R7F7010333AFP#KA3 - RH850/F1L 32-Bit MCU, 1MB Flash, 176-LFQFP | Renesas
N.º da peça: R7F7010333AFP#KA3 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.45 | $12,45 |
| 10 | $11.21 | $112,10 |
| 100 | $9.97 | $997,00 |
| 500 | $8.95 | $4.475,00 |
| 1.000 | $8.12 | $8.120,00 |
R7F7010333AFP#KA3 Visão geral
An automotive microcontroller (MCU) is a specialized microcontroller optimized for the harsh electrical and thermal environment of a vehicle. The RH850/F1L family sits within the broader Renesas RH850 family, which itself belongs to the 32-bit automotive MCU category — a segment that also includes Freescale/NXP MPC56xx, Infineon Aurix TC2xx, and Texas Instruments TMS570. RH850 cores are based on the V850E2M architecture extended with an FPU and lockstep dual-core options for ASIL-D applications.
Key features of the R7F7010333AFP#KA3 include 1 MB of code Flash, 80 MHz maximum CPU clock, hardware multiplier and divider, multiple 16-bit timers, A/D converters, and a multi-channel CAN controller compliant with ISO 11898. The 176-pin LFQFP exposes the full peripheral set, supporting simultaneous operation of multiple serial interfaces and PWM outputs required in body control modules and HVAC systems.
The RH850G3K core uses a 32-bit RISC architecture with 5-stage pipeline and hardware multiply-accumulate unit, delivering deterministic interrupt response. The on-chip Flash is single-voltage programmable and supports background operation (BGOP) and rewrite-in-rewrite without CPU stall — important for OBD-II compliant boot loaders.
Typical applications include automotive BCM (body control modules), HVAC control, instrument clusters, electric power steering (EPS) sensor nodes, transmission ECUs, and battery management slaves. The automotive-grade temperature range and CAN connectivity make it well suited to chassis networks.
Design consideration: when migrating from previous F1L variants, verify peripheral pinout mapping and ECLK/EMCLK clock source assignments against the user manual. The internal regulator requires careful VDD/VSS decoupling layout — at least four 0.1 µF X7R ceramic capacitors placed symmetrically around the package.
This page synthesizes distributor pricing, same-footprint drop-in alternatives, and practical design notes not found in the Renesas datasheet itself.
Alternativas drop-in para R7F7010333AFP#KA3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
R7F7010334AFP#KA3
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
R7F7010303AFP#KA3
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
R7F7010333AFP#AA3
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
R7F7010333AFP#KA4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
R7F7010333AFP-C#KA4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
R7F7010333AFP#KA3 Classificações máximas e características elétricas
| Core | RH850G3K (32-bit RISC) |
| Family | RH850/F1L |
| Maximum CPU Clock | 80 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| Encapsulamento | 176-LFQFP (24x24 mm) |
| Operating Voltage | 3.0 V to 5.5 V (single supply) |
| Faixa de temperatura de operação | -40°C to +105°C (automotive grade) |
| CAN Interface | Multiple CAN channels (ISO 11898) |
| Timer/Counter | Multiple 16-bit/32-bit timers |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Guia de Configuração de Pinos do R7F7010333AFP#KA3 176-lfqfp (24x24 mm)
Configuração de pinos para R7F7010333AFP#KA3 (pacote 176-lfqfp (24x24 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para R7F7010333AFP#KA3.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
R7F7010333AFP#KA3 é adequado para 7 aplicaçãos: Automotive Body Control Module (BCM), HVAC Control Module, Instrument Cluster MCU, Battery Management Slave (BMS), Electric Power Steering (EPS) Sensor Node, Transmission Gearbox ECU Slave, DC Motor / Pump Controller Node.
Automotive Body Control Module (BCM)
The R7F7010333AFP#KA3 fits BCM designs where multiple CAN buses, LIN nodes, and PWM-driven actuators must be coordinated in real time. Its 80 MHz RH850G3K core serves 10-25 kHz control loops with deterministic interrupt latency, and the 176-pin LFQFP exposes enough GPIO and timer channels to drive lighting, mirror, and wiper sub-functions. Source: Renesas RH850/F1L datasheet typical use-case diagram. Compared to NXP S32K1 in the same BCM class, the R7F7010333AFP#KA3 offers higher peripheral density per pin.
Recomendado
HVAC Control Module
HVAC ECUs blend sensor inputs (temperature, pressure, blower RPM) with actuator drive (PWM stepper motors, solenoid valves). The R7F7010333AFP#KA3 with its on-chip A/D converters, timers, and CAN channels fits this exact workload, and its 1 MB Flash accommodates the lookup-table-rich control firmware plus bootloader. The 176-LFQFP package provides the heat-dissipation performance required for under-dash mounting where ambient can reach 70°C.
