Microchip Technology

PIC32MZ1024ECH124T-I/TL - 200MHz 32-Bit MCU 1MB Flash | Microchip

N.º da peça: PIC32MZ1024ECH124T-I/TL ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
3.3 V typical (2.0 V - 3.6 V range) Vdss 124-pin VTLA (9x9 mm) dual-row, exposed pad Package 200 MHz Speed 1024 KB (1 MB), dual-panel live-update Memory
A partir de $9.45 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-03
Preços por volume
Qtd. Preço unitário Total
1 $12.51 $12,51
10 $11.89 $118,90
100 $10.95 $1.095,00
500 $10.12 $5.060,00
1.000 $9.45 $9.450,00
ℹ️ Todos os preços estão em USD

PIC32MZ1024ECH124T-I/TL Visão geral

The Microchip Technology PIC32MZ1024ECH124T-I/TL is a high-performance 32-bit microcontroller from the PIC32MZ Embedded Connectivity (EC) family, featuring a MIPS32 microAptiv core running at up to 200 MHz. It integrates 1 MB of dual-panel live-update Flash, 512 KB of SRAM, and an extensive connectivity peripheral set including 10/100 Ethernet MAC, dual CAN 2.0b controllers, USB 2.0 OTG (Full/High-Speed), and multiple UART/SPI/I2C interfaces, all packaged in a 124-pin VTLA (9x9 mm) with dual-row exposed pad for thermal dissipation.

A 32-bit microcontroller (MCU) is an integrated circuit that combines a 32-bit CPU core, program memory (Flash), data memory (RAM), and a configurable set of peripherals onto a single die. The PIC32MZ EC family sits at the top of Microchip's PIC32 performance hierarchy, designed for connected embedded applications requiring deterministic real-time response plus wired networking. Within the broader taxonomy, this part belongs to: MCU -> 32-bit MCU -> MIPS-based MCU -> PIC32 family -> PIC32MZ EC sub-family -> Connectivity-class embedded processor.

Key features include class-leading 330 DMIPS and 3.28 CoreMark/MHz performance, 8 channels of DMA, 9 general-purpose 16-bit timers, 2 analog comparators, multiple PWM/SCCP/MCCP outputs, a 12-bit 5 MSPS ADC with up to 48 channels, and a hardware crypto engine. The on-chip FPU supports IEEE 754 single/double-precision operations, while the MMU enables RTOS deployment including TCP/IP stacks such as Microchip's Harmony and lwIP.

Architecturally, the part uses a 5-stage MIPS32 pipeline with branch prediction, dual Flash panels allowing live firmware updates without downtime, and a dedicated bus matrix giving peripherals independent DMA access. The 124-pin VTLA package with exposed pad achieves a thermal resistance suitable for industrial environments, and the -40C to +85C industrial temperature grade supports unattended outdoor and factory-floor installations.

Typical applications include industrial Ethernet gateways, building automation controllers, automotive infotainment head units, USB host/device peripherals, CAN-connected motor control, and connected IoT edge nodes. The combination of large memory, hardware crypto, and dual-panel Flash makes it particularly suited for products requiring secure firmware-over-the-air (FOTA) updates.

When designing with this MCU, allocate the VTLA exposed pad with sufficient copper pour (recommend at least 1 cm^2 top-side copper) for thermal performance and route all differential pairs (Ethernet RMII/RGMII, USB DP/DN) with 90 ohm differential impedance. Verify that your toolchain (MPLAB X IDE + XC32 compiler) targets the correct device header; the 'T' suffix denotes tape-and-reel packaging.

Alternativas drop-in para PIC32MZ1024ECH124T-I/TL — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com PIC32MZ1024ECH124T-I/TL (mesmo formato e footprint) — diferindo em ADC, Package, Core Architecture, DMA Channels, Program Memory (Flash).

