PIC32MZ2064DAK176-I/2J - 200MHz 32-bit MCU, 2MB Flash, 176-LQFP
N.º da peça: PIC32MZ2064DAK176-I/2J ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $11.42 | $11,42 |
| 10 | $10.27 | $102,70 |
| 100 | $9.13 | $913,00 |
| 500 | $8.21 | $4.105,00 |
| 1.000 | $7.32 | $7.320,00 |
PIC32MZ2064DAK176-I/2J Visão geral
The PIC32MZ DA family sits within the broader taxonomy of 32-bit microcontrollers -> MIPS microAptiv architecture -> PIC32 family -> PIC32MZ Graphics sub-family. These microcontrollers target applications that previously required a microprocessor plus companion ICs, because the device integrates a 200MHz core, large SRAM, hardware graphics acceleration, and an external DDR2 controller on a single die. The Graphics Processing Unit (GPU) accelerates 2D drawing operations such as line, rectangle, and circle rendering, plus alpha-blended overlays, freeing the CPU to handle application logic.
Key features include 2MB Flash program memory (2M x 8), 640KB SRAM (640K x 8), an integrated DDR2 DRAM controller supporting 32MB or 128MB externally addressable memory, a 32-bit MIPS32 microAptiv core running at 200MHz, and an integrated graphics controller with hardware-accelerated primitives. Communication peripherals include USB 2.0 High-Speed with PHY, dual CAN, Ethernet MAC, multiple UART/SPI/I2C channels, and a 12-bit ADC. The 120 I/O pins support capacitive touch sensing and parallel bus expansion.
Typical applications include industrial human-machine interface (HMI) panels, point-of-sale terminals, medical patient monitors, automotive infotainment displays, and smart-home control panels with TFT LCD touchscreens. Designers benefit from MPLAB Harmony ecosystem, which provides free graphics libraries, middleware, and example projects for accelerated GUI development.
When designing with this device, ensure the DDR2 memory is laid out per Microchip's routing guidelines; incorrect impedance matching or trace length mismatch will degrade DDR2 throughput. Plan power sequencing carefully: VDDIO must ramp before VDDCORE to prevent latch-up. Use the exposed thermal pad with a continuous ground plane for thermal dissipation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para PIC32MZ2064DAK176-I/2J — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ2064DAK176-I/2J (mesmo formato e footprint) — diferindo em Package, ADC, External Memory Interface, Graphics Controller, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ2064DAH176-I/2J
✅ Drop-In✓ Em estoque
$11.3 / unidade
Ver ficha técnica →PIC32MZ2064DAS176-I/2J
✅ Drop-In✓ Em estoque
$22.61 / unidade
Ver ficha técnica →PIC32MZ2064DAL176-I/2J
✅ Drop-In✓ Em estoque
$17.95 / unidade
Ver ficha técnica →PIC32MZ2064DAR176-I/2J
✅ Drop-In✓ Em estoque
$21.2 / unidade
Ver ficha técnica →PIC32MZ2064DAG176-I/2J
✅ Drop-In✓ Em estoque
$26.1 / unidade
Ver ficha técnica →PIC32MZ2064DAB176T-I/2J
✅ Drop-In✓ Em estoque
$9.45 / unidade
Ver ficha técnica →PIC32MZ2064DAK176-I/2J Classificações máximas e características elétricas
| Core Architecture | MIPS32 microAptiv |
| Core Type | 32-bit Single-Core |
| Max CPU Clock | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| SRAM | 640 KB (640K x 8) |
| External Memory Interface | DDR2 DRAM controller, up to 128 MB addressable |
| Integrated Graphics Controller | Yes (with 2D GPU acceleration) |
| Operating Voltage | 1.7 V to 1.9 V (core), 3.3 V (I/O) |
| I/O Pins | 120 |
| Encapsulamento | 176-LQFP (20 x 20 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (Industrial, 'I' suffix) |
| Communication Interfaces | USB 2.0 HS PHY, 2x CAN, Ethernet MAC, UART, SPI, I2C |
| ADC | 12-bit |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do PIC32MZ2064DAK176-I/2J 176-lqfp (20 x 20 mm) with exposed pad
Configuração de pinos para PIC32MZ2064DAK176-I/2J (pacote 176-lqfp (20 x 20 mm) with exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PIC32MZ2064DAK176-I/2J.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PIC32MZ2064DAK176-I/2J é adequado para 6 aplicaçãos: Industrial HMI Touch Panels, Point-of-Sale Terminals, Medical Patient Monitors, Automotive Infotainment Displays, Smart Home Control Panels, Building Access Control Terminals.
Industrial HMI Touch Panels
The PIC32MZ2064DAK176-I/2J's 200MHz MIPS32 microAptiv core and integrated 2D graphics controller deliver smooth full-color GUI rendering on 5-10 inch TFT LCD panels typical of industrial operator interfaces. The 2MB Flash accommodates large multilingual HMI fonts, and the DDR2 controller offloads frame buffer storage to external 32-128MB DDR2, eliminating costly internal SRAM. With 120 I/O and CAN/Ethernet, the MCU interfaces directly to PLC backplanes and remote I/O racks. Industrial-grade -40C to +85C operation supports factory floor deployment without additional thermal management.
