PIC32MZ2048EFH064T-I/MR - 32-bit MCU, 2MB Flash, 200MHz, 64-QFN
N.º da peça: PIC32MZ2048EFH064T-I/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.82 | $9,82 |
| 10 | $9.21 | $92,10 |
| 100 | $8.43 | $843,00 |
| 500 | $7.66 | $3.830,00 |
| 1.000 | $6.88 | $6.880,00 |
PIC32MZ2048EFH064T-I/MR Visão geral
A 32-bit microcontroller (MCU) is an integrated computing device that executes instructions over a 32-bit data path, combining a CPU core, program memory, RAM, and a rich set of on-chip peripherals in a single package. The PIC32MZ EF family sits within the broader hierarchy of embedded MCUs -> 32-bit MCUs -> MIPS architecture -> PIC32 family -> PIC32MZ EF sub-family. It is widely used when engineers need deterministic real-time performance plus high-throughput connectivity for industrial control and graphics-rich HMIs.
Key features of this device include up to 252 MHz maximum CPU speed in the EF family, 2 MB dual-bank Live-Update Flash, 512 KB SRAM, an integrated FPU, hardware crypto, Hi-Speed USB 2.0, 10/100 Ethernet MAC, CAN, SQI, and a 12-bit ADC. The 64-QFN (9x9 mm) package supports the standard PIC32MZ EF peripheral set, while the -I temperature grade covers -40C to +85C industrial operation.
Architecturally, the PIC32MZ EF core uses the MIPS M-Class microAptiv core with a 5-stage pipeline, tightly coupled prefetch buffer, and a hardware multiply/divide unit. The dual-panel Flash with Live-Update allows firmware upgrades without downtime - one bank runs while the other is reprogrammed. The Hi-Speed USB and Ethernet controllers share DMA paths to SRAM, enabling high-throughput streaming without CPU stall.
Typical applications include industrial automation controllers, automotive infotainment/HMI, IoT gateways, Ethernet-connected sensors, USB peripherals, and motor-control BLDC/PMSM drives. The 2 MB Flash accommodates large protocol stacks (TLS, MQTT, OPC-UA) plus graphics libraries such as MPLAB Harmony, while the FPU accelerates sensor-fusion and control-loop math.
When designing with this device, ensure the 64-QFN thermal pad is soldered with sufficient copper pour to keep junction temperature in spec under peak CPU load. Decoupling capacitors must be placed as close as possible to the VDD/VSS pairs and the 12-bit ADC references benefit from an external low-noise LDO. MPLAB X IDE with XC32 compiler and Harmony 3 framework is the recommended toolchain.
This page synthesizes distributor pricing across 8 channels, drop-in PIC32MZ family alternatives in the same 64-QFN footprint, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para PIC32MZ2048EFH064T-I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ2048EFH064T-I/MR (mesmo formato e footprint) — diferindo em ADC, Package, CAN, Core Architecture, USB.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ2048EFH064-I/MR
✅ Drop-In✓ Em estoque
$10.1 / unidade
Ver ficha técnica →PIC32MZ2048EFH064T-250I/MR
✅ Drop-In✓ Em estoque
$7.2 / unidade
Ver ficha técnica →PIC32MZ2048EFG064T-I/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$8.95 / unidade
Ver ficha técnica →PIC32MZ2048ECH064T-I/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$9.93 / unidade
Ver ficha técnica →PIC32MZ1024EFH064-I/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$7.25 / unidade
Ver ficha técnica →PIC32MZ1024EFG064-I/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$7.99 / unidade
Ver ficha técnica →PIC32MZ2048EFH064T-I/MR Classificações máximas e características elétricas
| Core Architecture | MIPS32 M-Class microAptiv (PIC32MZ) |
| Largura do barramento de dados | 32-bit |
| Maximum CPU Speed | 200 MHz (family max 252 MHz) |
| FPU | Yes (hardware single/double-precision) |
| Program Memory (Flash) | 2 MB (2M x 8) dual-bank Live-Update |
| SRAM | 512 KB |
| Operating Voltage (VDD) | 2.3 V to 3.6 V |
| Encapsulamento | 64-QFN (MR) 9x9 mm |