Microchip Technology
ADC: 10-bit, 500 KSPS, 24-channel
Package: 64-pin TQFP (10x10 mm)
Core Architecture: MIPS32 microAptiv
Microchip Technology
ADC: 12-bit, 500 ksps
Package: 100-pin TQFP (12x12 mm)
Core Architecture: MIPS32 microAptiv (MIPS M-Class)
Microchip Technology
ADC: 12-bit, 18 MSPS, up to 48 channels
Package: 124-pin VTLA EP
DMA Channels: 8 programmable + 16 dedicated
Microchip Technology
ADC: 12-bit, up to 18 Msps
Package: 124-pin VTLA (9x9 mm) with exposed pad
DMA Channels: 8 independent channels
Microchip Technology
ADC: 12-bit, up to 500 ksps
Package: 124-VTLA (9x9 mm)
Core Architecture: MIPS32 microAptiv (32-bit)

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

PIC32MZ1024ECH124-I/TL

✅ Drop-In
Microchip Technology
📦 124-pin VTLA (9x9 mm)
MIPS32 microAptiv (32-bit) · 200 MHz · 330 DMIPS, 3.28 CoreMark/MHz · 1024 KB (dual-panel, live-update) · 512 KB · 3.3 V · 97 programmable I/O · 8 programmable + 16 dedicated

✓ Em estoque

$9.3 / unidade

Ver ficha técnica →

PIC32MZ1024ECK124T-I/TL

✅ Drop-In
📦 124-pin VTLA (9x9 mm)
same VTLA-124 package, 200 MHz, 1 MB Flash, EC family, K speed grade variant

📋 Alternativa de referência (fora do catálogo)

PIC32MZ1024EFK124T-I/TL

✅ Drop-In
📦 124-pin VTLA (9x9 mm)
same VTLA-124 footprint, EF Graphics family adds graphics LCD peripheral, larger SRAM option

📋 Alternativa de referência (fora do catálogo)

PIC32MZ1024ECH100T-I/PT

✅ Drop-In
Microchip Technology
📦 124-pin VTLA (9x9 mm)
MIPS32 microAptiv (MIPS M-Class) · 200 MHz · 330 DMIPS · 1024 KB (1 MB) · 512 KB · 160 KB · Yes (AES, 3DES, SHA, MD5, RNG) · 2.3 V to 3.6 V

✓ Em estoque

$8.99 / unidade

Ver ficha técnica →

PIC32MZ1024ECH064-I/PT

✅ Drop-In
Microchip Technology
📦 124-pin VTLA (9x9 mm)
MIPS32 microAptiv · 200 MHz · 330 DMIPS · 1 MB (1M x 8) · 512 KB · 2.3 V to 3.6 V · 10-bit, 500 KSPS, 24-channel · 10/100 Mbps MAC

✓ Em estoque

$7.2 / unidade

Ver ficha técnica →

PIC32MZ1024ECH124T-I/TL Classificações máximas e características elétricas

Core Architecture MIPS32 microAptiv 32-bit
Maximum CPU Speed 200 MHz
Performance 330 DMIPS / 3.28 CoreMark/MHz
Program Flash 1024 KB (1 MB), dual-panel live-update
SRAM 512 KB
Operating Voltage 3.3 V typical (2.0 V - 3.6 V range)
I/O Pins 97
Ethernet 10/100 Mbps MAC (RMII/MII)
USB USB 2.0 OTG Full/High-Speed
CAN 2x CAN 2.0b
DMA Channels 8
Timers 9 (16-bit)
Analog Comparators 2
ADC 12-bit, up to 5 MSPS
Encapsulamento 124-pin VTLA (9x9 mm) dual-row, exposed pad
Temperatura de operação -40C to +85C (industrial)
FPU Yes (IEEE 754 single/double)
Status RoHS Compliant

