PIC32MX664F064L-V/BG - 80MHz 32-bit MIPS MCU USB OTG TFBGA-121 | Microchip
N.º da peça: PIC32MX664F064L-V/BG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.42 | $8,42 |
| 10 | $7.55 | $75,50 |
| 100 | $6.42 | $642,00 |
| 500 | $5.51 | $2.755,00 |
| 1.000 | $4.78 | $4.780,00 |
| 2.500 | $4.25 | $10.625,00 |
PIC32MX664F064L-V/BG Visão geral
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a high-performance processor core, program and data memory, and programmable peripherals around a unified system bus. Within the broader semiconductor taxonomy, MCUs belong to the integrated circuits family, and 32-bit variants such as the PIC32MX sit above 8-bit and 16-bit microcontrollers in processing performance while retaining deterministic real-time behavior. The PIC32MX6xx sub-family specifically targets USB- and Ethernet-connected embedded designs where on-chip connectivity peripherals eliminate the need for external PHY or MAC chips.
Key differentiating features of this part include the integrated USB 2.0 On-The-Go transceiver with PHY, a 10/100 Mbps Ethernet MAC with MII/RMII interfaces, the MIPS16e code-compression mode that reduces code size up to 40 percent, a 5-stage pipelined Harvard architecture, and four DMA channels optimized for USB OTG throughput. The on-chip 10-bit 1 Msps ADC and the configurable 16-bit timer/capture/compare/PWM modules further extend its applicability to mixed-signal designs.
In terms of architecture, the M4K core implements a 5-stage pipeline with separate instruction and data buses (Harvard), branch delay slots handled in hardware, and a Multiply/Divide unit that executes 32x16 MACs in one cycle. The memory map places 64 KB of Flash and 32 KB of SRAM on the same bus, with Flash prefetch and wait-state generation handled transparently. Code development is supported through Microchip's MPLAB X IDE and the MPLAB Harmony framework, both of which provide peripheral libraries, USB and TCP/IP stacks, and real-time operating system options.
Typical applications include industrial USB peripherals such as data loggers and POS terminals, 10/100 Ethernet-enabled embedded nodes, USB OTG device/host bridges, CAN-bus interface cards, and connectivity-rich consumer devices that need simultaneous USB and Ethernet operation. The wide peripheral set also suits motor-control front ends and human-machine interface panels.
When designing with this device, allocate adequate decoupling on every AVDD/VDD pair, respect the 121-ball TFBGA PCB layout rules (0.8 mm pitch, microvia-friendly fanout), and use the on-chip regulator decoupling guidelines from the datasheet to keep core and I/O rails clean during USB Full-Speed transitions.
This page synthesizes current distributor pricing, drop-in same-brand alternatives, and practical design notes that are not aggregated in any single manufacturer datasheet or distributor listing, giving engineers a one-stop reference for the PIC32MX664F064L-V/BG.
Alternativas drop-in para PIC32MX664F064L-V/BG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MX664F064L-V/BG (mesmo formato e footprint) — diferindo em DMA Channels, Package, ADC, Core Architecture, SPI.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MX664F064LT-V/BG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX664F064L-I/BG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX564F064L-V/BG
✅ Drop-In✓ Em estoque
$3.74 / unidade
Ver ficha técnica →PIC32MX564F128LT-V/BG
✅ Drop-In✓ Em estoque
$4.97 / unidade
Ver ficha técnica →PIC32MX460F512L-80V/BG
✅ Drop-In✓ Em estoque
$6.1 / unidade
Ver ficha técnica →PIC32MX664F064L-V/BG Classificações máximas e características elétricas
| Core Architecture | MIPS32 M4K, 5-stage pipeline, Harvard bus |
| Core Frequency | 80 MHz (105 DMIPS) |
| Flash Program Memory | 64 KB (64K x 8) |
| SRAM Data Memory | 32 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Faixa de temperatura de operação | -40 C to +105 C |
| USB Interface | USB 2.0 On-The-Go with integrated PHY |
| Ethernet MAC | 10/100 Mbps with MII/RMII |
| ADC | 10-bit, 1 Msps |
| DMA Channels | 4 (dedicated for USB OTG) |
| Code Compression | MIPS16e (up to 40% code-size reduction) |
| Encapsulamento | 121-ball TFBGA, 10x10 mm, 0.8 mm pitch |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Nível MSL | 3 (per JEDEC J-STD-020) |
Guia de Configuração de Pinos do PIC32MX664F064L-V/BG 121-ball tfbga, 10x10 mm, 0.8 mm pitch
Configuração de pinos para PIC32MX664F064L-V/BG (pacote 121-ball tfbga, 10x10 mm, 0.8 mm pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PIC32MX664F064L-V/BG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PIC32MX664F064L-V/BG é adequado para 6 aplicaçãos: USB OTG Peripheral Devices, Industrial Ethernet Embedded Nodes, POS Terminals and Data Loggers, USB Host / Device Bridge Products, Human-Machine Interface (HMI) Panels, CAN-Connected Motor Control Front Ends.
USB OTG Peripheral Devices
The PIC32MX664F064L-V/BG is ideal for USB On-The-Go peripheral designs because it integrates the USB 2.0 OTG controller with on-chip PHY and four dedicated DMA channels. The 80 MHz MIPS32 M4K core delivers 105 DMIPS throughput, sufficient to manage USB bulk transfers, HID, CDC, and mass-storage class stacks in parallel. Engineers typically pair the part with a single 3.3 V regulator and a USB Type-A/B receptacle; no external PHY is required, saving roughly 50 mm of PCB area and $0.40 BOM versus discrete PHY solutions.