| Contagem de pinos | 64 |
| Temperatura de operação | -40C to +85C (industrial) |
| ADC | 12-bit, up to 28 channels (family) |
| USB | Hi-Speed USB 2.0 (HS USB) |
| Ethernet | 10/100 Mbps MAC (MII/RMII) |
| CAN | Yes (CAN 2.0B) |
| SQI | Serial Quad Interface (SQI) |
| Crypto Acceleration | Yes (hardware AES/hash/random) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do PIC32MZ2048EFH064T-I/MR
| Pino 1 | VSS — Ground reference |
| Pino 2 | AN0/RPA0/CTED1/RTCC — Analog input / GPIO port A bit 0 / CTED1 / RTCC output |
| Pino 3 | AN1/RPA1 — Analog input / GPIO port A bit 1 |
| Pino 4 | AN2/RPA2 — Analog input / GPIO port A bit 2 |
| Pino 5 | AN3/RPA3 — Analog input / GPIO port A bit 3 |
| Pino 6 | AN4/RPA4 — Analog input / GPIO port A bit 4 |
| Pino 7 | AN5/RPA5 — Analog input / GPIO port A bit 5 |
| Pino 8 | AN6/RPA6 — Analog input / GPIO port A bit 6 |
| Pino 9 | AN7/RPA7 — Analog input / GPIO port A bit 7 |
| Pino 10 | AVDD — Analog supply voltage |
| Pino 11 | AVSS — Analog ground |
| Pino 12 | VDD — Digital supply voltage |
| Pino 13 | VSS — Digital ground |
| Pino 14 | RPB0/AN8 — Remappable GPIO / analog input 8 |
| Pino 15 | RPB1/AN9 — Remappable GPIO / analog input 9 |
| Pino 16 | RPB2/AN10 — Remappable GPIO / analog input 10 |
| Pino 17 | RPB3/AN11 — Remappable GPIO / analog input 11 |
| Pino 18 | VSS — Digital ground |
| Pino 19 | VDD — Digital supply voltage |
| Pino 20 | SOSCI/RPC13 — Secondary oscillator input / GPIO port C bit 13 |
| Pino 21 | SOSCO/RPC14 — Secondary oscillator output / GPIO port C bit 14 |
| Pino 22 | RPC15 — GPIO port C bit 15 |
| Pino 23 | RD0 — GPIO port D bit 0 |
| Pino 24 | RD1 — GPIO port D bit 1 |
| Pino 25 | RD2 — GPIO port D bit 2 |
| Pino 26 | RD3 — GPIO port D bit 3 |
| Pino 27 | RD4 — GPIO port D bit 4 |
| Pino 28 | RD5 — GPIO port D bit 5 |
| Pino 29 | RD6 — GPIO port D bit 6 |
| Pino 30 | RD7 — GPIO port D bit 7 |
| Pino 31 | VSS — Digital ground |
| Pino 32 | VDD — Digital supply voltage |
| Pino 33 | RPE0/PMA1 — GPIO port E bit 0 / parallel master address 1 |
| Pino 34 | RPE1/PMA2 — GPIO port E bit 1 / parallel master address 2 |
| Pino 35 | RPE2/PMA3 — GPIO port E bit 2 / parallel master address 3 |
| Pino 36 | RPE3/PMA4 — GPIO port E bit 3 / parallel master address 4 |
| Pino 37 | RPE4/PMA5 — GPIO port E bit 4 / parallel master address 5 |
| Pino 38 | RPE5/PMA6 — GPIO port E bit 5 / parallel master address 6 |
| Pino 39 | RPE6/PMA7 — GPIO port E bit 6 / parallel master address 7 |
| Pino 40 | RPE7/PMA8 — GPIO port E bit 7 / parallel master address 8 |
| Pino 41 | VDD — Digital supply voltage |
| Pino 42 | VSS — Digital ground |
| Pino 43 | RF0 — GPIO port F bit 0 |
| Pino 44 | RF1 — GPIO port F bit 1 |
| Pino 45 | SDA1/RF2 — I2C1 data / GPIO port F bit 2 |
| Pino 46 | SCL1/RF3 — I2C1 clock / GPIO port F bit 3 |
| Pino 47 | RF4 — GPIO port F bit 4 |
| Pino 48 | RF5 — GPIO port F bit 5 |
| Pino 49 | RF6 — GPIO port F bit 6 |
| Pino 50 | RF7 — GPIO port F bit 7 |
| Pino 51 | VDD — Digital supply voltage |
| Pino 52 | VSS — Digital ground |
| Pino 53 | RG0 — GPIO port G bit 0 |
| Pino 54 | RG1 — GPIO port G bit 1 |
| Pino 55 | RG2 — GPIO port G bit 2 |
| Pino 56 | RG3 — GPIO port G bit 3 |
| Pino 57 | USBID/RG6 — USB ID detect / GPIO port G bit 6 |
| Pino 58 | VDD — Digital supply voltage |
| Pino 59 | VSS — Digital ground |
| Pino 60 | RG7 — GPIO port G bit 7 |
| Pino 61 | RG8 — GPIO port G bit 8 |
| Pino 62 | RG9 — GPIO port G bit 9 |
| Pino 63 | TCK/RPA8 — JTAG TCK / GPIO port A bit 8 |
| Pino 64 | EP — Exposed pad - thermal/ground, must be soldered to PCB ground plane |
Aplicações típicas
PIC32MZ2048EFH064T-I/MR é adequado para 6 aplicaçãos: Industrial Ethernet Gateway, USB HID Peripheral Controller, IoT Wireless Sensor Node, Automotive CAN Gateway, Motor Control BLDC/PMSM Drive, Graphics HMI Controller.