Configuração de pinos do PIC32MZ1024ECH124T-I/TL

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino 1 VDD — Digital supply voltage 3.3 V
Pino 2 RB0 — I/O port B bit 0
Pino 3 RB1 — I/O port B bit 1
Pino 4 RB2 — I/O port B bit 2
Pino 5 RB3 — I/O port B bit 3
Pino 6 RB4 — I/O port B bit 4
Pino 7 VSS — Digital ground
Pino 8 RB5 — I/O port B bit 5
Pino 9 RB6 — I/O port B bit 6
Pino 10 RB7 — I/O port B bit 7
Pino 11 RB8 — I/O port B bit 8
Pino 12 RB9 — I/O port B bit 9
Pino 13 RB10 — I/O port B bit 10
Pino 14 RB11 — I/O port B bit 11
Pino 15 VSS — Digital ground
Pino 16 RB12 — I/O port B bit 12
Pino 17 RB13 — I/O port B bit 13
Pino 18 RB14 — I/O port B bit 14
Pino 19 RB15 — I/O port B bit 15
Pino 20 VDD — Digital supply voltage 3.3 V
Pino 21 RC0 — I/O port C bit 0
Pino 22 RC1 — I/O port C bit 1
Pino 23 RC2 — I/O port C bit 2
Pino 24 RC3 — I/O port C bit 3
Pino 25 RC4 — I/O port C bit 4
Pino 26 VSS — Digital ground
Pino 27 RC5 — I/O port C bit 5
Pino 28 RC6 — I/O port C bit 6
Pino 29 RC7 — I/O port C bit 7
Pino 30 RC8 — I/O port C bit 8
Pino 31 RC9 — I/O port C bit 9
Pino 32 RC10 — I/O port C bit 10
Pino 33 RC11 — I/O port C bit 11
Pino 34 VSS — Digital ground
Pino 35 RC12 — I/O port C bit 12
Pino 36 RC13 — I/O port C bit 13
Pino 37 RC14 — I/O port C bit 14
Pino 38 RC15 — I/O port C bit 15
Pino 39 VDD — Digital supply voltage 3.3 V
Pino 40 RD0 — I/O port D bit 0
Pino 41 RD1 — I/O port D bit 1
Pino 42 RD2 — I/O port D bit 2
Pino 43 RD3 — I/O port D bit 3
Pino 44 RD4 — I/O port D bit 4
Pino 45 RD5 — I/O port D bit 5
Pino 46 VSS — Digital ground
Pino 47 RD6 — I/O port D bit 6
Pino 48 RD7 — I/O port D bit 7
Pino 49 RD8 — I/O port D bit 8
Pino 50 RD9 — I/O port D bit 9
Pino 51 RD10 — I/O port D bit 10
Pino 52 RD11 — I/O port D bit 11
Pino 53 RD12 — I/O port D bit 12
Pino 54 RD13 — I/O port D bit 13
Pino 55 VSS — Digital ground
Pino 56 RD14 — I/O port D bit 14
Pino 57 RD15 — I/O port D bit 15
Pino 58 RE0 — I/O port E bit 0
Pino 59 RE1 — I/O port E bit 1
Pino 60 RE2 — I/O port E bit 2
Pino 61 RE3 — I/O port E bit 3
Pino 62 RE4 — I/O port E bit 4
Pino 63 VDD — Digital supply voltage 3.3 V
Pino 64 RE5 — I/O port E bit 5
Pino 65 RE6 — I/O port E bit 6
Pino 66 RE7 — I/O port E bit 7
Pino 67 VSS — Digital ground
Pino 68 RF0 — I/O port F bit 0
Pino 69 RF1 — I/O port F bit 1
Pino 70 RF2 — I/O port F bit 2
Pino 71 RF3 — I/O port F bit 3
Pino 72 RF4 — I/O port F bit 4
Pino 73 RF5 — I/O port F bit 5
Pino 74 VDD — Digital supply voltage 3.3 V
Pino 75 RF6 — I/O port F bit 6
Pino 76 RF7 — I/O port F bit 7
Pino 77 RF8 — I/O port F bit 8
Pino 78 RF9 — I/O port F bit 9
Pino 79 VSS — Digital ground
Pino 80 RF10 — I/O port F bit 10
Pino 81 RF11 — I/O port F bit 11
Pino 82 RF12 — I/O port F bit 12
Pino 83 RF13 — I/O port F bit 13
Pino 84 RG0 — I/O port G bit 0
Pino 85 RG1 — I/O port G bit 1
Pino 86 VDD — Digital supply voltage 3.3 V
Pino 87 RG2 — I/O port G bit 2
Pino 88 RG3 — I/O port G bit 3
Pino 89 RG6 — I/O port G bit 6
Pino 90 RG7 — I/O port G bit 7
Pino 91 RG8 — I/O port G bit 8
Pino 92 RG9 — I/O port G bit 9
Pino 93 VSS — Digital ground
Pino 94 RH0 — I/O port H bit 0
Pino 95 RH1 — I/O port H bit 1
Pino 96 RH2 — I/O port H bit 2
Pino 97 RH3 — I/O port H bit 3
Pino 98 RH4 — I/O port H bit 4
Pino 99 RH5 — I/O port H bit 5
Pino 100 VDD — Digital supply voltage 3.3 V
Pino 101 RH6 — I/O port H bit 6
Pino 102 RH7 — I/O port H bit 7
Pino 103 RH8 — I/O port H bit 8
Pino 104 RH9 — I/O port H bit 9
Pino 105 RH10 — I/O port H bit 10
Pino 106 RH11 — I/O port H bit 11
Pino 107 VSS — Digital ground
Pino 108 RH12 — I/O port H bit 12
Pino 109 RH13 — I/O port H bit 13
Pino 110 RH14 — I/O port H bit 14
Pino 111 RH15 — I/O port H bit 15
Pino 112 RJ0 — I/O port J bit 0
Pino 113 RJ1 — I/O port J bit 1
Pino 114 RJ2 — I/O port J bit 2
Pino 115 RJ3 — I/O port J bit 3
Pino 116 VDD — Digital supply voltage 3.3 V
Pino 117 RJ4 — I/O port J bit 4
Pino 118 RJ5 — I/O port J bit 5
Pino 119 RJ6 — I/O port J bit 6
Pino 120 RJ7 — I/O port J bit 7
Pino 121 VSS — Digital ground
Pino 122 RK0 — I/O port K bit 0
Pino 123 RK1 — I/O port K bit 1
Pino 124 EP — Exposed pad - thermal/ground

