PIC32MZ1024EFM144-I/JWX - 200MHz MIPS MCU 1MB Flash 144-TFBGA | Microchip
N.º da peça: PIC32MZ1024EFM144-I/JWX ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $13.62 | $13,62 |
| 10 | $12.27 | $122,70 |
| 100 | $11.1 | $1.110,00 |
| 500 | $10.08 | $5.040,00 |
| 1.000 | $9.45 | $9.450,00 |
PIC32MZ1024EFM144-I/JWX Visão geral
A 32-bit microcontroller is a programmable embedded processor with on-chip memory and peripherals, sitting between low-end 8/16-bit MCUs and application processors in the embedded computing hierarchy. Microcontroller -> 32-bit MCU -> MIPS32 M-Class MCU -> PIC32 family -> PIC32MZ EF family. These parts typically integrate flash program memory, SRAM, timers, ADC, communication peripherals (UART, SPI, I2C, CAN, USB, Ethernet), and security/crypto accelerators to deliver a complete SoC for connected embedded systems.
Key features of the PIC32MZ1024EFM144-I/JWX include a MIPS32 M-Class core with DSP/FPU extensions, 200 MHz maximum operating frequency, 1 MB dual-panel Flash (live update capable), 512 KB SRAM, hardware crypto engine (AES/SHA/RNG), dual CAN FD, USB 2.0 Hi-Speed, 10/100 Ethernet MAC with MII/RMII, 12-bit ADC, and integrated FPU for floating-point math. The 144-TFBGA package supports the highest pin count in the family, exposing parallel bus, trace, and abundant GPIO for HMI graphics.
This MCU is built on a 65 nm embedded flash process and integrates ample analog peripherals including multiple 12-bit ADC modules, comparators, and a temperature sensor. The 200 MHz core achieves 3.84 CoreMark/MHz, and dedicated DSP extensions accelerate signal processing loops used in audio, motor control, and sensor fusion.
Typical applications include industrial HMI panels, IoT gateways with secure cloud connectivity, automotive body and infotainment subsystems, motor-control FOC drives, and medical instrumentation with graphical user interface. The integrated crypto engine plus CAN FD make it well suited for connected industrial nodes requiring TLS/DTLS acceleration and robust in-vehicle networking.
Designers should note that the I-grade variant operates from -40C to +85C and requires a 3.3 V supply. BGA routing demands HDI PCB with microvia stackups; reference the PIC32MZ EF Family data sheet for trace pin assignments and MII/RMII PHY connection diagrams.
This page combines distributor pricing, drop-in same-family alternatives, and BGA layout design notes not found in the manufacturer summary page.
Alternativas drop-in para PIC32MZ1024EFM144-I/JWX — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ1024EFM144-I/JWX (mesmo formato e footprint) — diferindo em Package, Operating Temperature, ADC, Core Architecture, CAN.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ1024EFM144-E/JWX
✅ Drop-In✓ Em estoque
$11.62 / unidade
Ver ficha técnica →PIC32MZ1024EFM144T-I/JWX
✅ Drop-In✓ Em estoque
$8.5 / unidade
Ver ficha técnica →PIC32MZ1024EFG144T-E/JWX
✅ Drop-In✓ Em estoque
$5.85 / unidade
Ver ficha técnica →PIC32MZ1024EFF144T-E/JWX
✅ Drop-In✓ Em estoque
$9.12 / unidade
Ver ficha técnica →PIC32MZ1024EFM144-E/PL
✅ Drop-In✓ Em estoque
$9.55 / unidade
Ver ficha técnica →PIC32MZ1024EFE144-I/PL
✅ Drop-In✓ Em estoque
$8.95 / unidade
Ver ficha técnica →PIC32MZ1024EFM144-I/JWX Classificações máximas e características elétricas
| Manufacturer | Microchip Technology |
| Series | PIC32MZ EF Family |
| Core Architecture | MIPS32 M-Class with FPU/DSP |
| Core Width | 32-bit |
| Max CPU Speed | 200 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| RAM | 512 KB |
| Operating Voltage | 3.0 V to 3.6 V (3.3 V typ.) |