Recomendado
Point-of-Sale Terminals
POS terminals require responsive touch interfaces, barcode scanner integration, and secure payment processing, all of which the PIC32MZ2064DAK176-I/2J addresses with its hardware graphics acceleration and USB 2.0 High-Speed PHY for EMV card readers. The 640KB SRAM plus external DDR2 supports full VGA-resolution UI overlays with alpha blending for receipt preview and signature capture. Dual CAN interfaces connect to peripheral printer/scanner subsystems, while the 12-bit ADC reads thermal printer temperature sensors. MPLAB Harmony middleware accelerates POS UI development.
Recomendado
Medical Patient Monitors
Multi-parameter patient monitors demand crisp waveform rendering and reliable real-time response, both of which benefit from the PIC32MZ2064DAK176-I/2J's 200MHz CPU and hardware 2D graphics primitives. The integrated DDR2 controller supports 800x480 or higher resolution LCDs used for ECG/SpO2 multi-trace displays, while the 2MB Flash stores boot loader, application code, and graphical assets. The USB 2.0 High-Speed PHY enables connectivity to bedside central stations. Industrial temperature range and long-term Microchip silicon availability support 7-10 year medical device lifecycles.
Recomendado
Automotive Infotainment Displays
In automotive rear-seat entertainment and instrument cluster displays, the PIC32MZ2064DAK176-I/2J provides graphics-rich interfaces with hardware acceleration, dual CAN bus connectivity for vehicle network integration, and 120 I/O for tactile button matrices and backlight control. Designers can target up to 128MB external DDR2 for storing complex 3D-style menu graphics and instrument cluster animations. The -40C to +85C industrial temperature range handles cabin environments; for under-hood or AEC-Q100 Grade 2 needs, the 'V' suffix variant is recommended.
Recomendado
Smart Home Control Panels
Wall-mounted smart home controllers combine touchscreen interfaces, Zigbee/Z-Wave bridge functionality, and Wi-Fi connectivity, all addressable by the PIC32MZ2064DAK176-I/2J's Ethernet MAC and USB 2.0 High-Speed PHY. The integrated DDR2 controller drives high-resolution 1280x800 displays for floor-plan visualizations, while the 2MB Flash stores complex automation rule engines. The 12-bit ADC reads ambient light sensors for automatic backlight dimming, and the 120 I/O control relay drivers for traditional lighting loads.
Recomendado
Building Access Control Terminals
Access control terminals with integrated cameras and biometric displays benefit from the PIC32MZ2064DAK176-I/2J's 200MHz MIPS core for face/fingerprint recognition preprocessing, integrated graphics for live camera preview overlays, and 2MB Flash for storing credential databases. The DDR2 controller handles high-resolution preview frames, while the Ethernet MAC connects to centralized access management. Dual CAN and UART interfaces link to door controllers and card readers, with USB 2.0 HS supporting fingerprint module attachment.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ2064DAK176-I/2J — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ2064DAH176-I/2J | PIC32MZ2064DAS176-I/2J | PIC32MZ2064DAL176-I/2J | PIC32MZ2064DAR176-I/2J | PIC32MZ2064DAG176-I/2J | PIC32MZ2064DAB176T-I/2J |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20) | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same |
| CPU Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB (-50%) | 2 MB |
| DDR2 Controller | Yes (up to 128 MB) | Yes | Yes | Yes | Yes | Yes | Yes |
| Graphics Controller | Yes (2D GPU) | Yes | Yes | Yes | Yes | Yes | Yes |
| I/O Pins | 120 | 120 | 120 | 120 | 120 | 120 | 120 |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principais diferenciais
- Largest Flash in DA family (vs PIC32MZ2064DAG176-I/2J)
- Maximum SRAM configuration (vs PIC32MZ2064DAL176-I/2J)
- Latest silicon revision available (vs PIC32MZ2064DAS176-I/2J)
Notas de projeto
The DDR2 interface requires strict impedance-controlled routing: target 50 ohm single-ended and 100 ohm differential impedance for DQ/DQS pairs. Trace length matching within 50 mils (1.27mm) between byte groups is mandatory for reliable operation above 133MHz. Use a ground reference plane beneath all DDR2 traces and avoid splitting the ground plane under the memory bus. Reference decoupling capacitors (100nF and 10uF) must be placed within 100 mils of each DDR2 power pin.
The 176-LQFP exposed thermal pad must be soldered to a continuous ground plane with multiple thermal vias (0.3mm drill, 0.6mm pad) to the bottom layer. Estimated: at 200MHz CPU + DDR2 active read/write, typical power dissipation is approximately 1.5W, requiring thermal relief for sealed enclosures. Without proper thermal pad soldering, junction temperature can exceed 100C at ambient above 60C, triggering thermal shutdown.
Do not omit the external 32.768kHz crystal for the low-power secondary oscillator if you plan to use RTCC (Real-Time Clock and Calendar) or Deep Sleep modes. The internal FRC has a 2% tolerance over temperature, unsuitable for RTC accuracy. Also, when programming via JTAG, ensure the nTRST pin is correctly pulled up - leaving it floating prevents boundary scan from initializing properly.
Separate analog and digital ground planes if using the 12-bit ADC for precision measurements. Place the analog reference decoupling capacitor (typically 100nF) within 5mm of the AVDS pin. Avoid routing digital signals (especially DDR2 clock) across the analog section. The USB 2.0 D+/D- traces require 90 ohm differential impedance and must be length-matched within 150 mils.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial temperature grade (-40C to +85C). For AEC-Q100 automotive qualification, choose 'V' suffix variant.
