PIC32MZ1025DAS169-I/6J - 32-bit 200MHz MCU, 1MB Flash, 169-LFBGA | Microchip
N.º da peça: PIC32MZ1025DAS169-I/6J ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $13.42 | $13,42 |
| 10 | $12.41 | $124,10 |
| 100 | $10.85 | $1.085,00 |
| 500 | $9.74 | $4.870,00 |
| 1.000 | $8.92 | $8.920,00 |
PIC32MZ1025DAS169-I/6J Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on one die, enabling compact embedded designs. The PIC32MZ1025DAS169-I/6J sits within the PIC32MZ graphics hierarchy: 32-bit MCU -> MIPS32 microAptiv core -> PIC32MZ family -> PIC32MZ DAS graphics subfamily -> high-integration graphics controller with stacked DDR2. It also includes a 12-bit 18 MSPS ADC module with up to 45 analog inputs, plus CAN and High-Speed USB interfaces for industrial and automotive HMI designs.
Key differentiating features of this part include 1MB Flash and 640KB SRAM, an integrated LCD TFT controller with hardware graphics processing, up to 45 analog channels for sensor aggregation, and High-Speed USB plus CAN for industrial networking. The 169-LFBGA package offers high pin density for designs that need many simultaneous peripherals and large parallel display buses.
The architecture uses the MIPS32 microAptiv core running at 200 MHz with a 5-stage pipeline, an integrated DDR2 controller that lets the chip address 32MB or 128MB of external DDR2 memory, and a dedicated GPU block for accelerated 2D rendering. Hardware crypto and a true random number generator are also available on this family.
Typical applications include industrial HMI panels, automotive dashboard displays, medical GUI devices, IoT gateways with rich graphics, and point-of-sale terminals. Designers choose this part when they need integrated DDR2 support plus graphics acceleration without an external MPU plus external DDR combination.
When designing with this part, plan the PCB for the LFBGA fan-out carefully and ensure DDR2 trace lengths are matched per the JEDEC DDR2 specification. The DDR2 controller reduces BOM but the routing rules are tighter than for parallel SRAM, so allocate margin in the PCB stack-up.
This page synthesizes DigiKey and Mouser distributor pricing, Microchip same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para PIC32MZ1025DAS169-I/6J — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ1025DAS169-I/6J (mesmo formato e footprint) — diferindo em Graphics Controller, Mounting Type, USB, Core Architecture, External Memory Interface.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ1025DAS169-V/6J
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MZ1025DAR169T-I/6J
✅ Drop-In✓ Em estoque
$11.88 / unidade
Ver ficha técnica →PIC32MZ1025DAL169T-I/HF
✅ Drop-In✓ Em estoque
$8.3 / unidade
Ver ficha técnica →PIC32MZ1025DAK169-I/HF
✅ Drop-In✓ Em estoque
$10.95 / unidade
Ver ficha técnica →PIC32MZ1025DAB169T-I/HF
✅ Drop-In✓ Em estoque
$12.65 / unidade
Ver ficha técnica →PIC32MZ1025DAS169-I/6J Classificações máximas e características elétricas
| Core | MIPS32 microAptiv |
| Family | PIC32MZ Graphics (DAK/DAL/DAR/DAS) |
| Series | PIC32MZ DAS |
| Core Width | 32-bit |
| Maximum CPU Speed | 200 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| Data Memory (SRAM) | 640 KB |
| External Memory Interface | DDR2 controller, up to 32 MB or 128 MB externally addressable |
| Graphics Controller | Integrated LCD TFT controller and Graphics Processor |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Communication Interfaces | CAN, High-Speed USB |
| Operating Voltage | 1.8 V (core supply typical) |
| Encapsulamento | 169-LFBGA (11x11 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (Industrial, -I suffix) |
| Nível MSL | MSL3 (per JEDEC J-STD-020, typical for LFBGA) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do PIC32MZ1025DAS169-I/6J 169-lfbga (11x11 mm)
Configuração de pinos para PIC32MZ1025DAS169-I/6J (pacote 169-lfbga (11x11 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PIC32MZ1025DAS169-I/6J.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PIC32MZ1025DAS169-I/6J é adequado para 6 aplicaçãos: Industrial HMI Panels, Automotive Dashboard Displays, Medical GUI Devices, Point-of-Sale Terminals, IoT Gateways with Rich Graphics, Smart Home Touch Panels.
Industrial HMI Panels
The PIC32MZ1025DAS169-I/6J fits industrial HMI panels because its integrated Graphics Controller, dedicated Graphics Processor, and DDR2 controller eliminate the need for an external MPU plus external DDR combination. With 200 MHz microAptiv throughput and 1 MB Flash, the MCU drives multi-layer TFT panels at WXGA resolutions while leaving CPU headroom for Modbus/TCP, EtherNet/IP, or CANopen fieldbus stacks. Compared to a discrete host MCU plus external GPU, this part reduces BOM by one IC and simplifies PCB layout. The 12-bit 18 MSPS ADC with up to 45 analog inputs handles backlight dimming, temperature sensing, and touch-screen coordination from a single chip.
Recomendado
Automotive Dashboard Displays
For automotive dashboard displays, the PIC32MZ1025DAS169-I/6J delivers the graphics throughput needed for instrument clusters and infotainment panels. The 200 MHz MIPS32 microAptiv core plus dedicated GPU render 2D graphics with low CPU overhead, while the DDR2 controller keeps frame buffers in fast external memory instead of competing with on-chip SRAM. The -I (industrial) grade operates at -40C to +85C; for harsher under-hood requirements, drop in the PIC32MZ1025DAS169-V/6J V-temp variant without PCB changes. The integrated CAN and High-Speed USB interfaces connect to the vehicle network without external bridges, supporting both legacy CAN and modern CAN FD messaging.
