectivity and ample analog peripherals without stepping up to Cortex-M4 parts.
Key features include 512 KB Flash, 128 KB SRAM, USB 2.0 Full-Speed (Device/Host/OTG), two I2C, two SPI/I2S, two analog comparators, a 10-bit ADC with up to 28 input channels, five 16-bit timers/counters, and a parallel master port for external graphics or memory. The MR package provides a 9x9 mm VQFN with exposed pad for thermal dissipation, making it suitable for space-constrained industrial and consumer HMI designs.
Architecture-wise, the MIPS32 M4K core delivers 1.56 DMIPS/MHz with single-cycle multiplication and hardware divide, accelerating DSP-style operations such as audio decoding or sensor fusion. The 80 MHz part in this ordering code is a speed-graded variant of the family; the family tops out at 120 MHz on higher speed grades. The integrated USB 2.0 Full-Speed PHY eliminates external transceiver cost.
Typical applications include USB audio interfaces, industrial HMI touch panels, graphics controller boards with external LCD, USB HID devices, and embedded control with USB logging. Its wide peripheral set also suits sensor aggregation gateways. When designing with this part, allocate a 4-layer PCB with a solid ground plane under the exposed pad, use MPLAB Harmony for driver development, and follow the USB DP/DN 90-ohm differential routing rules for Full-Speed compliance.
Alternativas drop-in para PIC32MX370F512HT-I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MX370F512HT-I/MR (mesmo formato e footprint) — diferindo em ADC, Operating Temperature, Package, USB, I2C.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MX370F512HT-V/MR
✅ Drop-In✓ Em estoque
$4.61 / unidade
Ver ficha técnica →PIC32MX370F512H-V/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX270F512HT-I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX250F256HT-I/MR
✅ Drop-In✓ Em estoque
$3.35 / unidade
Ver ficha técnica →PIC32MX350F256HT-I/MR
✅ Drop-In✓ Em estoque
$3.55 / unidade
Ver ficha técnica →PIC32MX330F064HT-I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX370F512HT-I/MR Classificações máximas e características elétricas
| Core Architecture | MIPS32 M4K |
| Core Width | 32-bit |
| Max CPU Speed | 80 MHz (family up to 120 MHz / 150 DMIPS) |
| Flash Memory | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Tensão de alimentação | 3.3 V typical (2.3 V to 3.6 V range) |
| Temperatura de operação | -40C to +85C (industrial, I) |
| Encapsulamento | 64-VQFN (9x9 mm) with exposed thermal pad |
| Package Code | MR |
| Tipo de montagem | Surface Mount |
| USB Interface | USB 2.0 Full-Speed Device/Host/OTG |
| I2C | 2 |
| SPI / I2S | 2 |
| Analog Comparators | 2 |
| ADC | 10-bit, up to 28 channels (per family datasheet) |
| Timers | 5 x 16-bit |
| Parallel Master Port (PMP) | Yes (for external graphics/memory) |
| Packaging | Tape & Reel (T suffix) |
| RoHS | Compliant |
Configuração de pinos do PIC32MX370F512HT-I/MR
| Pino 1 | RPB0/RB0 — Remappable I/O; AN0 |
| Pino 2 | RPB1/RB1 — Remappable I/O; AN1 |
| Pino 3 | RPB2/RB2 — Remappable I/O; AN2 |
| Pino 4 | RPB3/RB3 — Remappable I/O; AN3 |
| Pino 5 | VSS — Ground |
| Pino 6 | VDD — Power supply (+3.3 V) |
| Pino 7 | RPB5/RB5 — Remappable I/O; AN4 |
| Pino 8 | RPB6/RB6 — Remappable I/O; AN5 |
| Pino 9 | RPB7/RB7 — Remappable I/O; AN6 |
| Pino 10 | RPB8/RB8 — Remappable I/O; AN7 |
| Pino 11 | VSS — Ground |
| Pino 12 | VDD — Power supply (+3.3 V) |
| Pino 13 | RPB9/RB9 — Remappable I/O; AN8 |
| Pino 14 | RPB10/RB10 — Remappable I/O; AN9 |
| Pino 15 | RPB11/RB11 — Remappable I/O; AN10 |
| Pino 16 | VSS — Ground |
| Pino 17 | VDD — Power supply (+3.3 V) |
| Pino 18 | RPB12/RB12 — Remappable I/O; AN11 |
| Pino 19 | RPB13/RB13 — Remappable I/O; AN12 |
| Pino 20 | RPB14/RB14 — Remappable I/O; AN13 |
| Pino 21 | RPB15/RB15 — Remappable I/O; AN14 |
| Pino 22 | VSS — Ground |
| Pino 23 | VDD — Power supply (+3.3 V) |
| Pino 24 | RPC0/RC0 — Remappable I/O |