| Temperatura de operação | -40C to +85C (industrial, I grade) |
| Encapsulamento | 144-pin TFBGA, 7x7 mm |
| Tipo de montagem | Surface Mount (BGA) |
| Communication | 2x CAN FD, USB 2.0 Hi-Speed, 10/100 Ethernet, UART, SPI, I2C |
| Crypto Engine | Yes (AES, SHA, RNG) |
| ADC | 12-bit |
| Nível MSL | 3 (per BGA JEDEC J-STD-020) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do PIC32MZ1024EFM144-I/JWX 144-pin tfbga, 7x7 mm
Configuração de pinos para PIC32MZ1024EFM144-I/JWX (pacote 144-pin tfbga, 7x7 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PIC32MZ1024EFM144-I/JWX.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PIC32MZ1024EFM144-I/JWX é adequado para 7 aplicaçãos: Industrial HMI Panels, Secure IoT Gateways, Automotive Body and Infotainment Nodes, BLDC and PMSM Motor Control, Medical Instrumentation, Audio Processing and Streaming, Connected Point-of-Sale Terminals.
Industrial HMI Panels
The PIC32MZ1024EFM144-I/JWX is well suited to industrial HMI panels where its 200 MHz MIPS core plus FPU accelerate 2D graphics rendering and its 512 KB SRAM holds a full display framebuffer without external SDRAM. Designers can drive parallel RGB displays directly via the integrated EBI while leaving enough MIPS headroom for Modbus/TCP and EtherNet/IP stacks. Compared with the older PIC32MX795F512L, this part triples the rendering throughput and exposes CAN FD for fieldbus integration.
Recomendado
Secure IoT Gateways
With its on-chip Crypto engine (AES/SHA/RNG), 10/100 Ethernet MAC, and USB Hi-Speed, the PIC32MZ1024EFM144-I/JWX enables TLS/DTLS-secured IoT gateways with no external crypto IC. The MIPS M-class core handles mbedTLS handshakes alongside an MQTT or CoAP stack, while the dual CAN FD ports bridge to industrial sensor busses. Its 1 MB dual-panel Flash supports secure OTA firmware upgrades with rollback on boot failure.
Recomendado
Automotive Body and Infotainment Nodes
The PIC32MZ1024EFM144-I/JWX meets the integration demands of automotive body controllers, where dual CAN FD replaces classic CAN and the Crypto engine secures diagnostic UDS sessions. Its 144-pin BGA exposes the external memory bus needed for shared display RAM. Although not AEC-Q100 qualified itself, the family is widely used behind an isolated CAN gateway in automotive subsystems at the industrial temperature range.
Recomendado
BLDC and PMSM Motor Control
The PIC32MZ1024EFM144-I/JWX drives field-oriented control loops on BLDC and PMSM motors at switching frequencies to 50 kHz with full DSP extensions, achieving sub-1 microsecond current-loop execution. The 12-bit ADC with multiple S&H channels samples all three phase currents simultaneously, while the 144-TFBGA exposes the PWM output pairs and quadrature encoder inputs required for resolver or encoder feedback.
Recomendado
Medical Instrumentation
Medical instrumentation such as portable patient monitors benefits from the PIC32MZ1024EFM144-I/JWX USB Hi-Speed device port, on-chip 12-bit ADC with adequate ENOB for ECG and SpO2 signal chains, and ample MIPS for digital filtering algorithms. The 1 MB Flash stores both the FDA-traceable calibration constants and the active waveform DSP code simultaneously, eliminating an external memory IC.
Recomendado
Audio Processing and Streaming
Audio products such as networked amplifiers and pro-audio mixers leverage the PIC32MZ1024EFM144-I/JWX DSP extensions to run FFT-based EQ, dynamics, and feedback suppression in real time. The I2S ports stream to external DACs and codecs, while Ethernet handles Dante or AES67 audio-over-IP. The 512 KB SRAM stages FFT buffers without DMA thrash.