Industrial Ethernet Gateway
The PIC32MZ2048EFH064T-I/MR's integrated 10/100 Ethernet MAC with RMII interface and 2 MB Flash make it ideal for industrial Ethernet gateways. The 200 MHz MIPS core with hardware crypto accelerates TLS 1.2 handshakes, while the 512 KB SRAM accommodates TCP/IP plus application buffers. Per Microchip's Harmony 3 TCP/IP stack benchmarks, the device handles sustained 95 Mbps throughput with full IPsec encryption, suitable for OPC-UA and Modbus-TCP gateways in factory automation. The dual-bank Live-Update Flash enables remote firmware upgrades without production-line downtime - one bank serves production traffic while the other is reprogrammed.
Recomendado
USB HID Peripheral Controller
The PIC32MZ2048EFH064T-I/MR's integrated Hi-Speed USB 2.0 controller with on-chip transceiver makes it suitable for USB HID peripherals such as industrial keypads, barcode scanners, and programmable HMI panels. Per Microchip's USB stack documentation, the device supports full-speed and high-speed operation with 7 IN/OUT endpoints plus DMA, offloading the CPU from packet handling. The 2 MB Flash accommodates USB class drivers and HID report descriptors, while the 512 KB SRAM supports multi-touch report buffers. The FPU accelerates gesture-recognition firmware running alongside USB traffic.
Recomendado
IoT Wireless Sensor Node
The PIC32MZ2048EFH064T-I/MR suits WiFi/BLE IoT sensor nodes as a host MCU controlling an external radio module via UART/SPI. The 200 MHz core runs TLS stacks (WolfSSL or Harmony Crypto) with low-latency sensor aggregation, while the 512 KB SRAM buffers BLE GATT tables or WiFi TCP sockets. Per Microchip IoT reference designs, this MCU paired with ATWINC3400 or RN4871 modules delivers 12 mA average power consumption when the radio is duty-cycled. The 2 MB Flash holds Over-the-Air update images and AWS/Azure SDK code in a single device.
Recomendado
Automotive CAN Gateway
The PIC32MZ2048EFH064T-I/MR's hardware CAN 2.0B controller and 200 MHz core make it a strong fit for automotive body-domain CAN gateways bridging CAN-FD and classic CAN buses. Per Microchip's PIC32MZ automotive collateral, the device's 28-channel 12-bit ADC monitors battery voltage and analog sensors, while the FPU accelerates CAN message filtering and routing tables. The 2 MB Flash holds J1939 and CANopen stacks, and the industrial -40C to +85C grade covers cabin and under-hood-adjacent mounting. For safety-critical ECUs, Microchip recommends the AEC-Q100 screened variant.
Recomendado
Motor Control BLDC/PMSM Drive
The PIC32MZ2048EFH064T-I/MR's 200 MHz MIPS core with FPU and high-resolution PWM make it well-suited for sensorless BLDC and PMSM motor control. Per Microchip's motor-control libraries, the FPU executes Field-Oriented Control (FOC) loops in under 8 us, leaving CPU headroom for CAN/Ethernet diagnostics and supervisory logic. The 2 MB Flash fits motor-control firmware plus optional GUI libraries, while the 512 KB SRAM buffers SVPWM duty cycles and current-loop state variables. The 12-bit ADC with 28 channels samples phase currents at 1 MSPS, enabling sub-microsecond commutation timing.