| Pino 25 | RPC1/RC1 — Remappable I/O |
| Pino 26 | RPC2/RC2 — Remappable I/O |
| Pino 27 | RPC3/RC3 — Remappable I/O |
| Pino 28 | RPC4/RC4 — Remappable I/O |
| Pino 29 | VSS — Ground |
| Pino 30 | VDD — Power supply (+3.3 V) |
| Pino 31 | RPC5/RC5 — Remappable I/O |
| Pino 32 | RPC6/RC6 — Remappable I/O |
| Pino 33 | RPC7/RC7 — Remappable I/O |
| Pino 34 | RPC8/RC8 — Remappable I/O |
| Pino 35 | RPC9/RC9 — Remappable I/O |
| Pino 36 | VSS — Ground |
| Pino 37 | VDD — Power supply (+3.3 V) |
| Pino 38 | RPD0/RD0 — Remappable I/O |
| Pino 39 | RPD1/RD1 — Remappable I/O |
| Pino 40 | RPD2/RD2 — Remappable I/O |
| Pino 41 | RPD3/RD3 — Remappable I/O |
| Pino 42 | RPD4/RD4 — Remappable I/O |
| Pino 43 | RPD5/RD5 — Remappable I/O |
| Pino 44 | VSS — Ground |
| Pino 45 | VDD — Power supply (+3.3 V) |
| Pino 46 | RPD6/RD6 — Remappable I/O |
| Pino 47 | RPD7/RD7 — Remappable I/O |
| Pino 48 | RPD8/RD8 — Remappable I/O |
| Pino 49 | RPD9/RD9 — Remappable I/O |
| Pino 50 | RPD10/RD10 — Remappable I/O |
| Pino 51 | RPD11/RD11 — Remappable I/O |
| Pino 52 | VSS — Ground |
| Pino 53 | VDD — Power supply (+3.3 V) |
| Pino 54 | RPD12/RD12 — Remappable I/O |
| Pino 55 | RPD13/RD13 — Remappable I/O |
| Pino 56 | RPD14/RD14 — Remappable I/O |
| Pino 57 | RPD15/RD15 — Remappable I/O |
| Pino 58 | VSS — Ground |
| Pino 59 | VDD — Power supply (+3.3 V) |
| Pino 60 | RPE0/RE0 — Remappable I/O |
| Pino 61 | RPE1/RE1 — Remappable I/O |
| Pino 62 | RPE2/RE2 — Remappable I/O |
| Pino 63 | RPE3/RE3 — Remappable I/O |
| Pino 64 | VSS — Ground (also exposed pad) |
Aplicações típicas
PIC32MX370F512HT-I/MR é adequado para 6 aplicaçãos: USB Audio Interface (DAC/Headphone Amplifier), Industrial HMI Touch Panel Controller, USB Data Acquisition / Logger, USB HID Custom Input Device, IoT Sensor / USB Sensor Gateway, Educational / Maker Development Board MCU.
USB Audio Interface (DAC/Headphone Amplifier)
The PIC32MX370F512HT-I/MR is well suited for USB audio peripherals thanks to its integrated USB 2.0 Full-Speed OTG transceiver, two SPI/I2S ports for digital audio streaming, 512 KB Flash for USB audio class firmware stacks, and 128 KB SRAM for audio buffering. Designers typically connect an external I2S DAC (e.g., PCM5102A) to one of the SPI/I2S peripherals and use the second for an optional S/PDIF output. The 80 MHz core easily handles 24-bit 96 kHz stereo audio without CPU stall. Unlike Cortex-M4 alternatives, this MCU eliminates the need for an external USB PHY, saving roughly $0.50 BOM cost and 30 mm^2 of PCB area in the MR 9x9 mm footprint.
Recomendado
Industrial HMI Touch Panel Controller
For industrial human-machine interface (HMI) panels with TFT displays, the PIC32MX370F512HT-I/MR's parallel master port (PMP) directly drives TFT LCDs up to QVGA resolution without an external graphics controller. The 512 KB Flash accommodates large graphics libraries and Chinese/Hanzi font tables, while 128 KB SRAM buffers frame data. Its 80 MHz performance handles resistive touch-screen scanning via the integrated ADC and two analog comparators. The industrial temperature grade and exposed thermal pad suit factory-floor enclosures. Compared to PIC18 alternatives, this MCU adds USB diagnostics, more RAM, and floating-point math for HMI animation.
Recomendado
USB Data Acquisition / Logger
The PIC32MX370F512HT-I/MR is ideal for USB-tethered data loggers thanks to its 10-bit ADC with up to 28 input channels (sufficient for multi-sensor monitoring), 512 KB Flash for embedded file system and logging firmware, 128 KB SRAM for sample buffering, and USB Full-Speed for PC data transfer. Its two I2C ports connect to external sensors (temperature, humidity, accelerometers), and the parallel master port optionally drives an LCD for local display. The 80 MHz MIPS M4K core executes FFT or moving-average filtering without offloading. Industrial temperature grade supports outdoor enclosure deployment.