Recomendado
Instrument Cluster MCU
Mid-range instrument clusters need a reliable MCU to drive stepper gauge motors, read CAN vehicle-speed messages, and run the odometer / service-interval logic. The R7F7010333AFP#KA3's on-chip data Flash supports OBD-II compliant rewriteable service records, while its timer resources generate the precise stepper pulse trains. Operating over -40°C to +105°C, it tolerates the extreme thermal environment of a dashboard.
Recomendado
Battery Management Slave (BMS)
Distributed BMS slave nodes monitor 8-16 cells per module, balancing them and forwarding cell voltages over isolated CAN. The R7F7010333AFP#KA3 with its on-chip 12-bit A/D (subject to datasheet verification), CAN, and 1 MB Flash is well matched to 12-16 cell slave boards. The 176-LFQFP provides the GPIO and timer density for cell-balancing FET drive and current-sense sampling.
Recomendado
Electric Power Steering (EPS) Sensor Node
EPS torque/angle sensor ECUs run high-rate (1 kHz) torque loop sensing and CAN-connected reporting to the central ECU. The R7F7010333AFP#KA3 combines 80 MHz CPU clock, fast analog front-end, and automotive-grade temperature range needed for EPS reliability. The package's exposed-pad thermal path handles motor-bay heat soak. Note: this is a sensor-node role, not the central EPS-CPU which requires ASIL-D.
Recomendado
Transmission Gearbox ECU Slave
Inside automatic transmission ECUs, MCUs manage shift solenoids, pressure sensors, and torque-estimator interfaces. The R7F7010333AFP#KA3 with 1 MB Flash provides headroom for adaptive shift-maps and CAN links to the central powertrain ECU. Its 176-LFQFP footprint supports the timer count demanded by multi-solenoid PWM drive.
Recomendado
DC Motor / Pump Controller Node
Water pumps, oil pumps, and auxiliary drives across vehicle subsystems often use a local MCU to apply soft-start, fault detection, and CAN diagnostics. The R7F7010333AFP#KA3 with on-chip timers and CAN fits a smart pump controller. Its LFQFP-176 footprint is large for a pump but enables BOM consolidation where multiple pumps share the same BOM.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para R7F7010333AFP#KA3 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | R7F7010334AFP#KA3 | R7F7010303AFP#KA3 | R7F7010333AFP#AA3 | R7F7010333AFP#KA4 | R7F7010333AFP-C#KA4 |
|---|---|---|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Package | 176-LFQFP (24x24 mm) | 176-LFQFP (24x24 mm) - same | 176-LFQFP (24x24 mm) - same | 176-LFQFP (24x24 mm) - same | 176-LFQFP (24x24 mm) - same | 176-LFQFP (24x24 mm) - same |
| Core | RH850G3K | RH850G3K | RH850G3K | RH850G3K | RH850G3K | RH850G3K |
| Maximum CPU Clock | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Family | RH850/F1L | RH850/F1L | RH850/F1L | RH850/F1L | RH850/F1L | RH850/F1L |
| Operating Temperature | -40°C to +105°C | -40°C to +105°C | -40°C to +105°C | -40°C to +105°C | -40°C to +105°C | -40°C to +105°C |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- Same-footprint variant for scalability (vs R7F7010334AFP#KA3)
- Operational characteristic identical to #AA3 (vs R7F7010333AFP#AA3)
- Variant screen tier availability (vs R7F7010333AFP-C#KA4)
Notas de projeto
Place at least four 0.1 µF X7R ceramic decoupling capacitors close to the VDD/VSS pins, plus a 4.7 µF bulk capacitor near the internal regulator output pin. The RH850/F1L requires strict power-up sequencing per the hardware user manual. Estimated: P_total ~ 0.5 W typical at 80 MHz, 5 V supply.
Route crystal traces (XIN/XOUT) symmetrically and shield them with a ground guard ring. Keep the analog AVDD/AVSS pair separated from noisy digital returns and place the AVSS pin capacitor within 3 mm of the AVSS pin. Avoid routing high-current motor drive traces parallel to analog inputs.
Common pitfalls: (1) programming the wrong flash rewrite mode will lock the MCU during normal operation — always enable BGOP before software reset; (2) using incorrect ECLK pin function for CAN sync — verify ECLK source in the CKSC_ICTL register; (3) ordering MPN #AA3 vs #KA3 by mistake — verify the exact suffix against the BOM before placing orders.
Informações de conformidade
Renesas automotive-grade F1L family parts are AEC-Q100 qualified. RoHS compliant and lead-free per DigiKey listing.
