PK20X256VMD100 - Kinetis K20 ARM Cortex-M4 MCU 256KB Flash | NXP
N.º da peça: PK20X256VMD100 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.72 | $12,72 |
| 10 | $11.58 | $115,80 |
| 100 | $9.85 | $985,00 |
| 500 | $8.74 | $4.370,00 |
| 1.000 | $7.92 | $7.920,00 |
PK20X256VMD100 Visão geral
What is a Kinetis K20 microcontroller? The K20 sub-family sits inside the broader Kinetis portfolio of ARM Cortex-M4 microcontrollers from NXP Semiconductors. It is a low-power, mixed-signal MCU tier designed for applications that need DSP class math throughput, large volatile and non-volatile memories, USB connectivity, and rich analog peripherals, bridging the gap between 8/16-bit legacy MCUs and full application processors. Within the Kinetis hierarchy (K-series), the K20 occupies the mainstream tier: Cortex-M4 + DSP -> Kinetis family -> ARM Cortex-M MCU -> 32-bit microcontroller -> embedded processor.
Key features include single-precision floating point unit (FPU), 1.25 Dhrystone MIPS per MHz, hardware multiplication/accumulation, low-leakage wake-up unit with multiple low-power modes, and a 12-bit DAC on selected variants. The 144-MAPBGA package exposes 100 user I/Os and supports an external memory bus for parallel SRAM/Flash expansion, a capability that smaller QFP/LQFP K20 parts lack.
Architecturally the K20 uses a Cortex-M4 core with tightly coupled memories, a multi-layer AHB-Lite bus matrix, and dedicated peripherals on separate bridge buses so that DMA and interrupt traffic do not starve the CPU. The 256 KB Flash is single-bank with EEPROM emulation capability, and the 64 KB SRAM is split between general purpose, USB endpoint, and L2 cache for the external bus controller.
Typical applications include industrial control and HMI panels, USB peripherals, low-power metering, secure point-of-sale terminals, automotive body and chassis ECUs (on Q100 variants), and medical sensor aggregation. The DSP extensions make it well suited to digital filters and audio processing.
When designing with this device, allocate PCB layer budget for the 0.8 mm pitch BGA - at least 4 layers with continuous ground stitching under the package. Confirm your toolchain (IAR, Keil, MCUXpresso, GCC) supports the specific K20 mask revision before board bring-up, since early silicon revisions required errata workarounds for the FlexTimer and I2C peripherals.
This page synthesizes distributor pricing, parametric drop-in alternatives, and K20 family design notes not collected in any single manufacturer or distributor document.
Alternativas drop-in para PK20X256VMD100 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PK20X256VMD100 (mesmo formato e footprint) — diferindo em Package, Maximum Clock Frequency, Core Size, Flash Memory, Supply Voltage.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MK21DN256VMD5
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MK21DN512VMD5
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MK21DN512AVLK5
✅ Drop-In✓ Em estoque
$4.8 / unidade
Ver ficha técnica →MK21FX512VMC12-FR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$0.88 / unidade
Ver ficha técnica →MK30DX256VLK7
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →MK60DN256VMD10
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MK40DX256VLH7
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PK20X256VMD100 Classificações máximas e características elétricas
| Core | ARM Cortex-M4 with FPU and DSP |
| Maximum Core Frequency | 100 MHz |
| Performance | 1.25 Dhrystone MIPS per MHz |
| Program Flash | 256 KB (256K x 8) |
| SRAM | 64 KB (64K x 8) |
| User I/O Count | 100 |
| Tensão de alimentação | 1.8 V / 2.5 V / 3.3 V |
| Operating Temperature (ambient) | 0 C to 105 C |
| Encapsulamento | 144-MAPBGA (13x13 mm, 0.8 mm pitch) |
| Oscillator | Internal |
| Tipo de montagem | Surface Mount |
| Packaging | Tray |
| Nível MSL | 3 (168 hours) |
| Status RoHS | Compliant |
| Family | Kinetis K20 |
Configuração de pinos do PK20X256VMD100
| Pino A1 | PTE0 — General purpose I/O / UART1_CTS |
| Pino A2 | PTE1 — General purpose I/O / UART1_RTS |
| Pino B1 | PTE2 — General purpose I/O / SPI1_SOUT |
| Pino B2 | PTE3 — General purpose I/O / SPI1_SIN |
| Pino C1 | PTE4 — General purpose I/O / SPI1_PCS0 |