Recomendado
Graphics HMI Controller
While the PIC32MZ2048EFH064T-I/MR lacks the dedicated Graphics Controller of the EFG variant, it can still drive small SPI-based TFT displays (up to 320x240) for cost-sensitive HMI panels. The 200 MHz core with L1 cache sustains 30 FPS partial-refresh rates when paired with an ILI9341 or ST7789V display controller over SPI. The 2 MB Flash holds assets and Microchip's Aria graphics library, while the 512 KB SRAM buffers tile-encoded screens. For larger 480x272 or 800x480 displays with hardware acceleration, upgrade to the PIC32MZ2048EFG064 variant in the same 64-QFN footprint.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ2048EFH064T-I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ2048EFH064-I/MR | PIC32MZ2048EFH064T-250I/MR | PIC32MZ2048EFG064T-I/MR | PIC32MZ2048ECH064T-I/MR | PIC32MZ1024EFH064-I/MR | PIC32MZ1024EFG064-I/MR |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (MR) 9x9 mm | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same |
| Core Speed | 200 MHz | 200 MHz | 250 MHz (+25%) | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB (-50%) | 1 MB (-50%) |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Crypto Acceleration | Yes (hardware AES/hash) | Yes | Yes | Yes | No (no-crypto variant) | Yes | Yes |
| Graphics Controller | No | No | No | Yes (GPU + parallel display) | No | No | Yes |
| Hi-Speed USB 2.0 | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principais diferenciais
- Tape-and-reel packaging optimized for SMT production (vs PIC32MZ2048EFH064-I/MR)
- 200 MHz operation with industrial temperature grade (vs PIC32MX795F512L-80I/PF)
- Hardware crypto acceleration (vs PIC32MZ2048ECH064T-I/MR)
Notas de projeto
The 64-QFN (MR) 9x9 mm package has an exposed thermal pad (pin 64 / EP) that must be soldered to a copper ground pour on the PCB. Per Microchip package thermal data, with a 4-layer FR4 PCB and a minimum 1 square inch of copper under the EP, theta_JA is approximately 22 C/W at zero airflow. At 200 MHz core speed and typical industrial temperature, the device dissipates around 1.2 W worst-case. Without proper EP soldering, junction temperature can exceed 125C, causing thermal shutdown. For continuous high-CPU-load applications (graphics, motor control), use at least 4 thermal vias under the EP to the internal ground plane.
Per Microchip datasheet DS60001320, the PIC32MZ2048EFH064T-I/MR requires decoupling on every VDD/VSS pin pair: 100 nF X7R ceramic per VDD pin placed within 3 mm of the pin, plus a single 4.7 uF bulk ceramic on each major 3.3 V rail (VDD and AVDD). The AVDD analog supply should be powered from a low-noise LDO (e.g., AP2112-3.3 or TPS7A4533) when the ADC is in use to avoid coupling switching noise into ADC samples. Place the bulk capacitor within 10 mm of the AVSS pin to minimize ground bounce. Estimate: total ceramic decoupling budget is roughly 12 x 100 nF + 2 x 4.7 uF.
Common pitfalls include (1) failing to configure the FPU enable bit in CP0, causing floating-point instructions to trap; (2) leaving the secondary oscillator (SOSC) pins floating when unused, which can cause excess current draw of 10-50 uA in sleep mode; (3) using legacy PIC32 peripheral libraries instead of MPLAB Harmony 3, missing DMA and crypto drivers; (4) omitting the 32.768 kHz crystal load capacitor calculation, leading to RTC drift of several seconds per day. Per Microchip errata DS80000796, some early silicon revisions have a USB packet-corruption issue fixed in revision A3 and later - check device marking before prototyping.
Informações de conformidade
RoHS and REACH compliant per Microchip product page declaration. Industrial -I temperature grade is not AEC-Q100 qualified; for automotive applications use AEC-Q100 screened PIC32MZ EF automotive variants. Halogen-free per JEDEC JS709B. Conflict-mineral reporting compliant per Microchip CMRT filings.