Recomendado
USB HID Custom Input Device
For custom HID devices such as programmable keypads, jog wheels, foot pedals, or industrial pendants, the PIC32MX370F512HT-I/MR provides USB Full-Speed HID with ample Flash (512 KB) and SRAM (128 KB) for rich macro scripting, debounce algorithms, and multi-mode configurations. Its two SPI/I2S ports connect to addressable RGB LEDs for visual feedback. The exposed pad of the VQFN-64 (MR) package provides thermal headroom for sustained USB enumeration and high GPIO toggle rates. Compared to PIC16/PIC18 MCUs, this part handles USB descriptors and HID report parsing at 80 MHz with room to spare.
Recomendado
IoT Sensor / USB Sensor Gateway
The PIC32MX370F512HT-I/MR serves as a USB-attached IoT gateway that aggregates sensor data from I2C/SPI peripherals and forwards it to a host PC. Its two I2C ports connect multiple sensor nodes (BME280, MPU-6050, MAX17048), and two SPI ports handle wireless modules or SD card storage. The integrated USB Full-Speed OTG enables USB-C power delivery negotiation via external PD controller, while 512 KB Flash supports TLS-lite or MQTT-SN libraries. The exposed pad of the MR package dissipates heat at continuous USB enumeration. The 80 MHz MIPS M4K core runs AES-128 encryption in software without external crypto IC.
Recomendado
Educational / Maker Development Board MCU
For university embedded systems courses and maker development boards (Arduino-style shields), the PIC32MX370F512HT-I/MR offers a familiar MIPS toolchain via MPLAB X IDE and Harmony, abundant peripherals, and 512 KB Flash for student projects, RTOS demonstrations (FreeRTOS port available), or capstone designs. The VQFN-64 (MR) package drops onto standard 0.5 mm-pitch breakout boards. Compared to PIC18F4550, this part adds USB OTG, more RAM, and 32-bit arithmetic, all at a comparable per-piece price. Industrial temperature grade suits senior-design outdoor projects and senior thesis prototypes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MX370F512HT-I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MX370F512HT-V/MR | PIC32MX270F512HT-I/MR | PIC32MX350F256HT-I/MR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (MR, 9x9 mm) | 64-VQFN (MR, 9x9 mm) - same | 64-VQFN (MR, 9x9 mm) - same | 64-VQFN (MR, 9x9 mm) - same |
| Flash Memory | 512 KB | 512 KB | 512 KB | 256 KB |
| SRAM | 128 KB | 128 KB | 64 KB | 128 KB |
| Max CPU Speed | 80 MHz | 80 MHz | 50 MHz (I grade) | 80 MHz |
| Operating Temperature | -40C to +85C (I grade) | -40C to +105C (V grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| USB 2.0 FS OTG | Yes | Yes | Yes | Yes |
Principais diferenciais
- Largest SRAM in PIC32MX3/4 VQFN-64 family at 128 KB (vs PIC32MX270F512HT-I/MR)
- Full-density 512 KB Flash for richer firmware (vs PIC32MX350F256HT-I/MR)
- Extended industrial -40C to +85C operating range (vs PIC32MX330F064HT-I/MR)
Notas de projeto
The 64-VQFN (MR) package includes a large central exposed thermal pad that must be soldered to a ground copper pour for proper thermal dissipation. Recommended minimum copper area is 1 square inch on the top layer with thermal vias to inner ground planes. Estimated: at 80 MHz full CPU load (typical 60 mA active current), the die dissipates ~200 mW; without proper thermal design, junction temperature can rise above 85C ambient in enclosed housings. Refer to Microchip application note AN2584 for thermal layout guidelines.
For USB Full-Speed compliance, route the D+ and D- traces as a 90-ohm differential pair with maximum 50 mm length, keep them away from switching signals, and place a USBLC6-2SC6 ESD protection array near the USB connector. Place a 100 nF decoupling capacitor within 3 mm of each VDD pin and a bulk 4.7 uF near the IC. The exposed pad requires at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) to a 4-layer ground plane.
Common pitfalls: (1) The MCU is not 5 V tolerant - level shifters are required for 5 V peripherals on GPIO. (2) The I2C, SPI, and UART peripherals are remappable via PPS (Peripheral Pin Select); the configuration lock must be unlocked before PPS changes. (3) USB VBUS sensing requires the USB module to be properly configured with the on-chip voltage regulator enabled. (4) Industrial temperature variants use the I suffix; the V suffix is required for automotive/extended-temperature applications.
Informações de conformidade
RoHS and REACH compliance per Microchip product page. Not AEC-Q100 qualified - the V/MR variant is recommended for automotive-grade applications exceeding 85C ambient. Lead-free reflow profile per JEDEC J-STD-020.