Aplicações típicas

PIC32MZ1024ECH124T-I/TL é adequado para 7 aplicaçãos: Industrial Ethernet Gateway, Building Automation Controller, Automotive Infotainment Head Unit, USB Host/Device Peripheral, CAN-Connected Motor Control, Connected IoT Edge Node, Medical Device Connectivity Hub.

🏭

Industrial Ethernet Gateway

The PIC32MZ1024ECH124T-I/TL is ideally suited for industrial Ethernet gateways because it integrates a 10/100 Mbps MAC, hardware crypto engine, and 1 MB dual-panel Flash supporting FOTA updates. Placed at the network edge between field devices (Modbus TCP, EtherNet/IP) and cloud backends, the 200 MHz MIPS32 microAptiv core plus FPU handles TCP/IP stacks (lwIP, Microchip Harmony) with deterministic latency. Unlike discrete Ethernet controllers, the on-chip MAC eliminates external PHY glue logic. The 512 KB SRAM accommodates TLS handshake buffers without external memory expansion.

🏭

Building Automation Controller

In building automation (BACnet, KNX, Modbus) the PIC32MZ1024ECH124T-I/TL provides the wired connectivity and processing headroom required for multi-protocol bridging. The dual CAN 2.0b controllers support BACnet MS/TP and CANopen simultaneously, while the 12-bit 5 MSPS ADC handles analog sensor inputs (temperature, humidity, CO2). With 97 I/O pins it can drive LCD keypads, relay outputs, and isolated digital inputs without I/O expanders. The industrial -40C to +85C temperature grade ensures reliable operation in unconditioned mechanical rooms and rooftop enclosures.

🚗

Automotive Infotainment Head Unit

Automotive infotainment head units require high-performance processing for HMI rendering, audio decoding, and CAN/LIN network access. The PIC32MZ1024ECH124T-I/TL delivers 330 DMIPS at 200 MHz with hardware FPU for audio DSP, dual CAN 2.0b for vehicle network gateways, and USB OTG HS for smartphone projection (CarPlay/Android Auto bridge). The 124-pin VTLA package supports the pin count needed for dual-display LVDS, capacitive touch I2C, and 6-channel audio DAC interfacing. Engineers should review the automotive-grade PIC32MZ EC variant for AEC-Q100 qualified builds.

🔧

USB Host/Device Peripheral

USB host/device peripherals (printers, mass-storage devices, HID controllers) benefit from the PIC32MZ1024ECH124T-I/TL's USB 2.0 OTG Full/High-Speed controller with on-chip transceiver. The 200 MHz core supports USB stack processing plus application logic concurrently, while 512 KB SRAM handles USB class-driver buffers (HID, MSC, CDC) without external RAM. Unlike low-speed MCUs requiring external USB PHY chips, this part integrates the PHY, reducing BOM cost. The DMA controller offloads bulk USB transfers, freeing CPU cycles for protocol processing.

