PM5991B-FEI - DIGI-G4 OTN Processor (No Encryption) | Microchip
N.º da peça: PM5991B-FEI ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $179.32 | $179,32 |
| 10 | $165.5 | $1.655,00 |
| 100 | $148 | $14.800,00 |
| 250 | $134.5 | $33.625,00 |
| 500 | $122.8 | $61.400,00 |
PM5991B-FEI Visão geral
An OTN processor is a specialized Application-Specific Integrated Circuit (ASIC) that performs the digital-layer functions of an optical transport network, including ODU/OTU frame mapping, multiplexing, switching, and forward-error-correction (FEC) processing. Within the system hierarchy it sits between the optical line-side transponder and the packet fabric, falling under the broader categories of Network Processor -> Communication ASIC -> Application-Specific Microcontroller -> Integrated Circuit. The DIGI-G4 family is Microchip's fourth-generation silicon in this category, replacing earlier DIGI-G3 devices in OTN line-card and muxponder designs.
Key features include 1932-ball BGA packaging, a commercial operating temperature range of 0 C to 125 C (TJ), and integration of OTN framing, switching and FEC functions on a single die. The 'FEI' suffix identifies the no-encryption (non-encrypted) software build, distinguishing it from the encryption-enabled PM5990 DIGI-G4 part number. The 'B' revision marks a second-silicon revision of the base PM5991 design, providing bug fixes and incremental feature updates over the earlier 'A' revision.
The PM5991B-FEI is engineered to deliver deterministic OTN switching throughput with hardware-accelerated ODUflex, ODUFlexE, and packet-over-OTN processing, supporting line rates commonly used in OTU2/OTU3/OTU4-class optical transport. Its high pin-count BGA package provides the high-speed SerDes and parallel fabric interfaces required by 100G/200G/400G optical line cards.
Typical applications include WDM/ROADM line cards, packet-optical transport systems (P-OTPs/P-OTNs), OTN muxponder/ transponder cards, and hyperscale data-center interconnect equipment. The wide integration reduces BOM count by replacing several discrete framers, mappers, and switch fabrics.
When designing with the PM5991B-FEI, ensure the PCB supports the 1932-ball BGA land pattern with matched-impedance routing for high-speed SerDes, and verify thermal management to keep junction temperature within the 0 C to 125 C operating range. Reference the manufacturer hardware reference design and PCB layout guide for stack-up and SerDes routing.
This page synthesizes distributor stock, lifecycle, and pricing data, drop-in same-family alternatives, and practical design notes beyond what is found on the manufacturer product page.
Alternativas drop-in para PM5991B-FEI — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PM5990B-FEI
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PM5991A-FEI
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PM5990A-FEI
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PM5991B-FEI-R
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PM5991B-FEI Classificações máximas e características elétricas
| Product Family | DIGI-G4 OTN Processor |
| Part Variant | No encryption (FEI build) |
| Silicon Revision | B (second revision) |
| Função | OTN Mapper / Network Processor |
| Categoria | Application Specific Microcontroller / Network Processor |
| Core | Microchip DIGI-G4 OTN processing core |
| Encapsulamento | 1932-BBGA |
| Contagem de pinos | 1932 |
| Tipo de montagem | Surface Mount (BGA) |
| Temperatura de junção de operação | 0 C to +125 C (TJ) |
| Encryption Support | No (non-encrypted build) |
| Target Applications | OTN switching, P-OTN/POTP, WDM/ROADM, hyperscale DCI |
| Generation | Fourth-generation (DIGI-G4) |
Guia de Configuração de Pinos do PM5991B-FEI 1932-bbga
Configuração de pinos para PM5991B-FEI (pacote 1932-bbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PM5991B-FEI.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PM5991B-FEI é adequado para 6 aplicaçãos: OTN Switching Line Cards, Packet-Optical Transport (P-OTN / POTP), WDM / ROADM Line Equipment, Hyperscale Data-Center Interconnect (DCI), OTN Muxponder / Transponder Cards, OTN Cross-Connect / Add-Drop Multiplexers.
OTN Switching Line Cards
The PM5991B-FEI's hardware-accelerated ODU/ODUflex/ODUFlexE mapping and FEC make it the natural choice for core OTN switch line cards that must terminate and re-originate OTU2/OTU3/OTU4-class traffic. Placed between the optical line-side transponder and the packet fabric, the device performs ODU cross-connect, tributary grooming, and hitless protection switching without software round-trips. Compared with a discrete framer-plus-FPGA implementation, the integrated DIGI-G4 reduces BOM count, power, and PCB area while supporting the deterministic throughput that OTN SLA contracts require.
Recomendado
Packet-Optical Transport (P-OTN / POTP)
The PM5991B-FEI is purpose-built for packet-optical transport platforms (P-OTPs/P-OTNs) that converge OTN and packet services on a single line card. Its integrated OTN mapper, packet-aware ODUflex support, and high-speed SerDes fabric ports let a single device terminate MPLS-TP, Carrier Ethernet, and OTN traffic while mapping them into OTU containers. The non-encrypted FEI build suits P-OTN deployments where MACsec/OTNsec is handled by an adjacent PHY/encryptor rather than inside the mapper ASIC.
Recomendado
WDM / ROADM Line Equipment
Wavelength Division Multiplexing (WDM) and Reconfigurable Optical Add-Drop Multiplexer (ROADM) platforms rely on a high-integration OTN processor to map client services onto DWDM wavelengths, and the PM5991B-FEI delivers that function on a single die. Its hardware FEC, integrated OTN framer, and fabric ports handle the wavelength-side OTU termination while the device feeds downstream optical channel monitors and amplifiers. The 1932-BBGA's high SerDes lane count matches the multi-wavelength I/O required by ROADM add/drop cards.