Recomendado
Medical GUI Devices
The PIC32MZ1025DAS169-I/6J suits medical GUI devices such as patient monitors, infusion pumps, and diagnostic analyzers that need crisp TFT displays and reliable I/O. Its 1 MB Flash and 640 KB SRAM hold a full graphics stack plus application firmware, while the DDR2 controller supports large frame buffers for smooth waveform scrolling on patient monitors. The 12-bit 18 MSPS ADC reads multiple sensor inputs (SpO2, temperature, pressure) at high sampling rates without an external analog front end. The 169-LFBGA package integrates all peripherals into a compact form factor suitable for handheld or cart-mounted medical equipment.
Recomendado
Point-of-Sale Terminals
POS terminals benefit from the PIC32MZ1025DAS169-I/6J's integrated graphics controller for rendering rich touchscreen UIs with payment-flow animations, and from the DDR2 controller that holds large icon and font libraries in external memory. The High-Speed USB port directly drives a printer or payment dongle, while CAN and serial peripherals connect to barcode scanners, cash drawers, and customer displays. The 200 MHz core processes encrypted PIN pad transactions in real time without offloading to a separate secure element, reducing BOM. The 169-LFBGA footprint supports a compact motherboard design typical of space-constrained POS hardware.
Recomendado
IoT Gateways with Rich Graphics
IoT gateways that present data on a local TFT display use the PIC32MZ1025DAS169-I/6J to consolidate edge-compute, graphics rendering, and protocol bridging. The MIPS32 microAptiv core runs TLS/DTLS stacks, MQTT, or CoAP clients, while the GPU renders live sensor-data dashboards. High-Speed USB provides an upstream connection to a host system or external radio module, and CAN/RS-485 interfaces connect to industrial sensors. Compared to a multi-chip solution with separate MCU + GPU + external memory, this single-chip approach cuts PCB area and BOM cost, while the DDR2 controller avoids internal SRAM exhaustion for large dashboards.
Recomendado
Smart Home Touch Panels
Premium smart-home touch panels (whole-home controllers, multi-zone HVAC controllers, security keypads) leverage the PIC32MZ1025DAS169-I/6J's TFT graphics capability and DDR2-backed UI performance. The 200 MHz microAptiv core handles capacitive-touch processing, multi-zone logic, and encrypted Zigbee/Wi-Fi bridging without host offloading. The integrated graphics processor drives smooth animations across home screens and live camera feeds, while DDR2 support keeps large icon sets resident for instant page transitions. Compared to lower-pin PIC32 parts, the 169-LFBGA exposes enough peripherals for multiple touch-screen I/O, RS-485 HVAC bus, and Ethernet connectivity simultaneously.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ1025DAS169-I/6J — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ1025DAS169-V/6J | PIC32MZ1025DAR169T-I/6J | PIC32MZ1025DAL169T-I/HF | PIC32MZ1025DAK169-I/HF | PIC32MZ1025DAB169T-I/HF |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Core | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz |
| DDR2 Controller | Integrated, up to 128 MB external | Integrated | Integrated | Integrated | Integrated | Integrated |
| Graphics Controller | Integrated LCD TFT + GPU | Integrated LCD TFT + GPU | Integrated | Reduced | Reduced | Reduced |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +105C (Automotive V-temp) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
Principais diferenciais
- Only DAB/DAK/DAL/DAR/DAS 169-LFBGA part with the full graphics plus DDR2 feature set (vs PIC32MZ1025DAK169-I/HF)
- Industrial-grade -40C to +85C operating range with same 169-LFBGA footprint (vs PIC32MZ1025DAS169-V/6J)
- 1 MB Flash and 640 KB SRAM in a 169-LFBGA footprint (vs PIC32MZ1025DAR169T-I/6J)
Notas de projeto
The 169-LFBGA package has a 0.65 mm ball pitch (per Microchip family datasheet typical for 169-LFBGA). PCB layout requires microvia (laser-drilled) stack-up to fan-out the inner balls; standard 0.4 mm through-vias will not fit between balls. Use a 1-4-1 or 1-6-1 HDI stack-up with 50-ohm single-ended controlled impedance. Allocate at least 4 routing layers for DDR2 signals plus 2 for the TFT bus plus 2 for power, totaling 8 layers minimum for a clean industrial-grade layout.
DDR2 signal traces must follow JEDEC DDR2 length-matching rules: data byte lanes matched within 25 mil, address/command matched within 100 mil, clock pair within 25 mil. The DDR2 controller on the PIC32MZ DAS family does not include on-die termination control for all modes; place external VTT termination resistors near the DRAM. Use series resistors (typically 22 ohm) on clock and data strobe lines for damping, and keep impedance discontinuities below 10% per layer transition. Reference the Microchip PIC32MZ DA family hardware design guide for routing recommendations.
Do not assume the DDR2 controller auto-initializes at power-up; configure the DDR2 timing registers in the startup code before any C runtime accesses external memory. The 1.8 V core supply must ramp before the 3.3 V I/O supply to avoid latch-up; add a power-sequencer IC or sequence from a PMIC. Stack-overflow on the microAptiv can corrupt the DDR2 controller registers and trigger hard faults - reserve adequate heap/stack in MPLAB X linker settings for graphics buffers. When migrating from -I (industrial) to -V (automotive) grade, recalibrate the ADC offset at the new temperature range.
Informações de conformidade
Industrial-grade (-I) part; for AEC-Q100 automotive qualification use PIC32MZ1025DAS169-V/6J variant. RoHS compliant per Microchip product page.