Recomendado
Industrial Ethernet Embedded Nodes
The PIC32MX664F064L-V/BG suits industrial 10/100 Ethernet nodes thanks to its integrated Ethernet MAC with both MII and RMII interfaces, 32 KB SRAM for TCP/IP socket buffers, and 64 KB Flash for lightweight IP stacks such as Microchip's TCP/IP Lite. The 80 MHz core can sustain wire-rate UDP throughput for small payloads; for TCP or higher bandwidth, designers add an external PHY like the KSZ8041 on the RMII interface. The -40C to +105C industrial temperature grade supports factory-floor deployment without additional thermal management.
Recomendado
POS Terminals and Data Loggers
The PIC32MX664F064L-V/BG fits USB-connected point-of-sale terminals and industrial data loggers because it combines USB device/host support, an on-chip 10-bit 1 Msps ADC for analog sensor acquisition, and sufficient Flash for protocol stacks plus application logic. The Harvard architecture and DMA channels allow concurrent ADC sampling, USB bulk transfers, and user-interface tasks without CPU bottleneck. Typical designs use the USB port for tethered PC communication and a UART for printer or external modem interfacing.
Recomendado
USB Host / Device Bridge Products
The PIC32MX664F064L-V/BG is well suited for USB host/device bridge designs because USB OTG with on-chip PHY supports both roles without external components. The four dedicated DMA channels sustain USB isochronous and bulk transfers at full-speed rates up to 12 Mbps. Common bridge applications include USB mass-storage to SD card readers, USB HID to UART bridges, and USB audio class adapters. The 32 KB SRAM provides buffer headroom for typical 512-byte endpoint packets plus protocol overhead.
Recomendado
Human-Machine Interface (HMI) Panels
The PIC32MX664F064L-V/BG works in small HMI panels because its 10-bit ADC reads potentiometers and resistive touch, its PWM outputs drive LED backlights or small buzzer tones, and the 80 MHz core renders graphical menus at acceptable frame rates on character or small TFT displays. The Ethernet MAC enables remote monitoring and firmware update over Modbus TCP or HTTP, while USB OTG allows on-site configuration via USB stick. The TFBGA-121 footprint keeps the PCB compact for panel-mount designs.
Recomendado
CAN-Connected Motor Control Front Ends
Although the PIC32MX664F064L-V/BG does not integrate a CAN peripheral, its 80 MHz MIPS core, 32 KB SRAM, and PWM-timer-rich peripheral set make it a capable CAN-to-Ethernet gateway or motor-control front end paired with an external MCP2515 or MCP2551 CAN transceiver. Designers can run a CANopen or DeviceNet slave stack alongside Ethernet TCP/IP for industrial gateway designs. The 10-bit 1 Msps ADC samples motor current and back-EMF with adequate resolution for FOC control loops.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MX664F064L-V/BG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MX664F064LT-V/BG | PIC32MX664F064L-I/BG | PIC32MX564F064L-V/BG | PIC32MX564F128LT-V/BG | PIC32MX460F512L-80V/BG |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-ball TFBGA (10x10 mm) | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same |
| Core Speed | 80 MHz (105 DMIPS) | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash Memory | 64 KB | 64 KB | 64 KB | 64 KB | 128 KB | 512 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| USB OTG with PHY | Yes | Yes | Yes | No | No | No |
| 10/100 Ethernet MAC | Yes (MII/RMII) | Yes | Yes | Yes | Yes | No |
| Dedicated DMA for USB OTG | 4 channels | 4 channels | 4 channels | None | None | None |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +85 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
Principais diferenciais
- On-chip USB OTG PHY with dedicated DMA (vs PIC32MX564F064L-V/BG)
- Higher SRAM per MHz for protocol stacks (vs PIC32MX460F512L-80V/BG)
- Extended -40 C to +105 C temperature grade (vs PIC32MX664F064L-I/BG)
Notas de projeto
The 121-ball TFBGA package has 0.8 mm ball pitch and requires microvia-friendly PCB stackups. Use at minimum a 4-layer board with 1 oz copper on outer layers; place a continuous ground plane on layer 2 directly under the BGA to reduce inductance on the decoupling capacitors. For hand-rework, pre-tin the balls and use a hot-air rework station with a 280-300 C profile per JEDEC J-STD-020 MSL-3 handling.
Place a 100 nF ceramic capacitor on each VDD pin and a 4.7 uF bulk capacitor on each AVDD pair, positioned within 3 mm of the respective balls. The on-chip voltage regulator requires a 10 uF tantalum or ceramic capacitor on the VCAP pin to stabilize the internal 1.8 V core rail. Estimated: with all peripherals active at 80 MHz, the VDD current is approximately 65 mA, so size the external 3.3 V LDO for at least 100 mA to handle USB transient bursts.
Do not enable both the USB module and the Ethernet MAC simultaneously at full throughput without checking the bus arbitration settings in the CFGCON register, as DMA contention can drop USB packets. The D+ and D- USB lines need a series ferrite bead or common-mode choke within 5 mm of the connector for Class-A EMI compliance. Also note that the V temperature grade (-40 C to +105 C) and I grade (-40 C to +85 C) variants are functionally identical but should not be substituted in field-deployed designs that require the wider temperature range.
Estimated: at 80 MHz with all peripherals active, the typical power dissipation is around 200 mW at 3.3 V. With the TFBGA-121 package theta_JA of approximately 30 C/W on a 4-layer JEDEC test board, junction temperature rise above ambient is roughly 6 C, keeping the die well within safe limits up to 85 C ambient. For continuous operation at the +105 C maximum, ensure the PCB copper pour under the thermal pad is at least 1 square inch to keep junction temperature within the data book maximum of 125 C.
Informações de conformidade
RoHS compliant per Microchip product page. AEC-Q100 qualification does not apply to this commercial/industrial-grade MCU. Halogen-free status not explicitly stated in the provided datasheet excerpts.