Recomendado
Connected Point-of-Sale Terminals
POS terminals need secure boot, encrypted storage, and multi-protocol connectivity, all of which the PIC32MZ1024EFM144-I/JWX delivers through its integrated Crypto engine, USB Hi-Speed, and Ethernet. The 144-TFBGA's peripheral density supports barcode scanner UART, NFC SPI, and thermal printer interfaces concurrently. Live-update dual-panel Flash allows secure firmware upgrades in deployed terminals with no downtime.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ1024EFM144-I/JWX — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ1024EFM144-E/JWX | PIC32MZ1024EFM144T-I/JWX | PIC32MZ1024EFG144T-E/JWX | PIC32MZ1024EFF144T-E/JWX |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-TFBGA (7x7) | 144-TFBGA (7x7) - same | 144-TFBGA (7x7) - same | 144-TFBGA (7x7) - same | 144-TFBGA (7x7) - same |
| Max CPU Speed | 200 MHz | 180 MHz (-10%) | 200 MHz (same) | 180 MHz (-10%) | 180 MHz (-10%) |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| RAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Crypto Engine | Yes | Yes | Yes | No (F-suffix style cost-down) | No |
| CAN FD | Yes (2x) | Yes (2x) | Yes (2x) | Yes (2x) | No (classic CAN only) |
| Temperature Grade | Industrial (-40C to +85C) | Extended (-40C to +125C) | Industrial (-40C to +85C) | Extended (-40C to +125C) | Extended (-40C to +125C) |
Principais diferenciais
- Industrial temperature grade at full 200 MHz (vs PIC32MZ1024EFM144-E/JWX)
- Integrated Crypto engine for TLS/DTLS (vs PIC32MZ1024EFE144-I/PL)
- Highest pin count in the 144-TFBGA (vs PIC32MZ1024EFM100-I/PT)
Notas de projeto
Estimated: The 144-TFBGA at 0.5 mm pitch requires a 1-2-1 or 1-2-2-2 HDI stackup with laser-drilled microvias for the inner fan-out. Escape routing should use 4-mil trace/space with 8-mil pad pitch to maintain a 50 ohm controlled-impedance environment for the parallel memory bus and RMII traces. Route RMII traces length-matched within 50 mil and keep them away from PWM and switching power nodes.
The 144-TFBGA at full 200 MHz with all peripherals enabled can dissipate up to 1.2 W (estimated from Microchip power consumption tables). The 7x7 mm BGA provides adequate thermal pad spreading for typical designs, but designers should stitch the centre BGA balls with thermal vias to the inner copper plane and provide at least 1 sq. cm of copper per side of the BGA footprint.
Place 100 nF X7R bypass capacitors adjacent to every VDD/VSS pair on the BGA, with 4.7 uF bulk decoupling on the regulator outputs. Add a ferrite bead plus 10 uF bulk capacitor on the analog AVDD rail feeding the 12-bit ADC to suppress switching regulator noise below the ADC ENOB. Use Microchip's MPLAB Harmony Power Configuration to model inrush during peripheral startup.
Do not assume cross-package variants share the same pinout: the /JWX BGA and /PH LQFP have different ball-to-pin maps. Do not enable both Ethernet and USB Hi-Speed simultaneously without reviewing the PLL configuration in the datasheet's clocking section. Finally, do not omit the 32 kHz secondary oscillator load capacitors on the SOSC pins when using RTC or low-power sleep modes.
Keep the parallel memory bus traces to no more than 50 mm and length-match the byte-lane strobes within 0.5 inch for reliable operation above 100 MHz EBICLK. Shield the analog ADC traces with a ground guard ring on the same layer, and route the analog AVSS return directly to the regulator ground pin rather than the digital ground pour.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. Halogen-free per Microchip material declarations. Not AEC-Q100 qualified; AEC-Q100 variants exist in the PIC32MZ family but are different orderable parts.