| Pino C2 | PTE5 — General purpose I/O / SPI1_SCK |
| Pino D1 | PTE6 — General purpose I/O / I2S0_MCLK |
| Pino D2 | PTE7 — General purpose I/O |
| Pino E1 | VDD — Digital supply 1.8/2.5/3.3 V |
| Pino E2 | VSS — Digital ground |
| Pino F1 | PTA0 — General purpose I/O / JTAG_TCLK |
| Pino F2 | PTA1 — General purpose I/O / JTAG_TDI |
| Pino G1 | PTA2 — General purpose I/O / JTAG_TDO |
| Pino G2 | PTA3 — General purpose I/O / JTAG_TMS |
| Pino H1 | PTA4 — General purpose I/O / NMI_b |
| Pino H2 | PTA5 — General purpose I/O / RESET_b |
| Pino J1 | VDDA — Analog supply 1.8/2.5/3.3 V |
| Pino J2 | VSSA — Analog ground |
| Pino K1 | USB0_DP — USB D+ (on-chip PHY) |
| Pino K2 | USB0_DM — USB D- (on-chip PHY) |
| Pino L1 | VOUT33 — USB regulator 3.3 V output |
| Pino L2 | VREGIN — USB regulator input |
| Pino M1 | PTB0 — General purpose I/O / ADC0_SE8 |
| Pino M2 | PTB1 — General purpose I/O / ADC0_SE9 |
| Pino N1 | PTB2 — General purpose I/O / ADC0_SE10 |
| Pino N2 | PTB3 — General purpose I/O / ADC0_SE11 |
Aplicações típicas
PK20X256VMD100 é adequado para 6 aplicaçãos: Industrial USB Peripherals and HMI Panels, Low-Power Metering and Sensor Aggregation, USB Barcode Scanners and POS Terminals, Motor Control and Inverter Subsystems, Portable Medical Sensor Aggregation, Automotive Body and Chassis ECUs.
Industrial USB Peripherals and HMI Panels
The PK20X256VMD100 fits industrial USB peripherals and HMI panels because it integrates USB 2.0 Full-Speed on-chip with 256 KB Flash, ample for USB HID / CDC / vendor-class stacks, plus 100 MHz Cortex-M4 + DSP for responsive UI rendering. The 100 GPIO pins drive TFT displays, keypads, and indicator LEDs without external bus expanders, while the 144-MAPBGA footprint stays compact. Compared to a Cortex-M0+ design, the K20 doubles the MIPS headroom needed for USB stack and GUI work without pricing out the BOM.
Recomendado
Low-Power Metering and Sensor Aggregation
For electricity meters, gas meters, and sensor aggregation nodes, the PK20X256VMD100 offers low-leakage wake-up modes, Cortex-M4 DSP for filter math (RMS, FFT, Kalman), and 16-bit ADC accuracy adequate for metrology-grade sensing. Its 0 C to 105 C ambient range covers outdoor enclosures. The 256 KB Flash holds networking stacks plus metrology libraries, while the 64 KB SRAM is sufficient for sample buffers. Battery-backed RTC and segmented LCD drivers on adjacent Kinetis parts complement this use case when needed.
Recomendado
USB Barcode Scanners and POS Terminals
The PK20X256VMD100 suits USB-connected barcode scanners and POS terminals because the on-chip USB Full-Speed PHY eliminates an external transceiver, and the 100 MHz Cortex-M4 + DSP decodes 1D/2D barcode imagery and runs DES/AES encryption for payment flows. Its 144-MAPBGA package fits the slim scanner form factor, and 100 GPIO pins drive scan LEDs, buzzers, and display modules. Drop-in compatibility with K21 variants preserves the same layout while letting firmware scale upward as feature sets expand.
Recomendado
Motor Control and Inverter Subsystems
The PK20X256VMD100's Cortex-M4 DSP extensions and FlexTimer/PWM peripherals drive 3-phase BLDC and PMSM motors up to mid-power ranges, while the 144-MAPBGA package offers the GPIO count needed for dual-shunt current sensing and encoder feedback. The 100 MHz core closes field-oriented control loops well under 10 us, and the 256 KB Flash holds sensorless-FOC libraries plus app code. Use AEC-Q100 qualified K20 auto-grade variants for under-hood EV/HEV inverter stages where qualification is required.
Recomendado
Portable Medical Sensor Aggregation
Medical sensor aggregation nodes benefit from the PK20X256VMD100's DSP-extended Cortex-M4, which executes digital filters on ECG/EMG/SpO2 waveforms in real time, and its low-leakage modes that extend battery life on portable patient monitors. The 256 KB Flash stores reference waveforms and BLE/USB device stacks, while the 64 KB SRAM is sufficient for sample buffering of typical biosignals. The 0 C to 105 C ambient range covers wearable and bedside applications. Designers targeting FDA-cleared end products should verify IEC 60601 EMI/ESD margins with the chosen 144-MAPBGA PCB layout.