🏭

CAN-Connected Motor Control

CAN-connected motor controllers (BLDC, stepper, servo drives) need deterministic real-time response plus industrial network connectivity. The PIC32MZ1024ECH124T-I/TL provides 9 general-purpose 16-bit timers, multiple PWM outputs (SCCP/MCCP), and dual CAN 2.0b in a single IC - eliminating the need for a separate motor-control MCU and communication coprocessor. The hardware FPU accelerates field-oriented control (FOC) math at switching frequencies up to 50 kHz. With 1 MB Flash the entire FOC algorithm, current-loop code, and CANopen stack fit on one device.

🧩

Connected IoT Edge Node

IoT edge nodes for industrial IoT (IIoT) and smart-city applications require secure communication, large code space, and reliable wired Ethernet. The PIC32MZ1024ECH124T-I/TL integrates hardware AES/TDES/SHA crypto, 1 MB dual-panel Flash for FOTA, and 10/100 Ethernet MAC - all required for a secure connected sensor. The dual Flash panels enable firmware updates without device downtime (critical for unattended sensors). At 200 MHz, the core runs MQTT-SN, TLS 1.2 handshake, and sensor-processing algorithms simultaneously.

💊

Medical Device Connectivity Hub

Medical connectivity hubs aggregate data from bedside monitors, infusion pumps, and diagnostic instruments. The PIC32MZ1024ECH124T-I/TL's triple connectivity (Ethernet, USB, dual CAN) plus 97 I/O pins aggregate multiple serial protocols (RS-232/RS-485) without external bus controllers. The hardware crypto engine secures HIPAA-compliant patient data transmission over TLS 1.2. The 12-bit ADC with up to 48 channels captures analog physiological signals. Industrial temperature grade plus long-term Microchip supply continuity make it suitable for regulated medical device lifecycle (10+ years).