Recomendado
Hyperscale Data-Center Interconnect (DCI)
Hyperscale DCI platforms use 100G/200G/400G coherent optics that need a high-throughput OTN processor to map Ethernet and OTN traffic onto the optical channel. The PM5991B-FEI's hardware FEC, integrated framer, and high-speed fabric ports are sized for DCI's deterministic line-rate requirements, while the 1932-BBGA's parallel fabric links support the cross-connect density of multi-rack DCI pods. Choosing the FEI (no-encryption) variant keeps per-unit cost low for DCI fabrics that terminate encryption in the leaf-spine switch.
Recomendado
OTN Muxponder / Transponder Cards
Muxponder and transponder cards aggregate multiple client signals (10G/25G/100G Ethernet, Fibre Channel, OTU) onto a single higher-rate OTU wavelength, and the PM5991B-FEI provides the OTN mapping, multiplexing, and FEC in a single device. Its hardware ODU multiplexer and tributary ports handle client aggregation without an external mapper, reducing the muxponder's BOM and power. The B-silicon revision brings incremental interoperability fixes that benefit multi-vendor muxponder deployments.
Recomendado
OTN Cross-Connect / Add-Drop Multiplexers
Digital cross-connect and add-drop multiplexer systems need an OTN processor that can groom, add, drop, and pass-through OTN tributaries at line rate, and the PM5991B-FEI delivers those functions in hardware. Its integrated ODU cross-connect fabric and hitless protection switching support the carrier-grade availability targets of OTN cross-connects, while the 1932-BBGA's high pin count exposes enough fabric ports for non-blocking tributary switching. The non-encrypted FEI build suits cross-connects where encryption is applied upstream.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PM5991B-FEI — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PM5990B-FEI | PM5991A-FEI | PM5990A-FEI |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 1932-BBGA | 1932-BBGA | 1932-BBGA | 1932-BBGA |
| Product Family | DIGI-G4 OTN Processor | DIGI-G4 OTN Processor | DIGI-G4 OTN Processor | DIGI-G4 OTN Processor |
| Silicon Revision | B | B | A | A |
| Encryption Support | No (FEI no-encryption build) | Yes (FEI encryption-enabled build) | No (FEI no-encryption build) | Yes (FEI encryption-enabled build) |
| Function | OTN Mapper / Network Processor | OTN Mapper / Network Processor | OTN Mapper / Network Processor | OTN Mapper / Network Processor |
| Operating Junction Temperature | 0 C to +125 C (TJ) | 0 C to +125 C (TJ) | 0 C to +125 C (TJ) | 0 C to +125 C (TJ) |
| Target Applications | OTN switching, P-OTN, WDM/ROADM, DCI | OTN switching, P-OTN, WDM/ROADM, DCI (secured) | OTN switching, P-OTN, WDM/ROADM, DCI | OTN switching, P-OTN, WDM/ROADM, DCI (secured) |
| Drop-in Compatibility | Reference part | Yes - same 1932-BBGA footprint, encryption differs | Yes - same 1932-BBGA footprint, silicon rev differs | Yes - same 1932-BBGA footprint, encryption + silicon rev differ |
Principais diferenciais
- Fourth-generation DIGI-G4 silicon vs older DIGI-G3 (vs PM8597B-FEI)
- Non-encrypted build reduces cost and export-control paperwork (vs PM5990B-FEI)
- B-silicon revision with incremental bug fixes and feature updates (vs PM5991A-FEI)
Notas de projeto
Estimated: routing the 1932-BBGA package requires a high-layer-count PCB (typically 12+ layers) with matched-impedance SerDes traces, length-matched differential pairs, and a continuous ground reference plane under the high-speed lanes. Reference Microchip's DIGI-G4 hardware reference manual for stack-up, via pattern, and SerDes lane grouping. A single BGA break-out mistake compounds significantly. Use buried vias and a 1.0 mm or finer BGA pitch BGA fanout strategy.
Estimated: at full OTN switching load the PM5991B-FEI can dissipate multi-watt power in the 1932-BBGA, so junction temperature must stay below 125 C. Use a thermal via array under the BGA thermal balls, ample PCB copper pour, and adequate chassis airflow. Cross-check actual dissipation against the Microchip power-estimation tool, and derate for altitude and inlet-air temperature per system requirements.
Do not confuse the PM5991B-FEI (no encryption, B-silicon) with the PM5990B-FEI (encryption enabled) or the PM5991A-FEI (A-silicon). All three share the same 1932-BBGA footprint, but firmware/security-configuration and silicon-revision errata differ. Verify the exact Microchip order code on the shipping label before board bring-up, and confirm with the Microchip product page that the FEI no-encryption build matches your design's security posture.
Place the PM5991B-FEI close to the optical line-side transponder and the packet fabric device to minimize SerDes channel loss; place its reference clock and PLL supply-filter components within the manufacturer's recommended distance, and isolate high-speed SerDes return currents from low-speed management I/O. Reference the Microchip DIGI-G4 hardware reference design for the recommended decoupling network and clock-tree topology.
Informações de conformidade
RoHS, REACH, lead-free and halogen-free status not present in the verified web snippets; compliance should be confirmed against the Microchip product page or PM5991 datasheet. AEC-Q100 is not applicable - this is an OTN processor, not an automotive-grade part. Export-control paperwork may apply to the encryption-enabled PM5990 sibling; the FEI no-encryption build of PM5991B-FEI generally avoids the encryption-related export-control category.