Recomendado
Automotive Body and Chassis ECUs
Although the PK20X256VMD100 itself is industrial-grade, the same K20 silicon is qualified to AEC-Q100 as the MK20 variant, used in body controllers, door modules, lighting, HVAC and instrument clusters. The 144-MAPBGA package supports the GPIO count needed for LIN/CAN nodes and discrete LED drivers. Designers porting firmware from K20 industrial to MK20 automotive silicon keep the same 144-MAPBGA land pattern and core peripherals, simplifying qualification cycles and BOM consolidation across industrial and automotive SKUs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PK20X256VMD100 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MK21DN256VMD5 | MK21DN512VMD5 | MK60DN256VMD10 | MK40DX256VLH7 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-MAPBGA (13x13 mm) | 144-MAPBGA (13x13 mm) - same | 144-MAPBGA (13x13 mm) - same | 144-MAPBGA (13x13 mm) - same | 144-MAPBGA (13x13 mm) - same |
| Program Flash | 256 KB | 256 KB | 512 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 128 KB | 128 KB | 64 KB | 64 KB |
| Core Frequency | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Ethernet MAC | No | No | No | Yes (10/100) | No |
| USB | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| Core | ARM Cortex-M4 + FPU + DSP | ARM Cortex-M4 + FPU + DSP | ARM Cortex-M4 + FPU + DSP | ARM Cortex-M4 + FPU + DSP | ARM Cortex-M4 + FPU + DSP |
| Operating Voltage | 1.8 / 2.5 / 3.3 V | 1.8 / 2.5 / 3.3 V | 1.8 / 2.5 / 3.3 V | 1.8 / 2.5 / 3.3 V | 1.8 / 2.5 / 3.3 V |
Principais diferenciais
- 256 KB Flash + 64 KB SRAM in K20 mainstream tier (vs MK21DN256VMD5)
- Higher memory ceiling via drop-in MK21DN512VMD5 (vs MK21DN512VMD5)
- USB 2.0 Full-Speed with on-chip PHY (vs MK60DN256VMD10)
Notas de projeto
The 144-MAPBGA (0.8 mm pitch, 13x13 mm) requires at least a 4-layer PCB with continuous ground stitching under the BGA to ensure reliable assembly and low-impedance return paths for the high-speed USB and SDRAM buses. Use non-solder-mask-defined (NSMD) pads with a 0.4 mm diameter and a microvia-in-pad process if the stack-up budget allows. Reference designators in the K20P144M100SF2 datasheet's hardware development section specify the recommended escape routing and via pattern.
K20 MCUs require a clean VDD/VSS pair and a separate VDDA/VSSA pair for the ADC and PLL. Place 100 nF X7R decoupling on every VDD pin within 2 mm, plus a 4.7 uF bulk cap near the package. The on-chip USB regulator (VREGIN -> VOUT33) needs a 2.2 uF X5R cap on each rail. Power-on-reset and brown-out reset thresholds are configured in the SIM module; select the trip voltage carefully if you operate at the lower bound of 1.8 V.
Early K20 mask revisions (0N36M, 1N36M) have errata around the I2C peripheral and FlexTimer channel synchronization; check the NXP errata document for your specific mask before committing to firmware features that depend on these modules. Always re-read the silicon revision marked on top of the package after tape-out and update the MCUXpresso SDK to a version that explicitly lists that revision as supported. Avoid mixing 1.8 V and 3.3 V peripherals on the same GPIO port without a level translator.
The 100 MHz Cortex-M4 + DSP core plus the external bus controller (EBI) for SDRAM can produce sharp edges on address and data lines. Route SDRAM in a tight point-to-point topology with matched lengths; keep trace impedance at 50 ohm single-ended. The USB DP/DM pair must be 90 ohm differential with no stubs, and the on-chip USB PHY requires the VOUT33 rail to be stable before the host detects VBUS. Do not route high-speed signals across BGA reference planes that are split.
Estimated: at 100 MHz, 1.8 V VDD, the typical K20 core consumption is around 35 mA, so total power at the ball grid is approximately 0.063 W. The 144-MAPBGA theta_JA is on the order of 35 C/W on a 4-layer JEDEC test board, yielding a junction-to-ambient rise of about 2.2 C. This is well within the 0 C to 105 C ambient envelope, but designers in enclosed industrial housings should add thermal vias under the center ball grid to keep junction temperature comfortable.
Informações de conformidade
RoHS compliance per NXP product packaging markings. AEC-Q100 qualification is not applicable to the industrial PK20X256VMD100; for AEC-Q100 variants choose MK20 NXP automotive part numbers. REACH, halogen-free and conflict-mineral declarations are available from NXP upon request via franchised distributor.