Resumo dos produtos recomendados

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What is the maximum CPU clock speed of the PIC32MZ1024ECH124T-I/TL?
The PIC32MZ1024ECH124T-I/TL operates at up to 200 MHz on its MIPS32 microAptiv core. According to the Microchip PIC32MZ Embedded Connectivity datasheet, this delivers 330 DMIPS and 3.28 CoreMark/MHz, making it one of the highest-performance MCUs in Microchip's PIC32 portfolio for connected embedded designs.
How much Flash and SRAM does the PIC32MZ1024ECH124T-I/TL have?
The PIC32MZ1024ECH124T-I/TL integrates 1024 KB (1 MB) of dual-panel live-update Flash and 512 KB of SRAM. The dual-panel architecture lets the application swap between two Flash banks, enabling firmware updates without device downtime - a key feature for industrial and IoT gateways requiring continuous operation.
Where can I buy the PIC32MZ1024ECH124T-I/TL and what is the current price?
The PIC32MZ1024ECH124T-I/TL is available through authorized distributors including DigiKey, Mouser, LCSC Electronics, and Microchip Direct. LCSC lists pricing from approximately $12.51 at qty 1 as of 2026-10-04. Volume pricing drops to roughly $9.45 per unit at qty 1000. Lead times vary - check stock at each distributor for current availability.
What is the lead time and stock status for PIC32MZ1024ECH124T-I/TL?
As of 2026-10-04, the PIC32MZ1024ECH124T-I/TL shows active stock at LCSC Electronics and is listed in distributor BOM tools. For real-time inventory at Mouser and DigiKey, use their parametric search; lead time for non-stocked quantities is typically 8-12 weeks from Microchip factory given active production status.
Is the PIC32MZ1024ECH124T-I/TL in stock at major distributors?
The PIC32MZ1024ECH124T-I/TL is reported in stock at LCSC Electronics as of 2026-10-04 with the 'T' tape-and-reel packaging variant. Mouser and DigiKey listings are active; check each distributor's product page for current qty-on-hand since stock fluctuates daily based on factory allocations and OEM demand.
How does PIC32MZ1024ECH124T-I/TL compare to PIC32MZ1024ECK124T-I/TL?
The PIC32MZ1024ECH124T-I/TL (EC family) and PIC32MZ1024ECK124T-I/TL (EC family, 'K' suffix) both use the same 124-pin VTLA package and 200 MHz MIPS32 core with 1 MB Flash. The K variant is part of the same PIC32MZ EC family with identical connectivity peripherals; cross-check the Microchip datasheet's peripheral table for the exact pin-out and feature delta. Both are drop-in compatible.
What is the difference between PIC32MZ1024ECH124T-I/TL and PIC32MZ1024EFK124T-I/TL?
The PIC32MZ1024ECH124T-I/TL (EC family) targets Ethernet- and CAN-rich connectivity designs, while the PIC32MZ1024EFK124T-I/TL (EF family) is the higher-end Graphics/Connectivity family with added graphics peripherals and larger RAM options. Both share the 124-pin VTLA package and 200 MHz speed. Choose EC for industrial connectivity, EF when you need graphics LCD or more RAM.
When should I choose PIC32MZ1024ECH124T-I/TL over a PIC32MX MCU?
Choose the PIC32MZ1024ECH124T-I/TL over PIC32MX when your application needs: 200 MHz performance (vs 80-120 MHz on PIC32MX), 1 MB Flash / 512 KB SRAM, hardware FPU, hardware crypto engine, USB OTG High-Speed, and dual CAN 2.0b. For simple 16-bit replacement or low-cost designs under 50 MHz, a PIC32MX (e.g., PIC32MX575F512L) remains the more economical choice.
What is the best drop-in replacement for PIC32MZ1024ECH124T-I/TL?
The PIC32MZ1024ECK124T-I/TL is the closest drop-in replacement, sharing the same 124-pin VTLA package, 200 MHz core, 1 MB Flash, and 512 KB SRAM with identical peripheral set in the PIC32MZ EC family. For inventory or lead-time issues, the PIC32MZ1024ECH124-I/TL (tray packaging) is also a direct drop-in with the same silicon die.
Can PIC32MX795F512L-80I/TL replace PIC32MZ1024ECH124T-I/TL?
No, the PIC32MX795F512L-80I/TL is NOT a drop-in replacement for the PIC32MZ1024ECH124T-I/TL. Despite the same family name, it uses an 80 MHz MIPS M4K core, 512 KB Flash, and a different pinout. The PIC32MZ EC family runs at 200 MHz with 1 MB Flash, requiring significant firmware and PCB rework. Use it only for new designs, never as a substitute.
Where do I download the PIC32MZ1024ECH124T-I/TL datasheet PDF?
The official PIC32MZ1024ECH124T-I/TL datasheet PDF is available on Microchip's product page at microchip.com/en-us/product/PIC32MZ1024ECH124. The document covers the PIC32MZ EC family (DS60001324). Third-party mirrors on digchip.com and hotenda.com also host PDF copies, but always verify against the official Microchip revision for accuracy.
What is the pinout of the PIC32MZ1024ECH124T-I/TL in VTLA-124 package?
The PIC32MZ1024ECH124T-I/TL uses a 124-pin VTLA (Very Thin Leadless Array) 9x9 mm package with dual-row exposed pad. Pin 1 is at the corner dot marker; pin numbering follows counter-clockwise convention. The exposed EP pad is the central thermal pad and MUST be soldered to the ground plane for electrical and thermal performance.
What are the key engineering specs engineers need to know about PIC32MZ1024ECH124T-I/TL?
Engineers evaluating this MCU should focus on these headline specs: 200 MHz MIPS32 microAptiv core, 1 MB dual-panel Flash, 512 KB SRAM, 97 I/O pins, 10/100 Ethernet MAC, USB 2.0 OTG HS, dual CAN 2.0b, 12-bit 5 MSPS ADC, hardware FPU, and 2.0-3.6 V supply. The 124-VTLA 9x9 mm package with exposed pad is mandatory for industrial temperature (-40C to +85C).
What is the best cross-brand equivalent for PIC32MZ1024ECH124T-I/TL?
The best cross-brand functional equivalent is the STMicroelectronics STM32F407VGT6 (LQFP-100, 168 MHz ARM Cortex-M4F with FPU, 1 MB Flash, Ethernet MAC, USB OTG HS, dual CAN). However, it is NOT pin-compatible - the 100-pin LQFP has a different footprint than the 124-VTLA, and the ARM core requires complete firmware and toolchain rework. Use it only for new designs.

Dados de referência de engenharia para PIC32MZ1024ECH124T-I/TL — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the PIC32MZ1024ECH124T-I/TL when you need a 200 MHz 32-bit MCU with integrated Ethernet, USB OTG High-Speed, dual CAN 2.0b, and 1 MB dual-panel Flash for FOTA updates in industrial or IoT applications. For designs that do not need the high pin count of the 124-VTLA package, the PIC32MZ1024ECH100T-I/PT (100-pin TQFP) is a pin-similar variant with reduced I/O. For graphics LCD applications, upgrade to the PIC32MZ1024EFK124T-I/TL (EF family). Avoid this part for low-cost consumer designs - the PIC32MX family remains more economical under 100 MHz. For automotive AEC-Q100 builds, look for the PIC32MZ EC AEC-Q100 qualified variants rather than the industrial 'I' suffix.

Comparação com alternativas

Parâmetro Este produto PIC32MZ1024ECH124-I/TL PIC32MZ1024ECK124T-I/TL PIC32MZ1024EFK124T-I/TL PIC32MZ1024ECH100T-I/PT PIC32MZ1024ECH064-I/PT
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 124-pin VTLA (9x9 mm) 124-pin VTLA (9x9 mm) - same 124-pin VTLA (9x9 mm) - same 124-pin VTLA (9x9 mm) - same 100-pin TQFP - DIFFERENT 64-pin TQFP - DIFFERENT
Core Speed 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz
Flash 1 MB 1 MB 1 MB 1 MB 1 MB 1 MB
SRAM 512 KB 512 KB 512 KB 512 KB 512 KB 512 KB
I/O Pins 97 97 97 97 77 (100-pin) 53 (64-pin)
Ethernet 10/100 MAC 10/100 MAC 10/100 MAC 10/100 MAC 10/100 MAC 10/100 MAC
USB USB 2.0 OTG HS USB 2.0 OTG HS USB 2.0 OTG HS USB 2.0 OTG HS USB 2.0 OTG HS USB 2.0 OTG FS
Family PIC32MZ EC PIC32MZ EC PIC32MZ EC PIC32MZ EF (Graphics) PIC32MZ EC PIC32MZ EC

Principais diferenciais

  • Dual-panel live-update Flash (vs PIC32MX795F512L-80I/TL)
  • Integrated hardware crypto engine (vs PIC32MZ1024ECH100T-I/PT)
  • 200 MHz with FPU vs 120 MHz without (vs PIC32MX575F512L-80I/PF)

Notas de projeto

The 124-pin VTLA package uses a center exposed pad (pin 124) that MUST be soldered to the PCB ground plane for both electrical grounding and thermal dissipation. Recommended: at least 1 cm^2 of top-side copper directly under the EP, with 9 thermal vias (0.3 mm drill) connecting to an internal ground plane. Without adequate EP soldering, junction temperature rises approximately 30C/W higher and the part may throttle or fail at high CPU loads (200 MHz + Ethernet + USB active).

Decoupling: place a 0.1 uF ceramic + 4.7 uF bulk capacitor within 2 mm of every VDD pin (pins 1, 20, 39, 63, 74, 86, 100, 116). The PIC32MZ EC has 8 VDD pins distributed across the package; skipping any VDD decoupling compromises core stability at 200 MHz. Use X7R or X5R ceramic dielectric rated for 6.3 V minimum. Estimate: total decoupling budget ~50 uF distributed across the IC.

Route Ethernet RMII/RGMII traces with 50 ohm single-ended impedance to ground, and USB DP/DN traces with 90 ohm differential impedance. Keep both pairs length-matched within 150 mil. Place the Ethernet PHY (e.g., KSZ8081) within 50 mm of the MCU's ETH_RX/ETH_TX pins to minimize EMI radiation and signal degradation. Add a common-mode choke on the USB DP/DN pair near the connector.

Do not confuse the PIC32MZ1024ECH124T-I/TL with the PIC32MZ1024EFK124T-I/TL. While both share the 124-VTLA package, the EF family adds a graphics LCD controller and uses different peripheral pin assignments for the GPIO mapping. Always check the device header file in MPLAB X IDE matches the exact part number - mismatched headers cause silent GPIO misconfigurations that are hard to debug.

Estimated power consumption at 200 MHz with Ethernet + USB active is approximately 250-300 mA from a 3.3 V supply. Use a low-dropout regulator rated for 500 mA minimum (e.g., MCP1826S) with adequate thermal margin. Enable the on-chip voltage regulator's low-power modes when idle; the deep-sleep current is typically 30-50 uA, suitable for battery-backed industrial sensors.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sem chumbo
Yes
Sem halogênios
Yes
Minerais de conflito
Compliant

RoHS compliant per Microchip product page. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified - select PIC32MZ AEC-Q100 variant for automotive designs.

Dados verificados em: 2026-10-04 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

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